JP4907491B2 - High frequency induction heating device and method of manufacturing high frequency induction heating device - Google Patents

Description

  The present invention relates to a high-frequency induction heating apparatus and can be applied to substrate heating in apparatuses such as a sputtering apparatus, a CVD apparatus, an ashing apparatus, an etching apparatus, an MBE apparatus, and a vapor deposition apparatus.

  In a sputtering apparatus, a CVD apparatus, an ashing apparatus, an etching apparatus, an MBE apparatus, and a vapor deposition apparatus, the substrate may be heated to a predetermined temperature. As a heating mechanism for heating the substrate, one using a heating element such as a lamp heater or a sheathed heater is known. In the heating mechanism using such a heating element, there is a problem that a temperature rise other than the heated part is unavoidable.

  A heating mechanism using high frequency induction is also known. The heating mechanism using high-frequency induction heating generates a high-frequency magnetic flux by applying a high-frequency current to a work coil (heating coil), and induces an induced current (eddy current) in the heated portion by the high-frequency magnetic flux. Heat is generated by Joule loss caused by flowing through the heating unit. The heating mechanism heats the heated portion by this heat generation, and further heats an object such as a substrate through the heated portion. For example, Patent Documents 1 to 3 are known as a heating apparatus using such high-frequency induction.

  For example, Patent Document 4 is known as an example in which high-frequency induction heating is used in a semiconductor film forming apparatus. In the semiconductor film forming apparatus described in Patent Document 4, a solid material is heated to a sublimation temperature or higher by using high-frequency induction heating, and a film is formed on an object to be deposited using a sublimation diffusion phenomenon.

JP 2004-342450 A JP 2004-289012 A Japanese Patent Laid-Open No. 06-151314 JP 2004-47658 A Japanese Patent Application No. 2007-103885

  High-frequency induction heating utilizes the fact that when the magnetic field generated by the work coil passes through the heated part, an eddy current flows through the heated part due to the passage of the magnetic field, and the heated part generates heat due to this eddy current. is there. The efficiency of this induction heating is determined by the degree of coupling between the heated part and the magnetic flux, and the amount of magnetic flux passing through the heated part increases as the distance between the work coil and the heated part becomes shorter. It is desirable to arrange it as close as possible to the heating part.

  When heating the heated part by high-frequency induction heating in a reduced pressure environment such as a vacuum, the heated part and the work coil are connected in addition to a mode in which the work coil is on the atmosphere side and only the heated part is in a reduced pressure state. There is a mode in which both are in a reduced pressure state.

  When the heated part is placed in a vacuum and the work coil is placed on the atmosphere side, a dielectric member is placed between the work coil and the heated part to keep the heated part side in a vacuum state. There is a need to. Since the distance between the work coil and the heated portion is limited by the dielectric member, it is difficult to dispose them in close proximity.

  On the other hand, when the work coil is disposed in a vacuum together with the heated portion, glow discharge or arcing (abnormal discharge) may occur in the space around the work coil. When glow discharge occurs, there is a problem that the formation of a magnetic field by the work coil becomes insufficient, and a sufficient induction current cannot be supplied to the heated portion, making it difficult to perform good heating.

  For example, when the power frequency used for high frequency induction heating is set to 100 kHz to 500 kHz, reactive power can be suppressed and high heating efficiency can be achieved by using high frequency induction heating, and the power supply configuration can be made inexpensive. In addition, there is an advantage that power can be supplied relatively easily. However, when high frequency induction heating is performed in a vacuum, since the coil voltage is high, capacitive coupling occurs between the heated portion and peripheral members due to the electric field component due to high frequency induction, and glow discharge is likely to occur.

  The applicant of the present invention suppresses the occurrence of glow discharge between the heated portion and the work coil by providing an electric field shield between the heated portion and the work coil in a vacuum, thereby An application has been filed in which a part and a work coil are arranged close to each other (see Patent Document 5).

  Since the configuration according to Patent Document 5 is mainly intended to suppress the occurrence of glow discharge between the heated portion and the work coil, for example, high-frequency induction heating such as a member that holds the work coil It is difficult to say that the effect of suppressing glow discharge occurring between parts other than the heated part of the apparatus is sufficient.

  In order to suppress glow discharge and arcing generated between the work coil and the periphery of the work coil, it is conceivable to cover the periphery of the work coil with a dielectric. For example, Patent Document 2 shows a configuration in which a work coil is covered with a resin.

  However, in order to suppress the occurrence of glow discharge and arcing only by the dielectric, it is necessary to sufficiently take the thickness of the dielectric, and there is a problem that the size of the high-frequency induction heating device is increased and the weight is increased. Arise. In addition, in this configuration, since the work coil is covered with an integral resin, it is difficult to form the work coil without forming a gap between the work coil and the resin material.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described conventional problems and suppress the occurrence of glow discharge around a work coil.

  Another object of the present invention is to easily manufacture a high-frequency induction heating device that can suppress the occurrence of glow discharge around a work coil.

  The high-frequency induction heating device of the present invention covers the periphery of the work coil except the side facing the heated portion with a conductor, and fills the space between the conductor and the work coil with a dielectric material having good thermal conductivity. By making the structure and grounding this conductor, the potential of the work coil is electrostatically shielded, thereby suppressing the occurrence of glow discharge around the work coil. Moreover, the thickness of the dielectric covering the work coil required to suppress glow discharge can be reduced by covering the work coil with a grounded conductor.

  According to the present invention, a gap between the work coil and the conductor is constituted by a dielectric base that supports the work coil and a filler that fills the gap between the dielectric base and the work coil. The filling material is filled between the dielectric base and the work coil, and the gas contained in the filled dielectric material is degassed by decompression, so that there is no gap between the work coil and the dielectric material. A dielectric material can be provided around the work coil with high adhesion.

  The present invention includes an aspect of a high-frequency induction heating device and an aspect of a method for manufacturing the high-frequency induction heating device.

  A high-frequency induction heating apparatus according to the present invention is a heating mechanism that uses a high-frequency induction heating function used in a reduced pressure environment, receives a supply of high-frequency power, and heats an induction current through a heated portion by this high-frequency induction. A dielectric base that supports the work coil, and a conductive box that covers the periphery of the dielectric base excluding the surface facing the heated part. The conductive box is grounded to zero potential, and the work coil is statically fixed. Shield electric.

  The space between the dielectric base and the work coil is filled with a filler made of a dielectric material having good thermal conductivity. As a result, the periphery of the work coil in the conductor box is filled without forming a gap by two kinds of dielectric materials, that is, the dielectric base and the filler, and a space that causes glow discharge and arcing is created. Can be easily removed.

  In addition, when there is a space between the conductor box and the dielectric base, this space portion may be filled with a filler, thereby causing a glow discharge between the conductor box and the dielectric base. And arcing can be suppressed.

  The work coil of the present invention can be formed of a metal pipe such as a copper pipe that allows cooling water to pass through the inside of the work coil, whereby a high-frequency induction heating apparatus heated by radiant heat from a heated portion is provided. Can be cooled.

  Further, by filling the space between the conductor box and the work coil with a dielectric material having good thermal conductivity without gaps, the dielectric base, the conductor box, and the filler can be efficiently cooled at the same time. According to this structure, it can comprise with an inexpensive dielectric material, without using an expensive high heat resistant material. Moreover, the thermal damage by the radiant heat from a to-be-heated part can be suppressed.

  The dielectric base of the present invention is a molded body that has a space for accommodating a work coil and is molded into a predetermined shape, and can be formed of PET (polyethylene terephthalate) or the like. In addition, the filler is potted with a dielectric material in a dielectric-based storage space, and gas contained in the potted dielectric material is degassed by decompression. By defoaming, the occurrence of glow discharge and arcing in the filler can be suppressed.

  The conductor box of the present invention can be configured by attaching a conductive thin plate to the outer peripheral surface of the dielectric base. The conductive thin plate constituting this conductor box can be composed of a plurality of divided conductive thin plate units. The conductive thin plate is divided, and a plurality of divided conductive thin plate units are bonded to the periphery of the dielectric base, so that a conductive box can be easily formed. It can be formed without forming a gap therebetween. If the conductor box is composed of an integral conductive plate, it needs to be formed in accordance with the outer dimensions and outer shape of the dielectric base, but by dividing as in the present invention, the dielectric base The dependence on the external dimensions and the external shape can be reduced, it can be formed easily, and can be easily attached to the dielectric base and the conductor thin plate without any gap.

  Moreover, the effect of electrostatic shielding can be achieved when the thickness of the conductor thin plate is, for example, about 0.01 mm. When the conductor thin plate is formed by using, for example, an ultra-thin aluminum foil, it is difficult to receive a dielectric heating effect due to the magnetic field from the work coil, so that the distance between the work coil and the conductor box is short as a smaller dielectric base. Even so, an electrostatic shielding effect can be obtained without receiving a dielectric heating action.

  The high-frequency induction heating device of the present invention is provided with an insulator cylinder that covers at least one end of the work coil on the high-frequency power supply side, and the dielectric base is hermetically sealed by this insulator cylinder. At least one end on the high-frequency power supply side of the work coil is a part that forms a boundary between the dielectric base and the outside. By covering the work coil and providing an insulator cylinder in this part, the periphery of the work coil and the dielectric It eliminates the gap between the body base and suppresses the occurrence of glow discharge and arcing in this area.

  The high frequency induction heating device of the present invention includes an adapter flange that holds both ends of a work coil on a conductor box and a dielectric base. The adapter flange includes an opening communicating with a space portion that holds the work coil in the dielectric base in a state where the conductor box and the dielectric base are connected. This opening can be used as an inlet for introducing a filler into a space portion holding the work coil in the dielectric base and an exhaust outlet for exhausting the space in the dielectric base to reduce the pressure.

  Moreover, the electric conductor box with which the high frequency induction heating apparatus of this invention is provided is installed in the position where the magnetic flux which generate | occur | produces from a work coil fully reduces, and is not induction-heated.

  A method of manufacturing a high-frequency induction heating device according to the present invention includes a work coil that receives high-frequency power and heats an induction current through a heated part by high-frequency induction, a dielectric base that supports the work coil, and a heated part And a grounded conductor box covering the periphery of the dielectric base excluding the opposite surface, and the space between the dielectric base and the work coil is filled with a dielectric material having good thermal conductivity. A high-frequency induction heating apparatus includes a flange for vacuum-sealing an open surface of a dielectric base, the flange including a first flange made of PTFE in close contact with an exposed surface of the dielectric base, A second flange made of a metal material in close contact with the other surface of the first flange.

  The first flange is in close contact with the exposed surface of the dielectric base and has a plurality of openings, and the second flange forms a decompression chamber. The space between the dielectric base and the work coil is hermetically sealed by superimposing the first flange and the second flange on the dielectric base, and the first flange and the second flange are sealed through the opening of the first flange. The space is decompressed by decompression of the decompression chamber of the flange No. 2, and the filler filled in the space is defoamed.

  In the manufacturing method of the high frequency induction heating device of the present invention, the space between the dielectric base and the work coil is held in a sealed state by a flange, thereby making the inside surrounded by the conductor box and the flange airtight, The inside can be easily reduced in pressure. By depressurizing the interior surrounded by the conductor box and the flange, the gas contained in the filler filled in the interior can be degassed. Since this defoaming can be performed without introducing the entire high-frequency induction heating apparatus into the decompression chamber, the apparatus configuration for decompression can be simplified.

  The sealed state can be applied not only to the space between the dielectric base and the work coil but also to the space between the electric box and the dielectric base.

  In addition, when the entire high-frequency induction heating apparatus is introduced into the decompression chamber, the volume to be exhausted increases. However, according to the configuration of the present invention, the dielectric base is formed within the interior surrounded by the conductor box and the flange. Since the space excluding the work coil is sufficient, the volume to be exhausted can be reduced, and the time required for decompression can be shortened.

  According to the configuration of the present invention, the space between the dielectric base and the work coil can be easily sealed by covering with a flange or the like, and the filling material filled in the space in the dielectric base by potting can be reduced with reduced pressure. Defoam.

  The sealing by the flange is performed in an airtight manner between the flange and the dielectric base and between the overlapping flanges, and this airtight state can be performed by using an O-ring or a flat material packing. The flange can be configured to overlap the first flange and the second flange.

  In sealing with an O-ring, an O-ring groove is provided in at least one of the first flange and the dielectric base and at least one of the first flange and the second flange, and the O-ring is provided in the O-ring groove. Is provided. As a result, the opposing surfaces of the first flange and the dielectric base and the opposing surfaces of the first flange and the second flange are overlapped with an O-ring interposed therebetween, and airtightness is maintained. .

  In the sealing by the flat material packing, the flat packing is inserted between the first flange and the dielectric base, and between the first flange and the second flange, and the opposing surfaces of the first flange and the dielectric base are inserted. And at least any one of the opposing surfaces of the first flange and the second flange is defined as a seal surface. As a result, the opposing surfaces of the first flange and the dielectric base, and the opposing surfaces of the first flange and the second flange are overlapped with the sealing surface of the flat packing interposed therebetween, and airtightness is improved. Retained.

  The first flange and the second flange are overlapped in order to pot the filler in the dielectric-based space that is hermetically sealed by this flange, and to degas the potted filler under reduced pressure. An opening is provided at each communicating position. The filler is charged through the openings of both flanges and exhausted. The pressure is reduced by exhausting, and the filler is degassed.

  Moreover, it is set as the structure provided with the connection flange connected with a vacuum apparatus with respect to a 2nd flange, and this connection flange is a position which connects with the opening part with which a 2nd flange is provided in the state piled up with a 2nd flange. It is good also as a structure which equips with an opening part and throws in a filler and evacuates through both opening parts.

  Further, in a configuration including an adapter flange for holding both ends of the work coil on the conductor box and the dielectric base, the adapter flange is connected to the dielectric base and the work coil in a state where the conductor box and the dielectric base are connected. And an opening that communicates with the space formed therebetween. Through this opening, a filler is charged and exhaust for decompressing the space in the dielectric base is performed.

  The filler is charged through the opening of the adapter flange and exhausted. The pressure is reduced by exhausting, and the filler is degassed.

  ADVANTAGE OF THE INVENTION According to this invention, the high frequency induction heating apparatus which suppresses generation | occurrence | production of the glow discharge around a work coil can be manufactured easily.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1-3 is a figure for demonstrating the structure of the high frequency induction heating apparatus of this invention, FIG. 1, FIG. 2 is a block diagram which arrange | positions the high frequency induction heating apparatus of this invention in a vacuum chamber, and shows a structure. FIG. 3 is a cross-sectional view for explaining the configuration of the high-frequency induction heating apparatus of the present invention.

  1 and 2, the high-frequency induction heating apparatus 1 of the present invention includes a work coil 20 and a conductive flat plate-shaped susceptor 70 (a heated portion) that supports the substrate 100. The work coil 20 is supplied from a high-frequency power source. Inductive current is generated in the susceptor (heated part) 70 by supplying a high-frequency current to the susceptor 70, and the susceptor 70 is heated by the induced current to heat the substrate 100 supported on the susceptor 70. The high frequency induction heating device 1 is used in a reduced pressure environment of 1000 Pa or less, for example.

  Here, the work coil 20 is supplied with a high-frequency current from a high-frequency power source 22. When supplying a high-frequency current from the high-frequency power source 22, a matching circuit is interposed between the high-frequency power source 22 and the work coil 20, thereby matching the input impedance and the output impedance, and the high-frequency current from the high-frequency power source 22 to the work coil 20. The supply efficiency can be improved. The high-frequency power source 22 includes, for example, a power limiting circuit (not shown) that limits power taken from an AC power source such as a commercial power source, and a high-frequency generating circuit that raises the frequency of the fetched power from 100 kHz to 500 kHz, for example. Can be configured (not shown). Further, the susceptor 70 is supported by the support portion 60. The support part 60 can be composed of, for example, three or more arm members made of a dielectric material.

  The high-frequency induction heating apparatus 1 of the present invention includes an electric field shield 40 disposed between the work coil 20 and a susceptor 70 that constitutes a heated portion, and an electric field and a magnetic field generated by flowing a high-frequency current through the work coil 20. Thus, the electric field is shielded and only the magnetic field is guided to the susceptor 70. The magnetic field that has passed through the electric field shield 40 is heated by passing an induced current through the susceptor 70.

  The electric field shield 40 is grounded together with the susceptor 70 to a ground potential. The electric field shield 40 eliminates a potential difference between the electric field shield 40 and the susceptor 70, and suppresses the occurrence of glow discharge in the space 80 between the electric field shield 40 and the susceptor 70.

  Further, the thermal radiation reducing material 50 is disposed in contact with the electric field shield 40. The heat radiation reducing material 50 can be heat resistant glass or quartz glass. Heat is released from the heated susceptor 70 by radiation. The heat radiation reducing material 50 reduces the heat radiation emitted from the susceptor 70 toward the electric field shield 40 and the work coil 20 and prevents the electric field shield 40 and the work coil 20 from being heated.

  Further, a white ceramic of titanium oxide is fired on at least one surface of the heat radiation reducing material 50. This white ceramic reflects heat radiation and suppresses heat radiation from the susceptor 70 toward the work coil 20.

  2 and 3 are schematic cross-sectional views of the high-frequency induction heating apparatus 1, FIG. 2 shows a state in which the high-frequency induction heating apparatus 1 is disposed in the vacuum chamber 90, and FIG. . The vacuum chamber 90 can heat the substrate 100 in a low-pressure environment by setting the inside of the chamber to a low-pressure environment by an exhaust device (not shown).

  A coil-shaped portion of the work coil 20 is held in a dielectric base 30 in the high frequency induction heating device 1. On the other hand, both end portions of the work coil 20 are led out of the vacuum chamber 90 via the high frequency shield box 21 and connected to a high frequency power source 22 provided outside to receive supply of high frequency power. The cold side of the exterior portion of the work coil 20 is disposed outside the high-frequency induction heating device 1 and the vacuum chamber 90 and grounded, and has the same potential as the susceptor 70 and the electric field shield 40 described above. Moreover, the heat generation of the work coil 20 can be cooled by covering the exterior portion of the work coil 20 with a cooling pipe 20a and flowing cooling water therein. The cooling water is introduced from one end of the cooling pipe 20a, and after cooling the work coil 20 portion, it is led out from the other end of the cooling pipe 20a.

  At this time, the cooling pipe 20a is introduced into the dielectric base 30 of the high-frequency induction heating device 1 through a cylindrical field through 88 that covers the outer periphery of the cooling pipe 20a. Providing the field through 88 suppresses the occurrence of glow discharge at the portion where the work coil 20 is introduced into the high frequency induction heating apparatus 1 and the vacuum chamber 90.

  The work coil 20 is held in the dielectric base 30 inside the high frequency induction heating apparatus 1. The dielectric base 30 surrounding the work coil 20 covers the outer periphery with a grounded conductor box (shield box) 10 such as aluminum, and suppresses the occurrence of glow discharge around the dielectric base 30. The conductor box 10 is arranged at a position where induction heating action by the magnetic field induced by the work coil 20 does not occur.

  More specifically, the high-frequency induction heating device 1 includes a work coil 20, a dielectric base 30 that supports the work coil 20, a filler 33 made of a dielectric material, and a position of the work coil 30 in the filler 33. The upper plate 51 and the lower plate 52 provided on the surface where the work coil 20 faces the heated portion (susceptor 70 (not shown in FIGS. 2 and 3)), and the dielectric base 30 A conductor box (shield box) 10 and an adapter flange 81 for attaching to the vacuum chamber 90 are provided on the outer peripheral portion except for the side and bottom excluding the surface facing the heated portion. The upper plate 51 can be made of, for example, a glass plate, and the lower plate 52 can be made of, for example, an electric field shield.

  The dielectric that supports the work coil 20 includes a dielectric base 30 and a filler 33. The dielectric base 30 is a member that forms a holding portion for holding, for example, one surface of the work coil 20 formed in a spiral shape so as to face the heated portion. The shape and size of the dielectric base 30 are set in accordance with the work coil 20. And pre-formed with PET or the like. At this time, a space 31 for accommodating the work coil 20 is formed in a part of the dielectric base 30. The work coil 20 is held by being housed in the space 31.

  When the work coil 20 is housed in the space 31, a gap is generated between the work coil 20 and the dielectric base 30, which may cause a glow discharge. The filler 33 is made of a dielectric material and fills a gap between the work coil 20 and the dielectric base 30. Thereby, the work coil 20 is filled with the dielectric material of the dielectric base 30 and the filling material 33 without a gap.

  The filling of the filler 33 can be performed by potting the filler in the gap between the work coil 20 and the dielectric base 30 after the work coil 20 is accommodated in the space 31 in the dielectric base 30. Furthermore, after potting the filler 33, the gas contained in the filler 33 is degassed by reducing the pressure. The filling material potting and vacuum degassing will be described later with reference to FIGS.

  On the outer periphery of the dielectric base 30, the work coil 20 is covered with a conductor except for the surface facing the heated portion to form a conductor box (shield box) 10 and grounded, and the work coil 20 is electrostatically Shut off. The conductor box 10 can have a configuration in which a plurality of conductor thin plates are bonded together. By forming the conductor box 10 with a plurality of conductor thin plates, the conductor box 10 can be easily formed.

  The thickness of the conductor thin plate is, for example, about 0.01 mm, and an electrostatic shielding effect can be obtained. In the case where the conductor thin plate is formed using, for example, an ultrathin aluminum foil, it is difficult to receive a dielectric heating action by a magnetic field from the work coil 20. For this reason, even when the dielectric base 30 is made smaller and the distance between the work coil 20 and the conductor box 10 is short, the conductor box 10 is not subjected to the dielectric heating action from the work coil 20. An electric shielding effect can be obtained.

  An adapter flange 81 for attachment to the vacuum chamber 90 is provided outside the conductor box 10, and airtightness can be maintained by providing an O-ring 85 on the surface where both are in contact. Further, airtightness can be maintained by providing an O-ring 86 between the dielectric base 30 and the conductor box 10.

  The adapter flange 81 is formed with an opening for allowing the work coil 20 to pass therethrough, so that O-rings 83 and 84 are provided at portions in contact with the work coil 20. Further, a configuration in which an O-ring pressing plate 87 is provided may be employed. Furthermore, airtightness is maintained by providing an O-ring 82 on the surface where the adapter flange 81 contacts the wall of the vacuum chamber 90.

  Next, the structure for filling the filler 33 that fills the gap between the work coil 20 and the dielectric base 30 after the work coil 20 is housed in the space 31 formed in the dielectric base 30 is shown in FIG. This will be described with reference to FIGS. 4, 5, and 6 are diagrams illustrating a configuration example of a high-frequency induction heating device for potting a filler and depressurizing and defoaming the potted filler, and FIG. It is a figure which shows the structural example for demonstrating, FIG. 8, FIG. 9 is a figure for demonstrating the procedure of potting and pressure reduction deaeration.

  FIG. 4 shows an example of the configuration of a high-frequency induction heating device for performing potting of the filler and vacuum degassing of the filler. In this configuration example, the surface of the periphery of the dielectric base 30 that is not covered with the conductor box 10 is covered with flanges (first flange 111, second flange 112, and third flange 113). Thus, the portion of the space 31 in the dielectric base 30 is hermetically sealed, the space 31 is filled with the filler 33, and the air-tight space is decompressed to degas the filled filler 33 under reduced pressure. This is a configuration example in which the airtightness between the dielectric base and the flange and between the flanges is held by an O-ring.

  According to this configuration, only the space 31 in the dielectric base 30 can be decompressed without introducing the entire high frequency induction heating device 1 into a vacuum chamber or the like in order to degas the filler 33 under reduced pressure. it can. Since the space 31 in the dielectric base 30 is a limited small space, the apparatus required for decompression can be simplified and reduced in size, and the time required for decompression can be shortened.

  In the configuration shown in FIG. 4, the first flange 111 and the second flange are formed on the surface of the dielectric base 30 that is not covered with the conductor box 10 in order to make the space 31 in the dielectric base 30 airtight. 112 and the third flange 113 are placed one on top of the other.

  The first flange 111 includes a large number of openings 111a in order to exhaust air released from the filler 33 by defoaming. The second flange 112 includes a space 112b in a portion facing the upper surface of the dielectric base 30 via the first flange 111, and forms a decompressed space by exhaust. A column 112a is provided in the space 112b in order to prevent distortion of the second flange 112 due to negative pressure.

  By forming the space 112b, the space 31 in the dielectric base 30 is uniformly decompressed through the numerous openings 111a formed in the first flange 111, and the filling material 33 filled in the electric body base 30 is obtained. It is possible to sufficiently uniformly degas bubbles such as air. In the embodiment, a desired result is obtained by setting the height of the space 112b to, for example, about 30 mm or more.

  The surplus portion of the filler 33 filled in the dielectric base 30 enters the opening 111a of the first flange 111 and forms a protruding portion 31a. The protruding portion 31a protrudes from the upper surface of the dielectric base 30 when the first flange 111 is removed after the defoaming process is completed. However, the protruding portion is cut off to remove the protrusion of the dielectric base 30. The upper surface can be formed in a plane.

  Here, an O-ring groove is formed on the surface of the first flange 111 facing the dielectric base 30 so as to dispose the O-ring 114, so that the gap between the first flange 111 and the dielectric base 30 is set. Maintains airtightness. In addition, the first flange 111 and the second flange 112 are formed by forming an O-ring groove on any surface facing each other and disposing the O-ring 115, so that the first flange 111 and the second flange 112 are arranged. The airtightness between the two is maintained.

  The first flange 111 includes an opening 110 that communicates with an exhaust device (not shown in FIG. 4). The opening 110 can be sealed by the third flange 113. The second flange 112 and the third flange 113 maintain airtightness by forming an O-ring groove on either surface facing each other and disposing the O-ring 116.

  After housing the work coil 20 in the dielectric base 30, the first flange 111 and the second flange 112 are attached, so that the space 31 of the dielectric base 30 communicates with the outside through the space 112b and the opening 110. It becomes a state. In this state, the third flange 113 is opened, and the filler is potted into the space 31 from the opening 110. The potted filling material fills the gap between the work coil 20 and the dielectric base 30 and is filled. After the gap is filled with the filler 33, the gas contained in the filler 33 is degassed by reducing the pressure. The gas degassed from the filler 33 is exhausted from the exhaust device (not shown in FIG. 4) through the opening 111a, the space 31a, and the opening 111.

  5 and 6 show another configuration example of the high-frequency induction heating device for performing potting of the filler and vacuum degassing of the filler. This configuration example is substantially the same as the configuration example shown in FIG. 4 and is a configuration example in which airtightness is maintained between the dielectric base and the flange and between the flanges by a seal structure using a flat packing.

  In the following, only portions different from the configuration of FIG. 4 are shown, and description of common configurations is omitted.

  In the high frequency induction heating apparatus 1 shown in FIG. 5, the surfaces of the periphery of the dielectric base 30 that are not covered with the conductor box 10 are flanges (first flange 111, second flange 112, and third By covering with the flange 113), the portion of the space 31 in the dielectric base 30 is made airtight, and the filling material 33 is potted in the space 31, and the space in the airtight state is decompressed, thereby potting the filling material. 33 is degassed under reduced pressure.

  In the configuration shown in FIG. 5, the first flange 111 and the second flange are formed on the surface of the dielectric base 30 that is not covered with the conductor box 10 in order to make the space 31 in the dielectric base 30 airtight. 112 and the third flange 113 are placed one on top of the other. The first flange 111 and the dielectric base 30 are formed by inserting a planar packing 117 between the surfaces of the first flange 111 facing the dielectric base 30 to form a seal surface having a flatness capable of being vacuum-tight. The first flange 111 and the second flange are formed by inserting a flat packing 117 between the first flange 111 and the second flange 112 to form a sealing surface. The airtightness between the two is maintained.

  The potting of the filler 33 into the space 31 performed through the openings 110 provided in the first flange 111 and the second flange 112 and the vacuum degassing of the potted filler are the same as in the configuration example of FIG. Can do.

  The configuration shown in FIGS. 4 and 5 is a configuration in which potting of the filler and vacuum degassing are performed on the surface side where the work coil 20 is disposed. On the other hand, the configuration shown in FIG. 6 is a configuration in which potting of the filler and vacuum degassing are performed from the dielectric base 30 side, and the configuration in FIG. 4 and FIG. is there.

  By covering the periphery of the dielectric base 30 that is not covered with the conductor box 10 with flanges (first flange 111, second flange 112, and third flange 113), the dielectric base The portion of the space 31 in the space 30 is made airtight, the filler 33 is potted in the space 31, and the potted filler 33 is degassed by decompressing the space in the airtight state. The potting of the filler 33 and the vacuum degassing of the filler are performed from the lower side of the dielectric base 30. In FIG. 6, the diagrams shown in FIGS. 4 and 5 are shown upside down.

  Underneath, the dielectric base 30 communicates with the outside through an opening formed in the conductor box 10 and an opening 131 formed in the adapter flange 81. A cap 130 is detachably attached to the opening 131. By opening the cap 130, the space 31 of the dielectric base 30 communicates with the outside, and by closing the cap 130, the space 31 of the dielectric base 30 becomes airtight. In the sealing with the cap 130, the airtightness can be improved by providing the O-ring 132.

  The potting of the filler 33 into the space 31 through the opening 110 provided in the first flange 111 and the second flange 112, and the vacuum degassing of the potted filler are the same as the configuration example of FIG. Can do.

  Potting of the filling material into the space 31 of the dielectric base 30 is performed through the opening 131 by opening the cap 130 and communicating the space 31 of the dielectric base 30 with the outside. Further, the defoaming of the potted filler is performed by connecting the vacuum pump (not shown) to the opening 131 to decompress the space 31 of the dielectric base 30.

  Next, vacuum degassing by the exhaust part will be described with reference to FIG. The configuration example shown in FIG. 7 shows an example in which the space 31 in the dielectric base 30 is made airtight by the flange configuration shown in FIG. 4 and the filling material potted in the space 31 is degassed under reduced pressure.

  Here, instead of the third flange 113, a T-shaped flange 121 is attached, and the exhaust device 120 is attached to the T-shaped flange 121 to perform degassing defoaming. The T-shaped flange 121 has a connection flange 122 connected to the second flange 112 at the lower end, a flange 123 and a flange 124 formed with an opening 125 for charging a filler at the upper end, and a vacuum at the other end. It has a flange formed with a vacuum exhaust port 126 for evacuating and connected to the pump 129 side. The flange in which the vacuum exhaust port 126 is formed is connected to an exhaust pipe 127, and this exhaust pipe 127 is connected to a vacuum pump 129 through a vacuum valve 128a. The exhaust pipe 127 is connected to the atmosphere side through a vacuum valve 128b.

  In order to pot the filler into the space 31 of the dielectric base 30, the flange 124 is opened, the filler is introduced into the T-shaped flange 121 through the opening 125 of the flange 123, and the opening of the connection flange 122 A filler is charged into the space 31 through the opening 110 of the first flange 111, the space 31a, and the opening 111a. At this time, the inside of the T-shaped flange 121 is set to atmospheric pressure by opening the vacuum valve 128b and closing the vacuum valve 128a.

  After introducing the filler, the flange 124 is closed, the vacuum valve 128b is closed, and the vacuum valve 128a is opened, whereby the inside of the T-shaped flange 121, the space 31a, and the space 31 is exhausted and decompressed. The decompression in the space 31 is performed through the opening 111a composed of a large number of holes with the space 31a as a decompression chamber. The space 31 is decompressed uniformly by the decompression of the space 31a having the predetermined volume and the communication with the space 31 of the dielectric base 30 through the large number of openings 111a, and is included in the potted filler. The gas is sufficiently degassed.

  Next, the procedure of potting the filler and vacuum degassing will be described with reference to FIGS. 8 shows the case of the configuration example shown in FIG. 4, and FIG. 9 shows the case of the configuration example shown in FIG.

  In the procedure shown in FIG. 8, first, the dielectric base 30 is formed of a dielectric material such as PET. The dielectric base 30 is formed by determining the outer shape and the shape and size of the space 31 according to, for example, the shape and size of the work coil (FIG. 8A). Then, the conductor box 10 is attached to the outer periphery of the dielectric base 30. When the conductor box 10 is formed using a plurality of conductor plates, the conductor plates are attached to the outer peripheral surface of the dielectric base 30. When the conductor box 10 is formed, the surface facing the heated portion (not shown) is left open (FIG. 8B).

  Next, the work coil 20 is attached to the space 31 formed in the dielectric base 30, and the adapter flange 81 is attached to the conductor box 10. In this attachment, the part which heats a to-be-heated part in the work coil 20 is arrange | positioned in the surface facing a to-be-heated part. On the other hand, the high-frequency power supply side and the cooling water supply side (both not shown) in the work coil 20 have an opening formed below the dielectric base 30, an opening formed in the conductor box 10, and It is taken out to the outside through each opening of the opening formed in the adapter flange 81 attached to the conductor box 10.

  In this state, since the work coil 20 is only housed in the space 31 in the dielectric base 30, there is a gap between the work coil 20 and the dielectric base 30. In order to fill this gap with a dielectric material, the filler is potted, and depressurized to remove bubbles from the filler. In the potting and vacuum degassing processes, the work coil 20 may be displaced. In particular, the inter-coil distance of the work coil at the portion where the heated part is heated may change depending on the filling material. In order to suppress this positional deviation, the distance between the coils can be kept constant by arranging the spacer 32 between the coils of the work coil 20 (FIG. 8C).

  After the work coil 20 is arranged in the assembly of the dielectric base 30 and the conductor box 10, the dielectric base 30 is provided with flanges (first flange 111 and second flange 112) in order to make the space 31 airtight. And the exhaust device 120 is attached to the flange.

  After the exhaust device 120 is attached, the vacuum valve 128a is closed, the vacuum valve 128b is opened, the T-shaped flange 121 is set to atmospheric pressure, the flange 124 is opened, and the opening 125 is opened. A filler is potted into the space 31 of the dielectric base 30 from the opening 125, and the gap between the work coil 20 and the dielectric base 30 is filled with the filler (FIG. 8D).

  After filling the gap between the work coil 20 and the dielectric base 30 with a filler, the flange 124 is closed, the vacuum valve 128b is closed, the vacuum valve 128a is opened, and the inside of the T-shaped flange 121 is decompressed by exhausting the vacuum pump 129. To do. Due to this depressurization, the space 112b of the first flange 112 is depressurized, and the filler 33 side is depressurized through a large number of openings 111a formed in the first flange 112. As a result, bubbles contained in the potted filler 33 are released and defoaming is performed (FIG. 8E).

  After the vacuum degassing of the filler is completed, the exhaust device 120 and the flanges (first flange 111 and second flange 112) are removed (FIG. 8 (f)).

  When the flange is removed, the filler that has entered the opening 111a of the second flange 112 protrudes and protrudes. The protruding portion 31a is cut off after the second flange 112 is removed, and the exposed surface after filling is made flat (FIG. 8G).

  In the procedure shown in FIG. 9, first, the dielectric base 30 is formed of a dielectric material such as PET. The dielectric base 30 is formed by determining the outer shape and the shape and size of the space 31 in accordance with, for example, the shape and size of the work coil (FIG. 9A). Then, the conductor box 10 is attached to the outer periphery of the dielectric base 30. When the conductor box 10 is formed using a plurality of conductor plates, the conductor plates are attached to the outer peripheral surface of the dielectric base 30. When the conductor box 10 is formed, the surface facing the heated portion (not shown) is left open (FIG. 9B). The processes of FIGS. 9A and 9B are the same as the processes of FIGS. 8A and 8B described above.

  Next, the work coil 20 is attached to the space 31 formed in the dielectric base 30, and the adapter flange 81 is attached to the conductor box 10, and the vertical position is reversed. In this attachment, the part which heats a to-be-heated part in the work coil 20 is arrange | positioned in the surface facing a to-be-heated part. On the other hand, the high-frequency power supply side and the cooling water supply side (both not shown) in the work coil 20 have an opening formed below the dielectric base 30, an opening formed in the conductor box 10, and It is taken out to the outside through each opening of the opening formed in the adapter flange 81 attached to the conductor box 10.

  In this state, similarly to FIG. 8C, the spacer 32 is arranged to suppress the displacement of the work coil, and the distance between the coils is kept constant (FIG. 9C).

  After the work coil 20 is arranged in the assembly of the dielectric base 30 and the conductor box 10, the dielectric base 30 is provided with flanges (first flange 111 and second flange 112) in order to make the space 31 airtight. Is attached (FIG. 9D).

  The cap 130 is opened, and the filler is potted into the space 31 from the opening 131 (FIG. 9E). After potting the filler, the exhaust device 120 is attached to the opening 131 portion. After installing the exhaust device 120 (not shown), the vacuum valve 128b (not shown) is closed, the vacuum valve 128a (not shown) is opened, and the vacuum pump 129 (not shown) is opened. Depressurize by exhaust. By this decompression, bubbles contained in the potted filler 33 are released and defoaming is performed (FIG. 9 (f)). After the vacuum degassing of the filler is completed, the exhaust device 120 is removed and the cap 130 is closed (FIG. 9 (g)).

  FIG. 10 is a plan view of the high-frequency induction heating device of the present invention as seen from the heated portion side, and shows a state where a substrate is attached.

  The susceptor 70 is supported by the support unit 60, and the substrate 100 is placed on the susceptor 70. The susceptor 70 is heated by a work coil disposed at a lower position, and heats the substrate 100 to be placed.

  The high-frequency induction heating apparatus of the present invention can be applied to substrate heating of a sputtering apparatus, a CVD apparatus, an ashing apparatus, an etching apparatus, an MBE apparatus, a vapor deposition apparatus, or the like.

It is a block diagram which arrange | positions the high frequency induction heating apparatus of this invention in a vacuum chamber, and shows a structure. It is a block diagram which arrange | positions the high frequency induction heating apparatus of this invention in a vacuum chamber, and shows a structure. It is sectional drawing for demonstrating the structure of the high frequency induction heating apparatus of this invention. It is a figure which shows the structural example for carrying out the vacuum degassing of the filler in the high frequency induction heating apparatus of this invention. It is a figure which shows the structural example for carrying out the vacuum degassing of the filler in the high frequency induction heating apparatus of this invention. It is a figure which shows the structural example for carrying out the vacuum degassing of the filler in the high frequency induction heating apparatus of this invention. It is a figure which shows the structural example for demonstrating the decompression degassing | defoaming by an exhaust part in the high frequency induction heating apparatus of this invention. It is a figure for demonstrating the procedure of potting and vacuum degassing | defoaming in the high frequency induction heating apparatus of this invention. It is a figure for demonstrating the procedure of potting and vacuum degassing | defoaming in the high frequency induction heating apparatus of this invention. It is the top view which looked at the high frequency induction heating apparatus of this invention from the to-be-heated part side.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... High frequency induction heating apparatus, 10 ... Conductor box, 20 ... Work coil, 21 ... High frequency shield, 22 ... High frequency power supply, 30 ... Dielectric base, 31 ... Space, 31a ... Projection part, 32 ... Spacer, 33 ... Filling 40 ... Electric field shield, 50 ... Thermal radiation reducing material, 51 ... Upper plate, 52 ... Lower plate, 60 ... Supporting part, 70 ... Susceptor (heated part), 80 ... Post, 81 ... Adapter flange, 82-86 ... O-ring, 87 ... O-ring retainer plate, 88 ... field through, 90 ... vacuum chamber, 100 ... substrate, 110 ... opening, 111 ... first flange, 111a ... opening, 112 ... second flange, 112a ... strut, 112b ... space, 113 ... third flange, 114-116 ... O-ring, 117, 118 ... flat packing, 120 ... exhaust device, 121 ... T-shaped flange, 122-1 4 ... Flange, 125 ... opening, 126 ... vacuum exhaust port, 127 ... exhaust pipe, 128a, 128b ... vacuum valve 129 ... vacuum pump, 130 ... Cap, 131 ... opening, 132 ... O-ring.

Claims (14)

In the heating mechanism using the high frequency induction heating action used in the reduced pressure environment,
A work coil that receives high-frequency power and heats the heated portion by induction current by high-frequency induction;
A dielectric base supporting the work coil;
A grounded conductor box covering the periphery of the dielectric base excluding the surface facing the heated portion;
A high-frequency induction heating apparatus, wherein a space between the dielectric base and the work coil is filled with a filler made of a dielectric material having good thermal conductivity.   The high-frequency induction heating apparatus according to claim 1, wherein the work coil is formed of a metal tube that allows cooling water to pass therethrough. The dielectric base is a molded body that has a space for housing the work coil by PET (polyethylene terephthalate) and is molded into a predetermined shape,
The high-frequency induction heating device according to claim 1, wherein the filler is defoamed by potting the dielectric material in the dielectric-based storage space and depressurizing.   The high frequency induction heating device according to claim 1 or 3, wherein the conductor box is configured by attaching a conductive thin plate to an outer peripheral surface of the dielectric base.   The high frequency induction heating device according to claim 4, wherein the conductive thin plate constituting the conductor box is constituted by a plurality of divided conductive thin plate units.   The high-frequency induction heating apparatus according to claim 1, further comprising an insulator cylinder that covers and at least covers one end of the work coil on a high-frequency power supply side. An adapter flange for holding both ends of the work coil on the conductor box and the dielectric base;
The adapter flange includes an opening that communicates with a space portion that holds the work coil in the dielectric base in a state where the conductor box and the dielectric base are connected to each other. 2. The high frequency induction heating device according to claim 1, wherein the induction and exhaust for decompressing the space in the dielectric base are performed. A flange for vacuum-sealing the open surface of the dielectric base;
The flange is in close contact with the exposed surface of the dielectric base and has a first flange made of PTFE having a plurality of openings;
A second flange constituting a decompression chamber with a metal material in close contact with the other surface of the first flange;
The first flange and the second flange are overlapped and brought into close contact with the dielectric base, whereby the space between the dielectric base and the work coil is sealed, and the opening of the first flange is set. 2. The high frequency induction heating device according to claim 1, wherein the space is depressurized by depressurization of the depressurization chamber of the second flange, and the filler filled in the space is degassed by passing through the section. . A work coil that receives high-frequency power and heats the heated portion by induction current by high-frequency induction;
A dielectric base supporting the work coil;
A grounded conductor box covering the periphery of the dielectric base excluding the surface facing the heated portion;
In a manufacturing method for manufacturing a high-frequency induction heating apparatus including a space between the dielectric base and the work coil and a filler made of a dielectric material having good thermal conductivity,
A flange for vacuum-sealing the open surface of the dielectric base;
The flange includes a first flange made of PTFE in close contact with the exposed surface of the dielectric base;
A second flange made of a metal material in close contact with the other surface of the first flange;
By overlapping the first flange and the second flange and bringing them into close contact with the dielectric base, the space between the dielectric base and the work coil is sealed, and the space is decompressed. A method for producing a high-frequency induction heating apparatus, wherein the filler filled in the space is degassed.   The high frequency according to claim 9, further comprising an O-ring groove in at least one of the first flange and the dielectric base and at least one of the first flange and the second flange. A method for manufacturing an induction heating apparatus.   A planar packing is inserted between the first flange and the dielectric base, and between the first flange and the second flange, and at least one of the opposing surfaces of the first flange and the dielectric base. The manufacturing method of the high frequency induction heating device according to claim 9, wherein at least one of the one surface and the opposing surfaces of the first flange and the second flange is a sealing surface. Method.   The first flange and the second flange are each provided with an opening at a position where they communicate with each other in an overlapped state, and charging of the filler and evacuation are performed through the both openings. The manufacturing method of the high frequency induction heating apparatus as described in any one of 1-11. A connection flange connected to a vacuum device is provided for the second flange,
The connection flange includes an opening at a position communicating with the opening provided in the second flange in a state where the connection flange is overlapped with the second flange, and the filler is charged and exhausted through the both openings. A method for manufacturing a high-frequency induction heating device according to any one of claims 9 to 11. An adapter flange for holding both ends of the work coil on the conductor box and the dielectric base;
The adapter flange includes an opening communicating with a space formed between the dielectric base and the work coil in a connection state between the conductor box and the dielectric base, and the filler flange is formed through the opening. 10. The method of manufacturing a high frequency induction heating device according to claim 9, wherein the charging and the exhaust for depressurizing the space in the dielectric base are performed.