JPH01308037A - Feed of solder - Google Patents

Abstract

PURPOSE:To make possible an omission of a process, to contrive an increase in efficiency and to make possible a significant reduction in a cost by a method wherein a powdery solder is fed using a solder feeding plate, the solder feeding plate is heated to form the solder into spherical shapes and the solder feeding plate formed with the spherical solders is bonded to such a part to be fed as the input/output terminal part of a semiconductor element. CONSTITUTION:A solder feeding device is constituted of a receiving stand 4, a solder feeding plate 3, which is placed on this stand 4 and has solder feeding hole parts 6, and a compression plate 1 which force fits a powdery solder 2 fed to the plate 3 in the hole parts 6. At the time of feed of the solder, the plate 3 is installed on the stand 4 and the solder 2 is fed to the hole parts 6 of the plate 3. Then, the put-in solder is force-fitted in the hole parts using the plate 1 and the plate 3 with the solder force-fitted therein is taken out. Then, the above plate 3 is heated to form the solder into ball shapes, this solder feeding plate formed with the ball-shaped solders is bonded to such a part 5 to be fed as an input/output terminal part of a semiconductor element and after they are positioned to each other, the ball-shaped solders are transferred to the input/output terminal part by heating in a bump shape and the terminal part is raised. Thereby, a soldering work to numerous independent places can be simultaneously executed by a simple process.

Description

[Detailed description of the invention] <Industrial application field> The present invention relates to a method for supplying solder in semiconductor devices.

<Conventional technology> Generally, when mounting semiconductor element (chip) parts on a board,
The mainstream connection method is soldering. This soldering method includes a preliminary soldering method and a solder fusion connection method, and there is a flow soldering method that combines both of these methods at one time.

This flow soldering method begins with preliminary soldering: ■ solder immersion, ■ jet soldering, ■ solder base, ■ solder plating,
■Solder vapor deposition, ■molded solder (sheet, ball shape), etc. are performed, and connection methods include whole surface heating, local heating, etc., and each method is selected depending on the material and physical properties of the object to be bonded, the size of the connection part, etc. is used.

<Problems to be Solved by the Invention> Conventionally, in the above-mentioned connections, especially those with a high degree of integration, a method has been adopted in which solder is supplied to each location one by one.

However, this method requires time and effort, and the work becomes more difficult as the number of semiconductor elements per unit area increases.

For example, a semiconductor integrated circuit (IC) package measuring 10 to 20 mm square often has 400 to 500 or more input/output terminals, and it takes a considerable amount of time even for high-speed automatic machines. Furthermore, the solder itself is extremely small, and the spacing between the solders is also extremely small, requiring an automatic machine that can handle at high speed and with high precision, and most of all, it costs a lot of money.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a solder supply method that is easy to work with and does not require much cost without using an automatic machine when mounting a semiconductor element on a substrate.

Means for Solving the Problems> The present inventor has solved the above object (when supplying solder used for mounting a semiconductor element on a substrate to an input/output terminal portion of the semiconductor element, the input/output terminal portion of the semiconductor element is A predetermined amount of powdered solder is mounted on a solder supply plate having a predetermined-shaped hole at a position corresponding to the output terminal portion, and after forming the powdered solder into a ball shape by heating, heating and bonding a solder supply plate to the input/output terminal portion of the semiconductor element;
A solder supply method is provided, characterized in that the solder is transferred to the input/output terminal portion in a convex shape.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The solder supply method of the present invention will be specifically described below based on preferred embodiments shown in the accompanying drawings.

FIG. 1 is a schematic cross-sectional view showing an example of the configuration of a solder supply device that implements a solder supply method according to the present invention.

As shown in the figure, the solder supply device includes a pedestal 4, a solder supply plate 3 placed on the pedestal 4 and having a solder supply hole 6, and powdered solder supplied to the solder supply plate 3. 2 is press-fitted into the hole 6.

The solder supply plate 3 used in the present invention has holes 6 at positions corresponding to input/output terminal portions, ie, electrodes, of a semiconductor element. The holes 6 only need to correspond to the electrodes of the semiconductor element, and their number and size are not particularly limited.

This solder supply plate 3 may be made of any material as long as it has excellent heat resistance, is easy to handle, and does not cause deformation or distortion in the holes 6 even after repeated use, such as a stainless steel plate (SLIS304). It is better to use

Next, the holes 6 may be opened in the solder supply plate 3 by any known method, such as mechanical drilling, etching, mechanical drilling using a drilling machine, lathe, etc.
Holes may be formed using a slicing machine or the like. In particular, the etching method is effective in microfabrication.

The shape of the hole 6 may be any shape as long as it can suitably press-fit the powdered solder, heat it into a ball shape, and then transfer it to the electrode of the semiconductor element, but a tapered hole as shown in FIG. Preferably, the hole is a tapered circular hole.

The size of the hole 6 is determined as appropriate depending on the amount of solder supplied, but preferably about 50 to 250 μm is suitable for general semiconductor devices.

The appropriate depth of the hole is 100 to 300 μm, and the bottom may or may not be penetrating.
It is better to stick to it. This is to increase the solder filling rate, improve the accuracy of the supply amount, and further facilitate cleaning.

The first step of the solder supply method of the present invention is to install the solder supply plate 3 on the pedestal 4 and supply powdered solder to the hole 6 of the solder supply plate.

This powdered solder is not particularly limited in its shape and size, but it is convenient to use a particle size of 5 to 50 μm.

0.5 to 5 kg of the introduced powdered solder is compressed using the compression plate 1.
The solder is compressed with a force of /am2 and press-fitted into the hole 6.

Note that the pedestal 4 may be of any type as long as it is sturdy and has good heat resistance.

As shown in FIG. 2, the solder supply plate 3 into which the powdered solder was press-fitted by the above method is taken out.

Next, in a second step, as shown in FIG. 3, the solder supply plate 3 is heated to form the solder into a ball shape.

This is because the solder melts due to heating and is caused by surface tension. For heating, use a soaking furnace, continuous furnace, etc., and raise the temperature to the melting point of the solder. In this case, in order to make it easier to form into a ball, it is recommended to apply a mold release agent with mold releasability to the surface of the hole in advance to prevent adhesion between the solder supply plate 3 and the solder and to help protect the mold. to read. As the mold release agent, a carbon-based or chlorine-based lubricant that satisfies requirements such as adhesion to the mold and lubricity is suitable.

In the third and final step of the present invention, the solder supply plate 3 on which the ball-shaped solder has been formed as described above is applied to the solder supply plate 3 on the solder supply portion 5 such as the input/output terminal portion (electrode) of the semiconductor element as shown in FIG.
After bonding and positioning, it is transferred to the input/output terminal part in a bump shape by heating and pulled up.

The compression surface of the compression plate 1 may be flat as shown in FIG. 1, or may have a convex portion matching the hole as shown in FIG. 5. Further, it is better to remove solder that does not fit into the hole 6 and protrudes when powdered solder is introduced or compressed.

The present invention is basically constructed as described above, and its main purpose is to perform precise soldering, and moreover, to apply accurate soldering to many parts of a small surface at the same time, but the present invention is not limited to this. Of course, various improvements and changes in design are possible without departing from the gist of the present invention, such as modifications such as a patch type, and applications that can be continuously supplied as a hoop material. .

Another specific example of the method for making the holes 6 in the solder supply plate 3 described above will be shown below.

The substrate of the solder supply plate 3 has 5i0 on the surface to the silicon wafer.
It is preferable to deposit a film of 2, Si, N4, etc. by CVD.

At this time, silicon wafer 8 and 5in2 or Si3N4
An ITO liquid may be applied in between.

The reason for using SiO2% Si, N4% ITO, etc. is that when the solder is later formed into a ball shape and joined to the supplied portion 5 and pulled up, it is easy to release the solder from the mold.

Another example of a method for opening the holes 6 for supplying solder in the solder supply plate 3 is the method of performing dry etching with (CF+82) while covering and protecting the board with resist as described above.

It is also possible to fill the hole 6 thus formed with solder to form a solder ball.

<Effects of the Invention> According to the solder supply method of the present invention, steps can be omitted in the conventional connection method for mounting semiconductor element (chip) components on a board, and efficiency can be improved, resulting in a significant cost reduction. be.

In other words, the method of supplying and bonding solder using a solder supply plate as in the method of the present invention is a short and simple process.
Soldering to many independent points at the same time is a method that allows you to work.

This method becomes more effective as the number of input/output terminals of the semiconductor device increases, that is, as the degree of integration increases.

Furthermore, in order to make the method of the present invention even more possible, the holes in the solder supply plate may be processed in advance to have the same pattern as the electrodes of the semiconductor element, which is the plate to be supplied, to further miniaturize the solder. It is possible and a greater effect can be expected.

It is also economical because it can be used repeatedly.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing an example of the configuration of an apparatus for carrying out the solder supply method of the present invention. FIG. 2 is a cross-sectional view of a solder supply plate filled with powdered solder made by the method of the present invention. FIG. 3 is a sectional view of a solder supply plate on which solder is formed into a ball shape by heating in the method of the present invention. FIG. 4 is a cross-sectional view of the solder supply plate formed as shown in FIG. 3 transferred to a supplied portion and pulled up. Like FIG. 1, FIG. 5 is a schematic sectional view showing an example of the configuration of an apparatus for carrying out the solder supply method of the present invention. Explanation of symbols 1... Compressed plate, 2... Powdered solder, 3...
・Solder supply plate, 4... pedestal, 5... supplied part,
6... Hole FIG, 1

Claims (1)

[Claims] (1) When supplying solder used for mounting a semiconductor element onto a substrate to an input/output terminal portion of the semiconductor element, a solder supply having a hole of a predetermined shape in advance at a position corresponding to the input/output terminal portion. A predetermined amount of powdered solder is loaded into the hole portion of the plate, and the powdered solder is heated to form a ball shape, and then the solder supply plate is heated and bonded to the input/output terminal portion of the semiconductor element. A solder supply method characterized by transferring the solder in a convex shape to an input/output terminal portion.