JPH02179395A - Production of silver brazing grain - Google Patents
Production of silver brazing grainInfo
- Publication number
- JPH02179395A JPH02179395A JP33386988A JP33386988A JPH02179395A JP H02179395 A JPH02179395 A JP H02179395A JP 33386988 A JP33386988 A JP 33386988A JP 33386988 A JP33386988 A JP 33386988A JP H02179395 A JPH02179395 A JP H02179395A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- mold material
- holes
- powder
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 9
- 239000004332 silver Substances 0.000 title claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000000843 powder Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 239000000945 filler Substances 0.000 claims abstract description 8
- 229910001316 Ag alloy Inorganic materials 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 238000005245 sintering Methods 0.000 claims abstract description 4
- 239000002245 particle Substances 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 238000000889 atomisation Methods 0.000 abstract description 2
- 229910052799 carbon Inorganic materials 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣ等に取りつけるリードビンに予め付けて
おく銀ろうの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing silver solder that is attached in advance to a lead bin to be attached to an IC or the like.
ＩＣ等に用いられているリードビンを図面を用いて説明
する。Lead bins used for ICs and the like will be explained using drawings.
第３図はリードビンを被ろう付は物にろう付けした状態
の断面図、第４図はリードビンにろう材を付ける状態の
断面図であり、図において１は釘状のリードビン、２は
このリードビン１を取り付けるＩＣ等の部材であり、リ
ードビン１を取り付ける箇所には必要に応じてメタライ
ズされた端子部３があり、上記リードビン１がろう４に
よってろう付けされる。Figure 3 is a cross-sectional view of a lead bin being brazed to an object, and Figure 4 is a cross-sectional view of a lead bin with brazing material attached. In the figure, 1 is a nail-shaped lead bin, and 2 is a lead bin. A metalized terminal portion 3 is provided at the location where the lead bin 1 is attached, as required, and the lead bin 1 is brazed with a solder 4.
そこで、一般にリードビン１の頭部１ａには予めろう４
を付けておくとろう付は加工が非常に作業性にすぐれる
ためにリードビン１の頭部１ａにろう４が予め付けられ
ている。Therefore, generally the head 1a of the lead bin 1 is filled with wax 4.
The solder 4 is pre-attached to the head 1a of the lead bin 1 because the workability of the brazing process is very high if the lead bin 1 is attached.
そこで、このリードビン１の頭部１ａにろう４を付ける
加工を第４図を用いて説明すると、リードビン１の頭部
１ａが丁度入る径で、リードビン１の全長より深くした
底付穴５ａを有する治具５の底付穴５ａ内に頭部１ａを
上にしてリードビン１を挿入し、その脚部１ｂ先端を底
に付けた状態で頭部１ａ上面に粒状のろう材４を載せ、
その粒状のろう材４を焼成して付け、第５図に示すよう
な製品にしていた。Therefore, the process of attaching the solder 4 to the head 1a of the lead bin 1 will be explained using FIG. 4. The bottom hole 5a has a diameter that is just enough for the head 1a of the lead bin 1 to fit in, and is deeper than the entire length of the lead bin 1. The lead bottle 1 is inserted into the bottom hole 5a of the jig 5 with the head 1a facing upward, and the granular brazing material 4 is placed on the top of the head 1a with the tips of the legs 1b touching the bottom.
The granular brazing filler metal 4 was baked and applied to produce a product as shown in FIG.
ところが、上記の従来技術によると、リードビンの頭部
に付ける粒状のろう材は、線材や板材に加工した後、定
量を切断したりプレス加工で打ち抜いて製造したりして
いるが、その量が非常に微量であるために定量にするこ
とは困難な作業であり、塑性加工を含めて加工設備や加
工時間が非常に悪いという問題がある。However, according to the above-mentioned conventional technology, the granular brazing material to be attached to the head of the lead bin is manufactured by processing it into wire rods or plates and then cutting or punching them in fixed quantities, but the amount is limited. Since the amount is extremely small, it is difficult to quantify it, and there is a problem that processing equipment and processing time, including plastic processing, are very poor.
また、その量が定量より少ないと、被ろう付は物にろう
付けしたときの接着強度に問題が生じ、その量が多いと
被ろう付は物にろう付けしたときにろうが他に漏出して
しまう問題がある。Also, if the amount is less than the fixed amount, there will be a problem with the adhesive strength when brazing the object, and if the amount is large, the wax will leak out when brazing the object. There is a problem with this.
さらに、ろう材の定量が定量より多いと、リードピンの
頭部に付けたろうが底付穴の周面にも接着してしまいり
−ドビンを抜き出すときに抜けなくなるという問題があ
る。Furthermore, if the amount of solder metal is larger than the amount determined, there is a problem that the solder attached to the head of the lead pin also adheres to the circumferential surface of the bottomed hole and cannot be removed when the dobbin is removed.
そこで、本発明は恨もしくは銀合金による粉体を型材の
所定形状の孔内に入れ、焼結もしくは溶解・凝結させる
ことによって、一定量の粒のろう材を得ることを特徴と
する。Therefore, the present invention is characterized in that a certain amount of grains of brazing filler metal is obtained by putting powder made of silver alloy or silver alloy into holes of a predetermined shape of a mold material, and sintering or melting and condensing the powder.
（作 用〕
型材の所定形状の孔内に粉体のろう材を満たし、炉の中
にいれて加熱することにより焼結もしくは溶解・凝結さ
せ、これを孔内から抜き取ることにより、一定量の粒の
ろう材を得ることができる。(Function) Fill the holes of a predetermined shape in the mold material with powder brazing filler metal, place it in a furnace and heat it to sinter or melt and solidify it, and then extract it from the hole to create a fixed amount of filler metal. Granular filler metal can be obtained.
以下に本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
図面は製造具の解体斜視図であり、図において６は型材
であって一定厚さのカーボン等の銀ろうと高温時にぬれ
性を持たない材質であり、一定間隔に所定径の貫通孔６
ａがあけてあり、この貫通孔６ａの体積が一定の値とな
っている。The drawing is an exploded perspective view of the manufacturing tool, and in the drawing, 6 is a mold material made of a material such as carbon that does not wettability at high temperatures, and has through holes 6 of a predetermined diameter at regular intervals.
A is opened, and the volume of this through hole 6a is a constant value.
７はこの型材６の下に敷く底板である。Reference numeral 7 denotes a bottom plate placed under this molded material 6.
８は型材６と底板７を一体にする周囲枠である。Reference numeral 8 denotes a peripheral frame that integrates the profile 6 and the bottom plate 7.
つぎに、銀もしくは銀合金の粉体を、例えばアトマイズ
法、還元法もしくは蒸発法等によって５０〜３２５メツ
シュ程度に製造する。Next, silver or silver alloy powder is produced to a size of about 50 to 325 mesh by, for example, an atomization method, a reduction method, or an evaporation method.
第２図に示す如く、このようにした粉体を底板７を敷い
た型材６の各貫通孔６ａ内に満たし、周囲枠８によって
一体にする。As shown in FIG. 2, the thus prepared powder is filled into each through hole 6a of the molded material 6 on which the bottom plate 7 is laid, and is integrated by the surrounding frame 8.
このような状態にして炉に入れて加熱焼成する。In this state, it is placed in a furnace and fired.
この加熱焼成時に炉の温度がろうの融点より低く充分に
高温ならば粉体は焼結し、融点より充分高ければ溶融し
、冷却後凝固する。During this heating and firing, if the furnace temperature is lower than the melting point of the wax and is sufficiently high, the powder will sinter, and if it is sufficiently higher than the melting point, it will melt and solidify after cooling.
以上によると、すべての銀ろう粒は底板７を取り除くこ
とにより型材６の各貫通孔６ａから容易に抜くことがで
きるが、抜けにくい場合には治具により押し出してもよ
い。According to the above, all the silver solder grains can be easily pulled out from each through hole 6a of the mold material 6 by removing the bottom plate 7, but if it is difficult to pull out, they may be pushed out with a jig.
このようにして抜き出した銀ろう粒はすべてが一定の量
の粒となる。The silver solder grains extracted in this way all have a certain amount of grains.
〔発明の効果］
以上詳細に説明した本発明によると、銀もしくは銀合金
による粉体を型材の所定形状の孔内に入れ、焼結もしく
は溶解・凝結させることによって、一定量の粒のろう材
を得ることができる効果を有する。[Effects of the Invention] According to the present invention described in detail above, a certain amount of particles of brazing filler metal is produced by putting silver or silver alloy powder into holes of a predetermined shape of a mold material and sintering or melting and condensing the powder. It has the effect of being able to obtain.
また、従来のように線材に加工したり板材に加工した後
、定量にカットするような製造工程をなくすことができ
る効果を有する。It also has the effect of eliminating the conventional manufacturing process of cutting into fixed quantities after processing into wire rods or plate materials.
第１図は本発明の実施に用いる型材の解体斜視図、第２
図は貫通孔に粉体のろう材を満たした状態の拡大断面図
、第３図はリードビンを被ろう付は物にろう付けした状
態の断面図、第４図はり−ドピンにろう材を付ける状態
の断面図、第５図はり−ドピンにろう材を付けた状態の
側面図である。
６・・・型材
６ａ・・・貫通孔
７ ・ ・ ・ 底牟反
８・・・周囲枠Fig. 1 is an exploded perspective view of a mold used in carrying out the present invention;
The figure is an enlarged cross-sectional view of the through hole filled with powder brazing material, Figure 3 is a cross-sectional view of the lead bottle covered with brazing, and Figure 4 is a cross-sectional view of the state in which the soldering material is applied to the beam and dowel. FIG. 5 is a cross-sectional view of the state; FIG. 6... Shape material 6a... Through hole 7 ・ ・ ・ Bottom panel 8... Surrounding frame
Claims (1)
内に入れ、炉内で焼結もしくは溶解・凝結させることに
よって、一定量の粒のろう材を得ることを特徴とする銀
ろう粒の製造方法。1. Silver braze, which is characterized by obtaining a certain amount of particles of brazing filler metal by putting silver or silver alloy powder into holes of a predetermined shape in a mold material and sintering or melting and condensing it in a furnace. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63333869A JP2696546B2 (en) | 1988-12-28 | 1988-12-28 | Production method of silver brazing particles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63333869A JP2696546B2 (en) | 1988-12-28 | 1988-12-28 | Production method of silver brazing particles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02179395A true JPH02179395A (en) | 1990-07-12 |
| JP2696546B2 JP2696546B2 (en) | 1998-01-14 |
Family
ID=18270858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63333869A Expired - Fee Related JP2696546B2 (en) | 1988-12-28 | 1988-12-28 | Production method of silver brazing particles |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2696546B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61283494A (en) * | 1985-04-09 | 1986-12-13 | クラムコ ソルダ− アロイズ リミテツド | Method of forming welding material to solid body held to predetermined shape |
| JPS63212094A (en) * | 1987-02-26 | 1988-09-05 | Tanaka Kikinzoku Kogyo Kk | Production of very small solder ball consisting of metallic ball as nucleus |
| JPH01192499A (en) * | 1988-01-29 | 1989-08-02 | Senju Metal Ind Co Ltd | Method for forming powder solder for creamy solder and spherical powder solder |
| JPH01308037A (en) * | 1988-06-06 | 1989-12-12 | Hitachi Cable Ltd | Feed of solder |
-
1988
- 1988-12-28 JP JP63333869A patent/JP2696546B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61283494A (en) * | 1985-04-09 | 1986-12-13 | クラムコ ソルダ− アロイズ リミテツド | Method of forming welding material to solid body held to predetermined shape |
| JPS63212094A (en) * | 1987-02-26 | 1988-09-05 | Tanaka Kikinzoku Kogyo Kk | Production of very small solder ball consisting of metallic ball as nucleus |
| JPH01192499A (en) * | 1988-01-29 | 1989-08-02 | Senju Metal Ind Co Ltd | Method for forming powder solder for creamy solder and spherical powder solder |
| JPH01308037A (en) * | 1988-06-06 | 1989-12-12 | Hitachi Cable Ltd | Feed of solder |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2696546B2 (en) | 1998-01-14 |
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