JPH04288000A - Method and apparatus for assembling printed circuit board - Google Patents

Abstract

PURPOSE:To assemble a printed board circuit such as, for example, a hybrid IC in which various components including a bare chip are mounted in a high density on a printed board, with excellent productivity. CONSTITUTION:On a printed board, a bare chip mounting machine for executing a bare chip mounting step #3, a chip component mounting machine for executing a chip component mounting step #8, a package molding unit for executing a package molding step #13, an inspecting unit, etc., are disposed in a line, to make it possible that the board is continuously processed to have a printed board circuit fabricated thereon.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention is a printed circuit board on which bare chips (bare chips such as ICs, transistors, resistors, capacitors, etc. without a package or resin coating) or chip parts (with a package or resin coating) are mounted on the printed circuit board. The present invention relates to a printed circuit board assembly method and apparatus for sequentially assembling circuits (eg, hybrid ICs).

0002

[Prior Art and Problems to be Solved by the Invention] In conventional printed circuit board assembly, after mounting electronic components on a printed circuit board, the soldering process and packaging process are separated from the electronic component mounting process. In addition, although inspection must be performed after the printed circuit board is assembled, the inspection process is also generally carried out separately and independently. For this reason,
It was difficult to make the process continuous, and each process was separated. As a result, incidental operations such as temporary storage of printed circuit boards and transportation to the next process tend to increase, and process management is also troublesome.

[0003] In view of the above points, the present invention reduces waste by sequentially performing each process for each printed circuit board, from mounting bare chips and chip components onto the printed circuit board, soldering, inspection, and packaging. It is an object of the present invention to provide a method and apparatus for assembling a printed circuit board, which can improve productivity and save labor by reducing incidental work, and which is suitable for high-density, high-precision mounting.

0004

[Means for Solving the Problems] In order to achieve the above object, the printed circuit board assembly method of the present invention includes a bare chip mounting step for mounting a bare chip on a printed circuit board, and a chip component mounting step for mounting a chip component. The present invention is characterized in that a packaging step for providing a package on the printed circuit board circuit after mounting the bare chip and chip components, and an inspection step for inspecting the printed circuit board circuit are sequentially and continuously executed for each printed circuit board.

The printed circuit board circuit assembly apparatus of the present invention also includes a bare chip mounting machine for mounting a bare chip on a printed circuit board, a wire bonder for connecting the printed circuit board side pattern and the bare chip, and a potting for applying a resin coat to the surface of the bare chip. a device section, a resin curing device section that cures the resin coat, a solder applicator that applies cream solder to a printed circuit board, and a chip component mounting machine that mounts chip components in correspondence with the cream solder application position on the printed circuit board; We use a lead frame mounting machine that attaches lead frames to printed circuit boards, a solder reflow oven that melts cream solder and solders chip components to printed circuit boards, and inspects printed circuit boards with components mounted and connected to printed circuit boards. Equipped with an inspection equipment section, a package molding equipment section that places a package on a printed circuit board circuit, and a cut forming equipment section that removes unnecessary parts of the lead frame and bends the remaining leads, it can process printed circuit boards continuously. It has a line layout configuration.

[0006]

[Operation] In the present invention, the process from mounting bare chips and chip components to the packaging process and the inspection process can be carried out sequentially and continuously for each printed circuit board, and it is possible to carry out the process sequentially and continuously for each printed circuit board, unlike when each process is separated. The trouble of storing and transporting printed circuit boards becomes unnecessary, process management becomes easy, labor can be saved, and productivity can be improved. In addition, by using a multilayer board as a printed circuit board and mounting bare chips without packages, the pitch of adjacent components can be minimized, and by making each bare chip narrower in pitch and with a higher number of pins, high density and high precision can be achieved. It can also be fully implemented. Furthermore, regarding component mounting and inspection, CAD (computer-aided design) is used when designing printed circuit boards.
ign) information, CAM(
computer-aided manufacturer
e), CAT (computer-aided tech)
By using hnology) information, various inspections are carried out in parallel with the installation of each part. ■Prevents defective products from being passed on to the next process. ■Self-diagnosis function that feeds back trouble information in real time and performs self-recovery. A self-contained intellectual production system can be constructed.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a method and apparatus for assembling a printed circuit board according to the present invention will be described with reference to the drawings.

FIG. 1 is a process diagram of the first embodiment of the present invention, and FIG.
1 shows an apparatus for carrying out the process of FIG. The steps in Figure 1 can be roughly divided into bare chip mounting process 1, in which a bare chip is mounted on a printed circuit board and required connection wiring and resin coating, and chip component mounting process 2, in which chip components are mounted on a printed circuit board and soldered. and a packaging step 3 in which a package is provided on the printed circuit board circuit after the components are mounted. Here, bare chip mounting process 1 consists of board stocking process #1 to UV curing process #6, chip component mounting process 2 consists of solder application process #7 to tie bar cutting process #12, and packaging process 3 consists of package molding process #13 to packaging process #17.

The apparatus shown in FIG. 2 will be explained. 2 from the left
0 is a board dividing supply machine that divides and supplies printed circuit boards of a predetermined shape and pattern from a large board; 21 is a bare chip mounting machine that mounts bare chips on printed circuit boards;
22 is a wire bonder for connecting the bare chip and the pattern on the printed circuit board; 23 is a potting device for applying ultraviolet curing resin (hereinafter referred to as UV resin) to the bare chip mounted on the printed circuit board; 24 is a potting device for applying ultraviolet curing resin (hereinafter referred to as UV resin) This is a UV irradiation device section that irradiates UV resin with ultraviolet rays to cure it. In addition, 25 is a solder applicator that applies cream solder to the required locations on the printed circuit board, 26 is a chip component mounting machine that mounts chip components in correspondence with the cream solder application position, and 27 is an irregularly shaped component (a component whose dimensions and shape are normal). 28 is a lead frame mounting machine that mounts a lead frame on a printed circuit board on which each component is mounted; 29 is a lead frame mounting machine that melts cream solder with hot air to solder each component. It is done in a reflow oven. Further, 30 is an inspection equipment unit that performs various tests such as characteristic tests on the printed circuit board circuit after each component is mounted and connected, and 31 is a unit that integrates the package with the printed board circuit on which the components are mounted after the inspection is completed using resin molding. A package molding device section 32 is a cut-forming device section that cuts and removes unnecessary lead frame parts from the packaged printed circuit board circuit and bends the remaining leads to produce a final product. These board dividing supply machine 20 to cut forming device section 32 are arranged in a line so that each printed circuit board can be processed continuously, and sequentially process and transfer the printed circuit boards one by one (or each plurality of boards). One-by-one/takt production method).

Next, each step will be explained in order. In the substrate dividing supply machine 20 that performs the substrate dividing process #2, the substrates stored in multiple stages in the substrate stocking process #1 are shown in FIG.
A large board 40 as shown in (A) is divided into printed circuit boards 41 having a predetermined shape and a predetermined pattern as shown in FIG. Here, the board dividing and supplying machine 20 checks the dividing accuracy and the pattern accuracy of the printed circuit board when dividing the large board 40 and creating the printed circuit board 41 of a predetermined shape in parallel with carrying out the board dividing step #2. inspect. These inspections can be performed by capturing an image of the printed circuit board using an imaging device into an image processing device and comparing the image with the standard dimensions and pattern of the printed circuit board. The bare chip mounting machine 21 that executes the bare chip mounting process #3 attaches a mounting head 50 that holds a bare chip 42 without a package (without an exterior) and an imaging device 51 integrated therewith to a station 52, as shown in FIG. The bare chip 42 is held by the mounting head 50 and used for CAD during board design.
3(C) at the specified position on the printed circuit board 41 based on the information.
Attach it as shown. The bare chip mounting machine 21 inspects the positional accuracy regarding bare chip mounting on the printed circuit board in parallel with executing the bare chip mounting process #3. This inspection can be performed by capturing an image of the printed circuit board 41 using the imaging device 51 into the image processing device, recognizing the actual bare chip mounting position, and comparing it with the CAD information. Wire bonder 2 performing wire bonding process #4
2 receives the printed circuit board with the bare chip attached and receives it in Figure 3 (
As shown in C), the bare chip 42 and the pattern on the printed circuit board are connected by wire bonding. The wire bonder 22 inspects bonding defects and positional accuracy in parallel with executing wire bonding step #4. These inspections can be performed by capturing an image around the bare chip on the printed circuit board using an imaging device into an image processing device and recognizing the wire bonding situation. After the wire bonding is completed, the printed circuit board 41 is transferred to the potting device section 2 that performs the potting process #5.
3, and a UV resin 43 is applied onto the bare chip as shown in FIG. 3(D). In parallel with executing the potting step #5, the potting device section 23 inspects the wire bonding for disconnection defects. The printed circuit board 41 coated with the UV resin 43 is sent to the UV irradiation device section 24, and UV curing step #6 is performed. As a result, the bare chip part is covered with a hardened UV resin coating (
protected by resin coating). In this way, the bare chip mounting process 1 is completed.

[0011] Thereafter, the printed circuit board is sent to the solder applicator 25 that performs solder application step #7, and an appropriate amount of cream solder is applied to predetermined locations on the printed circuit board by a dispenser provided in the solder applicator 25. The chip component mounting machine 26 that executes the chip component mounting process #8 receives the printed circuit board coated with cream solder, and attaches the chip component 44 to the printed circuit board 41 as shown in FIG. 3(E) using the CAD information at the time of board design. Attach it to the cream solder application position. Similarly, the odd-shaped parts are mounted by the odd-shaped parts mounting machine 27 which executes the odd-shaped parts mounting step #9. The chip component mounting machine 26 and the irregularly shaped component mounting machine 27 inspect position accuracy, missing parts, and poor posture in parallel with executing the chip component mounting process #8 and the irregularly shaped component mounting process #9, respectively. These inspections are carried out by integrating an imaging device into a mounting head for mounting chip components and irregularly shaped parts, as in the case of Figure 4, and capturing images around the chip components and irregularly shaped components with the imaging device and performing image processing. This can be carried out by importing the information into the device, recognizing the actual mounting positions and mounting conditions of the chip components and odd-shaped components, and comparing the results with the CAD information. The printed circuit board on which the chip components and irregularly shaped components have been mounted is sent to the lead frame inserter 28 that performs the lead frame insertion step #10, where the lead frame 45 is inserted into the side edge of the printed circuit board 41 as shown in FIG. 3(F). It is attached to the electrode part of. The lead frame inserter 28 inspects lead frame position accuracy and lead frame bending in parallel with executing lead frame insertion step #10. These inspections can be performed by capturing an image of the lead frame 45 inserted into the side edge of the printed circuit board using an imaging device into an image processing device and recognizing the position and orientation of the lead frame. After the lead frame has been attached, the printed circuit board is passed through a solder reflow oven 29 that performs a solder reflow process #11, where soldering is performed by melting cream solder with hot air. The reflow oven 29 has a chamber structure into which nitrogen gas is introduced, and is designed to reduce the oxygen concentration in the oven to prevent solder from oxidizing, and to be able to handle fine soldering patterns. This reflow soldering connects the patterns on the printed circuit board to the electrodes of the chip components and irregularly shaped components, and to the lead ends of the lead frame, thereby forming a printed circuit board in which a predetermined electric circuit is configured. The printed circuit board circuit after soldering is sent to the inspection equipment section 30. In the inspection equipment section 30, tie bar cutting process #12
to conveniently inspect the lead frame 45.
A portion (or most) of the leads are cut off from the wire, and then printed circuit board inspection, lead bending inspection, soldering inspection, and characteristic inspection are performed. Among these inspections, those related to appearance are performed using image processing, and those related to electrical characteristics are performed using electrical measuring instruments. In this way, the chip component mounting process 2 is completed.

After passing through the inspection device section 30, the printed circuit board circuit is sent to a package molding device section 31, where the package molding device section 31 carries out a package molding process #13 and a runner cutting process #14. First, in the package molding process 13, as shown in FIG.
6 will be made by resin molding (for example, injection molding). Thereafter, in a runner cutting step #14, the runner used in resin molding is cut. The package molding device section 31 inspects for lead bending and mold defects by image processing in parallel with executing the package molding process #13 and the runner cutting process #14. The packaged printed circuit board circuit that has exited the package molding device section 31 is sent to the cut forming device section 32 which executes the cut forming step #15, where it is shown in FIG.
Each lead 4 required in the lead frame as shown in (H)
The parts other than the part 7 are cut off, and the remaining lead 47 is bent to form the final product shape. Then, a stamped and packaged printed circuit board circuit is created through the stamping step #16 and the packaging step #17. Stamping process #16
At the same time, marking defects and characteristic inspections are carried out, and the packaging process is completed.

In the case of the first embodiment, a high-density circuit can be realized by using a multilayer board as a printed circuit board or by mounting a bare chip on a printed circuit board. High-density, high-precision mounting of 3 mm is possible. In addition, a self-contained (autonomous multifunctional) compact production system can be constructed by performing necessary inspections in parallel with the execution of each process. Also, one printed circuit board
It is a one-by-one/takt production method in which each board (or multiple boards) is processed and transferred to the next process, eliminating the need to store boards for each process and automating the transfer of boards between each process. It is possible to save labor in the production process. Further, incidental work can also be automated by the outline robot.

In the first embodiment, various parts are mounted on a single printed circuit board and a package is formed by resin molding.
ogy) is also possible. This case is shown in FIG. 5 as a second embodiment. In this second embodiment, the first
Following the solder reflow process #11 in the figure, in the board assembly process #20, a plurality of unmolded printed circuit board circuits 61 are assembled into a support 60 that three-dimensionally supports the board in a multi-tiered state as shown in Figure 6, and then insert molding is performed. In step #21, the multi-tiered printed circuit board circuits are insert-molded to create a package 62 shown by the imaginary line in FIG. Packaging is performed in step #24.

FIG. 7 shows a third embodiment in which the packaged printed circuit board circuit obtained in the first embodiment shown in FIG. 1 is mounted on another large board (PCB process). In this third example, cream solder is printed in the solder printing process #31 on another board supplied in the board supply process #30, and the package obtained in the first example is attached in the component mounting process #32. A printed circuit board circuit is mounted, other components are mounted as necessary, soldering is performed in a solder reflow step #33, and characteristics are inspected in a characteristic testing step #34.

[0016] In the packaging process, insert molding (injection molding) may be performed on the spot, but a pre-molded case may be attached depending on the situation of the printed circuit board circuit.

[0017]

[Effects of the Invention] As explained above, according to the present invention,
By continuously performing each process on each printed circuit board, from mounting bare chips and chip components to the printed circuit board, soldering, inspection, and packaging, we reduce unnecessary incidental work, improving productivity and saving labor. can be achieved. In addition, high-density and high-precision mounting can be achieved by mounting bare chips on a printed circuit board and connecting them using wire bonding, etc., or by using a multilayer printed circuit board.

[Brief explanation of the drawing]

FIG. 1 is a process diagram showing a first embodiment of the present invention.

FIG. 2 is a perspective view showing an apparatus for performing each step shown in FIG. 1;

FIG. 3 is an explanatory diagram of each step in FIG. 1.

FIG. 4 is a front view showing the bare chip mounting machine.

FIG. 5 is a process diagram showing a second embodiment of the present invention.

FIG. 6 is an explanatory diagram of the main steps in FIG. 5;

FIG. 7 is a process diagram showing a third embodiment of the present invention.

[Explanation of symbols]

1　Bare chip mounting process 2 Chip component mounting process 3 Packaging process 20　Substrate dividing supply machine 21　Bare chip mounting machine 22 Wire bonder 23 Potting device section 24 UV irradiation equipment section 25 Solder applicator 26 Chip component mounting machine 27　Irregular-shaped parts mounting machine 28 Lead frame insertion machine 29 Reflow oven 30 Inspection equipment department 31 Package mold equipment department 32 Cut forming device section

Claims (5)

[Claims] 1. A bare chip mounting step of mounting a bare chip on a printed circuit board, a chip component mounting step of mounting a chip component, a packaging step of providing a package on the printed circuit board circuit after mounting the bare chip and the chip component, and a printed circuit board. 1. A method for assembling a printed circuit board, characterized in that an inspection step of inspecting the circuit is sequentially and continuously carried out on each printed circuit board. 2. The method for assembling a printed circuit board circuit according to claim 1, wherein the printed circuit board circuit is inspected in the inspection step before executing the packaging step. 3. The bare chip mounting step includes a wire bonding step for connecting the bare chip mounted on the printed circuit board with a pattern on the printed circuit board, and a potting step for providing a resin coat on the surface of the bare chip. 1. The method for assembling a printed circuit board according to 1. 4. A bare chip mounting machine that mounts a bare chip on a printed circuit board, a wire bonder that connects the printed board side pattern and the bare chip, a potting device that applies a resin coat to the surface of the bare chip, and a resin cure that hardens the resin coat. The equipment section, a solder applicator that applies cream solder to a printed circuit board, a chip component mounting machine that mounts chip components in correspondence with the cream solder application position on the printed circuit board, and a lead frame mount that mounts the lead frame to the printed circuit board. machine, a solder reflow oven that melts cream solder and solders chip components to printed circuit boards, and mounts components on printed circuit boards.
an inspection equipment section that inspects the connected printed circuit board circuit;
Equipped with a package molding device section that forms a package on a printed circuit board circuit, and a cut forming device section that removes unnecessary parts of a lead frame and bends the remaining leads, the system is arranged in a line so that printed circuit boards can be processed continuously. A printed circuit board circuit assembly device featuring: 5. A bare chip mounting machine that mounts a bare chip on a printed circuit board, a wire bonder that connects the printed board side pattern and the bare chip, a potting device that applies a resin coat to the surface of the bare chip, and a resin cure that hardens the resin coat. Equipment section, a solder applicator that applies cream solder to a printed circuit board, a chip component mounting machine that mounts chip components in correspondence with the cream solder application position on the printed circuit board, and an irregular component mounter that mounts irregularly shaped components onto the printed circuit board. A lead frame mounting machine that attaches lead frames to printed circuit boards, a solder reflow oven that melts cream solder and solders chip components to printed circuit boards, and a solder reflow oven that attaches parts to printed circuit boards.
an inspection equipment section that inspects the connected printed circuit board circuit;
Equipped with a package molding device section that forms a package on a printed circuit board circuit, and a cut forming device section that removes unnecessary parts of a lead frame and bends the remaining leads, the system is arranged in a line so that printed circuit boards can be processed continuously. A printed circuit board circuit assembly device featuring: