JPH04332144A - Paste application device - Google Patents

Abstract

PURPOSE:To provide the improved structure of a paste application device, the device serving to apply paste on an application surface and the structure being capable of maintaining at all times parallellism between a surface where an injection outlet of an application head is provided and the application surface. CONSTITUTION:A title device includes a syringe 1 which is filled with paste 7 and which possesses a gas supply outlet la, an application head 4 which is connected to the lower portion of the syringe 1 and which possesses an injection outlet 4a for the paste 7 on the lower surface thereof, and a holding tool 2 which holds the syringe 1 and which moves vertically the application head 4 and the syringe 1 integrally. In the paste application device for applying the paste 7 on the application surface 5, the syringe 1 and the aplication head 4 are interconnected with each other through a joint part 3 comprising a flexible material.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in the structure of a paste coating device for applying paste to a coating surface.

[0002] In the die attaching process in which a semiconductor chip is fixed to a die stage using a paste using a die bonder, a paste in which fine silver particles are mixed with a thermosetting polymer material is applied to the die stage using a paste coating device. However, if the paste applicator does not operate properly, the paste will be applied unevenly, resulting in poor adhesion of the semiconductor chip to the die stage.

[0003] Under the above circumstances, there is a need for a paste coating device that can uniformly apply paste to a die stage.

0004

2. Description of the Related Art A conventional paste coating device that sprays paste from nine spray ports will be described in detail with reference to FIG.

As shown in FIG. 2, the conventional paste application device includes a syringe 11 filled with paste 7, and a syringe 11 filled with paste 7.
The syringe 11 is directly connected to the coating head 14 that applies the coating onto the coating surface 5 to form an integral unit, and the holder 12 that holds the syringe 11 is moved up and down to bring the coating head 14 closer to the coating surface 5.
A high-pressure gas such as high-pressure nitrogen is supplied for a certain period of time from the gas supply port 11a provided in the gas supply port 11a, and the paste 7 is ejected from the nine ejection ports 14a of the coating head 14 using this gas pressure to coat the coating surface of the die stage, etc. It is applied to 5.

[0006]

[Problems to be Solved by the Invention] In the conventional paste applicator described above, the syringe and the applicator head are directly connected, so it is difficult to apply the paste to the surface where the spray port of the applicator head is provided. It is adjusted so that it is parallel to the applied surface, but if the adjustment is incomplete or if it is used for a long time, this parallelism will be lost due to changes over time, and as shown in Figure 3, the nine The amount of paste ejected from the spout becomes uneven, and if the paste is applied so that the appropriate amount is applied to the part with the largest amount, the amount of paste will be insufficient in the part with the least amount, and the semiconductor chip 6 will be placed on top of this. When pressure-bonded to the coating surface 5, there was a problem in that an adhesion failure occurred in which the semiconductor chip 6 was not completely adhered to the coating surface 5 in a small portion.

SUMMARY OF THE INVENTION In view of the above-mentioned circumstances, the present invention aims to provide a paste coating device that is capable of always maintaining parallelism between the surface on which the jetting port of the coating head is provided and the coating surface. It is.

[0008]

[Means for Solving the Problems] The paste coating device of the present invention includes a syringe filled with paste and equipped with a gas supply port, and a coating device that is connected to the lower part of the syringe and has a jetting port for the paste on the lower surface. In a paste coating device that includes a head and a holder that holds the syringe and moves the coating head and the syringe up and down as one, and applies the paste to the coating surface, the syringe and the coating head are It is configured to be connected via a joint portion made of a flexible material.

[0009]

[Operation] That is, in the present invention, since the syringe and the coating head are connected by a joint made of a flexible material, even if the syringe is not held in an accurate vertical direction and is moved up and down, the coating head will not move. The surface on which the spout is provided can always be maintained horizontally by the weight of the coating head. Therefore, it is possible to make the amount of paste ejected from a large number of ejection ports uniform, making it possible to apply the paste evenly to the coating surface, making it possible to make the adhesive force of the semiconductor chip to the coating surface uniform. becomes.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, a paste coating apparatus according to an embodiment of the present invention, which sprays paste from nine spouting ports to apply the paste, will be explained in detail below.

FIG. 1 is a diagram showing an embodiment of a paste coating apparatus according to the present invention. As shown in the figure, the paste application device of the present invention includes a syringe 1 made of plastic such as acrylic filled with paste 7, and a syringe 1 made of plastic such as acrylic filled with paste 7,
A coating head 4 made of plastic such as acrylic is connected to the coating head 4 by a joint part 3, and the holder 2 that holds the syringe 1 is moved up and down to bring the coating head 4 closer to the coating surface 5. Gas supply port 1a provided
A high pressure gas such as high pressure nitrogen is supplied for a certain period of time from
This gas pressure causes the paste 7 to be ejected from the nine ejection ports 4a of the coating head 4 and applied to the coating surface 5 of a die stage or the like.

The joint portion 3 in one embodiment of the present invention has a bellows structure made of a flexible material, for example, fluororubber with a film thickness of 1 mm. Since the syringe 1 and the application head 4 are connected by the joint part 3 having a flexible bellows structure, even if the syringe 1 is not held in an accurate vertical direction and moves up and down, the application head 4 By increasing the weight of the joint portion 3, the surface on which the spout 4a is provided can be maintained horizontally due to the flexibility of the joint portion 3, and the paste 7 can be uniformly applied to the application surface 5.

[0013]

As is clear from the above description, according to the present invention, by providing a joint portion with an extremely simple structure, it is possible to maintain the surface on which the spray nozzle of the coating head is provided horizontally. A paste coating device that has advantages such as being able to uniformly apply the paste to the coating surface and making it possible to make the adhesion of semiconductor chips to the coating surface uniform, and can be expected to have significant economic and reliability effects. It is possible to provide

[Brief explanation of drawings]

FIG. 1 is a diagram showing a paste coating device according to an embodiment of the present invention;

[Figure 2] Diagram showing a conventional paste coating device,

[Figure 3
] Diagram showing problems with conventional paste application equipment,

[Explanation of symbols]

1 is a syringe, 1a is a gas supply port, 2 is a holder; 3 is the joint part, 4 is a coating head; 4a is the spout; 5 is the coating surface, 6 is a semiconductor chip, 7 is paste,

Claims (1)

[Claims] Claim 1: A syringe (1) filled with a paste (7) and equipped with a gas supply port (1a);
1) Connected to the bottom of the paste (7) on the bottom surface
a coating head (4) provided with a spout (4a);
2) and, applying the paste (7) to the application surface (
5) A paste coating device for coating on a paste, characterized in that the syringe (1) and the coating head (4) are connected via a joint portion (3) made of a flexible material. .