JP5582819B2 - Processing equipment - Google Patents

Description

  The present invention relates to a processing apparatus, and more particularly, to a heat dissipation suppression structure for a processing container in a processing apparatus for performing plasma processing or the like.

  In the manufacturing process of an FPD (flat panel display), various plasma processes such as plasma etching, plasma ashing, and plasma film formation are performed on a glass substrate for FPD. As an apparatus for performing such plasma processing, a parallel plate type plasma processing apparatus, an inductively coupled plasma (ICP) processing apparatus, and the like are known.

  Here, in various plasma processing apparatuses, the temperature in the processing chamber rises due to the generation of plasma. However, since the plasma density in the vicinity of the processing chamber wall is usually low, temperature distribution occurs in the processing chamber. Due to this temperature distribution, reaction products may accumulate on the inner surface of the processing vessel. In particular, in a large apparatus that processes a large substrate, since the heat capacity of the processing container is large and the surface area of the processing container is large and heat is easily radiated, temperature distribution is likely to occur in the processing chamber, and deposition of reaction products increases. In addition, there is a concern that the in-plane uniformity of the plasma processing may be adversely affected.

  Therefore, in the plasma processing apparatus, the temperature of the processing container is adjusted by providing a flow path for flowing a heat medium on the wall of the processing container or attaching a heater.

  However, in recent years, processing vessels have also become larger in order to process large substrates, and the amount of heat released to the outside has increased, making uniform temperature control in the processing chamber more and more difficult. There is a lot of waste. Therefore, in order to improve the efficiency and energy saving of temperature control in the processing chamber, and as a safety measure such as preventing burns, the processing container is externally used by using a cloth cover material with a heat-resistant dust-proof cloth packed with heat insulating material. Covering is done. However, the cloth cover material has a problem that it takes time to attach and detach, and the processing cost is high.

  In order to suppress heat dissipation from the processing container and improve energy efficiency, Patent Document 1 proposes covering a vacuum container and a high-frequency induction heating coil with a casing in a vacuum heat treatment apparatus.

JP-A-8-134533 (FIG. 1 etc.)

  In recent years, some glass substrates for FPD have a side exceeding 3 m, and the size of a processing container for processing the glass substrate is as small as a building. Thus, it is not realistic to cover a large processing container with a larger casing from the outside. Therefore, the heat dissipation prevention measure of Patent Document 1 cannot be applied to a large processing container.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a processing container having a heat dissipation prevention structure that is easy to handle and can be applied to a large processing container.

  The processing apparatus of the present invention includes a processing container that forms a processing chamber for processing an object to be processed, and a heat dissipation suppression assembly that combines a plurality of plate materials that cover the outer wall surface of the processing container from the outside, and the plate By disposing the material away from the outer wall surface of the processing container, an air heat insulating portion is provided between the processing container and the heat dissipation suppressing assembly.

  The plate material may be made of metal or resin.

  In the processing apparatus of the present invention, the surface of the plate material facing the processing container may be mirror-finished.

  The processing apparatus of this invention may have an infrared reflective layer in the surface facing the said processing container of the said plate material.

  In the processing apparatus of the present invention, at least a part of the plate material may be formed of a visible light transmissive material.

  In the processing apparatus of the present invention, a spacer member may be provided on the outer wall surface of the processing container, and the plate material may be fixed to the spacer member. In this case, the air heat insulation part may be sealed by the spacer member. The spacer member may be formed of a heat insulating material.

  In the processing apparatus of the present invention, the thickness of the air heat insulating portion may be in the range of 5 mm to 20 mm. Moreover, the said air heat insulation part may be provided in the multilayer in part or entirely by arranging the said plate material in multiples partially or entirely. The object to be processed may be a rectangular substrate having a long side exceeding 2 m.

  According to the processing apparatus of the present invention, a heat dissipation suppression assembly is provided that combines a plurality of plate materials that cover the processing container from the outside, and an air heat insulating portion is provided between the processing container and the heat dissipation suppression assembly. Heat dissipation from the processing container can be suppressed, and the temperature adjustment efficiency of the processing container can be improved. Further, since the heat dissipation suppressing assembly is configured by combining a plurality of plate materials, it can be applied to a large processing container, can be easily attached and detached, and can be installed at a low cost. Moreover, there is almost no concern that causes particles.

  Therefore, the processing apparatus of the present invention is excellent in the efficiency of temperature control in the processing container by including the heat radiation suppressing assembly, and as a result, the target processing can be performed with high reliability. , Has the effect.

It is sectional drawing which shows typically the structure of the plasma etching apparatus which concerns on the 1st Embodiment of this invention. It is principal part sectional drawing of the plasma etching apparatus of FIG. It is a side view which shows the example of arrangement | positioning of the spacer in the plasma etching apparatus of FIG. It is a side view which shows the state which mounted | wore with the plate material in the plasma etching apparatus of FIG. It is principal part sectional drawing in the 5-5 line arrow in FIG. It is principal part sectional drawing in the 6-6 line arrow in FIG. It is a side view which shows another example of arrangement | positioning of the spacer in the plasma etching apparatus of FIG. It is sectional drawing which shows the modification of plate material. It is sectional drawing which shows another modification of plate material. It is principal part sectional drawing of the plasma etching apparatus which concerns on the 2nd Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is a sectional view showing a schematic configuration of a plasma etching apparatus as a first embodiment of the processing apparatus of the present invention. FIG. 2 is an enlarged cross-sectional view showing a main part of FIG. As shown in FIG. 1, a plasma etching apparatus 200 is a capacitively coupled parallel plate plasma etching that performs etching on, for example, an FPD glass substrate (hereinafter simply referred to as “substrate”) S as an object to be processed. It is configured as a device. Examples of the FPD include a liquid crystal display (LCD), an electro luminescence (EL) display, a plasma display panel (PDP), and the like.

  The plasma etching apparatus 200 has a processing container 101 formed into a rectangular tube shape made of aluminum, the inside of which is anodized (anodized). The main body (container main body) of the processing container 101 includes a bottom wall 101a and four side walls 101b (only two are shown). A lid 101c is joined to the upper part of the main body of the processing container 101.

  In addition, a heat medium flow path 101d is formed inside the four side walls 101b. An introduction pipe 102 and a discharge pipe 103 are connected to the heat medium flow path 101d. The chiller unit 104 as a heat medium circulation device provided outside the processing vessel 101 is connected via the introduction pipe 102 and the discharge pipe 103. The chiller unit 104 includes, for example, a heat exchanger and a circulation pump (not shown). The heat medium heats or cools the side wall 101b while circulating between the heat medium flow path 101d and the chiller unit 104 provided outside the apparatus by the action of a circulation pump (not shown). The heat medium flow path 101d, the introduction pipe 102, the discharge pipe 103, and the chiller unit 104 constitute temperature adjustment means for adjusting the temperature of the processing container 101.

  A heat dissipation suppression unit 105 as a “heat dissipation suppression assembly” is provided outside the sidewall 101 b of the processing container 101 so as to surround the periphery of the processing container 101. The heat dissipation suppression unit 105 is configured by combining a plurality of plate members 106. Each plate member 106 of the heat dissipation suppression unit 105 is attached to a spacer 107 disposed on the side wall 101 b of the processing container 101. The detailed structure of the heat dissipation suppression unit 105 will be described later.

  The lid 101c is configured to be openable and closable with respect to the side wall 101b by an opening / closing mechanism (not shown). In a state where the lid 101c is closed, the joint portion between the lid 101c and each side wall 101b is sealed by the O-ring 120, and the airtightness in the processing container 101 is maintained. A heat dissipation suppression unit 121 as a “heat dissipation suppression assembly” is provided outside the lid 101c so as to surround the periphery of the lid 101c. The heat dissipation suppression unit 121 is configured by combining a plurality of plate materials 122. Each plate material 122 of the heat dissipation suppression unit 121 is attached to a spacer 123 disposed on the lid 101c. Note that the heat radiation suppressing unit 121 outside the lid 101c may not be provided. Further, since the basic configuration of the heat dissipation suppression unit 121 is the same as that of the heat dissipation suppression unit 105, detailed description thereof is omitted.

  A frame-shaped insulating member 110 is disposed at the bottom in the processing container 101. On the insulating member 110, a susceptor 111, which is a mounting table on which the substrate S can be mounted, is provided. The susceptor 111 that is also a lower electrode includes a base material 112. The substrate 112 is made of a conductive material such as aluminum or stainless steel (SUS). The base material 112 is disposed on the insulating member 110, and a sealing member 113 such as an O-ring is provided at a joint portion between the two members to maintain airtightness. Airtightness is also maintained between the insulating member 110 and the bottom wall 101a of the processing vessel 101 by a sealing member 114 such as an O-ring. The outer periphery of the side portion of the base material 112 is surrounded by an insulating member 115. Thereby, the insulation of the side surface of the susceptor 111 is ensured, and abnormal discharge during plasma processing is prevented.

  Above the susceptor 111, a shower head 131 that functions as an upper electrode is provided in parallel to and opposite to the susceptor 111. The shower head 131 is supported by a lid body 101 c at the top of the processing container 101. The shower head 131 has a hollow shape, and a gas diffusion space 133 is provided therein. In addition, a plurality of gas discharge holes 135 for discharging a processing gas are formed on the lower surface of the shower head 131 (the surface facing the susceptor 111). The shower head 131 is grounded and constitutes a pair of parallel plate electrodes together with the susceptor 111.

A gas inlet 137 is provided near the upper center of the shower head 131. A processing gas supply pipe 139 is connected to the gas inlet 137. A gas supply source 145 for supplying a processing gas for etching is connected to the processing gas supply pipe 139 via two valves 141 and 141 and a mass flow controller 143. As the processing gas, for example, a rare gas such as Ar gas can be used in addition to a halogen-based gas or O ₂ gas.

  At positions close to the four corners in the processing vessel 101, four exhaust openings 151 penetrating the bottom wall 101a are formed. An exhaust pipe 153 is connected to each exhaust opening 151. The exhaust pipe 153 has a flange portion 153a at an end thereof, and is fixed with an O-ring (not shown) interposed between the flange portion 153a and the bottom wall 101a. The exhaust pipe 153 is connected to the exhaust device 155. The exhaust device 155 includes a vacuum pump such as a turbo molecular pump, for example, and is configured so that the inside of the processing vessel 101 can be evacuated to a predetermined reduced pressure atmosphere.

  Although not shown, the sidewall 101b of the processing container 101 is provided with a transfer opening for the substrate S that is opened and closed by a gate valve and a transmission window provided so that the inside of the processing container 101 can be seen. ing.

  A power supply line 171 is connected to the base material 112 of the susceptor 111. A high frequency power source 175 is connected to the feeder line 171 via a matching box (MB) 173. Thereby, for example, high frequency power of 13.56 MHz is supplied from the high frequency power source 175 to the susceptor 111 as the lower electrode. The power supply line 171 is introduced into the processing container 101 through a power supply opening 177 as a through opening formed in the bottom wall 101a.

  Next, details of the heat dissipation suppression unit 105 will be described. The heat radiation suppression unit 105 is disposed along the side wall 101b so as to cover a part or substantially the entire outer wall surface of each side wall 101b of the processing container 101. In the present embodiment, the plate material 106 of the heat dissipation suppression unit 105 is arranged so as to cover from a position slightly below the upper end of the side wall 101b of the processing container 101 (boundary with the lid 101c) to the vicinity of the lower end of the side wall 101b. ing. When the gate valve, the opening for transporting the substrate S, the transmission window for confirming the state of plasma, and the like are arranged on the side wall 101b of the processing container 101, the heat radiation suppressing unit 105 can be provided avoiding that part. It is not always necessary to cover the entire side wall 101b.

  The heat dissipation suppression unit 105 includes a plurality of plate members 106 and a spacer 107 that supports the plate members 106. For the plate member 106 constituting the heat dissipation suppressing unit 105, for example, stainless steel, a metal material such as aluminum or an aluminum alloy like the processing container 101, or a heat-resistant resin material can be used.

  The shape of each plate material 106 is arbitrary, but may be a rectangular plate shape, for example. In the present embodiment, each plate member 106 is a plate-like member having a plane with an area smaller than the area of one side wall 101 b of the processing container 101. In addition, the magnitude | size of each plate material 106 may be the same, and may differ. Moreover, the shape of each plate material 106 may be aligned in the same shape, and may differ. Further, when the processing container 101 has a cylindrical shape, the heat dissipation suppression unit 105 can be a cylindrical enclosure having a larger diameter than the processing container 101. In this case, the plate material 106 can have a curved shape obtained by dividing the cylinder into an arbitrary number.

  As shown in FIG. 2, in the present embodiment, the vicinity of the upper end of the plate material 106 is bent in an L shape, and the bent portion 106a is hung on the upper surface of the spacer 107 arranged at the top. . The bent portion 106a acts to prevent the air in the air heat insulating portion 180 from escaping upward due to a gap formed between the upper end of the plate member 106 and the spacer 107. In addition, by providing the bent portion 106a, attachment work and positioning when the plate material 106 is attached to the spacer 107 are facilitated. In addition, the plate material 106 does not need to have the bending part 106a.

  Since the plate material 106 also has a design effect of adjusting the appearance of the processing container 101, it is a substitute for a decorative plate. That is, by disposing the plate member 106, it is not necessary to dispose a decorative plate in the processing container 101.

  Each plate member 106 is attached to a spacer 107 disposed on the outer wall surface of the side wall 101 b of the processing container 101. Each plate member 106 is mounted apart from the processing container 101 by interposing a spacer 107. A space formed between the side wall 101 b of the processing container 101 and the plate material 106 forms an air heat insulating portion 180. The distance between the side wall 101b of the processing container 101 and the plate material 106 (that is, the thickness of the air heat insulating portion 180) may be determined in consideration of the required heat insulating effect and application to a large processing container. In the present embodiment, for example, it is preferably about 5 mm to 20 mm, and more preferably about 7 mm to 12 mm. Moreover, the thickness of the air heat insulation part 180 may not be constant as long as it is not less than a necessary thickness. For example, the upper part of the side wall 101b may be thicker than the lower part.

  The heat dissipation suppressing unit 105 of the present embodiment uses a large number of plate materials 106 that are smaller than the side wall 101b of the processing container 101 in combination so that the processing container 101 targets a large substrate S as a processing target. Even if it is a thing, it can be attached and removed without any obstacles. In addition, since the heat dissipation suppression unit 105 is configured by combining a plurality of plate materials 106 smaller than the side wall 101b, the size and shape of the plate material 106 can be changed according to the shape of the processing container 101. . Therefore, it is possible to deploy the plate material 106 using the spacer 107 while keeping the thickness of the air heat insulation portion 180 at a necessary thickness, and excellent heat insulation efficiency can be obtained. Temporarily, when the structure (for example, patent document 1) which covers the whole processing container 101 with a big housing | casing is employ | adopted, while applying to a large processing container is difficult, the space | interval of a processing container and a housing | casing is constant. Therefore, the effect of air insulation differs depending on the part, and a sufficient heat radiation suppression effect may not be obtained.

  Further, in order to avoid direct heat conduction from the processing container 101 to the plate material 106, each plate material 106 preferably does not have a portion in surface contact with the side wall 101b of the processing container 101. More preferably, the container 101 is brought into a completely non-contact state.

  Further, it is preferable that the inner surface of the plate material 106 (the surface facing the outer wall surface of the side wall 101b of the processing container 101) is subjected to mirror finishing or the like so as to have a high reflectance. By mirror-finishing the inner surface of the plate material 106, infrared rays radiated from the processing container 101 can be reflected, heat radiation to the outside can be suppressed, and the heat insulation performance by the air heat insulation unit 180 can be improved.

  The spacer 107 has a function of fixing the plate material 106 to the side wall 101b of the processing container 101 with a certain distance. That is, the spacer 107 has a function of supporting and fixing the plate material 106 and a function of securing the thickness of the air heat insulating portion 180 by being interposed between the plate material 106 and the side wall 101b. The spacer 107 can withstand the temperature of the processing vessel 101 and can be formed of a heat insulating material with low thermal conductivity. By forming the spacer 107 with a heat insulating material, heat conduction from the processing vessel 101 to the plate material 106 via the spacer 107 can be suppressed. Examples of the heat insulating material include resin materials such as polycarbonate, fluororesin, polyimide, polyamideimide, polyphenylene sulfide, polyethersulfone, polysulfone, and epoxy glass, fluororubber, silicone rubber, fluorosilicone rubber, and perfluoropolyether rubber. A rubber material such as acrylic rubber or ethylene propylene rubber can be used.

  FIG. 3 is a side view showing an example of arrangement of the spacers 107 on the outer wall surface of an arbitrary side wall 101b of the processing container 101. FIG. In the example shown in FIG. 3, a total of nine spacers 107 are arranged on the outer wall surface of one side wall 101b, three each in length and width. The arrangement position and the number of the spacers 107 are arbitrary as long as the plurality of plate members 106 can be fixed. In the present embodiment, the spacer 107 has a long prismatic shape, but the shape is not particularly limited. The spacer 107 may have, for example, an L shape or a cross shape in plan view, or may be a frame shape such as a quadrangle or a U shape (U shape).

  FIG. 4 shows a state in which the plate material 106 is attached to the spacer 107 provided in the state of FIG. 3 and the heat radiation suppressing unit 105 is provided in the processing container 101. In FIG. 4, the position of the spacer 107 is clarified by a broken line. In this example, three plate members 106A, 106B, and 106C are attached to the outside of one side wall 101b. Note that the number of plate members 106 arranged on one side wall 101 b is not limited to three, and an arbitrary number can be selected according to the size of the processing container 101.

  The spacer 107 is fixed to the processing container 101 by a screw 108. In addition, the plate material 106 is fixed to the spacer 107 by a screw 109 different from the screw 108 for fixing the spacer 107 in order to minimize heat conduction from the processing container 101 to the plate material 106 via the screw 108. Note that the spacer 107 and the plate material 106 may be fastened to the processing vessel 101 as long as the screw has low heat conduction. The means for fixing the spacer 107 and the plate material 106 is not limited to the screws 108 and 109. For example, it is possible to attach the plate material 106 to the spacer 107 more easily by attaching a male or female fitting structure to the spacer 107 and the plate material 106 or by hooking the plate material 106 to the spacer 107. .

  The joint between the plate material 106A and the plate material 106B, and the joint between the plate material 106B and the plate material 106C overlap with each other with a slight width (for example, 2 to 10 cm), and air in the air heat insulation portion 180 leaks to the outside as much as possible. Is configured to not. Specifically, as shown in FIG. 5, for example, the vicinity of the end portion of the plate material 106B is bent outward and overlapped so as to cover the end portion of the plate material 106A from the outside. FIG. 6 shows a cross section of a corner portion of the heat dissipation suppression unit 105. In the corner portion of the heat dissipation suppression unit 105, the plate material 106A is bent substantially at a right angle along the shape of the corner of the processing container 101. The end portions of the plate material 106A are overlapped and joined so as to cover the end portions of the plate material 106D (not shown in FIG. 4) covering the adjacent side wall 101b orthogonal to the side wall 101b shown in FIGS. ing. In addition, the shape of the corner portion of the heat dissipation suppression unit 105 may be an arc shape or a shape bent at a plurality of obtuse angles in consideration of safety.

  Thus, by assembling the heat dissipation suppressing unit 105 by overlapping the end portions of the plate material 106, it is possible to eliminate the gap at the joining portion of the plate material 106 and to prevent the air in the air heat insulating portion 180 from leaking to the outside. The portion where the adjacent plate members 106 overlap may be fixed with, for example, a screw (not shown). The gap between the end portions of the plate material 106 may be covered with another member without overlapping the end portions of the plate material 106.

  Moreover, the air heat insulation part 180 can be sealed using the spacer 107. FIG. 7 shows a configuration example in which long spacers 107A having a length substantially equal to the lateral length of the side wall 101b are disposed on the upper and lower sides of the side wall 101b in order to fix the upper and lower ends of the plate material 106. Is shown. A spacer 107 having the same shape as that in FIG. 3 is provided at a substantially intermediate position in the vertical direction of the side wall 101b. By using the long spacer 107 </ b> A, the air heat insulating portion 180 can be sealed near the upper end and the lower end of the plate material 106. That is, the upper and lower sides of the air heat insulation portion 180 are sealed by the spacer 107A, and the air in the air heat insulation portion 180 is suppressed from escaping to the outside, so that the heat insulation efficiency can be improved. The same effect can be obtained by replacing the long spacer 107A in FIG. 7 with the shorter spacers 107 continuously in the lateral direction without any gaps. In the example shown in FIG. 7, the long spacers 107A are provided on both the upper and lower portions of the side wall 101b. However, the left and right end portions of the side wall 101b are also provided with spacers 107A along the end portions. The top, bottom, left, and right of the air heat insulation unit 180 may be sealed by the spacer 107A. On the other hand, for example, a long spacer 107A may be provided only on the upper portion of the side wall 101b to seal only the upper portion of the air heat insulating portion 180.

  Next, the processing operation in the plasma etching apparatus 200 configured as described above will be described. First, a substrate S, which is an object to be processed, is loaded into the processing container 101 by a fork of a transfer device (not shown) through a substrate transfer opening with a gate valve (not shown) opened, and delivered to the susceptor 111. The Thereafter, the gate valve is closed, and the inside of the processing container 101 is evacuated to a predetermined degree of vacuum by the exhaust device 155.

  Next, the valve 141 is opened, and the processing gas is introduced from the gas supply source 145 into the gas diffusion space 133 of the shower head 131 through the processing gas supply pipe 139 and the gas introduction port 137. At this time, the flow rate of the processing gas is controlled by the mass flow controller 143. The processing gas introduced into the gas diffusion space 133 is further uniformly discharged to the substrate S placed on the susceptor 111 through the plurality of discharge holes 135, and the pressure in the processing container 101 becomes a predetermined value. Maintained.

  In this state, high frequency power is applied from the high frequency power source 175 to the susceptor 111 via the matching box 173. As a result, a high-frequency electric field is generated between the susceptor 111 as the lower electrode and the shower head 131 as the upper electrode, and the processing gas is dissociated into plasma. The substrate S is etched by this plasma.

  After performing the etching process, the application of the high frequency power from the high frequency power source 175 is stopped, the gas introduction is stopped, and then the inside of the processing container 101 is decompressed to a predetermined pressure. Next, the gate valve is opened, the substrate S is transferred from the susceptor 111 to a fork of a transfer device (not shown), and the substrate S is unloaded from the transfer opening of the processing container 101. With the above operation, the plasma etching process for the substrate S is completed.

  In the course of the above processing, in the plasma etching apparatus 200, the temperature of the heat medium flow path 101d provided in the processing container 101 is formed by surrounding the processing container 101 with the heat dissipation suppressing unit 105 and forming the air heat insulating portion 180. Adjustment efficiency can be increased. Therefore, it is possible to obtain an effect of suppressing the adhesion of deposits in the processing container 101 and improving the in-plane uniformity of the plasma etching process. Moreover, since the heat dissipation suppression unit 105 has an assembled structure in which a plurality of plate members 106 are combined, it can be easily attached and detached, and is suitable for a large processing container 101. Further, since the heat dissipation suppression unit 105 is composed of the plate material 106, it hardly causes particles.

  Note that the plate member 106 can be made of a material other than a metal material. FIG. 8 shows a modification in which the plate material 106 is formed of a visible light transmissive transparent material. Examples of the transparent material that can be used for the plate material 106 include acrylic resin and polycarbonate. By using a transparent material as the material of the plate material 106, the visibility of the plasma etching apparatus 200 can be improved. For example, when a transmission window (not shown) for checking the inside (processing chamber) is provided on the side wall 101b of the processing container 101, heat radiation is suppressed from the outside without avoiding the position of the transmission window. Even if it is covered with the unit 105, the state in the processing chamber can be confirmed through the transparent plate 106 and the transmission window. In this case, only the portion corresponding to the position where the transmission window is disposed can be replaced with the transparent plate 106.

  FIG. 9 shows a modification in which an infrared reflecting layer 190 is provided on the inner surface of the plate material 106 (the surface facing the outer wall surface of the side wall 101b of the processing container 101). The infrared reflective layer 190 can be formed by coating the surface of the plate material 106 with an infrared reflective paint or laminating an infrared reflective film. As the infrared reflective paint, for example, ATTSU-9 (trade name; manufactured by Nippon Paint Co., Ltd.) can be used. As the infrared reflective film, for example, Nano 70S (trade name; manufactured by Sumitomo 3M Limited) or the like can be used. As illustrated in FIG. 8, when the plate member 106 is formed of a transparent material, the infrared reflective layer 190 is formed using a visible light transmissive infrared reflective paint or a visible light transmissive infrared reflective film. It is preferable. As the visible light transmissive infrared reflective film, for example, Nano-80S (trade name; manufactured by Sumitomo 3M Limited) or the like can be used.

[Second Embodiment]
Next, a plasma etching apparatus according to a second embodiment of the processing apparatus of the present invention will be described with reference to FIG. FIG. 10 is an enlarged view showing a cross-section of the main part of the processing container 101 corresponding to FIG. 2 in the first embodiment. In the following description, differences from the first embodiment will be mainly described, and description of the same configuration as that of the first embodiment in the second embodiment will be omitted.

  As shown in FIG. 10, the heat dissipation suppression unit 201 of the plasma etching apparatus of the present embodiment includes an inner plate material 202 close to the side wall 101 b and an outer plate material 203 disposed outside the inner plate material 202. ing. Thereby, the air heat insulation part has the double heat insulation structure of the inner side heat insulation part 180a and the outer side heat insulation part 180b. The inner heat insulating portion 180 a is a space between the outer wall of the side wall 101 b and the inner plate member 202 defined by the first spacer 204 interposed. The outer heat insulating portion 180b is a space between the inner plate member 202 and the outer plate member 203 that is defined by the second spacer 205 interposed therebetween.

  A first spacer 204 is fixed to the outer wall of the processing container 101 by screws, for example, and the inner plate member 202 is fixed to the first spacer 204. The second spacer 205 is fixed to the first spacer 204 via the inner plate member 202, and the outer plate member 203 is fixed to the second spacer 205. The inner plate member 202, the outer plate member 203, and the second spacer 205 can be fixed by, for example, screws.

  Further, the first spacer 204 is fixed to the outer wall of the processing container 101 by, for example, a screw, the second spacer 205 and the inner plate material 202 are fixed to the first spacer 204 by a screw passing through them, The outer plate member 203, the second spacer 205, and the inner plate member 202 may be fixed to the first spacer 204 with screws passing through them.

  In addition, the first spacer 204 is fixed to the outer wall of the processing container 101 by, for example, a screw, and the second spacer 205, the inner plate member 202, and the first spacer 204 are fixed to the outer wall of the processing container 101 by a screw passing through them. Further, the outer plate member 203, the second spacer 205, and the inner plate member 202 may be fixed to the first spacer 204 by screws passing through them.

  Further, for example, a structure in which a second spacer 205 is provided between the inner plate member 202 and the outer plate member 203 may be assembled in advance and fixed to the first spacer 204.

  Thus, the effect of suppressing heat release from the processing container 101 can be further enhanced by providing the air heat insulating portion with a double structure.

  The structure of the joint portion between the inner plate members 202 and the outer plate member 203 in the heat dissipation suppression unit 201 of the present embodiment is the same as that of the first embodiment. Similarly to the plate material 106 of the first embodiment, both the inner plate material 202 and the outer plate material 203 can be made of a transparent material, and the inner plate material 202 and the outer plate material 203. The inner wall surface (surface on the processing container 101 side) can be mirror-finished or provided with an infrared reflection layer.

  Further, in one processing container 101, a portion where a single air heat insulating portion (see the first embodiment) is provided according to a part and a portion where a double air heat insulating portion is provided can be combined. . For example, by providing a double heat insulation unit in a part of the processing vessel 101 where heat dissipation is particularly large and disposing a heat dissipation suppression unit provided with a single air insulation part in the other part, effective heat suppression can be achieved. realizable. Note that the air heat insulating portion is not limited to double, and may be triple or more. As described above, the air heat insulating portion can be partially or entirely provided in multiple layers by arranging the plate materials in part or entirely in multiple layers.

  Other configurations and effects in the second embodiment are the same as those in the first embodiment, and thus description thereof is omitted.

  As mentioned above, although embodiment of this invention was described in detail for the purpose of illustration, this invention is not restrict | limited to the said embodiment. Those skilled in the art can make many modifications without departing from the spirit and scope of the present invention, and these are also included within the scope of the present invention. For example, although the parallel plate plasma processing apparatus has been described as an example in the above-described embodiment, the present invention can be applied to, for example, an inductively coupled plasma processing apparatus, a surface wave plasma processing apparatus, an ECR (Electron Cyclotron Resonance) plasma processing apparatus, and a helicon wave. The present invention can also be applied to other types of plasma processing apparatuses such as a plasma processing apparatus. Further, as long as the temperature in the chamber needs to be adjusted, the present invention is not limited to a dry etching apparatus but can be equally applied to a film forming apparatus, an ashing apparatus, and the like.

  In addition, the present invention is not limited to the FPD substrate used as an object to be processed, and can be applied to, for example, a semiconductor wafer or a solar cell substrate used as an object to be processed.

  Moreover, the heat dissipation suppression unit of each of the above embodiments can be applied to a processing container that does not have a temperature adjusting means.

  DESCRIPTION OF SYMBOLS 101 ... Processing container, 101a ... Bottom wall, 101b ... Side wall, 101c ... Cover body, 101d ... Heat-medium flow path, 105 ... Radiation suppression unit, 106 ... Plate material, 107 ... Spacer, 108 ... Screw, 109 ... Screw, 111 DESCRIPTION OF SYMBOLS ... Susceptor, 112 ... Base material, 113, 114 ... Seal member, 115 ... Insulating member, 131 ... Shower head, 133 ... Gas diffusion space, 135 ... Gas discharge hole, 137 ... Gas inlet, 139 ... Process gas supply pipe, 141 ... Valve, 143 ... Mass flow controller, 145 ... Gas supply source, 151 ... Exhaust opening, 153 ... Exhaust pipe, 153a ... Flange, 155 ... Exhaust device, 171 ... Feed line, 173 ... Matching box (MB 175 ... High frequency power supply, 180 ... Air heat insulation part, 200 ... Plasma etching apparatus.

Claims (10)

A processing container for forming a processing chamber for processing a rectangular substrate having a long side exceeding 2 m ;
A heat dissipation suppression assembly that combines a plurality of plate materials covering the outer wall surface of the processing container from the outside, and
With
The plate material is disposed apart from the outer wall surface of the processing container, and the adjacent plate materials overlap at a joint portion, and an end portion of one plate material is bent to end the other plate material. The processing apparatus which has an air heat insulation part between the said process container and the said heat dissipation suppression assembly by covering the part.   The processing apparatus according to claim 1, wherein the plate material is made of metal or resin. The processing apparatus according to claim 1, wherein a surface of the plate material facing the processing container is mirror-finished.   The processing apparatus of any one of Claim 1 to 3 which has an infrared reflective layer in the surface facing the said processing container of the said plate material.   The processing apparatus according to any one of claims 1 to 4, wherein at least a part of the plate material is formed of a visible light transmissive material.   The processing apparatus according to claim 1, wherein a spacer member is provided on an outer wall surface of the processing container, and the plate material is fixed to the spacer member.   The processing apparatus according to claim 6, wherein the air heat insulating portion is sealed by the spacer member.   The processing apparatus according to claim 6 or 7, wherein the spacer member is formed of a heat insulating material.   The processing apparatus according to any one of claims 1 to 8, wherein a thickness of the air heat insulating portion is within a range of 5 mm to 20 mm.   10. The air heat insulating portion is provided in multiple layers partially or entirely by arranging a plurality of the plate members partially or entirely in a state of being separated from each other. The processing apparatus according to item 1.

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