JPH04196191A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH04196191A JPH04196191A JP32362990A JP32362990A JPH04196191A JP H04196191 A JPH04196191 A JP H04196191A JP 32362990 A JP32362990 A JP 32362990A JP 32362990 A JP32362990 A JP 32362990A JP H04196191 A JPH04196191 A JP H04196191A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electrodes
- circuit board
- printed circuit
- insulating wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 34
- 239000006071 cream Substances 0.000 abstract description 10
- 238000009413 insulation Methods 0.000 abstract 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はプリント基板に係り、基板に形成された回路パ
ターンの電極部と電極部の間に絶縁壁部を形成すること
により、半田ブリッジが生じるのを阻止するようにした
ものである。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a printed circuit board, in which solder bridges are prevented by forming an insulating wall between electrode parts of a circuit pattern formed on the board. It is designed to prevent this from occurring.
（従来の技術）
電子部品を基板に接着する手段として、基板に形成され
た回路パターンの電極部にクリーム半田を塗布し、この
クリーム半田に電子部品の電極を搭載した後、リフロー
装置により半田を加熱処理して、半田を固化させること
が行われる。(Prior art) As a means of bonding electronic components to a board, cream solder is applied to the electrodes of a circuit pattern formed on the board, and after the electrodes of the electronic components are mounted on the cream solder, the solder is applied using a reflow machine. Heat treatment is performed to solidify the solder.
（発明が解決しようとする課題）
ところが上記のように半田を加熱処理すると、溶融した
半田が側方へ溶出し、相隣る半田同士が合体して、半田
ブリッジが発生しやすい問題点があった。第４図は、半
田ブリッジが発生した電子部品を示すものであって、図
中、１００は電子部品、１０１はリード、１０２は半田
、１０２ａは半田ブリッジ、１０３はプリント基板であ
る。(Problem to be Solved by the Invention) However, when the solder is heat-treated as described above, there is a problem in that the molten solder elutes to the sides, and adjacent solders tend to coalesce, resulting in solder bridges. Ta. FIG. 4 shows an electronic component in which a solder bridge has occurred, and in the figure, 100 is an electronic component, 101 is a lead, 102 is solder, 102a is a solder bridge, and 103 is a printed circuit board.
そこで本発明は、半田ブリノンの発生を防止できるプリ
ント基板を提供することを目的とする。Therefore, an object of the present invention is to provide a printed circuit board that can prevent the generation of solder brinone.
（課題を解決するための手段）
本発明は、基板に形成された回路パターンの電極部と電
極部の間に、絶縁壁部を形成したものである。(Means for Solving the Problems) According to the present invention, an insulating wall portion is formed between electrode portions of a circuit pattern formed on a substrate.
（作用）
上記構成において、電極部にクリ−Ｊ・半田を塗布し、
このクリーム半田子に電子部品を搭載した後、クリーム
半田を加熱する。するとクリーム半田は熔融し、側方へ
溶出するが、電極部の間には絶縁壁部があることから、
半田同士が合体して半田ブリッジが発生ずるのは阻止さ
れる。(Function) In the above configuration, apply Cree J/solder to the electrode part,
After mounting electronic components on this cream solder, the cream solder is heated. Then, the cream solder melts and elutes to the side, but since there is an insulating wall between the electrodes,
This prevents the solders from coalescing and forming solder bridges.
（実施例） 次に、図面を参照しながら本発明の詳細な説明する。(Example) Next, the present invention will be described in detail with reference to the drawings.
第１図はプリント基板の斜視図である。１はプリント基
板であり、その上面には回路パターン２が形成されてい
る。３は回路パターンの電極部である。電極部３と電極
部３の間には、絶縁壁部４が形成されている。FIG. 1 is a perspective view of the printed circuit board. 1 is a printed circuit board, and a circuit pattern 2 is formed on the upper surface thereof. 3 is an electrode portion of the circuit pattern. An insulating wall portion 4 is formed between the electrode portions 3 .
この電極部３に、スクリーン印刷機によりクリーム半田
５を塗布し、次いで電子部品６のリード７をこのクリー
ム半田５上に搭載し、リフロー装置によりクリーム半田
５を加熱処理する。Cream solder 5 is applied to this electrode portion 3 using a screen printing machine, then leads 7 of electronic components 6 are mounted on this cream solder 5, and cream solder 5 is heated using a reflow device.
するとクリーム半田５は溶融し、側方へ溶出するが、相
隣る半田同士が合体して半田ブリッジが生じるのは、絶
縁壁部４により阻止される（第２図参照）。Then, the cream solder 5 melts and elutes laterally, but the insulating wall 4 prevents adjacent solders from merging to form a solder bridge (see FIG. 2).
第３図は、上記プリント基板１の製造工程を示している
。同図（ａ）において、１°は基板主材であり、その上
面に銅７！３゛ が形成されている。次いでエツチング
により回路パターン２や電極部３を形成する（同図（ｂ
））。次いで主材１′の全面にレジスト４゛を形成しく
同図（Ｃ）） 、次いでエツチングにより、上記絶縁壁
部４を残して、レジスト４゛を除去する（同図（ｄ））
。このようにエツチング手段により、絶縁壁部４を有す
るプリント基板１を簡単に製造できる。FIG. 3 shows the manufacturing process of the printed circuit board 1. As shown in FIG. In the same figure (a), 1° is the main material of the substrate, and copper 7.3° is formed on its upper surface. Next, the circuit pattern 2 and the electrode part 3 are formed by etching (see (b) in the same figure).
)). Next, a resist 4' is formed on the entire surface of the main material 1' ((C) in the same figure), and then the resist 4' is removed by etching, leaving the insulating wall portion 4 ((d) in the same figure).
. In this manner, the printed circuit board 1 having the insulating wall portion 4 can be easily manufactured by using the etching means.
（発明の効果）
以上説明したように本発明は、基板に形成された回路パ
ターンの電極部と電極部の間に、絶縁壁部を形成してプ
リント基板を構成しているので、半田の熔融にともなう
半田ブリッジの発生を確実に防止できる。(Effects of the Invention) As explained above, the present invention configures a printed circuit board by forming an insulating wall section between the electrode sections of the circuit pattern formed on the circuit board, so that the solder melts. It is possible to reliably prevent the occurrence of solder bridges caused by solder bridging.
図は本発明の実施例を示すものであって、第１図はプリ
ント基板と電子部品の斜視図、第２図は正面図、第３図
はプリント基板の製造工程図、第４図は従来手段により
基板に接着した電子部品の平面図である。
１・・・プリント基板
２・・・回路パターン
３・・・電極部
４・・・絶縁壁The drawings show an embodiment of the present invention, in which Fig. 1 is a perspective view of a printed circuit board and electronic components, Fig. 2 is a front view, Fig. 3 is a manufacturing process diagram of the printed circuit board, and Fig. 4 is a conventional FIG. 3 is a plan view of an electronic component bonded to a substrate by means of means. 1... Printed circuit board 2... Circuit pattern 3... Electrode section 4... Insulating wall
Claims (1)
、絶縁壁部を形成したことを特徴とするプリント基板。A printed circuit board characterized in that an insulating wall section is formed between electrode sections of a circuit pattern formed on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32362990A JPH04196191A (en) | 1990-11-26 | 1990-11-26 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32362990A JPH04196191A (en) | 1990-11-26 | 1990-11-26 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04196191A true JPH04196191A (en) | 1992-07-15 |
Family
ID=18156865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32362990A Pending JPH04196191A (en) | 1990-11-26 | 1990-11-26 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04196191A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7009114B2 (en) | 2000-03-02 | 2006-03-07 | Murata Manufacturing Co., Ltd | Wiring substrate, method of producing the same, and electronic device using the same |
| DE10164879B4 (en) * | 2000-03-02 | 2006-06-08 | Murata Manufacturing Co., Ltd., Nagaokakyo | wiring substrate |
-
1990
- 1990-11-26 JP JP32362990A patent/JPH04196191A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7009114B2 (en) | 2000-03-02 | 2006-03-07 | Murata Manufacturing Co., Ltd | Wiring substrate, method of producing the same, and electronic device using the same |
| DE10164879B4 (en) * | 2000-03-02 | 2006-06-08 | Murata Manufacturing Co., Ltd., Nagaokakyo | wiring substrate |
| DE10110151B4 (en) * | 2000-03-02 | 2006-08-17 | Murata Manufacturing Co., Ltd., Nagaokakyo | A wiring substrate, a method of manufacturing the same, and an electronic device using the same |
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