TWI520666B - Application apparatus and application method - Google Patents

Description

Coating device and coating method

The present invention relates to a coating apparatus and a coating method, and more particularly to a coating apparatus and a coating method for applying a liquid to a circumferential edge portion of a wiring board.

A printed wiring board using a glass epoxy resin member is generally used as a wiring board for mounting electronic components. The glass epoxy component is formed by impregnating epoxy resin on an overlapping glass fiber cloth. Therefore, when the glass epoxy resin member is cut, fine dust composed of epoxy resin or glass fiber is generated. These fine dusts may cause problems such as poor contact and deterioration of the circuit board circuit. Therefore, it is necessary to remove the dust generated when the printed circuit board is manufactured, when the circuit board is cut.

However, even if dust is removed from the end face of the printed wiring board, since the end face portion of the printed wiring board is very brittle, there is a possibility that the end face portion is damaged and dust is generated.

Then, the present inventors have previously proposed a coating device for preventing the end portion from being damaged by coating a film forming liquid on the surface of the end of the printed wiring board (Patent Document 1).

Fig. 7 is a side sectional view showing the main part of the coating apparatus proposed by the inventors of the present invention, and Fig. 8 is a schematic front view showing the display of the internal mechanism of the coating apparatus, and the frame display is omitted.

A transfer device 102 extending in the front-rear direction is disposed across the input port 101a and the output port 101b of the housing 101. The conveyor 102 is supported by the casing 101 by a support member (not shown). An operation portion 103 having a plurality of operation switches 103a is provided on the casing 101. The transport device 102 is driven and stopped by manipulating the operation switch 103a.

The coating mechanisms 110, 110 are disposed on the left and right sides of the conveyor 102 in the casing 101, respectively. The coating mechanism 110 is fixed to a fixing plate 104 disposed opposite to the rear surface of the casing 101, and a lower portion of the fixing plate 104 is coupled to the ball screw mechanism 120. The ball screw mechanism 120 is supported by the frame 101 by a support member (not shown).

The coating mechanism 110 has a coating disk 111, a motor 112, a coating liquid supply disk 113, and a motor 114. The motors 112, 112 for rotating the coating disk 111 are fixed to the support member 105 horizontally mounted to the fixed plate 104, and the rotating shaft 112a is disposed vertically downward. The coating discs 111 and 111 are disposed in the horizontal direction and have a shaft 111a extending upward. The shaft 111a of the coating disk 111 is coupled to the rotating shaft 112a of the motor 112, and the coating disk 111 is rotated by the driving of the motor 112.

The motors 114 and 114 for rotating the coating liquid supply disk 113 are fixed to the fixed plate 104 through a pivot 115 extending in the front-rear direction, and the rotating shaft 114a is disposed in the horizontal direction. The coating liquid supply disks 113, 113 are perpendicular to the opposite side of the conveying device 102 with the coating disks 111, 111 interposed therebetween. The direction is arranged to have a shaft 113a extending in the horizontal direction. The shaft 113a of the supply disk 113 is coupled to the rotation shaft 114a of the motor 114, and the supply disk 113 is rotated by the driving of the motor 114. The shaft 113a of the coating liquid supply disk 113 is located below the lower surface of the coating disk 111, and the upper side surface of the coating liquid supply disk 113 on the side of the coating disk 111 and the periphery of the coating disk 111 Face contact.

A box-shaped liquid supply container 117 for accommodating the resin-containing film forming liquid 116 is provided below the supply disk 113, and the lower end portion of the supply disk 113 is inserted from above the liquid supply container 117 and immersed in the film forming liquid 116. . As the supply disk 113 rotates, the film forming liquid 116 moves from the lower end portion of the coating liquid supply disk 113 to the upper portion of the supply disk 113, and is supplied to the outer peripheral surface of the coating disk 111.

A ball screw mechanism 120 is connected to the lower end portion of the fixed plate 104. The ball screw mechanism 120 has motors 121 and 121 disposed below the conveyor 102. The motor 121 has a rotating shaft (not shown) that is separated from the conveyor 102 and extends in the horizontal direction, and a male screw 122 that extends in the horizontal direction is connected to the rotating shaft. Further, a cylindrical female screw body 123 is engaged with the male screw 122, and a central portion of the lower end of the fixing plate 104 is coupled to the female screw body 123. The male screw 122 is rotated by the driving of the motor 121, and the fixing plate 104 coupled to the female screw body 123 can move left and right as the male screw 122 rotates.

A method of applying the film forming liquid 116 to the end surface 130a of the printed wiring board 130 by the above coating apparatus will be described below. First, the operation switch 103a of the operation unit 103 is manipulated to rotate the motor 121 forward and reverse. The left and right positions of the coating mechanisms 110, 110 are integrated with the left and right widths of the printed wiring board 130. Then, the printed wiring board 130 is placed on the transfer device 102 from the input port 101a side, the operation switch 103a is operated, the transfer device 102, the motors 112, 112, and the motors 114, 114 are driven.

The printed wiring board 130 is transported to the coating mechanism 110 by the transport device 102, and the left and right end faces 130a and 130a are brought into contact with the peripheral faces 111b and 111b of the coating disks 111 and 111. At this time, the film forming liquid 116 adhering to the circumferential surface 111b of the coating disk 111 is applied to the left and right end faces 130a and 130a of the printed wiring board 130. Further, as the printed wiring board 130 is transported, the entire left and right end faces 130a and 130a of the printed wiring board 130 are coated with the film forming liquid 116. After the coating, the printed wiring board 130 is carried out from the output port 101b to be used in the film forming liquid 116. The resin component contained is cured.

According to the above coating apparatus, the film forming liquid 116 is applied to the both end faces 130a and 130a of the printed wiring board 130 by coating the disks 111 and 111, so that it can be formed on both end faces 130a and 130a of the printed wiring board 130. A coating film is formed.

However, in the above coating apparatus, since the film forming liquid 116 is supplied to the outer peripheral surface 111b of the coating disk 111 through the supply disk 113, the film forming liquid 116 adhered to the outer peripheral surface 111b of the coating disk 111 is coated. Since the end surface 130a of the printed wiring board 130 is configured, the supply state of the film forming liquid 116 is likely to vary with respect to the outer peripheral surface 111b of the coating disk 111.

In order to stabilize the supply state of the film forming liquid to the outer peripheral surface 111b of the coating disk 111, it is necessary to adjust the viscosity of the film forming liquid 116. When it is relatively high (the degree of not falling), there is a problem that it is difficult to make the film thickness thin and it is difficult to apply uniformly.

On the other hand, in recent years, in order to cope with the reduction in size and miniaturization of various electronic devices, in recent years, there has been an increase in demand for a thin copper-clad laminate (also referred to as a package wiring board) having a thickness of several tens of μm to several hundreds of μm.

In such a thin wiring board, it is not easy to apply a film forming liquid to the end surface of the wiring board, and it is desirable to apply a shape such as a frame shape to the circumferential edge portion including the end surface of the wiring board.

However, the coating apparatus is configured to apply only the film forming liquid 116 on the end surface 130a of the printed wiring board 130, and it is not possible to thinly and uniformly apply the film forming liquid to the frame shape at the circumferential edge portion including the end surface of the wiring board. The problem.

[Patent Document 1] International Publication No. 2010/137418

The present invention has been made in view of the above problems, and it is an object of the invention to provide a circumferential edge portion including an end surface of a wiring board, which can surely prevent dust from being generated from an end portion of the wiring board, and can simultaneously form a circumferential edge of the end surface of the wiring board. A coating device and a coating method for coating a film forming liquid with a thin portion and a uniform film thickness.

In order to achieve the above object, a coating apparatus (1) of the present invention is a coating apparatus for applying a liquid to a circumferential edge portion of a wiring board including an end surface, and is characterized in that: a supporting means for supporting a wiring board; a coating means for facing the opposite side of the coating roller capable of sandwiching the end portion of the circuit board; a moving means for moving the coating means; a liquid supply means for supplying a film forming liquid containing a resin component to the rotating surface of the wheel; and controlling the moving means so that the pair of coating rollers sandwich the end portion of the wiring board supported by the supporting means A control means for moving the coating roller along the circumferential edge portion of the wiring board.

According to the coating apparatus (1), the film formation can be provided on the rotating surface of the pair of coating rollers in a state in which the end portions of the wiring board supported by the supporting means are sandwiched by the pair of coating rollers. At the same time as the liquid, the pair of coating rollers are moved along the circumferential edge portion of the wiring board. Therefore, the film forming liquid can be thinly and uniformly applied to the upper and lower surfaces of the circumferential edge portion of the wiring board supported by the supporting means, and the surface tension generated between the pair of coating rollers can also be The film forming liquid can be applied to the end surface (side surface) of the wiring board, and a thin coating film having a uniform film thickness can be formed on the circumferential edge portion of the wiring board. Therefore, it is possible to prevent the occurrence of dust due to the destruction of the end surface portion of the wiring board, and it is possible to enhance the circumferential edge portion of the wiring board by the coating film, thereby improving the usability of the wiring board.

Further, in the coating device (2) of the present invention, in the coating device (1), the coating means includes a rotating mechanism portion for rotating the pair of coating rollers, and the rotating mechanism portion is rotated The ring mechanism department.

According to the coating device (2), the rotation mechanism portion can be rotated by the rotation mechanism portion, for example, when a film forming liquid is applied to a circumferential edge portion of a rectangular wiring board. The sides of the pair of coating rollers of the rotating mechanism portion are formed on each side of the circuit board The direction of the end faces of the wiring board is set to the same direction, so that the sides of the wiring board can be stably applied in the same state.

Further, in the coating device (3) of the present invention, in the coating device (2), the rotating mechanism portion is attached to the ring rotating mechanism portion so as to be movable in a horizontal direction.

According to the coating device (3) described above, the rotating mechanism portion can be moved in the horizontal direction with respect to the ring rotating mechanism portion. Therefore, the position of the rotating mechanism portion (more specifically, the position of the pair of coating rollers) can be finely adjusted, that is, the fine adjustment of the width of the end portion of the wiring board sandwiched by the pair of coating rollers can be performed. The position control of the pair of application rollers can be performed with higher precision.

Further, in the coating device (4) of the present invention, in the coating device (2) or (3), the rotation mechanism portion includes a rotation driving portion, and a rotation force transmitting portion coupled to the rotation driving portion One end side is coupled to the rotational force transmitting portion, and the other end side is coupled to the pair of coating rollers to rotate the shaft portion; and the film forming liquid supplied from the liquid supply means is rotatable from the pair of coating rollers The flow path of the film forming liquid is formed in the pair of rotating shaft portions and in the pair of coating rollers.

According to the coating apparatus (4), the film forming liquid flows through the respective flow paths formed in the pair of rotating shafts and the pair of coating rollers, and is discharged from the respective rotating surfaces of the pair of coating rollers. Therefore, the film forming liquid can be directly supplied to the circumferential edge portion of the wiring board, and can be uniformly applied.

Further, in the coating device (5) of the present invention, in the coating device (4), the flow path of the film forming liquid formed in the pair of coating rollers is from the coating The central portion of the roller is formed radially.

According to the coating apparatus (5), since the flow path of the film forming liquid formed in the pair of application rollers is radially formed from the central portion of the application roller, the above-described coating roller can be stably formed. The film forming liquid is supplied to the entire circumferential surface of a pair of rotating surfaces of the respective coating rollers.

Further, the coating device (6) of the present invention is characterized in that, in any of the above coating devices (1) to (5), there is a drying means for drying and coating the circumferential edge portion of the wiring board The aforementioned film forming liquid.

According to the coating apparatus (6), the film forming liquid can be dried immediately after the film forming liquid is applied by the drying means, whereby the subsequent workability can be improved, and the film forming liquid can be prevented from being peeled off. Poor coating effect.

Further, the coating method (1) of the present invention is a coating method for coating a film forming liquid on a circumferential edge portion including an end surface of a wiring board, and has a coating roller provided by a pair of upper and lower sides. The film forming liquid is supplied to the rotating surface of the pair of coating rollers while rotating the pair of coating rollers while the end portions of the wiring board are interposed therebetween, and along the circumferential direction of the wiring board The edge portion moves the pair of coating rollers to apply the coating liquid coating step to the circumferential edge portion of the wiring board.

According to the coating method (1), the film forming liquid is supplied to the rotating surface of the pair of coating rollers while the pair of coating rollers are sandwiched between the end portions of the wiring board The film forming liquid is applied to the peripheral edge portion of the wiring board by moving the coating roller while rotating along the circumferential edge portion of the wiring board. Therefore, the film forming liquid can be thinly and uniformly applied to the upper and lower surfaces of the circumferential edge portion of the wiring board, and the surface tension generated between the pair of coating rollers can also be used in the wiring board. The film forming liquid is applied to the end surface (side surface), and a thin and uniform film-shaped coating film can be formed on the circumferential edge portion of the wiring board. Therefore, it is possible to prevent generation of dust due to damage of the end surface portion of the wiring board, and at the same time, the circumferential edge portion of the wiring board can be reinforced by the coating film, and the usability of the wiring board can be improved.

Further, in the coating method (2) of the present invention, in the coating method (1), the film forming liquid is applied so that the film thickness after curing is 20 μm to 60 μm.

According to the above coating method (2), since the film formation liquid is applied by setting the film thickness after curing to 20 μm to 60 μm, the coating is applied to a thin wiring board having a thickness of from several tens of μm to several hundreds of μm. The step can be an appropriate method of forming a coating film having a thin film thickness on the circumferential edge portion of the wiring board.

Further, in the coating method (3) of the present invention, the coating method (1) or (2) has a drying step for applying the aforementioned coating to the circumferential edge portion of the wiring board. Membrane forming solution dry.

According to the coating method (3), since the film forming liquid for drying the film forming liquid applied to the circumferential edge portion of the wiring board is provided, the film formation can be formed immediately after the film forming liquid is applied. When the liquid is dried, the subsequent workability can be improved, and the effect of preventing coating failure such as peeling of the film forming liquid can be improved.

1‧‧‧ Coating device

2‧‧‧PCB

2a‧‧‧right side of the circuit board

2b‧‧‧On the board

2c‧‧‧left side of the circuit board

2d‧‧‧ under the circuit board

10‧‧‧Support table

11‧‧‧Fixed rails

12‧‧‧Transportation rails

13‧‧‧ Lifting mechanism

14‧‧‧Support parts

20‧‧‧ Coating unit

21‧‧‧Rotating Mechanism Department

22a, 22b‧‧‧ coating roller

22c‧‧‧Rotating surface

22d‧‧‧ Hole Department

22e‧‧‧Flow hole

23‧‧‧Circular Mechanism Department

24, 29‧‧‧ Linked parts

25‧‧‧ring motor

25a, 26a, 30a, 32a, 32b‧‧‧ rotating shaft

26‧‧‧Rotary shaft

27‧‧‧ring arm

27a‧‧‧ wrist

28‧‧‧Sliding mechanism

30‧‧‧Rotary motor

31‧‧‧Tooth transfer mechanism

31a, 31b, 31c, 31d‧‧‧ spur gears

31e‧‧‧Center hole

32c‧‧‧ shaft material

32d‧‧‧Axis hole

33a, 33b‧‧‧ Keeping parts

34a, 34b‧‧‧Installation parts

40‧‧‧Mobile unit

41‧‧‧X-axis cylinder

42‧‧‧Y-axis cylinder

43‧‧‧Y-axis slider

44‧‧‧Support guide

50‧‧‧Liquid supply unit

51a, 51b‧‧‧ nozzle section

52‧‧‧Liquid supply department

53, 54‧‧‧Supply pump

55‧‧‧ tube

56‧‧‧film forming fluid

60‧‧‧ drying oven

61‧‧‧heat-dissipating materials

62‧‧‧Fin heater

63‧‧‧Supply piping

64‧‧‧Air pump

70‧‧‧Control Department

80‧‧‧Operation Department

81‧‧‧LCD operation panel

101‧‧‧ frame

101a‧‧‧ input port

101b‧‧‧ outlet

102‧‧‧Transfer device

103‧‧‧Operation Department

103a‧‧‧Operation switch

104‧‧‧Fixed plate

105‧‧‧Support parts

110‧‧‧Applicator

111‧‧‧ coated disc

111a‧‧‧Axis

111b‧‧‧ outer perimeter

112, 114, 121‧‧ ‧ motor

112a‧‧‧Rotary axis

113‧‧‧Application liquid supply disc

113a‧‧‧Axis

114a‧‧‧Rotary axis

115‧‧‧ pivot

116‧‧‧film forming fluid

117‧‧‧Liquid supply container

120‧‧‧Rolling screw mechanism

122‧‧‧ male thread

123‧‧‧Female thread body

130‧‧‧Printed circuit board

130a‧‧‧ end face

Fig. 1 is a schematic side view showing the main body of the coating apparatus according to the embodiment of the present invention, and the frame is omitted.

Fig. 2 is a schematic front view showing the main body of the coating unit of the coating device of the embodiment, and the frame is omitted.

Fig. 3 is a front cross-sectional partial cross-sectional view schematically showing the structure of a coating unit constituting the coating apparatus of the embodiment.

Fig. 4 is an enlarged cross-sectional view taken along line IV-IV in Fig. 3.

Fig. 5 is a plan view for explaining the operation of the coating roller of the coating device of the embodiment.

Fig. 6 is a view showing the vicinity of the circumferential edge portion of the wiring board coated by the coating apparatus of the embodiment, (a) a partial perspective view, and (b) a cross-sectional view taken along line b-b in (a).

Fig. 7 is a schematic side view of a conventional coating apparatus.

Fig. 8 is a schematic front view showing the housing in order to show the internal mechanism of the conventional coating apparatus.

Embodiments of the coating apparatus and the coating method of the present invention will be described below based on the drawings. Fig. 1 is a schematic side view showing the main part of the coating apparatus of the embodiment in which the housing display is omitted. Fig. 2 is a schematic front view in which the main body member around the coating unit of the coating device is displayed, and the display of the casing is omitted. Fig. 3 is a cross-sectional view schematically showing a front view of the structure of the coating unit.

The coating apparatus 1 includes a support base 10 that supports the wiring board 2, a coating unit 20 that has a pair of upper and lower application rollers 22a and 22b, and a moving unit 40 that moves the coating unit 20. Further, the coating device 1 is provided with a liquid supply unit 50 that supplies a film forming liquid 56 containing a resin component to the rotating surface 22c (see FIG. 3) of each of the application rollers 22a and 22b, and is applied to the wiring board 2 The dried drying oven 60 of the upper film forming liquid 56 controls the control unit 70 and the operation unit 80 that are driven by the respective portions of the device.

The support base 10 is disposed between the transport rails 12 disposed in parallel with the transport direction of the circuit board 2. The transport rail 12 is configured to be slidably movable on a fixed rail 11 disposed in parallel with the transport direction of the wiring board 2 by a linear mechanism or the like. The support table 10 is supported by the elevating mechanism 13 so as to be movable up and down, and the elevating mechanism 13 is mounted on the support member 14, which is disposed between the fixed rails 11. The fixed rail 11 is fixed to the casing (not shown).

The transport rail 12 is slidably moved on the fixed rail 11, the wiring board 2 placed on the transport rail 12 is transported onto the support table 10, and then the elevating mechanism 13 is operated, the support table 10 is lifted from below the transport rail 12, and the circuit board 2 is supported. On the support table 10, in this state, the support table 10 rises to a certain coating position. Further, at the end of the coating operation, the elevating mechanism 13 operates, the support table 10 descends, and the wiring board 2 is placed on the transport rail 12.

Further, a suction mechanism (not shown) is provided on the support base 10, so that the wiring board 2 can be sucked on the upper surface of the support base 10. As the absorbing mechanism, a plurality of air suction holes are provided in the support base 10, and the air suction holes are connected to the vacuum pump through an air duct.

The moving unit 40 is constituted by a 2-axis (XY-axis) linear motion mechanism capable of horizontally moving the coating unit 20 in two axial (XY-axis) directions, and is configured to include an X-axis fixed to a casing (not shown). The cylinder 41 has a Y-axis cylinder 42 coupled to the X-axis cylinder 41 so as to be slidable on one end side, a Y-axis slider 43 that slides on the Y-axis cylinder 42 and a support guide portion that supports the other end side of the Y-axis cylinder 42. 44. A coating unit 20 is attached to the Y-axis slider 43. The support guide portion 44 is fixed to a casing (not shown). The operation of the Y-axis cylinder 42 and the Y-axis slider 43 is controlled by the control unit 70.

The coating unit 20 includes a rotation mechanism portion 21 and a loop mechanism portion 23. As shown in Fig. 3, the rotation mechanism portion 21 is configured by rotating a pair of upper and lower application rollers 22a and 22b. The loop mechanism unit 23 is configured to rotate the rotation mechanism unit 21 around the rotation shaft 25a of the ring motor 25.

The configuration of the loop mechanism unit 23 includes a coupling member 24 coupled to the Y-axis slider 43, and a rotation motor 25 attached to the coupling member 24 is coupled to the rotation shaft 25a of the ring motor 25 extending in the vertical direction. The shaft portion 26 and the ring arm 27 coupled to the rotating shaft portion 26.

The rotating shaft portion 26 includes a rotating shaft 26a and a ball bearing (not shown) that rotatably supports the rotating shaft 26a. The upper end side of the rotating shaft 26a is coupled to the rotating shaft 25a of the ring motor 25, and the lower end side of the rotating shaft 26a. It is coupled to the ring arm 27.

The ring arm 27 has a wrist portion 27a extending in the horizontal direction, and a sliding mechanism 28 is provided at a lower portion of the lower portion of the arm portion 27a for moving the rotation mechanism portion 21 in the longer direction (horizontal direction) of the wrist portion 27a. Slide to move. A coupling member 29 for coupling the rotation mechanism portion 21 is attached to the slide mechanism 28. On the slide mechanism 28, an electric direct motion guide mechanism or the like can be employed.

Further, a sensor (for example, a U-shaped photosensitive sensor) for inspecting the loop stop position of the ring arm 27 is disposed at an interval of 90 degrees around the rotation shaft portion 26 (not shown). When the ring arm 27 is rotated 90 degrees, a light shielding plate (not shown) provided on the ring arm 27 blocks the light receiving portion of the sensor, and the stop position can be detected.

The rotation mechanism unit 21 includes a rotation motor 30, a gear mechanism 31 (spur gears 31a, 31b, 31c, and 31d) coupled to a rotation shaft 30a of the rotary motor 30 extending in the horizontal direction, and a pair of rotation shafts 32a and 32b. The rollers 22a, 22b hold the holding members 33a, 33b to which the coating rollers 22a, 22b can rotate, and these members are mounted on the mounting members 34a, 34b. The rotation mechanism portion 21 is attached to the slide mechanism 28 of the ring arm 27 via the coupling member 29.

One end side of the rotating shaft 32a is inserted into the center hole 31e of the spur gear 31c, and the other end side is connected to the center portion of the coating roller 22a. The over ball bearing and the bearing cage (both not shown) are rotatably mounted on the mounting member 34a.

One end side of the rotating shaft 32b is inserted into the center hole 31e of the spur gear 31d, and the other end side is coupled to the center portion of the coating roller 22b, and is rotatably mounted through the ball bearing and the bearing holder (both not shown). On the mounting part 34a. Further, the application roller 22a and the rotating shaft 32a may be integrally formed, and similarly, the application roller 22b and the rotating shaft 32b may be integrally formed.

Further, the rotating shafts 32a and 32b are each formed of a tubular member having a shaft hole 32d, and the nozzle portions (pipe joints) 51a and 51b constituting the liquid supply unit 50 are connected to the ends of the spur gears 31c and 31d, respectively.

Further, in the center hole 31e of the spur gear 31b provided between the spur gear 31a and the spur gear 31c, the shaft member 32c is inserted through a ball bearing (not shown), and the other end of the shaft member 32c is fixed to the mounting member 34a.

The rotational force of the rotary motor 30 passes through the gear mechanism 31 (spur gears 31a, 31b, 31c, 31d), and the rotary shaft portions 32a and 32b are transmitted to the application rollers 22a and 22b.

Fig. 4 is an enlarged cross-sectional view of the coating roller 22a, 22b taken along line IV-IV of Fig. 3; The application rollers 22a and 22b have a disk-shaped outer shape, and a hole portion 22d that communicates with each of the shaft holes 32d of the rotation shafts 32a and 32b is formed at a substantially central portion, and a plurality of radial flow path holes are formed from the hole portion 22d. 22e. Further, it is preferable that the diameter of the application rollers 22a, 22b is about 15 mm to 50 mm, and the width is set to about 10 mm to 30 mm.

The liquid supply unit 50 includes a nozzle portion 51a for supplying the film forming liquid 56 to the rotating shaft 32a, an electric supply pump 53 for supplying the film forming liquid 56 from the liquid containing portion 52 to the nozzle portion 51a, and a film forming liquid for the rotating shaft 32b. The nozzle portion 51b of the 56, the electric supply pump 54 that supplies the film forming liquid 56 to the nozzle portion 51b from the liquid accommodating portion 52.

The supply pump 53 and the nozzle portion 51a are connected to the liquid storage portion 52 via the tube 55. Similarly, the supply pump 54 and the nozzle portion 51b are also coupled to the liquid storage portion 52 via the tube 55.

The film forming liquid 56 in the liquid accommodating portion 52 passes through the supply pump 53, the nozzle portion 51a, the shaft hole 32d of the rotating shaft 32a, the hole portion 22d of the coating roller 22a, and the flow path hole 22e. The rotating surface 22c of the coating roller 22a is discharged.

Further, similarly, the film forming liquid 56 in the liquid accommodating portion 52 passes through the supply pump 54, the nozzle portion 51b, the shaft hole 32d of the rotating shaft 32b, the hole portion 22d of the coating roller 22b, and the flow path hole 22e, to the coating roller. The rotating surface 22c of 22b is discharged. Further, the control unit 70 can perform control for driving any one of the supply pumps (53 or 54) in addition to the control for driving the pumps 53 and 54.

The film forming liquid 56 has characteristics (acid resistance and/or smash resistance) that do not peel off in the wiring board processing step (such as an etching step and a plating step), and is mixed with a plurality of resin components excellent in adhesion to the surface of the wiring board. The composition of the liquid. Further, the viscosity is appropriately adjusted in accordance with the film thickness of the coating film forming liquid 56. For example, when the film thickness is thin, it is preferred to lower the viscosity of the film forming liquid 56. In addition, the driving timing of the ring motor 25, the rotation of the rotary motor 30 The rotation speed, the driving timing, and the like are controlled by the control unit 70.

Further, as shown in Fig. 1, a drying furnace 60 is provided behind the coating unit 20. The wiring board 2 coated by the coating unit 20 is transported into the drying furnace 60 while being placed on the transport rail 12, and is discharged from the drying furnace 60 after a certain drying time.

A heat insulating material 61 is disposed on the inner wall surface of the drying furnace 60, and a rod-shaped fin heater 62 is disposed in a well shape in the drying furnace 60, and a supply pipe is provided on the inner circumference of the inner surface of the drying furnace 60. 63. A supply hole (not shown) for feeding air into the drying furnace 60 is formed at a predetermined interval on the supply pipe 63. The supply pipe 63 is connected to an air pump 64 outside the drying furnace 60.

The control unit 70 has sliding movement control for the transport rail 12, XY-axis linear motion control of the moving unit 40, rotation/loop/sliding movement control of the coating unit 20, and lifting control of the support table 10 by the elevating mechanism 13. The suction control, the drive control of the supply pumps 53 and 54 of the liquid supply unit 50, and the temperature control of the drying furnace 60, etc., control functions of the respective portions of the coating device 1, including a microcomputer, a drive circuit, a memory unit, and a power supply unit. And so on (any one is not shown). Further, the control unit 70 may be constituted by one or a plurality of control units.

Further, the control unit 70 has a state in which the end portion of the wiring board 2 supported by the support base 10 is sandwiched between the pair of application rollers 22a and 22b, so that the pair of application rollers 22a and 22b are along the wiring board 2. The circumferential edge portion is rotationally moved to drive the functions of controlling the respective portions of the moving unit 40 and the coating unit 20.

The operation unit 80 has a liquid crystal operation panel 81 and is attached to a casing (not shown). By the liquid crystal operation panel 81, it is possible to set various operating conditions of the respective portions of the coating device 1, various operation instructions, and various operations such as switching between operation modes (manual, automatic, etc.). The input operation signal and setting signal can be transmitted to the control unit 70 or the like through the operation panel 81.

For example, in the operation unit 80, the horizontal moving speed of the coating unit 20 by the XY-axis linear motion mechanism of the moving unit 40 and the rotational speed of the rotary motor 30 of the coating unit 20 can be performed by the liquid supply unit 50. The setting of the operating conditions such as the conveying speed of the film forming liquid 56 by the supply pumps 53 and 54 is set by the fin heater 62 of the drying furnace 60, the setting of the drying time, and the like.

Next, a coating method in which the coating device 1 of the embodiment is applied to the circumferential edge portion of the wiring board 2 by applying the film forming liquid 56 will be described. Further, a case where a thin copper clad laminate having a rectangular shape is used as an object to be coated will be described.

First, the wiring board 2 is placed at a predetermined position on the transport rail 12 that moves to the loading side, and the operation unit 80 is manipulated to slide the transport rail 12 toward the coating unit 20 side.

When the transport rail 12 moves and transports the circuit board 2 to the upper position of the support base 10, the movement of the transport rail 12 is stopped, and then the elevating mechanism 13 operates, the support base 10 rises upward, and the circuit board 2 is supported on the support base 10. Further, the support table 10 is raised to a certain position (the position of the height between the pair of application rollers 22a and 22b of the coating unit 20). In addition, The absorbing mechanism (not shown) also operates, and the wiring board 2 is supported by the support base 10 in a state of being sucked.

In the subsequent coating step, the film forming liquid 56 is discharged from the rotating surface 22c while rotating the pair of application rollers 22a and 22b while holding the pair of application rollers 22a and 22b at the end portions of the wiring board 2. At the same time, the pair of rollers 22a and 22b are moved along the circumferential edge portions of the four sides of the wiring board 2.

Fig. 5 is a view for explaining a step of coating the circumferential edge portion of the wiring board 2 with a pair of application rollers 22a and 22b. The broken line in the figure shows the movement trajectory of a pair of application rollers 22a, 22b. Further, in the fifth drawing, only the upper application roller 22a is shown.

First, the Y-axis cylinder 42 and the Y-axis slider 43 of the moving unit 40 are driven to position the pair of application rollers 22a and 22b at the A position. Further, the ring-turn motor 25 of the coating unit 20 is driven, and the rotation mechanism portion 21 causes the rotation directions of the pair of application rollers 22a and 22b to coincide with the advancing directions of the application rollers 22a and 22b.

Then, by moving the Y-axis cylinder 42 in the a direction along the X-axis cylinder 41, the pair of application rollers 22a and 22b are moved in the a direction, which is the circumferential edge portion of the right side 2a of the wiring board 2 in FIG. The film forming liquid 56 is applied.

In other words, in a state in which the pair of application rollers 22a and 22b sandwich the circumferential edge portion of the right side 2a of the circuit board (the state shown in Fig. 4), the rotary motor 30 is driven to form a pair of application rollers 22a and 22b. Rotating while moving, simultaneously driving the supply pumps 53, 54 and transmitting through the nozzle portions 51a, 51b The rotating shafts 32a and 32b discharge the film forming liquid 56 from the rotating surface 22c of the pair of coating rollers 22a and 22b. Further, in order to apply, the end portion of the wiring board 2 is not exposed from the wide sides of the pair of application rollers 22a, 22b, and the positions of the pair of application rollers 22a, 22b are controlled.

When the pair of application rollers 22a and 22b reach the B position (the front surface of the corner portion of the wiring board 2), the slider mechanism 28 provided on the rotary arm 27 of the application roller 20 is operated by the pair of application rollers 22a and 22b. In the direction (d direction) in which the wiring board 2 is separated, the sliding mechanism portion 21 is moved by a few mm, whereby the pair of application rollers 22a and 22b are separated from the wiring board 2, and the application of the right side 2a of the wiring board is completed. Further, the pair of application rollers 22a and 22b are separated from the wiring board 2 at the position B so as to prevent the application of the film forming liquid 56 twice at the corner portion of the wiring board, but the pair of coating rollers are not disposed at the B position. It is also possible to separate the 22a and 22b from the wiring board 2 and apply the entire right side 2a of the wiring board.

Subsequently, the moving unit 40 is driven to move the pair of coating rollers 22a, 22b to the C position, and the sliding mechanism portion 21 of the sliding movement is returned to the original position by the slider mechanism 28 to drive the loop of the loop mechanism portion 23. The motor 25 rotates the rotating mechanism portion 21 to the left by 90 degrees so that the rotation directions of the pair of application rollers 22a and 22b coincide with the advancing directions of the application rollers 22a and 22b.

Subsequently, the moving unit 40 is driven to move the application rollers 22a, 22b at the D position, and the pair of application rollers 22a, 22b are moved in the b direction by moving the Y-axis slider 43 in the b direction along the Y-axis cylinder 42. By the same action as the right side 2a of the circuit board, the circumferential direction of the side 2b of the circuit board The film forming liquid 56 is applied to the edge portion.

When the pair of application rollers 22a and 22b reach the E position (the front surface of the corner portion of the wiring board 2), the slider mechanism provided on the ring arm 27 of the coating unit 20 is the same as the operation at the B position. In the operation of 28, the pair of application rollers 22a and 22b are slid in the direction away from the circuit board 2, and the rotation mechanism portion 21 is moved by about several mm, whereby the pair of application rollers 22a and 22b are separated from the circuit board 2, and the circuit board side is separated. The application of 2b is completed.

Subsequently, the drive moving unit 40 moves the pair of application rollers 22a, 22b to the F position, and the slider mechanism 28 returns the slide mechanism portion 21 that has been slidably moved back to the original position, and drives the loop of the loop mechanism portion 23. The rotation motor 25 rotates the rotation mechanism portion 21 90 degrees to the left to match the rotation directions of the pair of application rollers 22a and 22b with the advance directions of the application rollers 22a and 22b.

Subsequently, the moving unit 40 is driven to position the pair of application rollers 22a and 22b at the G position, and the pair of application rollers 22a and 22b are moved in the c direction by moving the Y-axis cylinder 42 in the c direction along the X-axis cylinder 41. Moving, the film forming liquid 56 is applied to the circumferential edge portion of the left side 2c of the wiring board in the same operation as the board edge 2b.

When the pair of application rollers 22a and 22b reach the H position (the front surface of the corner portion of the wiring board 2), the slider mechanism provided on the ring arm 27 of the coating unit 20 is the same as the operation at the B position. In the operation of 28, the pair of application rollers 22a and 22b are slid and moved by a few mm in the direction in which the rotation mechanism unit 21 is moved away from the wiring board 2, whereby the pair of application rollers 22a and 22b are separated from the wiring board 2, and the left side of the wiring board The application of 2c is completed.

Subsequently, after the driving unit 40 is moved to move the pair of application rollers 22a and 22b to the position I, the slider mechanism 28 returns the sliding mechanism portion 21 that has been slidably moved to the original position, and drives the ring of the loop mechanism portion 23. The rotary motor 25 rotates the loop mechanism portion 21 to the left by 90 degrees so that the rotation directions of the pair of application rollers 22a and 22b coincide with the advance directions of the application rollers 22a and 22b.

Subsequently, the drive moving unit 40 positions the pair of application rollers 22a, 22b at the J position, and moves the Y-axis slider 43 in the d direction along the Y-axis cylinder 42, so that the pair of application rollers 22a, 22b are oriented in the d direction. The movement is performed in the same manner as the left side 2c of the wiring board, and the film forming liquid 56 is applied to the circumferential edge portion of the lower side 2d of the wiring board.

When the pair of application rollers 22a and 22b reach the K position (the front surface of the corner portion of the wiring board 2), the sliding mechanism 28 provided to the ring arm 27 of the coating roller unit 20 is the same as that at the time of the B position. In the direction in which the pair of application rollers 22a and 22b are separated from the wiring board 2, the rotating mechanism portion 21 is moved by a few mm, and the pair of coating rollers 22a and 22b are separated from the wiring board 2, and the coating of the lower side 2d of the wiring board is completed. After the pair of application rollers 22a, 22b are moved to the L position, the sliding mechanism portion 21 that is slidably moved back to the original position by the slider mechanism 28, and the four sides of the wiring board 2 are coated. The application is over.

After the completion of the coating step, a drying step is followed. First, after the application is completed, the elevating mechanism 13 operates, the support table 10 is lowered, and the wiring board 2 is placed on the transport rail 12. Subsequently, the transport rail 12 is slidably moved in the direction of the drying furnace 60, and the circuit board 2 is transported to be set to one. The temperature is within the drying oven 60. After a certain drying time, the transport rail 12 moves, the circuit board 2 is carried out from the drying furnace 60, and the drying process is completed.

Fig. 6 is a view showing the vicinity of the circumferential edge portion of the wiring board 2 coated by the coating device 1 of the embodiment, (a) is a partial perspective view, and (b) is a sectional view taken along line bb in (a). .

The coating film 56a made of a resin component is formed in a frame shape (end surface, upper and lower surfaces) at the circumferential edge portion of the wiring board 2. The thickness of the coating film 56a can be controlled to 20 μm by adjusting the moving speed of the pair of coating rollers 22a and 22b, the rotation speed of the pair of rollers 22a and 22b, the conveying speed of the film forming liquid 56, and the viscosity of the film forming liquid 56. To 60 μm thick. Further, the upper and lower coating widths can be adjusted by the overlapping width between the pair of application rollers 22a and 22b and the end portions of the wiring board 2, and can be adjusted to the extent of 1 mm to 10 mm.

Further, the control unit 70 can control the driving of any one of the supply pumps (53 or 54) in addition to the driving of the supply pumps 53 and 54 at the same time. Therefore, by driving only the supply pump 53, the film forming liquid 56 can be applied only to the upper surface and the end surface portion of the circumferential edge portion of the wiring board 2, and by merely driving the supply pump 54, it is possible only on the wiring board 2. The film forming liquid 56 is applied to the lower surface and the end surface portion of the circumferential edge portion.

According to the coating apparatus 1 of the above-described embodiment, in a state where the pair of application rollers 22a and 22b sandwich the end portion of the wiring board 2 supported by the support base 10, the rotation surfaces of the pair of application rollers 22a and 22b can be used. 22c supplies the film forming liquid 56 while moving the pair of application rollers 22a, 22b along the circumferential edge portion of the wiring board 2. Therefore, it is possible to support the line supported by the support table 10. The film forming liquid 56 is thinly and uniformly coated on the upper and lower surfaces of the circumferential edge portion of the road board 2.

Further, the film forming liquid 56 can be applied to the end surface of the wiring board 2 by the surface tension generated in the gap between the pair of application rollers 22a and 22b, so that the peripheral edge portion of the wiring board 2 can be formed thin. A uniform film thickness of the frame-like coating film.

Therefore, it is possible to surely prevent the occurrence of dust due to the destruction of the end surface portion of the wiring board 2, and at the same time, the circumferential edge portion of the wiring board 2 can be reinforced by the coating film, so that the wiring board 2 in the subsequent process can be improved. Usability.

Further, by using the film forming liquid 56 having acid resistance and alkali resistance, workability and cost reduction in the wiring board processing step (such as an etching step and a plating step) can be achieved. For example, by using the film forming liquid 56 having plating resistance, it is possible to prevent plating from adhering to the circumferential edge portion of the wiring board 2, and it is possible to shield the peripheral edge portion of the wiring board, thereby improving the work efficiency of shielding. .

Further, according to the coating device 1, since the rotation mechanism portion 21 can be rotated by the loop mechanism portion 23, when the film forming liquid 56 is applied to the circumferential edge portion of the rectangular wiring board 2, the rotation mechanism portion 21 can be provided. The direction with respect to the end faces of the wiring board 2 is set to be the same direction at each side of the wiring board 2, so that each side of the wiring board 2 can be stably applied in the same state.

Further, the slide mechanism portion 21 can move the rotation mechanism portion 21 in the horizontal direction with respect to the loop mechanism portion 23. Therefore, able to The fine adjustment of the position of the rotation mechanism portion 21 (the position of the pair of application rollers 22a and 22b), that is, the fine adjustment of the nip width of the pair of application rollers 22a and 22b to the end surface of the wiring board 2 can be performed with higher precision The position control of the pair of application rollers 22a, 22b is performed.

In addition, in the coating device 1, the film forming liquid 56 supplied from the liquid supply unit 50 is discharged from the rotating surface 22c of each of the coating rollers 22a and 22b, and the shaft holes 32d are formed in the respective rotating shaft portions 32a and 32b. Since the hole portions 22d and the flow path holes 22e are formed in the application rollers 22a and 22b, the film formation liquid 56 can flow in the respective rotation shafts 32a and 32b and the application rollers 22a and 22b, from a pair of application rollers. The rotating surfaces 22c of the 22a and 22b are discharged, and the film forming liquid 56 can be directly provided to the circumferential edge portion of the wiring board 2, and can be uniformly applied.

Further, since the flow path holes 22e formed in the pair of application rollers 22a and 22b are formed radially from the hole portions 22d at the center of the application rollers 22a and 22b, the rotation faces of the application rollers 22a and 22b can be formed. The film forming liquid 56 is stably supplied to the entire circumference of 22c.

Further, since the coating device 1 has the drying furnace 60, the drying of the film forming liquid can be performed immediately after the film forming liquid 56 is applied, whereby the subsequent workability can be improved, and the peeling of the film forming liquid 56 can be improved. The effect of poor coating.

In addition, the type of the wiring board to be coated which the coating apparatus 1 can cope with is not particularly limited, but a wiring board made of various materials having a thickness of several hundred μm to several tens of μm and a film shape can be preferably used.

In addition, in order to prevent the film forming liquid 56 discharged from the rotating surface 22c of the coating rollers 22a and 22b from falling downward, it is preferable to adjust the supply speed and viscosity of the film forming liquid 56, but in other embodiments, Below the application rollers 22a and 22b, a liquid receiving portion (not shown) that receives the film forming liquid 56 discharged from the rotating surface 22c of the coating rollers 22a and 22b is provided, and is further equipped with the liquid receiving portion. The film forming liquid 56 moves to the transfer means (pump or the like) of the liquid accommodating portion 52, and can be reused as the recovered film forming liquid 56.

1‧‧‧ Coating device

10‧‧‧Support table

11‧‧‧Fixed rails

12‧‧‧Transportation rails

13‧‧‧ Lifting mechanism

20‧‧‧ Coating unit

21‧‧‧Rotating Mechanism Department

22a, 22b‧‧‧ coating roller

23‧‧‧Circular Mechanism Department

40‧‧‧Mobile unit

41‧‧‧X-axis cylinder

42‧‧‧Y-axis cylinder

43‧‧‧Y-axis slider

50‧‧‧Liquid supply unit

51a, 51b‧‧‧ nozzle section

52‧‧‧Liquid supply department

53, 54‧‧‧Supply pump

56‧‧‧film forming fluid

60‧‧‧ drying oven

70‧‧‧Control Department

80‧‧‧Operation Department

Claims (8)

A coating device for applying a liquid to a circumferential edge portion of a wiring board including an end surface, comprising: a supporting means for supporting the wiring board; and a pair of coating rollers disposed to face each other across the end portion of the wiring board a coating means for moving the coating means; a liquid supply means for supplying a film forming liquid containing a resin component to the rotating surface of the pair of coating rollers; and the support by the pair of coating rollers a control means for controlling the movement means to move the pair of coating rollers along a circumferential edge portion of the wiring board in a state of an end portion of the circuit board supported by the means; the coating means having the pair of coating rollers a rotating rotating mechanism portion and a looping mechanism portion that rotates the rotating mechanism portion. The coating device according to claim 1, wherein the rotating mechanism portion is attached to the ring rotating mechanism portion so as to be movable in a horizontal direction. The coating device according to the first or second aspect of the invention, wherein the rotating mechanism unit includes a rotation driving unit, and a rotation force transmitting unit coupled to the rotation driving unit is coupled to the rotation force transmitting unit at one end side. a pair of rotating shaft portions coupled to the coating roller on the other end side; In order to allow the film forming liquid supplied from the liquid supply means to be discharged from the rotating surface of the pair of coating rollers, a flow path of the film forming liquid is formed in the pair of rotating shaft portions and the pair of coating rollers. The coating device according to the third aspect of the invention, wherein the flow path of the film forming liquid formed in the pair of coating rollers is formed radially from a central portion of the coating roller. The coating apparatus according to any one of claims 1 to 2, further comprising a drying means for drying the film forming liquid applied to a peripheral edge portion of the wiring board. A coating method for coating a film forming liquid on a circumferential edge portion including an end surface of a wiring board, wherein a state in which an end portion of the wiring board is interposed between a pair of upper and lower coating rollers is used The rotation mechanism unit rotates the pair of coating rollers to supply the film forming liquid to the rotating surface of the pair of coating rollers, and simultaneously moves the pair of coating rollers along the circumferential edge portion of the wiring board. The step of applying the film forming liquid to the circumferential edge portion of the wiring board, and in the coating step, when the pair of coating rollers are moved from one side of the wiring board to the other side, The loop mechanism portion for causing the rotation mechanism portion of the pair of coating rollers to rotate is controlled such that the rotation directions of the pair of coating rollers are in the same direction with respect to the end faces of the respective sides of the wiring board. The coating method according to claim 6, wherein the film forming liquid is applied so that the film thickness after curing is from 20 μm to 60 μm. The coating method according to claim 6 or 7, wherein the coating method has a drying step of drying the film forming liquid applied to a circumferential edge portion of the wiring board.