JPH09232743A - Solder printing treatment of polyhedral arrangement shape and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To user the same pallets and the same metal masks to reduce the types of jigs and also to contrive to enhance the efficiency for mounting components by a method wherein both surfaces of printed-wiring boards are respectively made to arrange on an end material and the end material is made to invert. SOLUTION: Circuit constituent components are mounted on each of the surfaces and rears of printed-wiring boards 1. An end material 3 has coupling parts 4 for coupling the boards 1 with each other. Metal masks are respectively mounted on one part of each printed-wiring board 1, solder in semi-molten state is applied in one direction of the boards 1 and the metal masks are demented from the boards 1. Thereby, the components are mounted on each of the surfaces and rears of the boards 1. Then, the outer end surface of the end surfaces of the end material 3 is made to invert to mount respectively the metal masks on one part of each printed-wiring board 1, solder in semi-molten state is applied in one direction of the boards 1 and the metal masks are demented from the boards. Thereby, the components are respectively mounted on the surfaces and rears of the boards 1 provided on the other end surface of the end material 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder printing method of a multi-sided layout shape and a device using this method for improving the productivity in performing the solder printing processing on both sides of a printed wiring board.

[0002]

2. Description of the Related Art FIG. 5A is a schematic diagram showing a printed wiring board on which circuit components are mounted. FIG.
(B) is a schematic block diagram which shows the printed circuit board in which the circuit component parts were mounted on the surface of the printed wiring board.

FIG. 5 (c) is a schematic diagram showing a printed circuit board having circuit components mounted on the back surface of the printed wiring board. FIG. 6 is a schematic configuration diagram showing a process of soldering circuit components to the front surface and the back surface of the circuit board and a connection state.

As shown in FIG. 5A, a PWB (printed wiring board) 50 is a board on which circuit components are mounted on the front and back surfaces. The hole portion 52 is provided on the PWB 50 and is a positioning hole for mounting the PWB 50 on a pallet to be described later that is used when mounting and soldering circuit components.

A PCB (printed circuit board) 60 is a state in which circuit components are connected to either the front surface or the back surface of the PWB 50. As shown in FIG. 5B, P
On the surface of CB60, QFP54 (Quad Flat Packag
e), circuit components such as SOP 56 (Small Outline Package) and chip component 58 are electrically connected by soldering. In addition, QFP54
It is a part of an electric circuit and is electrically connected to the PWB 50, and is provided with conductive lead wires on all sides. The SOP 56 is a part of the electric circuit and is a PW.
It is electrically connected to B50 and has conductive lead wires at both ends. Chip parts 58
Is a part of an electric circuit and is electrically connected to the PWB 50.

As shown in FIG. 5C, on the back surface of the PCB 60, the QFP 54 and SO are newly added to the PWB 50 in the same manner as the front surface.
The circuit components such as P56 and the chip component 58 are electrically connected by soldering. However, PCB6
The arrangement of the circuit components mounted on the front surface and the back surface of 0 is different.

As shown in FIG. 6, the surface pallet 64 is P
This pallet is a surface-only pallet used when mounting and soldering circuit components such as the QFP 54, SOP 56, and chip component 58 on the surface of the WB 50, and a plurality of PWBs 50 can be mounted. The surface pins 66 are provided on the surface pallet 64 and are adapted to be inserted into the holes 52 of the PWB 50 to enable positioning of the surface of the PWB 50. The heat-resistant tape 68 is used for the PWB 50 positioned on the front surface pallet 64 and the rear surface pallet 70 described later.
And the PCB 60 for fixing the circuit components so as not to shift when mounted.

The back pallet 70, like the front pallet 64, is a pallet dedicated to the back used for mounting and soldering circuit components on the back of the PWB 50.
A plurality of WBs 50 can be attached. The back surface pins 72 are provided on the back surface pallet 70 and are adapted to be inserted into the holes 52 of the PWB 50 to enable positioning of the back surface of the PWB 50. The counterbore hole portion 74 is provided on the back surface pallet 70, and when the PWB 50 is placed on the back surface, the protrusion formed by the circuit component mounted and soldered on the front surface of the PWB 50 comes into contact with the back surface pallet 70. It is formed in a concave shape on the back surface pallet 70 so as not to be damaged.

Next, steps 1 to 6 will be described with reference to FIG. In step 1, first, the worker prepares the surface pallet 64 for mounting the PWB 50.

In step 2, the worker inserts the surface pin 66 of the prepared surface pallet 64 into the hole 52 of the PWB 50 for positioning. However, if only positioning is performed, a gap is created between the surface pallet 64 and the PWB 50, and the state of the PWB 50 is unstable for mounting the circuit component parts. Therefore, the worker uses the heat resistant tape 68 to
For example, the PWB 50 is fixed at two places on the boundary between the WB 50 and the front surface pallet 64. Then, the worker attaches the surfaces of all the PWBs 50 to the surface pallet 64 and then puts them on the production line.

In step 3, cream solder printing is performed and PW is performed.
After mounting the circuit components on the surface of B50, reflow soldering is performed. The cream solder printing and the reflow soldering will be described below.

In cream solder printing, when mounting circuit components such as QFP 54, SOP 56, and chip component 58 on the surface of PWB 50, a metal mask (not shown) dedicated to the surface having holes in the mounting portion is matched on PWB 50. Then, the semi-melted solder is applied from above the metal mask so as to be embedded in the hole portion. Then, the excess solder on the surface-only metal mask is removed by brushing, and this metal mask is removed. By removing the solder, only the semi-melted solder remains on the mounting portion, and the QFP 54, the SOP 56, and the chip component 58 are attached to the solder portion. It should be noted that since the circuit components are adhered to the semi-melted solder, they are unstable, so that they are firmly connected by reflow soldering.

In reflow soldering, the PWB 50 to which the circuit components are connected is placed in a reflow oven which radiates heat. The semi-melted solder is once melted by this reflow furnace, and then, when it is taken out from the reflow furnace, the melted solder is exposed to the air of the outside air to be solidified and the circuit components on the PWB 50 are firmly connected.

In this way, the circuit components are connected to the surface of the PWB 50 to form the PCB 60. In step 4, the worker prepares the back surface pallet 70 for mounting the circuit components on the back surface of the PCB 60.

In step 5, the worker temporarily removes the PCB 60 having the circuit components mounted on the front surface from the front surface pallet 64 and inserts the hole 52 of the PCB 60 into the rear surface pin 72 of the rear surface pallet 70 prepared as the back surface. Perform positioning. Then, after mounting all the PCBs 60 on the back surface pallet 70, the PCBs 60 are firmly fixed by the heat resistant tape 68. Although the circuit components mounted in step 3 are formed in a protruding shape, the recessed spot facing hole portion 6 is formed.
Circuit components are protected by 8.

In step 6, as in step 3, cream solder printing is performed on the back surface of the PCB 60 to mount circuit components, and then reflow soldering is performed. The metal mask is P
A metal mask dedicated to the back surface is used that matches the shape of the circuit components mounted on the back surface of the CB60.

[0017]

However, in step 4 described above, the worker has to purposely prepare a pallet exclusively for the back surface in order to mount the circuit components on the back surface of the PCB. Also, in step 5 above, the worker has a P on the surface of which QFP, SOP and chip parts are mounted.
Since the cumbersome work of reversing the CB on the back side and positioning the back side pin of the back side pallet and the hole of the PCB is forced, a working time is required and the working efficiency is poor.

Further, when a metal mask is used, it is necessary to prepare a metal mask dedicated to the front surface and a metal mask dedicated to the back surface, resulting in poor work efficiency. The present invention has been made in consideration of the above matters, by solving the above-mentioned problems and using an end material integrated so that a plurality of front and back surfaces of the PWB are arranged on one end surface,
Even if the PWB is inverted to the other end face, the PWB has the same shape and the same positional relationship, the pallet and the metal mask used for the one end face can be used for the other end face, and when the PWB is inverted, the end integrated with the PWB is used. It is an object of the present invention to provide a solder printing processing method and apparatus having a multi-sided layout shape, which can reduce the positioning work, improve the PWB position accuracy, and improve the work efficiency by only reversing the material. To do.

[0019]

In order to solve the above-mentioned problems, a printed circuit board on which electronic components are mounted on a printed wiring board having predetermined circuits printed on the front and back surfaces and a cross section are formed horizontally. The front surface and the back surface of the printed wiring board are continuously arranged on one end surface, and the surface opposite to the one end surface is the other end surface, and the other end surface is the print arranged on the one end surface. What is claimed is: 1. A solder printing processing apparatus having a multi-sided layout shape, comprising: a front surface and a back surface of a wiring board; and an end material having the same shape and the same positional relationship as each other, wherein the printed wiring board is fixed to the end material. Installed on a pallet for mounting, a metal mask for attaching solder to a part of the printed wiring board is mounted on the printed wiring board, and a semi-melted solder is applied to one surface of the mounted metal mask. , The metal mask is removed from the printed wiring board to attach the mounting component to a part of the printed wiring board, and the mounting member is mounted on the one end surface of the end material by mounting means for mounting the mounting component. The mounting components are respectively mounted on the front surface and the back surface of the printed wiring board, and the metal mask for reversing the other end surface to adhere solder to a part of the printed circuit board is mounted on the printed wiring board. Then, a semi-melting solder is applied to one surface of the mounted metal mask, and the metal mask is removed from the printed circuit board to attach the mounting component to the part of the printed wiring board, The mounting components are respectively provided on the front surface and the back surface of the printed circuit board arranged on the other end surface of the end material by means. It is characterized in being implemented.

According to the structure of the present invention, by arranging both sides of the PWB on the end materials, the same shape and the same positional relationship can be obtained even when the end materials are reversed, and when mounting the circuit component parts, the same shape is obtained. Since pallets and metal masks can be used, the types of jigs can be reduced, and by reversing the end material, positioning work between the PCB and pallet can be eliminated and work efficiency can be improved. it can.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view of a connection state in which a front surface and a back surface of a PWB (printed wiring board) integrated with one end surface of an end material are respectively arranged and viewed from above.

FIG. 2 is a view of the common pallet viewed from above. Fig. 3 shows the PWB when the scrap material is turned over to the other end surface.
It is the figure which looked at the connection state with.

As shown in FIG. 1, the PWB 1 is a circuit board on which circuit components (not shown) that are a part of an electric circuit are mounted on the front surface and the back surface. The end material 3 has a connecting portion 4 for connecting the PWB 1 and is integrated with the PWB 1 by the connecting portion 4. It has one end face and the other end face opposite to this one end face, and the front and back faces of the PWB 1 are continuously arranged on the one end face, and the back face of the PWB 1 is on the other end face. And the surfaces are continuously arranged. Further, the PWB 1 integrated with the end material 3 has a plurality of front and back surfaces arranged in the same number on one end surface of the end material 3.
The hole 15 is provided in the corner 3a of the scrap 3,
The common pallet 5 is to be attached to the pins of the pallet 5 (details will be described later).

The common pallet 5 described above is a mounting table for mounting the front and back surfaces of the PWB 1 provided on the end material 3 as shown in FIG. The pin 13 is for positioning the hole 15 shown in FIG. 1 and fixing the end material 3. The counterbore holes 6 (shown in black in FIG. 2) project when circuit components are mounted on the front and back surfaces of the PWB 1 arranged on one end surface of the end material 3 as shown in FIG. Since a part is generated, when the end material 3 is used as the other end surface, it is formed in a concave shape on the common pallet 5 so that the protrusion and the common pallet 5 do not come into contact with each other and are damaged. .

As shown in FIG. 3, when the end material 3 is inverted to the other end surface, the front surface and the back surface of the PWB 1 have the same shape and the same positional relationship as in FIG. That is, the PWB1
Since the front surface and the surface opposite to this surface are the back surfaces, if the front surface and the back surface of the PWB 1 are arranged on one end surface of the end material 3, respectively, even if the end material 3 is inverted, the surface of the PWB 1 is reversed. The back surface has the same shape and the same positional relationship.

Therefore, the operation of the following series of soldering operations using the above matters will be described with reference to FIG. FIG. 4 is a diagram showing a soldering process and a connection state of circuit component parts.

In step 1, first, an operator prepares the scrap 3 and the common pallet 5 on which the front surface and the back surface of the PWB 1 are respectively arranged. Then, the worker inserts the prepared common pallet 5 and the end material 3 into each other. In this insertion work, the pin 13 of the common pallet 5 and the hole 15 of the end material 3 are positioned and inserted. However, a gap is created between the shared pallet 5 and the end material 3 only by mounting, and the state of the PWB 1 is unstable for mounting the circuit component parts. Therefore, a heat-resistant tape for fixing the worker is provided. Shared pallet 5 using 11
For example, two places are attached and fixed at the boundary between the end material 3 and the end material 3. After that, the worker flows the common pallet 5 with the scrap 3 inserted into the production line.

In step 2, cream solder printing is performed on the PWB 1. In cream solder printing, circuit components are mounted on the front surface and the back surface of the PWB 1 arranged on one end surface of the end material, so that semi-melted solder is applied on the front surface and the back surface of the PWB 1. At the time of application, since the application is applied only to the pad portion (not shown) which is provided on the portion on the PWB 1 where the circuit components are mounted and is made of a metal member, a metal mask (a metal mask having a hole at the portion corresponding to the pad portion) (Not shown) the PWB arranged on the front surface and the back surface
Match 1 A common metal mask dedicated to the front surface and the back surface is used so as to match the front surface and the back surface of the plurality of PWBs 1 arranged on the scrap 3 at the same time. After that, in order to apply the semi-melted solder onto the metal mask sufficiently, especially to the hole portion, and to apply the solder evenly, the solder on the common metal mask is wiped off by, for example, a brush. As soon as the solder application work is completed, the common metal mask is removed from the PWB 1.

In step 3, solder is attached only to the pad portion on the front and back surfaces of the PWB 1 from which the common metal mask is removed, and the circuit component is attached to the pad portion. Since the solder is semi-melted, the circuit components are in an unstable state.

In step 4, reflow soldering is performed. In reflow soldering, the P
WB1 is put into a reflow furnace that radiates heat, and the semi-molten solder is once melted here. After that, when it is taken out from the reflow furnace, the melted solder is exposed to the air of the outside air to be solidified, and the circuit components on the front surface and the back surface of the PWB 1 are firmly connected. In addition, when the circuit components are connected to one surface of the PWB 1 and one surface of the back surface thereof,
The PWB 1 becomes the PCB 17.

Therefore, in step 5, the PCB 17 in which circuit components are connected to the front and back surfaces of the PWB 1 arranged on one end surface of the end material 3 in step 4 is turned to the other end surface. Work for mounting circuit components on the back and front surfaces of the PCB 17 is performed.

The worker has the PCB 1 mounted on one end face thereof.
The scrap 3 having circuit components connected to 7 is removed from the common pallet 5 and turned over to the other end surface, and then again.
The pin 13 of the common pallet 5 and the hole 15 of the end material 3
Position and insert. Then, a gap is created between the end material 3 and the common pallet 5 and an unstable state occurs. Therefore, the worker attaches the heat resistant tape 11 to the boundary between the end material 3 and the common pallet 5 at two places to fix the same. At this time, the circuit components inserted into the front surface and the back surface of the PCB 17 are formed in a protruding shape, but the counterbore holes 6 protect the circuit components. The arrangement state of the PCB 17 when the end material 3 is the other end surface has the same shape and the same positional relationship as the front surface and the back surface of the PWB 1 arranged on the one end surface as shown in FIG.

In step 6, cream solder printing is performed on the front and back surfaces of the PCB 17 arranged on the other end surface of the scrap 3. In cream solder printing, circuit components are mounted on the front surface and the back surface of the PCB 17 arranged on the other end surface of the end material 3 as in the step 2, so that the PCB 17 is mounted.
A semi-melted solder is applied on the front and back surfaces of the. When applying, only the pad portion (not shown) which is provided in the portion where the circuit component is mounted on the PCB 17 and is made of a metal member is applied. Therefore, the common metal mask having a hole in the portion corresponding to the pad portion. Match (not shown) with the PCB 17 located on the front and back. At this time, a common metal mask dedicated to the front surface and the back surface is used so as to match the front surface and the back surface of the plurality of PCBs 17 arranged on the scrap 3 at the same time. That is, the same common metal mask used in step 2 can be used.
After that, apply semi-melted solder from the top of this metal mask,
In particular, in order to sufficiently apply the solder to the portion where the holes are formed and to apply the solder uniformly, the solder on the common metal mask is wiped off by, for example, a brush. As soon as the solder application work is completed, the common metal mask is removed from the PCB 17.

In step 7, solder is attached only to the pad portion on the front and back surfaces of the PCB 17 from which the common metal mask is removed, and the circuit component is attached to the pad portion. Since the solder is semi-melted, the circuit components are in an unstable state.

Therefore, in step 8, reflow soldering is performed to firmly connect the circuit components. In this reflow soldering, the PCB to which the circuit components are attached
17 is put in a reflow furnace that radiates heat, and the semi-molten solder is once melted here. After that, when the solder is discharged from the reflow furnace, the melted solder is exposed to the air of the outside air to be solidified, and the PCB 17 arranged on the other end surface of the scrap 3 is removed.
The circuit components on the front and back sides of are firmly connected.

In step 9, the worker removes the end material 3 from the common pallet 5 and then sends it to a subsequent step for performing a manual work such as reworking of solder. According to the above-described embodiment, by using the end material 3 in which a plurality of front and back surfaces of the PWB 1 are arranged on one end surface, the front surface and the back surface of the PWB 1 have the same shape even if the other end surface is reversed. In the same positional relationship, when the circuit components are mounted on the PWB 1 on one end surface and then inverted on the other end surface, the P
It is only necessary to reverse the end material 3 integrated with the WB 1, and the working time can be shortened without individually reversing the plurality of PWBs 1.

Further, even if the end material 3 integrated with the PWB 1 is reversed, the shape and the positional relationship are the same,
A common metal mask capable of simultaneously matching the front and back surfaces of the PWB 1 can be used, and the scrap 3
It is possible to use a common pallet without using the front and back pallets by reversing only one.

Further, in the positioning work when the PWB 1 is attached to the common pallet 5, the end material 3 is the P
Since it is integrated with the WB1, it is sufficient to position only the end material 3 on the common pallet 5, and it is possible to reduce the troublesome positioning work, improve the position accuracy of the PWB 1, and improve the soldering quality. .

[0039]

As described above, according to the present invention, by using an end material having a plurality of front and back surfaces of PWB arranged on one end surface, the front and back surfaces of the PWB can be reversed even if the other end surface is reversed. Since they have the same shape and the same positional relationship, the mill ends themselves can be inverted, and the work time can be shortened without the troublesome work of individually inverting a plurality of PWBs. Further, even if the mill ends integrated with the PWB are inverted, they have the same shape and the same positional relationship, so that the mill ends are inverted by using a common metal mask that can match the front and back surfaces of the PWB at the same time. You can use the same common metal mask at any time,
A common pallet can be used without using two pallets dedicated to the front surface and the back surface, and the number of jigs can be reduced.

Further, by using the end material integrated with the PWB, it is possible to eliminate the positioning work when mounting the PWB on the pallet, and improve the PWB positioning accuracy.
It is possible to improve the soldering quality.

[Brief description of drawings]

FIG. 1 is a solder printing method and apparatus having a multi-sided layout according to an embodiment of the present invention, showing a connection state in which a front surface and a back surface of a PWB integrated on one end surface of an end material are respectively arranged from above. It is the figure seen.

FIG. 2 is a view of a common pallet on which scraps are placed as seen from above according to the embodiment.

FIG. 3 is a diagram showing a state of connection with a PWB when the end material is turned over to the other end surface as seen from above according to the embodiment.

FIG. 4 is a diagram showing a soldering step and a connection state of circuit component parts according to the same embodiment;

FIG. 5 is a schematic configuration diagram showing a conventional printed circuit board on which circuit components are mounted on a front surface and a back surface.

FIG. 6 is a schematic configuration diagram showing a process of connecting circuit components to the front surface and the back surface of a conventional board and a connection state.

[Explanation of symbols]

 1 ... PWB (printed wiring board) 3 ... End material 4 ... Coupling member 5 ... Shared pallet 6 ... Counterbore hole 11 ... Heat-resistant tape 13 ... Pin 15 ... Hole

Claims (2)

[Claims] 1. A printed circuit board in which electronic components are mounted on a printed circuit board having a predetermined circuit printed on the front surface and the back surface, and a cross section is formed horizontally, and the front surface and the back surface of the printed wiring board are formed on one end surface. The surface arranged opposite to the one end surface is continuously arranged, and the other end surface is the other end surface. The other end surface has the same shape and position as the front surface and the back surface of the printed wiring board arranged on the one end surface. A solder printing processing apparatus having a multi-sided layout shape, which comprises a scrap material on which a relationship is formed, wherein the solder print processing apparatus is installed on a pallet for fixing the scrap material on which the printed wiring board is arranged, A metal mask for attaching solder to a part is mounted on the printed wiring board, and one surface of the mounted metal mask is coated with semi-melting solder, and the metal mask is printed on the printed circuit board. The mounting component is attached to a part of the printed wiring board by removing it from the substrate, and the front and back surfaces of the printed wiring substrate disposed on the one end face of the end material by mounting means for mounting the mounting component. The mounting mask is mounted on the printed wiring board, and the metal mask for reversing the other end surface to attach solder to a part of the printed circuit board is mounted on the printed wiring board. Applying semi-melting solder on one surface, removing the metal mask from the printed circuit board to attach the mounting component to the part of the printed wiring board, and the other end surface of the end material by the mounting means. A multi-sided layout characterized in that the mounting components are mounted on the front surface and the back surface of the printed circuit board, respectively. Solder print processing method of shape. 2. A thin printed wiring board having predetermined circuits printed on the front surface and the back surface, which are integrated so that the front surface and the back surface of the printed wiring board are respectively disposed on one end surface, and the one end surface A solder printing process of a multi-sided arrangement shape, characterized in that the printed wiring board is provided with end materials arranged in the same shape and at the same position even when turned over to the other end surface located in the opposite direction. apparatus.