JPH03194994A - Solder-connecting method for surface mounting ic package - Google Patents
Solder-connecting method for surface mounting ic packageInfo
- Publication number
- JPH03194994A JPH03194994A JP33353089A JP33353089A JPH03194994A JP H03194994 A JPH03194994 A JP H03194994A JP 33353089 A JP33353089 A JP 33353089A JP 33353089 A JP33353089 A JP 33353089A JP H03194994 A JPH03194994 A JP H03194994A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- package
- pads
- waviness
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 39
- 239000006071 cream Substances 0.000 claims abstract description 16
- 238000005476 soldering Methods 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 3
- 238000007650 screen-printing Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は表面装着用ＩＣパッケージの多層配線用基板へ
の半田接続方法に係り、特に半田供給量の過不足に起因
する半田未接続、半田ブリッジの発生が少ない半田付方
法に間する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for soldering a surface-mounted IC package to a multilayer wiring board, and particularly relates to a method for soldering a surface-mounted IC package to a multilayer wiring board, and particularly relates to a method for soldering a surface-mounted IC package to a multi-layer wiring board, and in particular, for soldering and soldering caused by excessive or insufficient solder supply. Use a soldering method that reduces the occurrence of bridging.
従来、この種の表面装置用ＩＣパッケージ（以下単にＩ
Ｃパッケージという）の多層配線基板上への半田接続は
、多層配線基板のパッド上にスクリーン印刷により半田
クリームを供給し、これに表面実装用ＩＣパッケージを
位置合せして搭載し、その後、溶融加熱により半田クリ
ームをリフローさせて半田付を行なう方法が一般に用い
られている。以下第２図を用いて説明する。Conventionally, this type of surface device IC package (hereinafter simply referred to as I
To solder connect a C package to a multilayer wiring board, solder cream is supplied onto the pads of the multilayer wiring board by screen printing, the surface mount IC package is aligned and mounted on this, and then melted and heated. A commonly used method is to perform soldering by reflowing solder cream. This will be explained below using FIG. 2.
まず第２図（ａ）の様に、基板５上のパッド４には実装
されるべきＩＣパッケージ１の反りゃうねりの程度に係
らず、常に一定量の半田クリーム３が供給される。従っ
て、接続端子２とパッド４との間隔が広い部分は第２図
（ｂ）のように、半田８の未接続が、またせまい部分は
第１図（ｃ）の様に半田８によるブリッジが発生し易い
。First, as shown in FIG. 2(a), a fixed amount of solder cream 3 is always supplied to pads 4 on substrate 5, regardless of the degree of warpage or waviness of IC package 1 to be mounted. Therefore, in the part where the distance between the connection terminal 2 and the pad 4 is wide, as shown in FIG. 2(b), the solder 8 is not connected, and in the narrow part, as shown in FIG. 1(c), there is a bridge by the solder 8. Easy to occur.
またスクリーン印刷の半田供給量の均一性の点でも、外
形寸法の大きな基板よりも外形寸法の小さいＩＣパッケ
ージに印刷する方が反りやうねりの絶対量が小さいため
安定している。Also, in terms of the uniformity of the amount of solder supplied in screen printing, it is more stable to print on an IC package with a small outer dimension than on a board with a large outer dimension because the absolute amount of warpage and waviness is smaller.
しかしながら、上述した従来の基板に半田クリームをス
クリーン印刷供給する方法は下記の欠点があった。However, the above-described conventional method of applying solder cream to a substrate by screen printing has the following drawbacks.
第一に、ＩＣパッケージの接続端子面に反りやうねるが
ある場合、ＩＣパッケージを基板に搭載した状態では、
基板のパッドとＩＣパッケージの接続端子との間隔が一
様とならない。そのため、従来の様に基板の各パッドに
一定量の半田クリームを供給する方法では、上記間隔の
大きい個所では半田量が不足して半田未接続、また、間
隔の小さい個所では半田過多による半田ブリッジが発生
ずるという欠点があった。First, if the connection terminal surface of the IC package is warped or undulating, the IC package mounted on the board may
The spacing between the pads on the board and the connection terminals on the IC package is not uniform. Therefore, with the conventional method of supplying a fixed amount of solder cream to each pad of the board, there is not enough solder in areas with large gaps, resulting in unconnected solder, and in areas with small gaps, solder bridges due to too much solder occur. It had the disadvantage that it would occur.
第二に、基板に半田クリームをスクリーン印刷する場合
、基板はＩＣパッケージに比べて、外形寸法が大きいの
で反りやうねりの影響を受は易く、部分的に半田が供給
されなかったり、あるいは供給量が大きくばらつくとい
う問題のため、安定したＩＣパッケージの半田接続がで
きないという欠点があった。Second, when screen printing solder cream on a board, the board has a larger external dimension than an IC package, so it is more susceptible to warping and waviness, and solder may not be supplied in some areas, or the amount Because of the problem of large variations in the amount of solder, there was a drawback that stable solder connections of IC packages could not be made.
本発明の表面装着用ＩＣパッケージの半田付方法は、実
装されるべき表面装着用ＩＣパッケージの接続端子に対
応した半田クリーム供給用オープニングエリアを有する
メタルスクリーンを形成する第１の工程と、前記表面装
着用ＩＣパッケージの前記接続端子と前記メタルスクリ
ーンの前記オープニングエリアとの位置合わせを行い、
前記接続端子上に半田クリームを印刷供給する第２の工
程と、前記表面装着用ＩＣパッケージを搭載する基板の
パッドに、前記接続端子を位置合せして前記表面装着用
ＩＣパッケージを複数個搭載する第３の工程と、加熱溶
融により前記接続端子と前記パッドの半田接続を行う第
４の工程とを含んで構成される。The method for soldering a surface mount IC package of the present invention includes a first step of forming a metal screen having an opening area for supplying solder cream corresponding to the connection terminal of a surface mount IC package to be mounted; Aligning the connection terminal of the mounting IC package with the opening area of the metal screen,
A second step of printing and supplying solder cream onto the connection terminals, and aligning the connection terminals to pads of the board on which the surface-mount IC packages are mounted, and mounting a plurality of the surface-mount IC packages. The method includes a third step and a fourth step of performing solder connection between the connection terminal and the pad by heating and melting.
次に、本発明を図面を参照しながら詳細に説明する。 Next, the present invention will be explained in detail with reference to the drawings.
第１図（ａ）〜（ｄ）は本発明の一実施例を説明するた
めの工程順に示したＩＣバ・ソケージの断面図である。FIGS. 1(a) to 1(d) are sectional views of an IC bar cage shown in the order of steps for explaining one embodiment of the present invention.
まず第１図（ａ）に示すように、ＩＣバ・７ケージ１の
接続端子２に対応するオープニングエリア７を有するメ
タルスクリーン６を形成して、ＩＣパッケージ１の接続
端子２に位置合せする。この時にＩＣパッケージ１の反
りまたはうねりのため、接続端子面とメタルスクリーン
６とのギヤ・ツブがＩＣパッケージ１の凹凸に対応して
大きくなったり小さくなったりしている。First, as shown in FIG. 1(a), a metal screen 6 having an opening area 7 corresponding to the connection terminal 2 of the IC package 1 is formed and aligned with the connection terminal 2 of the IC package 1. At this time, due to the warping or waviness of the IC package 1, the gears and protrusions between the connection terminal surface and the metal screen 6 become larger or smaller in accordance with the unevenness of the IC package 1.
次に第１図（ｂ）に示すように、このメタルスクリーン
６を使用して半田クリーム３を印刷する０通常スクリー
ン印刷では、ギヤ・ツブが大きし）はとクリーム供給量
は増加するので、接続端子２に供給される半田量は第１
図（ｂ）に示したように、ギャップが小さい個所は少な
く、またギャップが大きい個所は多くなる。Next, as shown in FIG. 1(b), the metal screen 6 is used to print the solder cream 3 (in normal screen printing, the gears and knobs are large), and the amount of cream supplied increases. The amount of solder supplied to connection terminal 2 is the first
As shown in Figure (b), there are few places where the gap is small, and there are many places where the gap is large.
次に第１図（ｃ）に示すように、このＩＣパッケージト
を基板５のパッド４に半田クリーム３が対応するように
位置合せをし、このまま加熱溶融すると第１図（ｄ）の
用に、ＩＣパッケージ１の反りとうねりに応じて、接続
端子２とパッド４との間隔が広い部分は多量の半田８で
、またせまい部分は、少量の半田８で半田付が行なわれ
る。Next, as shown in FIG. 1(c), align this IC package so that the solder cream 3 corresponds to the pad 4 of the board 5, and heat and melt the IC package as shown in FIG. 1(d). Depending on the warpage and waviness of the IC package 1, soldering is performed with a large amount of solder 8 in areas where the distance between the connecting terminals 2 and pads 4 is wide, and with a small amount of solder 8 in the narrow areas.
以上説明した様に、本発明の表面装着用■パッケージの
半田付方法を適用することにより、大面積の反りやうね
りの大きな基板に、反りやうねりの大きい多ビンＩＣパ
ッケージを複数個搭載する場合、各々のＩＣパッケージ
の接続端子に最適量の半田を供給することができるため
、半田未接続並びに半田ブリッジの発生の少ない安定し
た半田付を実現することができる。As explained above, by applying the surface mounting package soldering method of the present invention, multiple multi-bin IC packages with large warps and waviness can be mounted on a large-area board with large warps and waviness. Since the optimal amount of solder can be supplied to the connection terminals of each IC package, stable soldering can be achieved with less occurrence of unsoldered connections and solder bridges.
第１図は本発明の一実施例を説明するためのＩＣパッケ
ージの断面図、第２図は従来例を説明するためのＩＣパ
ッケージの断面図である。
１・・・ＩＣパッケージ、２・・・接続端子、３・・・
半田クリーム、４・・・パッド、５・・・基板、６・・
・メタルスクリーン、７・・・オープニングエリア、８
・・・半田。FIG. 1 is a sectional view of an IC package for explaining an embodiment of the present invention, and FIG. 2 is a sectional view of an IC package for explaining a conventional example. 1...IC package, 2...connection terminal, 3...
Solder cream, 4...pad, 5...board, 6...
・Metal screen, 7...Opening area, 8
···solder.
Claims (1)
に対応した半田クリーム供給用オープニングエリアを有
するメタルスクリーンを形成する第１の工程と、前記表
面装着用ＩＣパッケージの前記接続端子と前記メタルス
クリーンの前記オープニングエリアとの位置合わせを行
い、前記接続端子上に半田クリームを印刷供給する第２
の工程と、前記表面装着用ＩＣパッケージを搭載する基
板のパッドに、前記接続端子を位置合せして前記表面装
着用ＩＣパッケージを複数個搭載する第３の工程と、加
熱溶融により前記接続端子と前記パッドの半田接続を行
う第４の工程とを含むことを特徴とする表面実装用ＩＣ
パッケージの半田接続方法。a first step of forming a metal screen having an opening area for supplying solder cream corresponding to the connection terminal of the surface mount IC package to be mounted; A second step aligns with the opening area and prints and supplies solder cream onto the connection terminal.
a third step of aligning the connection terminals to the pads of the board on which the surface-mount IC packages are mounted and mounting a plurality of the surface-mount IC packages; and a fourth step of soldering the pads.
Package solder connection method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33353089A JPH03194994A (en) | 1989-12-22 | 1989-12-22 | Solder-connecting method for surface mounting ic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33353089A JPH03194994A (en) | 1989-12-22 | 1989-12-22 | Solder-connecting method for surface mounting ic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03194994A true JPH03194994A (en) | 1991-08-26 |
Family
ID=18267074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33353089A Pending JPH03194994A (en) | 1989-12-22 | 1989-12-22 | Solder-connecting method for surface mounting ic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03194994A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2845520A1 (en) * | 2002-10-04 | 2004-04-09 | Wavecom | Reconditioning of an assembly of conducting elements distributed on the lower surface of an electronic modules, notably to repair flatness, by the addition of material to the free ends of the conducting elements |
| US6719185B2 (en) | 2001-06-27 | 2004-04-13 | Ngk Spark Plug Co., Ltd. | Substrate with top-flattened solder bumps and method for manufacturing the same |
-
1989
- 1989-12-22 JP JP33353089A patent/JPH03194994A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6719185B2 (en) | 2001-06-27 | 2004-04-13 | Ngk Spark Plug Co., Ltd. | Substrate with top-flattened solder bumps and method for manufacturing the same |
| FR2845520A1 (en) * | 2002-10-04 | 2004-04-09 | Wavecom | Reconditioning of an assembly of conducting elements distributed on the lower surface of an electronic modules, notably to repair flatness, by the addition of material to the free ends of the conducting elements |
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