JP2657356B2 - Method and apparatus for forming bump - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for bonding ball-shaped bumps for bonding ball-shaped bumps to inner leads of a film carrier, electrodes or electrode pads of a semiconductor chip.

[0002]

2. Description of the Related Art Conventionally, there are a wafer bump and a stud bump as bumps formed on an electrode pad on a semiconductor chip.

[0003] Wafer bumps are used to form bumps in a semiconductor element at the wafer stage, and require a complicated process as a wafer process many times, resulting in low yield and high cost for small-quantity multi-products. Becomes

The stud bumps are formed on the electrode pads of the semiconductor chip one by one by performing ball bonding at the time of primary bonding, and cutting the neck portion of the wire after the bonding to form stud bumps. The rest of the wire remains convex and non-uniform at the cut. For this reason, the bonding reliability using this bump is considerably low. Also, it takes time to bump one pin at a time.

Further, as a method of joining a bump to an inner lead of a film carrier, there is a transfer bump for joining a bump grown by plating on a substrate to an inner lead, but the bump formed by plating is a hemispherical bump. The bump width becomes larger than the required bump height, which is not suitable for narrow pitch bonding of 100 μm or less.

[0006]

As a countermeasure against the above-mentioned problem in the conventional bump bonding, there has been proposed a method in which a minute metal ball is used and the ball is transferred to an inner lead. When arranging the balls by hand, since the balls are arranged one by one on the joining stage, there is a problem that it takes an extremely long time.

Accordingly, the present invention provides a method and an apparatus for bonding a ball-shaped bump which can easily and reliably bond a ball-shaped bump to an inner lead of a film carrier, an electrode or an electrode pad on a semiconductor chip. The purpose is to:

[0008]

In order to achieve the above object, a method of bonding ball-shaped bumps according to the present invention is to provide a method of bonding a ball-shaped bump to a metal ball having a hole provided at the same position as an electrode pad of a semiconductor chip to be connected. Turn the array substrate upside down and apply micro-vibration to the container in which the fine metal balls are stored in advance,
An array in which at least one metal ball group of at least one semiconductor chip is arranged by adsorbing the metal balls floating due to the micro-vibration to the holes of the array substrate, removing excess metal balls attached to the array substrate. The substrate is transported to a joining stage and joined to a portion to be joined.

Further, in the ball bump bonding apparatus according to the present invention, a fine metal ball array substrate provided with holes so as to be located at the same position as the electrode pads of the semiconductor chip to be connected, and a fine metal ball previously housed therein. A ball arranging means for applying micro-vibration to the container and adsorbing the metal balls floating by the micro-vibration into the holes of the array substrate, and an array substrate on which at least one metal ball group of semiconductor chips is arrayed. Board transfer means for transferring to the bonding stage, ball removing means for removing extra balls attached to the arrayed substrate, and bonding means for bonding the metal ball group transferred to the bonding stage to a portion to be bonded. , Is provided.

[0010]

According to the present invention having the above-described structure, since the fine metal balls are used as the bumps, the bump width (diameter) can be reduced as compared with the bumps formed by substrate plating, and the narrow pitch can be obtained. Joining becomes easy. And
In order to arrange the balls to be joined to the inner leads of the film carrier, the electrodes or the electrode pads on the semiconductor chip, the floating balls are adsorbed, so that the balls can be arranged reliably. Further, by adsorbing a ball group for a plurality of semiconductor chips in advance, the tact time for mass production can be significantly reduced, the cost can be reduced, and continuous operation can be performed if there are two arrayed substrates.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

First, as shown in FIG. 1, this apparatus mainly includes a ball arrangement mechanism 1, a substrate transport mechanism 2,
A ball recognition unit 3 and a joining stage 4 are provided. This device can be configured by adding a function of arranging and joining minute metal balls to a device having a joining mechanism such as an inner lead bonder.

Next, in the ball arrangement mechanism 1, FIG.
As shown in (1), the ball stock dish 11 is vibrated. That is, a minute metal ball B is put into a metal ball stock dish 11, and a vibration generator 1 such as a parts feeder is used.
Vibration by 2. Thereby, the ball B effectively floats. The vibration frequency ranges from 0 to depending on the size of the ball B, etc.
The frequency is variable up to 1 kHz, and the ball stock dish 11 is detachable from the vibration generator 12.

Next, the ball B is placed on the ball suction stage 13.
Is adsorbed. The ball suction stage 13 has a ball array substrate 15 in which through suction holes 14 smaller than the ball diameter are arranged at predetermined positions, and it is preferable that the through suction holes 14 are provided for a plurality of semiconductor chips. And
The ball suction stage 13 is turned upside down, lowered to the vicinity of the ball stock tray 11, and oscillated up and down, so that the balls B are sucked into the through suction holes 14 of the array substrate 15 by vacuum. Here, the descending distance and amplitude distance of the ball suction stage 13 can be controlled in units of 0.1 mm, and the number of amplitudes can be controlled. At this time, if the ball suction stage 13 is slightly vibrated in the horizontal direction, the number of extra balls to be sucked can be minimized, and the ball can be sucked more effectively.

Next, the ball suction stage 13 is moved up to mechanically remove and collect excess balls B 'other than the vacuum-adsorbed balls B. Here, the ball suction stage 13 is driven by a vibration generator 16 as a surplus ball removing means.
Is finely vibrated so that the balls normally arranged in the through-suction holes 14 are not removed and the surplus balls B '
Only those are removed.

Next, as shown in FIG. 3, the ball suction stage 13 from which the surplus balls have been removed is moved to the recognition position, and the ball recognition means 3 performs image recognition of the missing or surplus balls. If a defect has occurred at the time of ball recognition, all the adsorbed balls B are collected by vacuum leak and mechanical removal, and the ball is adsorbed again.

Next, the ball suction stage 13 is transported to the joining stage 4 by the substrate transport mechanism 2 of FIG. During this transfer, the ball B is prevented from dropping due to vibration or the like.

Next, as shown in FIG. 3, the conveyed ball suction stage 13 is turned over, and mounted and fixed on the joining stage 4. The joining stage 4 is shared with the apparatus main body stage, and the stage is fixed by vacuum suction. Array substrate 1 of ball suction stage 13 set on bonding stage 4
5 ball B and film carrier inner lead 2
Alignment with 0 is performed. For this, the alignment mechanism of the main unit can be used. After the alignment, the ball B is bonded (transferred) to the inner lead 20. This joining can be performed using the function of the inner lead bonder device main body.

When bonding the balls B to the electrode pads of the semiconductor chip, the semiconductor chip 30 is placed on the bonding stage 4 as shown in FIG. Then, the ball suction stage 13 is lowered without being inverted, and the ball B is brought into contact with the electrode pad of the semiconductor chip 30, and the ball suction stage 13 is pressed by the heating tool 31 to join the ball B to the electrode pad.

Next, another embodiment of the present invention will be described. 5 and 6 show a configuration example of the ball suction stage 113 and the array substrate 115 in this embodiment. FIG.
As shown in the figure, the ball suction stage 113 has a suction groove 120 along its periphery, and the suction groove 120
As shown in FIG. 6B, it is connected to a vacuum source such as a vacuum pump via a suction pipe 121. A suction hole 122 is formed in the center of the ball suction stage 113, and the suction hole 122 is connected to a vacuum source such as a vacuum pump via a suction pipe 123 (see FIG. 6A). ).
Thus, the suction system for fixing the arrayed substrate 115 and the suction system for sucking the ball B are configured by two separate systems.

In the case of the array substrate 115 corresponding to one semiconductor chip, a regulator 124 for controlling the vacuum pressure is attached to the suction pipe 121 as shown in FIG. Ball B at suction hole 114
It is possible to adjust the strength of the suction force at the time of sucking. In this example, the array substrate 115 has a hole diameter of 30 μm.
When about 328 suction holes (m per side) are formed, the vacuum pressure for suctioning the ball B is 50
About 60 mmHg is preferable.

In this embodiment, an ultrasonic vibrator 100 whose typical configuration is shown in FIG. This ultrasonic vibrator 100
Is connected via a wiring 102 to a control device 101 for controlling the ultrasonic vibration. Ultrasonic transducer 1
00 is embedded or embedded in the ball suction stage 113. Ultrasonic transducer 10
The frequency, amplitude, and the like of the ultrasonic vibration at which 0 is to be generated are appropriately controlled by the control device 101.

When the vacuum source is evacuated through the suction tube 121, the ball B is sucked into the suction hole 114.
In this embodiment, for example, an Au (gold) ball B having a sphere diameter of 40 μm is used. However, it is basically preferable that one ball B be sucked into one suction hole 114. By the way, as shown in FIG. 7, an extra ball B 'may adhere to the surface of the array substrate 115 or the ball B already properly sucked in the suction hole 114 due to static electricity or the like. This extra ball B 'depends on, for example, the total number of the balls B to be properly attracted to the suction hole 114, but about 5 to 10 extra balls B' are attached.

Therefore, when the ultrasonic vibrator 100 is operated by the control device 101, the ball suction stage 11
Third, ultrasonic vibration is applied to the array substrate 115. The frequency of the ultrasonic vibration is preferably 50 kHz.
z. By oscillating the array substrate 115 in this way, all the extra balls B 'attached to the array substrate 115 are instantaneously detached from the array substrate 115,
It falls into a collection dish (not shown) installed below the array substrate 115. After confirming that the ball B 'has been completely removed from the array substrate 115, the operation of the ultrasonic transducer 100 is stopped.

In the above case, the ultrasonic vibrator 100 may be operated at the same time as the suction of the balls B, that is, at the time of the suction of the balls B on the array substrate 115. In this case, the ball B is placed in the suction hole 11
4 and at the same time, it is possible to prevent an extra ball B 'from being attached.

Here, the ultrasonic transducer 100 may be fixed to the back surface of the ball suction stage 113 as shown in FIG. In this case, the ultrasonic vibrator 100
It is fixed in place on the ball suction stage 113 using screws or the like. As described above, even when the ultrasonic vibrator 100 is externally attached, ultrasonic vibration can be applied to the array substrate 115 in the same manner as described above, and the extra ball B 'can be completely removed. In particular, in this case, the size of the ball suction stage 113 does not need to be increased.

As shown in FIG. 9, the ultrasonic vibrator 100 can be fixed to the ball suction stage 113 by using an appropriate adhesive 103, for example. Then, the ultrasonic transducer 100 is brought into close contact with the ball suction stage 113 with the adhesive 103. Instead of the adhesive 103, a rubber material or a high-viscosity grease may be interposed between the ball suction stage 113 and the ultrasonic oscillator 100 to fix the ultrasonic oscillator 100.

Further, as a method of applying the ultrasonic vibration to the array substrate 115, the ultrasonic vibration source is connected to the array substrate 115.
It is also possible to apply ultrasonic vibration by mechanically abutting the substrate. That is, as shown in FIG. 10, for example, the array substrate 115 on which the ball B is sucked is placed and fixed on a predetermined stage 104, and the array substrate 11
The capillary 105 of, for example, a wire bonder as the ultrasonic vibration source 100 ′ is brought into contact with the center of the wire 5 while applying a constant load (about 100 gf), and the capillary 105 is ultrasonically vibrated.

By applying the ultrasonic vibration through the capillary 105 as described above, the extra ball B 'can be completely removed from the arrangement substrate 115. In this case, particularly, the upper surface of the arrangement substrate 115 By applying a predetermined amount of air blow, an extra ball B 'floating from the array board 115 is forcibly removed. Note that the array substrate 115 is
In the case where it is fixed upside down from the case of 0, it is not necessary to apply air blow, and in that case, an extra ball B 'falls naturally.

Next, a description will be given of the operation of the present embodiment in a specific bonding step when the ball suction stage 113 and the array substrate 115, etc., which are composed of the two suction systems described above, are used.

In the ball arrangement mechanism 1, as shown in FIG. 11, an arrangement substrate 115 is mounted on a ball adsorption stage 113 having an adsorption function. In addition, ball stock dish 1
1 is given a vibration. That is, the ball B is put into the ball stock dish 11 and vibrated by the vibration generator 12. Thereby, the ball B effectively floats. The vibration frequency at this time ranges from 0 to 1 depending on the size of the ball B and the like.
It is variable up to kHz, preferably 70-400 Hz. Further, the ball stock dish 11 can be detached from the vibration generator 12.

Then, the array substrate 115 is lowered to the vicinity of the ball stock tray 11, and the balls B are vacuum-adsorbed into the suction holes 114 of the array substrate 115 while swinging up and down. The suction force at the time of sucking the ball B in the suction holes 114 is optimally set by the regulator 124, so that it is possible to prevent the extra balls B from adhering to the suction holes 114.

When the array substrate 115 is raised and the ultrasonic vibrator 100 is operated by the control device 101 described above,
Ultrasonic vibration is applied to the array substrate 115. As a result, the extra ball B ′ attached to the array substrate 115 is
All of them instantly separate from the array substrate 115 and fall. The timing at which the ultrasonic vibrator 100 is operated may be set so that the array substrate 115 is ultrasonically vibrated simultaneously with the suction of the ball B.

Next, as shown in FIG. 12, the ball suction stage 113 from which the surplus balls have been removed is moved to the recognition position, and the ball recognizing means 3 recognizes the absence of the ball and the presence or absence of the surplus ball. If a defect has occurred at the time of ball recognition, all the adsorbed balls B are collected by vacuum leak and mechanical removal, and the ball is adsorbed again.

The ball suction stage 113 is transferred to the joining stage 4 by the substrate transfer mechanism 2 shown in FIG. During this transfer, the ball B is prevented from dropping due to vibration or the like.

In particular, when bonding the ball B to the electrode pad of the semiconductor chip, the semiconductor chip 30 is mounted on the bonding stage 4 as shown in FIG. Then, the ball suction stage 113 is lowered without being inverted, and the ball B is brought into contact with the electrode pad of the semiconductor chip 30, and the ball suction stage 113 is pressed to join the ball B to the electrode pad.

Here, balls B for a plurality of semiconductor chips are provided.
An embodiment of an array substrate configured to be arrayable will be described. FIG. 13 shows a configuration example of the array substrate 215 in this embodiment. In this example, in particular, the array substrate 215 has four semiconductor chips. However, as shown in FIG. 14, the array substrate 215 forms an area w1 corresponding to one semiconductor chip on the wafer W in a form adjacent to each other. Can correspond to the area w4 obtained by combining the four areas.

FIG. 15 shows a ball B for four semiconductor chips.
5 shows an array substrate 215 having a suction hole 214 corresponding to FIG.
In this example, the ball suction stage 213 has a suction groove 220 formed in a substantially lattice shape (for example, a “D” shape). The suction groove 220 is connected to a vacuum source such as a vacuum pump via a suction path 221. Is connected to In addition, this suction path 22
1 is provided with a regulator for controlling the vacuum pressure so that the vacuum pressure for sucking the ball B through the suction hole 214 can be controlled. In addition, such a ball B
Is provided with a vacuum suction system for fixing the array substrate 215, in addition to a suction system for sucking the balls B, that is, a vacuum suction system for fixing the array substrate 215 and a suction system for sucking the balls B. Are provided.

Next, the operation of the present embodiment in a specific bonding step when the above-described ball suction stage 213 and array substrate 215 are used will be described.

In the ball arrangement mechanism 1, as shown in FIG. 16, an arrangement substrate 215 is mounted on a ball adsorption stage 213 having an adsorption function. In addition, ball stock dish 1
1 is given a vibration. That is, the ball B is put into the ball stock dish 11 and vibrated by the vibration generator 12. Thereby, the ball B effectively floats. The vibration frequency at this time is 0 to 1 depending on the size of the ball B and the like.
It is variable up to kHz, preferably 70-400 Hz. Further, the ball stock dish 11 can be detached from the vibration generator 12.

Then, the array substrate 215 is lowered to the vicinity of the ball stock tray 11, and the balls B are vacuum-adsorbed into the suction holes 214 of the array substrate 215 while swinging up and down. The suction force at the time of sucking the ball B in the suction holes 214 is optimally set by a regulator for vacuum pressure control, and it is necessary to prevent an extra ball B 'from adhering to each suction hole 214. it can. Array board 215
Is raised, and the ultrasonic vibrator 100 is operated by the control device 101 described above, so that ultrasonic vibration is applied to the array substrate 215. As a result, all the extra balls B 'attached to the array substrate 215 are instantaneously removed from the array substrate 21.
Drops from 5 and falls.

Next, as shown in FIG. 17, the ball suction stage 213 from which the surplus balls have been removed is moved to a recognition position, and the ball recognizing means 3 recognizes the absence of the ball and the presence or absence of the ball surplus. If a defect has occurred during ball recognition, all the adsorbed balls B may be collected by vacuum leak and mechanical removal, and the ball may be adsorbed again, or if the balls B are insufficient. May be re-adsorbed.

The ball suction stage 213 is connected to the joining stage 4 by the substrate transport mechanism 2 shown in FIG.
Transport to During this transfer, the ball B
Not be missing. In particular, when bonding the ball B to the pad 41 of the wafer 40, the wafer 40 is placed on the bonding stage 4, and the array substrate 215 is aligned with the electrode pad 41 of the wafer 40. Then, the ball suction stage 213 is lowered without being inverted, and the ball B is brought into contact with the pad 41 of the semiconductor chip 30, and the ball suction stage 213 is pressed to join the ball B to the pad 41.

Further, another example of the joining process when the ball suction stage 213 and the array substrate 215 are used will be described.

The ball suction stage 213 from which the surplus balls B 'have been completely removed by the ultrasonic vibrator 100 is
The ball is moved to the recognition position as shown in FIG. If a defect has occurred during ball recognition, all the adsorbed balls B may be collected by vacuum leak and mechanical removal, and the ball may be adsorbed again, or if the balls B are insufficient. May be re-adsorbed.

Next, the ball suction stage 213 is transported to the joining stage 4 by the substrate transport mechanism 2 shown in FIG.
During this transfer, the ball B is prevented from dropping due to vibration or the like. Then, as shown in FIG. 18, the conveyed ball suction stage 213 is inverted, and mounted and fixed on the joining stage 4. The joining stage 4 is shared with the apparatus main body stage, and the stage is fixed by vacuum suction. Ball suction stage 213 set on bonding stage 4
Alignment of the ball B of the array substrate 215 with the pad 51 of the semiconductor chip 50 fixedly adsorbed to the bonding head 400 is performed. After the alignment, the ball B is bonded to the pad 51 by thermocompression bonding.

The embodiment of the present invention has been described above.
The present invention is not limited to the above embodiments, and various effective modifications and applications are possible based on the technical idea of the present invention. In particular, the case where the ball B is bonded to the inner lead 20 of the film carrier or the electrode pad of the semiconductor chip 30, 50 has been described. However, the present invention can be effectively applied to the case where the ball B is bonded to the electrode pad of the printed circuit board. Although the example of the ball B constituting the bump has been described, the present invention can be effectively applied to a case where this kind of bonding is performed using microspheres made of a conductive rubber material.

[0048]

As described above, according to the present invention,
Since the minute metal balls are used as the bumps, the bump width (diameter) can be reduced as compared with the bumps formed by substrate plating, and narrow pitch bonding is facilitated. In addition, since the balls to be bonded to the inner leads of the film carrier, the electrodes, or the electrode pads on the semiconductor chip are arranged to adsorb the balls suspended by the vibration, the balls can be arranged reliably. In this case, excess balls can be reliably removed by vibrating the array substrate while vacuum-adsorbing the balls by the array carrying means. Therefore, it is possible to properly arrange a large number of extremely small balls. Further, by adsorbing a ball group for a plurality of semiconductor chips in advance, the tact time for mass production can be significantly reduced, the cost can be reduced, and continuous operation can be performed if there are two arrayed substrates.
This makes it possible to mass-produce the film carrier with ball bumps, and to easily and inexpensively bump bumps on the electrode pads of the semiconductor chip.

Further, when a metal ball is adsorbed on the array substrate, the suction system is constituted by two systems so that an appropriate suction function is exhibited, and by applying ultrasonic vibration to the array substrate, the suction system is provided. This has the advantage that extra metal can be completely prevented from adhering to the array substrate.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a configuration of an entire apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic view showing a ball arranging operation by a ball arranging mechanism in the embodiment of the present invention.

FIG. 3 is a schematic diagram showing ball bonding to a lead of a film carrier in an example of the present invention.

FIG. 4 is a schematic diagram showing ball bonding to an electrode pad of a semiconductor chip in an example of the present invention.

FIG. 5 is a plan view showing a configuration example of an array substrate having two suction systems and a ball suction stage thereof in another embodiment of the present invention.

6A is a cross-sectional view taken along the line KK of FIG. 5, FIG.
FIG. 6 is a sectional view taken along line LL in FIG. 5.

FIG. 7 is a cross-sectional view showing an example of a configuration of the array substrate provided with surplus ball removing means and a ball suction stage thereof in another embodiment of the present invention.

FIG. 8 is a sectional view showing a modified example of the array substrate provided with the surplus ball removing means and a ball suction stage thereof in another embodiment of the present invention.

FIG. 9 is a sectional view showing a modified example of the array substrate provided with the surplus ball removing means and a ball suction stage thereof in another embodiment of the present invention.

FIG. 10 is a cross-sectional view showing a modified example of the array substrate provided with the surplus ball removing means and a ball suction stage thereof in another embodiment of the present invention.

FIG. 11 is a schematic view showing a ball arranging operation by a ball arranging mechanism in another embodiment of the present invention.

FIG. 12 is a schematic view showing bonding of a ball to an electrode pad of a semiconductor chip according to another embodiment of the present invention.

FIG. 13 is a plan view showing a configuration example of an array substrate according to still another embodiment of the present invention.

FIG. 14 is a plan view showing a wafer according to still another embodiment of the present invention.

FIG. 15 is a sectional view showing a configuration example of an array substrate and a ball suction stage thereof in still another embodiment of the present invention.

FIG. 16 is a schematic view showing a ball arranging operation by a ball arranging mechanism in still another embodiment of the present invention.

FIG. 17 is a schematic view showing bonding of a ball to an electrode pad of a wafer according to still another embodiment of the present invention.

FIG. 18 is a schematic view showing bonding of a ball to an electrode pad of a semiconductor chip according to still another embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 ball arrangement mechanism 2 substrate transport mechanism 3 ball recognition means 4 joining stage 11 ball stock dish 12 vibration generator 13, 113, 213 ball suction stage 14, 114, 214 through suction hole 15, 115, 215 ball array substrate 16 vibration Generator 20 Film carrier lead 30 Semiconductor chip 31 Heating tool B Ball

Continuation of the front page (72) Inventor Hiroshi Hirata 1618 Ida, Nakahara-ku, Kawasaki-shi Nippon Steel Corporation Advanced Technology Research Laboratory (56) References JP-A-4-65130 (JP, A) JP-A-3 −225832 (JP, A)

Claims (29)

(57) [Claims] A step of applying a minute vibration to a container accommodating minute balls of a conductor to float the minute balls; and a method of forming an array substrate having suction holes at positions corresponding to electrodes of at least one semiconductor chip. Arranging and holding the floating micro-balls in the suction holes; removing extra micro-balls other than the array-supported micro-balls; and A step of collectively transferring the microballs to a target portion corresponding to the electrode of the at least one semiconductor chip to form a bump, the method comprising: 2. The method according to claim 1, wherein the conductor is a metal. 3. The method according to claim 1, wherein the diameter of the minute ball is 100 μm or less. 4. The method according to claim 1, wherein in the arrangement supporting step, the minute balls are sucked by vacuum suction.
3. The method for forming a bump according to 1. 5. The bump mounting device according to claim 1, wherein in the arrangement holding step, the arrangement substrate is held on a ball suction stage on a surface opposite to a surface on which the minute balls are arranged and carried. Forming method. 6. The bump forming method according to claim 5, wherein the array substrate is suction-held on the ball suction stage by vacuum suction. 7. A vacuum suction for sucking the arrayed substrates on the ball suction stage and a vacuum suction for sucking the micro balls into the suction holes are performed through a common vacuum suction system. The method of forming a bump according to claim 6. 8. Vacuum suction for sucking the arrayed substrates on the ball suction stage and vacuum suction for sucking the micro balls into the suction holes are performed through separate vacuum suction systems. 7. The method according to claim 6, wherein the suction system is separately controllable. 9. The arrangement supporting step wherein the arrangement substrate is reciprocated up and down at least once to promote selective adsorption of the minute balls to the adsorption holes. Item 4. The method for forming a bump according to Item 1. 10. The arrangement supporting step, wherein the arrangement substrate is finely vibrated horizontally to suppress extra fine balls from adhering to the arrangement substrate to a minimum. 3. The method for forming a bump according to 1. 11. The bump forming method according to claim 1, wherein extra fine balls are removed by vibrating the array substrate. 12. The method according to claim 11, wherein the vibration of the array substrate is an ultrasonic vibration. 13. A method according to claim 1, wherein, after the step of removing extra minute balls and before the transfer step, one minute ball is sucked into each of the suction holes in the transfer target area of the array substrate. The method of claim 1, further comprising a step of confirming. 14. The method according to claim 1, wherein in the transferring step, the fine balls are transferred to electrodes of a film carrier, a semiconductor chip or a printed circuit board to form bumps.
14. The method of forming a bump according to any one of claims 13 and 13. 15. A means for applying micro-vibration to said container so as to float micro-balls of a conductive material contained in said container, and an array substrate having suction holes at positions corresponding to electrodes of at least one semiconductor chip. Means for arranging and holding the floating micro-balls in the suction holes, means for removing extra micro-balls other than the array-supported micro-balls, and means for arranging and supporting the micro-balls arranged on the array substrate Means for collectively transferring the micro-balls to a target portion corresponding to the electrode of the at least one semiconductor chip to form a bump, the bump forming apparatus comprising: 16. The bump forming apparatus according to claim 15, wherein the conductor is a metal. 17. The bump forming apparatus according to claim 15, wherein the diameter of the minute ball is 100 μm or less. 18. The arrangement carrying means, wherein the micro balls are sucked by vacuum suction.
6. The bump forming apparatus according to 5. 19. The bump holding device according to claim 15, wherein in the array holding means, the array substrate is held on a ball suction stage on a surface opposite to a surface on which the micro balls are arrayed and supported. Forming equipment. 20. The bump forming apparatus according to claim 15, wherein the array substrate is suction-held on the ball suction stage by vacuum suction. 21. A vacuum suction for sucking the arrayed substrates on the ball suction stage and a vacuum suction for sucking the micro balls into the suction holes through a common vacuum suction system. The bump forming apparatus according to claim 20, wherein: 22. A vacuum suction for sucking the arrayed substrates on the ball suction stage and a vacuum suction for sucking the micro balls into the suction holes are performed through separate vacuum suction systems. 21. The bump forming apparatus according to claim 20, wherein the suction system is separately controllable. 23. The arrangement carrying means, further comprising means for reciprocating the arrangement substrate at least once up and down in order to promote selective adsorption of the micro-balls to the suction holes. The apparatus for forming a bump according to claim 15. 24. The arrangement carrying means further comprises means for horizontally micro-vibrating the arrangement substrate in order to minimize extra fine balls from adhering to the arrangement substrate. 16. A bump forming apparatus according to claim 15. 25. The bump forming apparatus according to claim 15, wherein the means for removing extra fine balls is configured to vibrate the array substrate. 26. The bump forming apparatus according to claim 25, wherein the vibration means of the array substrate is an ultrasonic vibration. 27. The bump forming apparatus according to claim 25, wherein the array substrate is vibrated while the micro balls are vacuum-adsorbed by array holding means. apparatus. 28. A means for confirming that one minute ball is adsorbed to each of the suction holes in a transfer target area of an array substrate on which transfer has not yet been performed after removing an extra minute ball. The bump forming apparatus according to claim 15, further comprising: 29. The transfer device according to claim 15, wherein the transfer means is configured to transfer the minute ball to an electrode of a film carrier, a semiconductor chip or a printed circuit board to form a bump. The bump forming apparatus according to claim 1.