JP5735047B2 - Coating apparatus and coating method - Google Patents

Description

  The present invention relates to a coating apparatus and a coating method, and more particularly to a coating apparatus and a coating method for coating a liquid on a peripheral edge of a substrate.

A printed circuit board using a glass epoxy member is generally used as a substrate for mounting electronic components. The glass epoxy member is obtained by impregnating a glass fiber cloth with an epoxy resin. Therefore, when the glass epoxy member is cut, fine dust made of epoxy resin or glass fiber is generated. Such fine dust may cause poor contact of the circuit board and deterioration of the quality. Therefore, it is necessary to remove dust generated when the substrate is cut when the printed circuit board is manufactured.
However, even if dust is removed from the end face of the printed circuit board, the end face portion of the printed circuit board is fragile, and there is a problem that it may collapse and generate further dust.

Therefore, the present inventor has previously proposed a coating apparatus that can prevent the end face portion from collapsing by applying a film forming liquid to the end face of the printed circuit board to form a film (Patent Document 1).
FIG. 7 is a side cross-sectional view showing the main part of the coating apparatus previously proposed by the present inventor, and FIG. 8 is a schematic front view showing the internal mechanism of the coating apparatus with the housing omitted. .

  A conveyor 102 extending in the front-rear direction is disposed across the carry-in port 101a and the carry-out port 101b of the housing 101. The conveyor 102 is supported by the housing 101 by a support member (not shown). The housing 101 is provided with an operation unit 103 including a plurality of operation switches 103a. The conveyor 102 is driven and stopped by operating the operation switch 103a.

  Application mechanisms 110 and 110 are respectively provided on the left and right sides of the conveyor 102 in the housing 101. The coating mechanism 110 is fixed to a fixed plate 104 disposed to face the rear surface of the housing 101, and the lower portion of the fixed plate 104 is connected to the ball screw mechanism 120. The ball screw mechanism 120 is supported on the housing 101 by a support member (not shown).

  The coating mechanism 110 includes a coating disk 111, a motor 112, a coating liquid supply disk 113, and a motor 114. The motors 112 and 112 for rotating the application disk 111 are fixed to a support member 105 that is horizontally mounted on the fixed plate 104, and the rotation shaft 112a thereof is disposed vertically downward. The application disks 111 and 111 are provided with a shaft 111a that is disposed in the horizontal direction and extends upward. The shaft 111 a of the application disk 111 is connected to the rotation shaft 112 a of the motor 112, and the application disk 111 is rotated by driving the motor 112.

  The motors 114 and 114 for rotating the coating liquid supply disk 113 are fixed to the fixed plate 104 via a pivot 115 extending in the front-rear direction, and the rotation shaft 114a is disposed in the horizontal direction. The coating liquid supply disks 113 and 113 include a shaft 113a that is disposed in the vertical direction on the opposite side of the conveyor 102 with the coating disks 111 and 111 therebetween, and extends in the horizontal direction. The shaft 113a of the supply disk 113 is connected to the rotating shaft 114a of the motor 114, and the supply disk 113 is rotated by driving the motor 114. The shaft 113 a of the coating liquid supply disk 113 is positioned below the lower surface of the coating disk 111, and the upper side surface on the coating disk 111 side of the coating liquid supply disk 113 is in contact with the peripheral surface of the coating disk 111.

  Below the supply disk 113, a box-shaped liquid supply container 117 for containing a film forming liquid 116 containing a resin component is provided, and the lower end of the supply disk 113 is inserted from above the liquid supply container 117 to form a film. It is immersed in the liquid 116. With the rotation of the supply disk 113, the film forming liquid 116 moves from the lower end portion of the coating liquid supply disk 113 to the upper part of the supply disk 113 and is supplied to the outer peripheral surface of the coating disk 111.

  A ball screw mechanism 120 is connected to the lower end portion of the fixed plate 104. The ball screw mechanism 120 includes motors 121 and 121 disposed below the conveyor 102. The motor 121 includes a rotation shaft (not shown) extending in the horizontal direction that is separated from the conveyor 102, and a male screw 122 extending in the horizontal direction is connected to the rotation shaft. Further, a cylindrical female screw body 123 is fitted to the male screw 122, and the lower end center portion of the fixing plate 104 is connected to the female screw body 123. By driving the motor 121, the male screw 122 rotates, and the fixing plate 104 connected to the female screw body 123 can move to the left and right as the male screw 122 rotates.

  A method for applying the film forming liquid 116 to the end face 130a of the printed circuit board 130 using the above-described coating apparatus will be described. First, the operation switch 103a of the operation unit 103 is operated to rotate the motor 121 forward and backward to adjust the left and right positions of the coating mechanisms 110 and 110 so as to match the left and right width of the printed circuit board 130. Next, the printed circuit board 130 is placed on the conveyor 102 from the carry-in port 101a side, and the operation switch 103a is operated to drive the conveyor 102, the motors 112 and 112, and the motors 114 and 114.

  The printed circuit board 130 is conveyed to the coating mechanism 110 by the conveyor 102, and the left and right end surfaces 130a and 130a come into contact with the peripheral surfaces 111b and 111b of the coating disks 111 and 111, respectively. At this time, the film forming liquid 116 adhering to the peripheral surface 111 b of the application disk 111 is applied to the left and right end faces 130 a and 130 a of the printed circuit board 130. Then, as the printed circuit board 130 is conveyed, the film forming liquid 116 is applied to the entire left and right end faces 130a and 130a of the printed circuit board 130. After the application, the printed circuit board 130 is unloaded from the carry-out port 101b, Allow the ingredients to cure.

  According to the coating apparatus, it is possible to apply the film forming liquid 116 to the both end surfaces 130a and 130a of the printed circuit board 130 by the application disks 111 and 111, and form a coating film on the both end surfaces 130a and 130a of the printed circuit board 130. became.

  However, in the above-described coating apparatus, the film forming liquid 116 is supplied to the outer peripheral surface 111 b of the coating disk 111 through the supply disk 113, and the film forming liquid 116 attached to the outer peripheral surface 111 b of the coating disk 111 is Since the coating is applied to the end surface 130a, the supply state of the film forming liquid 116 to the outer peripheral surface 111b of the coating disk 111 is likely to vary.

  In order to stabilize the supply state of the film forming liquid 116 to the outer peripheral surface 111b of the coating disk 111, it is necessary to adjust the viscosity of the film forming liquid 116 to be relatively high (not to sag), and the film thickness is thin and uniform. There was a problem that it was difficult to apply to.

On the other hand, in order to cope with the thinning and miniaturization of various electronic devices, in recent years, there has been an increasing demand for thin copper-clad laminates (also referred to as package substrates) having a thickness of several tens to several hundreds of μm. Yes.
For such a thin substrate, it is not easy to apply the film forming liquid only to the end surface of the substrate, and it is desirable to apply the film forming solution to the peripheral portion including the end surface of the substrate, for example, in a frame shape. It is done.

  However, the coating apparatus is configured to apply the film forming liquid 116 only to the end surface 130a of the printed circuit board 130, and the film forming liquid cannot be thinly and uniformly applied to the peripheral portion including the substrate end surface. There was a problem.

International Publication No. 2010/137418

Means for solving the problems and their effects

  The present invention has been made in view of the above problems, and protects the peripheral portion including the end surface of the substrate, reliably prevents the generation of dust from the end portion of the substrate, and forms a film on the peripheral portion including the end surface of the substrate. An object of the present invention is to provide a coating apparatus and a coating method capable of coating a liquid with a thin and uniform film thickness.

In order to achieve the above object, a coating apparatus (1) according to the present invention is a coating apparatus that applies a liquid to a peripheral portion including an end surface of a substrate, and sandwiches an end portion of the substrate with a supporting means that supports the substrate. An application means comprising a pair of application rollers arranged so as to face each other, a moving means for moving the application means, and a liquid supply means for supplying a film forming liquid containing a resin component to the rotating surfaces of the pair of application rollers And controlling the moving means to move the pair of application rollers along the peripheral edge of the substrate in a state where the end portions of the substrate supported by the support means are sandwiched between the pair of application rollers. And the coating means includes a rotation mechanism section that rotates the pair of application rollers, and a turning mechanism section that rotates the rotation mechanism section .

  According to the coating apparatus (1), the film forming liquid is supplied to the rotation surfaces of the pair of coating rollers in a state where the end portions of the substrate supported by the support means are sandwiched between the pair of coating rollers. The pair of application rollers can be moved along the peripheral edge of the substrate. Therefore, the film forming liquid can be applied thinly and uniformly on the upper and lower surfaces of the peripheral edge of the substrate supported by the support means, and the end surface of the substrate (by the surface tension generated between the pair of application rollers ( The film forming liquid can also be applied to the side surface, and the coating film can be formed in a thin frame with a uniform thickness on the peripheral edge of the substrate. Therefore, the generation of dust due to the collapse of the end surface portion of the substrate can be prevented, and the peripheral portion of the substrate can be reinforced with the coating film, so that the handling property of the substrate can be improved.

Further , according to the coating apparatus ( 1 ), the rotation mechanism unit can be swung by the swivel mechanism unit. For example, when a film forming liquid is applied to the peripheral portion of a rectangular substrate, The direction of the pair of application rollers of the rotation mechanism unit can be set to the same direction on each side of the substrate, and stable application can be performed in the same state on each side of the substrate.

Moreover, the coating device ( 2 ) according to the present invention is characterized in that, in the coating device ( 1 ), the rotation mechanism unit is attached to the turning mechanism unit so as to be movable in the horizontal direction.

According to the coating device ( 2 ), the rotation mechanism unit can be moved in the horizontal direction with respect to the turning mechanism unit. Therefore, the fine adjustment of the position of the rotation mechanism (more specifically, the position of the pair of application rollers), that is, the fine adjustment of the width of the end portion of the substrate held by the pair of application rollers is performed. In addition, the position control of the pair of application rollers can be performed with higher accuracy.

Further, the coating apparatus ( 3 ) according to the present invention is the coating apparatus ( 1 ) or ( 2 ), wherein the rotation mechanism section includes a rotation drive section, a rotational force transmission section coupled to the rotation drive section, and one end. And a pair of rotating shafts whose other side is connected to the application roller, and the film forming liquid supplied by the liquid supply means from the rotation surfaces of the pair of application rollers. A flow path for the film forming liquid is formed in the pair of rotating shaft portions and the pair of application rollers so as to be discharged.

According to the coating apparatus ( 3 ), the film forming liquid flows through the flow paths formed in the pair of rotating shafts and the pair of coating rollers, and is discharged from the rotating surfaces of the pair of coating rollers. Therefore, the film forming liquid can be directly supplied to the peripheral edge portion of the substrate and can be applied without unevenness.

In the coating apparatus ( 4 ) according to the present invention, in the coating apparatus ( 3 ), the flow path of the film forming liquid formed in the pair of coating rollers is formed radially from the center of the coating roller. It is characterized by being.

According to the coating device ( 4 ), since the flow path of the film forming liquid formed in the pair of coating rollers is formed radially from the central portion of the coating roller, each of the pair of coating films The film forming liquid can be stably supplied to the entire circumference of the rotating surface of the roller.

Moreover, the coating device ( 5 ) according to the present invention includes a drying unit that dries the film forming liquid applied to the peripheral portion of the substrate in any of the coating devices (1) to ( 4 ). It is characterized by.

According to the coating apparatus ( 5 ), the film forming liquid can be dried immediately after the film forming liquid is applied by the drying means, and the workability thereafter can be improved. The effect of preventing poor coating such as peeling can be enhanced.

A coating method (1) according to the present invention is a coating method in which a film forming liquid is applied to a peripheral portion including an end surface of a substrate, and the end portion of the substrate is sandwiched between a pair of upper and lower coating rollers. While rotating the pair of application rollers in a state, supplying the film forming liquid to the rotation surface of the pair of application rollers, moving the pair of application rollers along the peripheral edge of the substrate, A coating step of coating the film forming liquid on the peripheral edge of the substrate, and in the coating step, when moving the pair of coating rollers from one side of the substrate to another side, the pair of coating rollers swirled said rotary mechanism by turning mechanism for turning the rotary mechanism for rotating, as characterized in the rotation direction of the pair of coating rollers against the end face of each side of the substrate is controlled to be in the same direction That.

According to the coating method (1), the film forming liquid is supplied to the rotating surfaces of the pair of coating rollers while the end portions of the substrate are sandwiched between the pair of coating rollers, and the pair of coating rollers The film forming liquid is applied to the peripheral portion of the substrate by moving the substrate while rotating along the peripheral portion of the substrate. Further, when the pair of application rollers is moved from one side of the substrate to another side, the rotation mechanism unit is rotated by the rotation mechanism unit, so that the pair of application rollers with respect to the end surface of each side of the substrate Since the rotation direction is controlled to be the same direction, the film forming liquid can be applied thinly and uniformly on the upper and lower surfaces of the peripheral edge of each side of the substrate, and between the pair of application rollers. Due to the generated surface tension, the film forming liquid can be applied to the end face (side surface) of the substrate, and the coating film can be formed in a thin frame with a uniform thickness on the peripheral edge of each side of the substrate. . Therefore, the generation of dust due to the collapse of the end surface portion of the substrate can be prevented, and the peripheral portion of the substrate can be reinforced with the coating film, so that the handling property of the substrate can be improved.

  The coating method (2) according to the present invention is characterized in that, in the coating method (1), the film forming liquid is applied so that the film thickness after curing is 20 μm to 60 μm.

  According to the coating method (2), since the coating step applies the film forming solution so that the film thickness after curing is 20 μm to 60 μm, the thin film substrate having a thickness of several tens to several hundreds of μm is applied. On the other hand, it can be a method suitable for forming a thin film on the peripheral edge of the substrate.

  The coating method (3) according to the present invention is characterized in that, in the coating method (1) or (2), the coating method (3) includes a drying step of drying the film forming liquid applied to the peripheral portion of the substrate. Yes.

  According to the coating method (3), since the film forming liquid applied to the peripheral portion of the substrate is dried, the film forming liquid is dried immediately after the film forming liquid is applied. The workability after that can be improved, and the effect of preventing coating defects such as peeling of the film forming liquid can be enhanced.

It is the schematic side view which abbreviate | omitted and showed the housing | casing in order to show the principal part of the coating device which concerns on embodiment of this invention. It is the schematic front view which abbreviate | omitted the housing | casing in order to show the principal part of the coating unit periphery of the coating device which concerns on embodiment. It is the front fragmentary sectional view which showed roughly the structure of the coating unit which comprises the coating device which concerns on embodiment. It is the IV-IV line expanded sectional view in FIG. It is a top view for demonstrating operation | movement of the coating roller of the coating device which concerns on embodiment. It is the figure which showed the peripheral part vicinity of the board | substrate apply | coated using the coating device which concerns on embodiment, (a) is a fragmentary perspective view, (b) is the bb sectional view taken on the line in (a). It is a schematic side view of the conventional coating device. It is the schematic front view which abbreviate | omitted and showed the housing | casing in order to show the internal mechanism of the conventional coating device.

  Hereinafter, embodiments of a coating apparatus and a coating method according to the present invention will be described with reference to the drawings. FIG. 1 is a schematic side view in which the casing is omitted to show the main part of the coating apparatus according to the embodiment, and FIG. 2 is the casing to show the main part around the coating unit of the coating apparatus. It is the schematic front view which abbreviate | omitted and showed. FIG. 3 is a front partial sectional view schematically showing the structure of the coating unit.

  The coating apparatus 1 includes a support table 10 that supports the substrate 2, a coating unit 20 that includes a pair of upper and lower coating rollers 22 a and 22 b, and a moving unit 40 that moves the coating unit 20.

  Further, the coating apparatus 1 includes a liquid supply unit 50 for supplying a film forming liquid 56 containing a resin component to the rotating surfaces 22c (see FIG. 3) of the coating rollers 22a and 22b, and a film forming liquid 56 applied to the substrate 2. Are equipped with a drying furnace 60 that performs drying, a control unit 70 that controls driving of each part of the apparatus, and an operation unit 80.

  The support table 10 is disposed between transport rails 12 disposed in parallel with the transport direction of the substrate 2. The transport rail 12 is configured to be slidable on the fixed rail 11 disposed in parallel with the transport direction of the substrate 2 by a linear mechanism or the like. The support table 10 is supported by an elevating mechanism 13 so as to be movable up and down, and the elevating mechanism 13 is attached to a support member 14 installed between the fixed rails 11. The fixed rail 11 is fixed to a housing (not shown).

  When the transport rail 12 slides on the fixed rail 11 and the substrate 2 placed on the transport rail 12 is transported onto the support table 10, the elevating mechanism 13 is operated next, and the transport rail 12 is moved. The support table 10 positioned below the upper surface is raised, and the substrate 2 is raised to a predetermined application position while being supported on the support table 10. Further, after the application, the elevating mechanism 13 is operated, the support table 10 is lowered, and the substrate 2 is placed on the transport rail 12.

  The support table 10 is provided with a suction mechanism (not shown) so that the substrate 2 can be sucked onto the upper surface of the support table 10. As the suction mechanism, a structure in which a plurality of air intake holes are provided in the support table 10 and a vacuum pump is connected to the air intake holes via an air tube can be employed.

  The moving unit 40 includes a two-axis (XY-axis) linear motion mechanism that horizontally moves the coating unit 20 in two-axis (XY-axis) directions. The X-axis cylinder 41 and X are fixed to a housing (not shown). A Y-axis cylinder 42 whose one end is slidably connected to the shaft cylinder 41, a Y-axis slider 43 that slides on the Y-axis cylinder 42, and a support guide 44 that supports the other end of the Y-axis cylinder 42 are included. It is configured. The coating unit 20 is attached to the Y-axis slider 43. The support guide 44 is fixed to a housing (not shown). The operations of the Y-axis cylinder 42 and the Y-axis slider 43 are controlled by the control unit 70.

  The coating unit 20 includes a rotation mechanism unit 21 and a turning mechanism unit 23. As shown in FIG. 3, the rotation mechanism unit 21 is configured to rotate a pair of upper and lower application rollers 22a and 22b. The turning mechanism unit 23 is configured to turn the rotating mechanism unit 21 around the rotation shaft 25 a of the turning motor 25.

  The turning mechanism portion 23 includes a connecting member 24 connected to the Y-axis slider 43, a turning motor 25 attached to the connecting member 24, a rotating shaft portion 26 connected to a rotating shaft 25a of the turning motor 25 extending in the vertical direction, and A swivel arm 27 connected to the rotation shaft portion 26 is included.

  The rotating shaft portion 26 includes a rotating shaft 26a and a ball bearing (not shown) that rotatably supports the rotating shaft 26a, and the upper end side of the rotating shaft 26a is connected to the rotating shaft 25a of the turning motor 25 for rotation. The lower end side of the shaft 26 a is connected to the turning arm 27.

  The swivel arm 27 includes an arm portion 27a extending in the horizontal direction, and a slide for slidingly moving the rotation mechanism portion 21 in the longitudinal direction (horizontal direction) of the arm portion 27a is provided at the lower surface intermediate portion of the arm portion 27a. A mechanism 28 is provided. A connecting member 29 for attaching the rotation mechanism portion 21 is attached to the slide mechanism 28. An electric linear motion guide mechanism or the like can be employed for the slide mechanism 28.

  Further, a sensor (for example, a U-shaped photo sensor) (not shown) for detecting the turning stop position of the turning arm 27 is disposed around the rotating shaft portion 26 at intervals of 90 degrees. When turning 90 degrees, a light shielding plate (not shown) installed on the turning arm 27 blocks the light receiving portion of the sensor, so that the stop position is detected.

  The rotation mechanism unit 21 includes a rotation motor 30, a gear mechanism 31 (spur gears 31a, 31b, 31c, 31d) connected to a rotation shaft 30a of the rotation motor 30 extending in the horizontal direction, rotation shafts 32a, 32b, and a pair of coatings. The rollers 22a and 22b and the application rollers 22a and 22b are configured to include holding members 33a and 33b that are rotatably held, and these components are assembled to the mounting members 34a and 34b. The rotation mechanism unit 21 is attached to the slide mechanism 28 of the turning arm 27 via a connecting member 29.

One end of the rotary shaft 32a is inserted into the center hole 31e of the spur gear 31c, the other end is connected to the central portion of the application roller 22a, and the mounting member 34a is connected via a ball bearing or a bearing spacer (both not shown). It is attached to be rotatable.
One end side of the rotating shaft 32b is inserted into the center hole 31e of the spur gear 31d, and the other end side is connected to the center portion of the application roller 22b, and is attached to a mounting member 34a via a ball bearing or a bearing spacer (both not shown). It is attached to be rotatable. In addition, what formed the application roller 22a and the rotating shaft 32a integrally can be employ | adopted, and what formed the application roller 22b and the rotating shaft 32b integrally can be employ | adopted similarly.

The rotating shafts 32a and 32b are each formed of a tubular member having a shaft hole 32d, and nozzle portions (tube joints) 51a and 51b constituting the liquid supply unit 50 are provided at the ends of the spur gears 31c and 31d. Are connected to each other.
Further, a shaft member 32c is inserted into a center hole 31e of a spur gear 31b provided between the spur gear 31a and the spur gear 31c via a ball bearing (not shown), and the other end of the shaft member 32c. Is fixed to the mounting member 34a.
The rotational force of the rotary motor 30 is transmitted to the application rollers 22a and 22b via the gear mechanism 31 (spur gears 31a, 31b, 31c and 31d) and the rotary shaft portions 32a and 32b.

  FIG. 4 shows an enlarged sectional view taken along line IV-IV in the vicinity of the pair of application rollers 22a and 22b in FIG. The application rollers 22a and 22b have a disk-like outer shape, and a hole portion 22d communicating with each shaft hole 32d of the rotation shafts 32a and 32b is formed in a substantially central portion, and a plurality of flow passage holes 22e radially from the hole portion 22d. Is formed. The application rollers 22a and 22b are preferably designed to have a diameter of about 15 mm to 50 mm and a width of about 10 mm to 30 mm.

  The liquid supply unit 50 includes a nozzle part 51a for supplying the film forming liquid 56 to the rotary shaft 32a, an electric supply pump 53 for supplying the film forming liquid 56 from the liquid storage part 52 to the nozzle part 51a, and a rotary shaft 32b. The nozzle part 51b for supplying the film forming liquid 56 and the electric supply pump 54 for supplying the film forming liquid 56 from the liquid storage part 52 to the nozzle part 51b are configured.

  The supply pump 53 and the nozzle part 51 a are connected from the liquid storage part 52 by a tube 55, and similarly, the supply pump 54 and the nozzle part 51 b are also connected from the liquid storage part 52 by a tube 55. The liquid supply unit 50 causes the film forming liquid 56 in the liquid storage part 52 to pass through the supply pump 53, the nozzle part 51a, the shaft hole 32d of the rotating shaft 32a, the hole part 22d of the application roller 22a, and the flow path hole 22e. It is discharged onto the rotating surface 22c of the application roller 22a.

  Similarly, the film forming liquid 56 in the liquid storage part 52 is applied via the supply pump 54, the nozzle part 51b, the shaft hole 32d of the rotating shaft 32b, the hole part 22d of the application roller 22b, and the flow path hole 22e. The roller 22b is discharged onto the rotating surface 22c. In addition, in the control part 70, it is also possible to perform the control which drives any one supply pump (53 or 54) besides the control which drives the supply pumps 53 and 54 together.

  The film forming liquid 56 has a characteristic (resistance to acid and / or alkali) that does not peel off in the substrate processing step (etching step, plating step, etc.), and a plurality of resin components are used so as to have excellent adhesion to the substrate surface. It is preferable to use a mixture. Moreover, it is preferable to adjust a viscosity suitably according to the film thickness which apply | coats the film formation liquid 56, for example, when making a film thickness thin, it is preferable to reduce a viscosity. Further, the drive timing of the turning motor 25, the rotation speed and drive timing of the rotary motor 30, and the like are controlled by the control unit 70.

Further, as shown in FIG. 1, a drying furnace 60 is provided behind the coating unit 20. The substrate 2 coated by the coating unit 20 is placed on the transport rail 12 and transported into the drying furnace 60, and is unloaded from the drying furnace 60 after a predetermined drying time has elapsed.
A heat insulating material 61 is disposed on the inner wall surface of the drying furnace 60, a rod-shaped fin heater 62 is disposed in the drying furnace 60 in a cross beam shape, and air is supplied to the drying furnace 60 on the inner surface of the drying furnace 60. A supply pipe 63 in which supply holes (not shown) for feeding into the inside are formed at predetermined intervals is provided. The supply pipe 63 is connected to an air pump 64 outside the drying furnace 60.

The control unit 70 controls the slide movement of the transport rail 12, the XY-axis linear movement control of the moving unit 40, the rotation / turn / slide movement control of the coating unit 20, the lifting / lowering control of the support table 10 by the lifting / lowering mechanism 13, the suction control, the liquid It has functions to control each part of the coating apparatus 1 such as drive control of the supply pumps 53 and 54 of the supply unit 50 and temperature control of the drying furnace 60, and a microcomputer, a driver circuit, a storage unit, a power supply unit, etc. (Not shown). The control unit 70 can be configured by one or a plurality of control units.
In addition, the control unit 70 sandwiches the end portion of the substrate 2 supported by the support table 10 between the pair of application rollers 22a and 22b, and in this state, the pair of application rollers 22a and 22b is inserted into the peripheral edge of the substrate 2. Each unit of the moving unit 40 and the coating unit 20 is driven and controlled so as to rotate and move along the unit.

The operation unit 80 includes a liquid crystal operation panel 81 and is attached to a housing (not shown). Through the liquid crystal operation panel 81, it is possible to perform various operations such as setting of operation conditions of each part of the coating apparatus 1, instruction of operation of each part, and switching of operation modes (manual, automatic, etc.). An operation signal or a setting signal input via the operation panel 81 is transmitted to the control unit 70 or the like.
For example, in the operation unit 80, the horizontal movement speed of the coating unit 20 by the XY axis linear movement mechanism of the moving unit 40, the rotational speed of the rotation motor 30 of the coating unit 20, and the film forming liquid by the supply pumps 53 and 54 of the liquid supply unit 50. It is possible to set operating conditions such as a feeding speed of 56, furnace temperature setting and drying time setting by the fin heater 62 of the drying furnace 60, and the like.

  Next, a method for applying the film forming liquid 56 to the peripheral portion of the substrate 2 using the coating apparatus 1 according to the embodiment will be described. In addition, the case where the thin copper-clad laminated board | substrate which carried out the rectangle as a to-be-coated object is demonstrated.

First, the board | substrate 2 is mounted in the predetermined position on the conveyance rail 12 moved to the carrying-in side, the operation part 80 is operated, and the conveyance rail 12 is slid to the application unit 20 side.
When the transport rail 12 moves and the substrate 2 is moved to a position above the support table 10, the movement of the transport rail 12 stops, and then the lifting mechanism 13 operates to raise the support table 10. As a result, the substrate 2 is supported on the support table 10, and the support table 10 is further raised to a predetermined position (a height position between the pair of application rollers 22a and 22b of the application unit 20). Further, the suction mechanism (not shown) is also operated, and the substrate 2 is supported on the support table 10 while being sucked.

  In the next coating step, the film forming liquid 56 is discharged from the rotating surface 22c while rotating the pair of coating rollers 22a and 22b with the pair of coating rollers 22a and 22b sandwiching the end of the substrate 2. In this step, the pair of application rollers 22 a and 22 b are moved along the peripheral portions of the four sides of the substrate 2.

FIG. 5 is a diagram for explaining a process of applying the peripheral edge portion of the substrate 2 with a pair of application rollers 22a and 22b. The broken lines in the figure indicate the movement trajectories of the pair of application rollers 22a and 22b. FIG. 5 shows only the upper application roller 22a.
First, the Y-axis cylinder 42 and the Y-axis slider 43 of the moving unit 40 are driven to set the pair of application rollers 22a and 22b to the position A, and the swivel motor 25 of the application unit 20 is driven to The rotation mechanism 21 is turned so that the rotation direction of the application rollers 22a and 22b and the traveling direction of the application rollers 22a and 22b coincide.

  Thereafter, the Y-axis cylinder 42 is moved in the a direction along the X-axis cylinder 41 to move the pair of application rollers 22a and 22b in the a direction, and the film is formed on the peripheral edge of the right side 2a of the substrate 2 in FIG. The forming liquid 56 is applied.

  That is, in a state where the peripheral edge of the substrate right side 2a is sandwiched between the pair of application rollers 22a and 22b (the state shown in FIG. 4), the rotation motor 30 is driven to rotate the pair of application rollers 22a and 22b. The pumps 53 and 54 are driven to move the nozzle portions 51a and 51b while discharging the film forming liquid 56 from the rotating surfaces 22c of the pair of application rollers 22a and 22b via the rotating shafts 32a and 32b. At the time of application, the positions of the pair of application rollers 22a and 22b are controlled so that the end portion of the substrate 2 does not protrude from the lateral width of the pair of application rollers 22a and 22b.

  When the pair of application rollers 22a and 22b reach the B position (before the corner portion of the substrate 2), the slide mechanism 28 provided on the swivel arm 27 of the application unit 20 is operated to move the pair of application rollers 22a and 22b to the substrate. The rotation mechanism 21 is slid by about several millimeters in the direction away from 2 (d direction), the pair of application rollers 22a and 22b are separated from the substrate 2, and the application of the substrate right side 2a is completed. The reason why the pair of application rollers 22a and 22b is separated from the substrate 2 at the B position is to prevent the film forming liquid 56 from being applied twice to the corners of the substrate, but the pair of application rollers 22a and 22b at the B position. It is also possible to apply the entire right side 2a of the substrate without separating 22b from the substrate 2.

  Thereafter, the moving unit 40 is driven to move the pair of application rollers 22a and 22b to the C position, and then the rotating mechanism portion 21 slid by the slide mechanism 28 is returned to the original position. The turning motor 25 is driven to turn the rotation mechanism portion 21 counterclockwise by 90 degrees, so that the rotation direction of the pair of application rollers 22a and 22b and the traveling direction of the application rollers 22a and 22b are matched.

  Thereafter, the moving unit 40 is driven to set the application rollers 22a and 22b to the D position, and the Y-axis slider 43 is moved in the b direction along the Y-axis cylinder 42, thereby moving the pair of application rollers 22a and 22b to b. The film forming liquid 56 is applied to the peripheral edge of the upper side 2b of the substrate in the same manner as the right side 2a of the substrate.

  When the pair of application rollers 22a and 22b reach the E position (before the corner of the substrate 2), the slide mechanism 28 provided on the swivel arm 27 of the application unit 20 is operated in the same manner as the operation at the B position described above. Then, the rotation mechanism 21 is slid by about several millimeters in a direction to separate the pair of application rollers 22a and 22b from the substrate 2, and the pair of application rollers 22a and 22b is separated from the substrate 2 to finish the application of the substrate upper side 2b.

  Thereafter, the moving unit 40 is driven to move the pair of application rollers 22a and 22b to the F position, and then the rotating mechanism portion 21 slid by the slide mechanism 28 is returned to the original position. The turning motor 25 is driven to turn the rotation mechanism portion 21 counterclockwise by 90 degrees, so that the rotation direction of the pair of application rollers 22a and 22b and the traveling direction of the application rollers 22a and 22b are matched.

  Thereafter, the moving unit 40 is driven to set the pair of application rollers 22a and 22b to the G position, and the Y-axis cylinder 42 is moved in the c direction along the X-axis cylinder 41, whereby the pair of application rollers 22a and 22b. Is moved in the c direction, and the film forming liquid 56 is applied to the peripheral portion of the left side 2c of the substrate by the same operation as the upper side 2b of the substrate.

  When the pair of application rollers 22a and 22b reach the H position (before the corner of the substrate 2), the slide mechanism 28 provided on the swivel arm 27 of the application unit 20 is operated in the same manner as the operation at the B position described above. Then, the rotation mechanism 21 is slid by several millimeters in the direction in which the pair of application rollers 22a and 22b are separated from the substrate 2, and the pair of application rollers 22a and 22b is separated from the substrate 2 to finish the application of the substrate left side 2c.

  Thereafter, the moving unit 40 is driven to move the pair of application rollers 22a and 22b to the I position, and then the rotating mechanism portion 21 slid by the slide mechanism 28 is returned to the original position. The turning motor 25 is driven to turn the rotation mechanism portion 21 counterclockwise by 90 degrees, so that the rotation direction of the pair of application rollers 22a and 22b and the traveling direction of the application rollers 22a and 22b are matched.

  Thereafter, the moving unit 40 is driven to set the pair of application rollers 22a and 22b to the J position, and the Y-axis slider 43 is moved in the d direction along the Y-axis cylinder 42, whereby the pair of application rollers 22a and 22b. Is moved in the d direction, and the film forming liquid 56 is applied to the peripheral edge of the substrate lower side 2d by the same operation as the substrate left side 2c.

  When the pair of application rollers 22a and 22b reach the K position (before the corner of the substrate 2), the slide mechanism 28 provided on the swivel arm 27 of the application unit 20 is operated in the same manner as the operation at the B position described above. Then, the rotation mechanism 21 is slid about several millimeters in the direction to separate the pair of application rollers 22a and 22b from the substrate 2, the pair of application rollers 22a and 22b is separated from the substrate 2, and the application of the substrate lower side 2d is completed. After the pair of application rollers 22a and 22b are moved to the L position, the rotation mechanism 21 slid by the slide mechanism 28 is returned to the original position, and the application work on the four sides of the substrate 2 is completed.

  After the above coating process is completed, the process proceeds to the drying process. First, after the application is completed, the elevating mechanism 13 is operated, the support table 10 is lowered, and the substrate 2 is placed on the transport rail 12. Thereafter, the transport rail 12 slides in the direction of the drying furnace 60, and the substrate 2 is transported into the drying furnace 60 set to a predetermined temperature. When a predetermined drying time has elapsed, the transport rail 12 moves, the substrate 2 is unloaded from the drying furnace 60, and the drying process is completed.

FIG. 6 is a view showing the vicinity of the peripheral edge of the substrate 2 coated using the coating apparatus 1 according to the embodiment, where (a) is a partial perspective view, and (b) is bb in (a). It is line sectional drawing.
A coating 56a made of a resin component is formed in a frame shape (end face and top and bottom faces) on the peripheral edge of the substrate 2. The film thickness of the coating film 56a is adjusted by adjusting the moving speed of the pair of coating rollers 22a and 22b, the rotation speed of the pair of coating rollers 22a and 22b, the feeding speed of the film forming liquid 56, the viscosity of the film forming liquid 56, and the like. The thickness can be controlled to 20 μm to 60 μm. Moreover, the application width of the upper and lower surfaces can be adjusted by the overlapping width between the pair of application rollers 22a and 22b and the end portion of the substrate 2, and can be adjusted to about 1 mm to 10 mm.

  In addition, in the control part 70, the control which drives any one supply pump (53 or 54) other than the control which drives the supply pumps 53 and 54 together can be performed. Therefore, by driving only the supply pump 53, the film forming liquid 56 can be applied only to the upper surface and the end surface of the peripheral edge of the substrate 2, and by driving only the supply pump 54, The film forming liquid 56 can be applied only to the lower surface and the end surface of the peripheral edge.

  According to the coating apparatus 1 according to the above embodiment, the rotating surfaces 22c of the pair of coating rollers 22a and 22b with the end portion of the substrate 2 supported by the support table 10 sandwiched between the pair of coating rollers 22a and 22b. The pair of application rollers 22 a and 22 b can be moved along the peripheral edge of the substrate 2 while supplying the film forming liquid 56 to the substrate 2. Therefore, the film forming liquid 56 can be applied thinly and uniformly on the upper and lower surfaces of the peripheral edge of the substrate 2 supported by the support table 10.

Further, the film forming liquid 56 can be applied also to the end surface of the substrate 2 by the surface tension generated in the gap between the pair of application rollers 22a and 22b, and the coating film is thin and uniform in a frame shape on the peripheral edge of the substrate 2. It can be formed with a thickness.
Therefore, the generation of dust due to the collapse of the end surface portion of the substrate 2 can be surely prevented, and the peripheral portion of the substrate 2 can be reinforced with a coating film, thereby improving the handling property of the substrate 2 in a subsequent process. it can.

  In addition, by using the film forming liquid 56 that is resistant to acids and alkalis, it is possible to improve workability and reduce costs in the substrate processing process (such as an etching process or a plating process). For example, by using the film forming liquid 56 having plating resistance, plating can be prevented from adhering to the peripheral portion of the substrate 2, masking of the peripheral portion of the substrate can be performed, and the work efficiency of masking can be improved. Can be planned.

  Further, according to the coating apparatus 1, since the rotation mechanism unit 21 can be rotated by the rotation mechanism unit 23, when the film forming liquid 56 is applied to the peripheral edge of the rectangular substrate 2, the rotation mechanism with respect to the end surface of the substrate 2. The direction of the portion 21 can be set to the same direction on each side of the substrate 2, and stable application can be performed in the same state on each side of the substrate 2.

  Further, the rotation mechanism 21 can be moved in the horizontal direction with respect to the turning mechanism 23 by the slide mechanism 28. Therefore, fine adjustment of the position of the rotation mechanism portion 21 (position of the pair of application rollers 22a and 22b), that is, fine adjustment of the clamping width of the end surface of the substrate 2 by the pair of application rollers 22a and 22b can be performed. The position control of the application rollers 22a and 22b can be performed with higher accuracy.

  Further, according to the coating apparatus 1, the shaft forming holes 32d are formed in the rotary shaft portions 32a and 32b so that the film forming liquid 56 supplied by the liquid supply unit 50 is discharged from the rotating surfaces 22c of the coating rollers 22a and 22b. Since the hole 22d and the flow path hole 22e are formed in each coating roller 22a, 22b, the film forming liquid 56 is caused to flow through the rotation shafts 32a, 32b and the coating rollers 22a, 22b. The film can be discharged from the rotating surfaces 22c of the pair of application rollers 22a and 22b, and the film forming liquid 56 can be directly supplied to the peripheral edge of the substrate 2 and can be applied without uneven coating.

  Further, since the flow passage holes 22e formed in the pair of application rollers 22a and 22b are formed radially from the central hole 22d of the application rollers 22a and 22b, the rotation surfaces 22c of the application rollers 22a and 22b. The film forming liquid 56 can be stably supplied to the entire periphery.

  Moreover, since the coating apparatus 1 includes the drying furnace 60, the film forming liquid 56 can be dried immediately after the film forming liquid 56 is applied by the drying furnace 60, and the workability thereafter can be improved. In addition, the effect of preventing coating defects such as peeling of the film forming liquid 56 can be enhanced.

  In addition, although the kind of the board | substrate used as the to-be-coated object which can respond | correspond with the coating apparatus 1 is not specifically limited, It applies suitably to the board | substrate comprised from various thin plate-like or film-like materials about several hundred micrometers-several tens micrometers can do.

  In addition, it is preferable to adjust the supply speed and the viscosity of the film forming liquid 56 so that the film forming liquid 56 discharged from the rotating surfaces 22c of the coating rollers 22a and 22b does not sag downwards. In the embodiment, a liquid receiving portion (not shown) for receiving the film forming liquid 56 discharged from the rotating surface 22c of the applying rollers 22a and 22b is provided below the applying rollers 22a and 22b, and the film received by the liquid receiving portions. By further comprising a transfer means (such as a pump) for transferring the forming liquid 56 to the liquid storage part 52, it is possible to obtain an apparatus that can collect and reuse the film forming liquid 56.

DESCRIPTION OF SYMBOLS 1 Application | coating apparatus 10 Support table 11 Fixed rail 12 Conveying rail 13 Elevating mechanism 20 Application | coating unit 21 Rotation mechanism part 22a, 22b Application | coating roller 23 Turning mechanism part 40 Movement unit 41 X axis cylinder 42 Y axis cylinder 43 Y axis slider 50 Liquid supply unit 51a, 51b Nozzle part 52 Liquid supply part 53, 54 Supply pump 56 Film forming liquid 60 Drying furnace 70 Control part 80 Operation part

Claims (8)

A coating apparatus for applying a liquid to a peripheral portion including an end face of a substrate,
A support means for supporting the substrate;
A coating means provided with a pair of coating rollers arranged to face each other so as to sandwich the end of the substrate;
Moving means for moving the coating means;
A liquid supply means for supplying a film forming liquid containing a resin component to the rotating surfaces of the pair of application rollers;
Control means for controlling the moving means so as to move the pair of coating rollers along the peripheral edge of the substrate in a state where the end portions of the substrate supported by the supporting means are sandwiched between the pair of coating rollers; equipped with a,
The application means comprises:
A rotation mechanism that rotates the pair of application rollers;
A coating device comprising: a turning mechanism for turning the rotating mechanism . Coating apparatus of claim 1, wherein said rotary mechanism is mounted to be movable in a horizontal direction with respect to the pivot mechanism. The rotation mechanism unit is
A rotation drive unit;
A rotational force transmission unit coupled to the rotational drive unit;
One end side is connected to the rotational force transmission part, and the other end side includes a pair of rotating shaft parts connected to the application roller,
A flow path for the film forming liquid is formed in the pair of rotating shafts and in the pair of application rollers so that the film forming liquid supplied by the liquid supply means is discharged from the rotation surfaces of the pair of application rollers. The coating apparatus according to claim 1 or 2, wherein The coating apparatus according to claim 3 , wherein the flow path of the film forming liquid formed in the pair of coating rollers is formed radially from a central portion of the coating roller. The coating apparatus according to any one of claims 1 to 4 , further comprising a drying unit that dries the film forming liquid applied to a peripheral edge of the substrate. An application method for applying a film forming liquid to a peripheral portion including an end face of a substrate,
While rotating the pair of application rollers in a state where the end portion of the substrate is sandwiched between a pair of upper and lower application rollers, while supplying the film forming liquid to the rotation surface of the pair of application rollers, An application step of applying the film forming liquid to the peripheral edge of the substrate by moving a pair of application rollers along the peripheral edge of the substrate ;
In the coating process,
When the pair of application rollers is moved from one side of the substrate to another side, the rotation mechanism unit is rotated by a rotation mechanism unit that rotates a rotation mechanism unit that rotates the pair of application rollers, and the substrate is rotated. The coating method is characterized in that the rotation direction of the pair of coating rollers with respect to the end faces of the respective sides is controlled to be the same direction . The coating method according to claim 6 , wherein the film forming liquid is applied so that the film thickness after curing is 20 μm to 60 μm. Claim 6 or claim 7 The coating method according to characterized in that it comprises a drying step of drying the film-forming solution coated on the periphery of the substrate.

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