JPH06104549A - Dustproof method for end face of copper clad laminate - Google Patents

Abstract

PURPOSE:To reduce causes of defect due to chips or dust remarkably during production process of printed wiring board by treating the end face being cut and to eliminate load on a production line due to falling of chips or dust while contributing to clean environment. CONSTITUTION:A copper clad laminate 1, where a copper foil 3 is applied onto the surface of a material 2, is cut into work size. Resin 4 is applied onto the cut end face of the copper clad laminate 1. The resin 4 is then dried at 120 deg.C for 10min thus treating the cut end face of the copper clad laminate 1.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a cut copper clad laminate.

[0002]

2. Description of the Related Art Hitherto, as a method for dividing a copper clad laminate into work sizes as a part of a printed wiring board manufacturing process, a Giltin method or a cutting method applying a saw blade has been used.

[0003]

However, in the above-mentioned prior art, cutting scraps are likely to occur during cutting, and the cutting end face is likely to have an uneven shape. Cut scraps generated during this cutting fall off, or the convex portions of the concave and convex portions on the cutting surface fall off due to contact with other objects when the material moves, and dust is generated. The generated dust adheres to the material due to the action of static electricity, which interferes with the patterning that serves as an etching resist in the printed wiring board manufacturing process.

That is, when the material adheres to the surface of the material, the pattern is broken because the pattern is directly printed on the dust. Further, when dust adhering to the surface is transferred to the silk screen, wire breakage and short circuit due to ink bleeding occur, which is a serious drawback that the defective rate increases.

Therefore, the present invention has been developed in view of the above-mentioned drawbacks of the prior art, and prevents dust on the end face of a copper-clad laminate in which cut dust and dust during cutting do not occur during the printed wiring board manufacturing process. The purpose is to provide the law.

[0006]

DISCLOSURE OF THE INVENTION The present invention is constructed by coating the cut end face of a cut copper clad laminate.

[0007]

In the present invention, by coating the cut end surface,
It is possible to prevent falling off of scraps and generation of dust.

[0008]

FIG. 1 is a partially enlarged sectional view showing this embodiment. Reference numeral 1 is a copper-clad laminate (paper phenol laminate) having a copper foil 3 on a surface of a material 2. The copper-clad laminate 1 is cut into a work size. A resin 4 of DOTITE D-670 (trade name: manufactured by Fujikura Kasei Co., Ltd.) is applied to the cut end surface 1a of the copper-clad laminate 1. After coating, apply resin 4 to 12
The cut end surface 1a of the copper-clad laminate 1 is treated by drying at 0 ° C. for 10 minutes.

The copper clad laminate having the above-mentioned structure is fixed together with the resin 4 by coating so that cut dusts and dust generated during cutting do not hinder the manufacturing process of the printed wiring board.

According to this embodiment, it is possible to prevent falling dust and dust from occurring during the printed wiring board manufacturing process.

In this embodiment, the cut dust and the dust are fixed by the resin coating, but the present invention is not limited to this, and the cutting end face may be covered with an adhesive tape or the like. Further, the resin may be of any composition and resin as long as it can remove cut dust and fix dust.

[0012]

As described above, according to the method for preventing dust generation on the end face of the copper-clad laminate according to the present invention, the cut end face is treated so that the cut dust and dust are generated during the printed wiring board manufacturing process. The cause of defects can be greatly reduced. Also,
The load on the equipment due to scraps and dust falling off the line was eliminated, and a synergistic effect on a clean environment was obtained.

[Brief description of drawings]

FIG. 1 is a partially enlarged sectional view showing an embodiment.

[Explanation of symbols]

 1 Copper-clad laminate 1a Cutting end face 2 Material 3 Copper foil 3 4 Resin

Claims (1)

[Claims] 1. A method for preventing dust generation on an end face of a copper-clad laminate, which is formed by coating a cut end face of the cut copper-clad laminate.