JPH09219580A - Solder feeder device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder feeder device and a method capable of feeding proper amount of solder also performing the soldering step with high precision onto an electronic part of leads even at narrow pitch. SOLUTION: A suction jig 1 is provided with an air suction port 2, a stamping blade 3 and a mesh part 4. A solder sheet 6a put on a stamping jig 5 is stampped by lowering the suction jig 1 and the stampped solder piece 6b is held by the mesh part 4. Successively, the adsorption jig is shifted to a specific position of a printed-wiring board to be lowered arriving at that position. On the other hand, the solder piece 6b is released from the mesh part 4 by the air flow in the reverse direction to the suction port 2 to be held on an adhesive 9 of an electrode pad 8. Resultantly, the proper amount of solder can be fed onto the electrode pad 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supplying apparatus and a supplying method, and particularly when mounting a surface mounting type electronic component on an electronic circuit board and soldering it, only a predetermined portion to which the solder needs to be supplied. The present invention relates to a solder supply device and a supply method capable of supplying a necessary amount of solder to a solder.

[0002]

2. Description of the Related Art Conventionally, for example, when mounting an electronic circuit component on an electronic circuit board, preliminary solder is previously provided at a predetermined position of the electronic circuit board, and the electronic circuit component is placed on the electronic circuit board. A method is widely adopted in which the solder is heated and melted again to make electrical connection. As a method of supplying the preliminary solder, a solder paste as the preliminary solder is provided at a predetermined position on the electronic circuit board by a method such as screen printing or dispensing, or electrolytic plating and plating are performed at the stage of the electronic circuit board. Supply is generally performed by a chemical method such as an electroless plating method or a physical method such as a solder leveler method.

As another conventional method, a method of supplying solder in a solid state has been proposed in order to prevent defective printing. For example, JP-A-63-45891 discloses a solder transfer carrier film and a solder transfer method, and JP-A-63-212655 discloses a solder-embedded resist sheet and a component mounting method using the same. It is disclosed. Further, Japanese Patent Laid-Open No. 63-254792 discloses a sheet formed by mixing solder powder and flux powder in a hot-melt resin that is soluble in a solvent, and a method for mounting parts using the sheet. There is.

The techniques disclosed in Japanese Patent Laid-Open No. 63-45891 and Japanese Patent Laid-Open No. 63-2111655 are for transferring solder prepared in a predetermined shape on a film onto an electrode of an electronic circuit board. It is a feature. Further, in the technique disclosed in Japanese Patent Laid-Open No. 63-254792, a sheet made of a resin such as a hot melt resin mixed with a solder powder and a flux powder is transferred onto an electrode of an electronic circuit board, and a component is placed thereon. After mounting, the contact property (conductivity) between the solder powder in the sheet is increased by pressing the parts, that is, the principle of anisotropic conductivity is used.

[0005]

However, in the above-mentioned method of preliminarily providing the preliminary solder by paste printing at a predetermined position of the electronic circuit board, since the printing is performed through the screen mask, the preliminary solder applied to the electronic circuit board is used. The amount is not always constant, and in some cases, too much or too little occurs. As a result, there is a problem in that when soldering is performed by reflow (reheating and melting), there is a possibility that a bridge partially occurs between pads of an electronic circuit board or unsolder occurs. It was In addition, when a defective part or the like is found after soldering and must be replaced, there is a problem that manual re-soldering is required.

Further, in the prior arts disclosed in the above-mentioned three publications, there is a problem that the process for manufacturing a transfer film or transfer sheet is complicated and expensive. Further, when soldering is performed using the transfer film or transfer sheet, it is difficult to stabilize the positional accuracy of electronic components mounted on an electronic circuit board due to shrinkage of these films and sheets, High precision soldering is required for electronic parts with narrow pitch leads, but it is difficult to meet this requirement, or it is difficult to apply to large electronic circuit boards where precision errors easily occur. There was a problem.

An object of the present invention is to eliminate the above-mentioned problems of the prior art, to supply an appropriate amount of solder, and to perform soldering with high precision even for electronic components having narrow pitch leads. A supply device and a supply method are provided.

[0008]

In order to achieve the above-mentioned object, the first feature of the present invention is to provide a solder supply device for supplying solder to a predetermined position of an electronic circuit board, in which a solder piece is removed from a solder sheet. Solder piece punching and holding means having punching means and means for holding punched solder pieces and releasing them as necessary, and moving the solder piece punching and holding means to a predetermined position on the electronic circuit board. It is characterized in that it has a positioning means. A second feature is a solder supply method for supplying solder to a predetermined position on an electronic circuit board, in which a solder piece obtained from a solder sheet is moved to a predetermined position on the electronic circuit board, The feature is that it is installed at the planned position.

Since the present invention is a method of punching a solder piece from a solder sheet, an appropriate amount of solder can be supplied to a predetermined position of an electronic circuit board, and even for electronic components with narrow pitch leads. Highly accurate soldering can be performed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 is an explanatory diagram of an embodiment of a solder supply device of the present invention. The solder supply device of the present embodiment is
As shown in Fig. (A), the suction jig (collet)
1 and a punching jig 5. Adsorption jig 1
Has a suction port 2 through which air passes, a punching blade 3 for punching a solder sheet, and a mesh portion 4 for holding a solder piece punched during suction. On the other hand, the solder sheet 6 a is placed on the punching jig (lower die) 5.
The tip of the punching blade 3 is sharply processed, and by lowering the punching blade 3 onto the punching jig 5 and punching the solder sheet 6a, it is possible to improve the punching accuracy and suppress the occurrence of burrs and the like. . It is desirable that the suction jig 1 has a structure such that an electronic component such as a semiconductor package can be directly attached to a drive unit of a mounter that holds the electronic component at a predetermined position.

Next, the operation of this embodiment will be described with reference to FIG. At first, the suction jig 1 is lifted up as shown in FIG. 1 (a), and the solder sheet 6 a is placed on the punching jig 5 in this state. The suction jig 1
The punching blade 3 has a structure for punching through the solder sheet 6a, and has a punching surface shape and area determined by the shape and area of the pad of the electronic circuit board to which the electronic component is soldered. There is. Next, as shown in FIG. 2B, the suction jig 1 is lowered onto the punching jig 5,
Air is sucked from the suction port 2. By this operation, the solder sheet 6a is punched by the punching blade 3, sucked by the air, and adsorbed on the mesh portion 4. Suction port 2
The arrows inside indicate the direction of air flow.

Next, as shown in FIG.
The suction jig 1 is lifted upward and is carried onto the printed wiring board 7 as shown by the arrow in FIG. An adhesive 9 for temporary fixing is applied on the electrode pad 8 on the printed wiring board 7. As the adhesive 9 for temporary fixing, a pre-flux or a thermosetting resin can be used.

The suction jig 1 is carried on a predetermined electrode pad 8 on the printed wiring board 7 by a well-known NC (numerical control) program / image recognition mechanism (not shown). When the suction jig 1 is accurately positioned on the electrode pad 8 of the printed wiring board 7, the suction jig 1 is lowered onto the printed wiring board 7 and then sucked, as shown in FIG. Air is discharged from the mouth 2. Then, the solder pieces adsorbed on the mesh part 4 are separated from the mesh part 4 and adhere to the adhesive 9 on the electrode pad 8. Subsequently, as shown in FIG. 6F, the suction jig 1 is lifted, and the supply of solder onto the printed wiring board is completed. The remaining pieces after removing the solder pieces from the solder sheet can be recycled and regenerated, and effective use of resources can be achieved.

FIG. 2 is a diagram for explaining the punching of the solder pieces and the transfer of the solder pieces onto the printed wiring board 7 in the solder supply apparatus of the present embodiment in an easy-to-understand manner. Indicates equivalent. The solder sheet 6a is punched out from the solder piece 6b by the suction jig 1, and the solder piece 6b is sucked by the suction jig 1. Next, the suction jig 1 is carried on a predetermined electrode pad 8 on the printed wiring board 7 by an NC program / image recognition mechanism (not shown). After the alignment is completed, the suction jig 1 is then moved to the electrode pad 8
The solder piece 6b is attached to the adhesive 9 on the electrode pad 8 by discharging air from the suction port 2 of the suction jig 1. After that, by repeating the above operation, the punched solder pieces are sequentially mounted on the electrode pads 8 of the printed wiring board.

As described above, according to this embodiment, by determining the thickness of the solder sheet and the punching area of the punching blade 3 in advance, the amount suitable for the electrode pad of the printed wiring board for supplying the solder piece is obtained. Will be able to supply solder. As a result, it is possible to eliminate the problem that a bridge is generated between pads of the printed wiring board and unsoldered, and solder pieces are supplied with high precision to electronic components having narrow-pitch leads. As a result, the printed wiring board and the electronic component can be soldered with high accuracy and reliability.

Next, a second embodiment of the present invention will be described with reference to FIG. This embodiment shows a suction jig 10 in which solder pieces can be punched out in a row from a solder sheet. The figure (a) is an external perspective view of the suction jig 10, and the figure (b) is It is a bottom view. As is clear from the drawing, the suction jig 10 has a suction port 10a through which air passes, and a solder sheet punching portion 11 on the lower surface. The solder sheet punching section 11 is formed by arranging a plurality of solder piece punching units each having a punching blade 11a and a mesh section 11b in a line.

When this solder supply device is used, solder pieces corresponding to the number of the solder piece punching units are punched from a solder sheet (not shown) at a time and the solder pieces are carried on a plurality of pads having the same pattern on the printed wiring board. be able to. The solder supply device of this embodiment is a series batch type SOP.
Pad for (Small Outline Package), QFL (Quad Flat)
Package) pad, LCC (Leadless Chip Carrier P
It can be applied to a pad for ackage), a pad for TAB (Tape Automated Bonding) or a pad for BGA (Ball Grid Array).

Next, a third embodiment of the present invention will be described with reference to FIG. This embodiment shows a suction jig 15 which is capable of punching out solder pieces arranged in a rectangular shape from a solder sheet at a time, and FIG.
5 is an external perspective view, and FIG. 5 (b) is a bottom view. As is clear from the drawing, the suction jig 15 has a suction port 15a through which air passes, and a solder sheet punching portion 16 on the lower surface. The solder sheet punching portion 16 is formed by arranging a plurality of solder piece punching units each having a punching blade 16a and a mesh portion 16b in a rectangular shape.

When this solder supply device is used, the solder pieces not shown in the drawing are punched at the same time as many solder pieces as the number of the solder piece punching units arranged in the rectangle, and the solder pieces having the punching pattern are printed. It can be carried on a plurality of pads of the same pattern on the plate. The solder supply device of this embodiment may be applied to a four-way batch type QFP pad, LCC pad, TAB pad, BGA pad, or the like.

When the second and third solder strip supply devices are used, a plurality of solder strips can be punched at a time and carried on a plurality of pads of a printed wiring board at one time. Compared to the one that punches solder pieces one by one like this and carries them on the pad of the printed wiring board,
Work efficiency is greatly improved. It is needless to say that the present invention can be applied not only to the punching of the solder pieces in the one row or the rectangular array described above, but also to the punching of other arrays. Furthermore, the shape of the contour of the punching blade that punches out the solder pieces,
It is obvious that the shape is not limited to the shape shown and can be any shape. Further, in the above-mentioned embodiment, the shapes of the solder pieces punched in a line or a rectangular array are all the same, but the shape is not limited to this, and solder pieces of different shapes may be mixed.

[0021]

As is apparent from the above description, according to the present invention, the solder piece having the predetermined area obtained from the solder sheet is supplied to the electrode portion of the electronic circuit board on which the electronic component is mounted. Therefore, the required amount of solder can be supplied to the electrode portion. Therefore, as compared with the method of supplying the solder paste by the conventional printing method, the variation in the amount of solder is greatly reduced, and the possibility of a connection failure due to a bridge between electrodes or unsoldering is further reduced. Further, compared to the method using an organic medium such as a transfer film, less affected by temperature and humidity, the shape of the solder,
Regarding the position accuracy, it is possible to provide a stable connection quality.

Further, even if the electronic circuit board becomes large in size or the lead pitch of the electronic parts to be mounted becomes narrow, the punching and holding of the solder pieces is carried out in a structure according to the requirements of the electronic circuit board and the electronic parts. The means can be designed.
Therefore, the present invention can be applied to the large-sized electronic circuit board and electronic components having narrow pitch leads. Also, when it becomes necessary to replace an electronic component that has been soldered once, after removing the electronic component from the board, the remaining solder on the electrode part is removed with a device such as a sucker, and the solder obtained from the solder sheet is used. If the piece is supplied to the electrode position from which the electronic component has been removed, the solder piece can be supplied by using the solder supply device of the present invention instead of manual work.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a configuration and operation of a main part of an embodiment of the present invention.

FIG. 2 is a diagram for explaining the outline of the operation of the present embodiment.

FIG. 3 is an explanatory diagram of a main part of a second embodiment of the present invention.

FIG. 4 is an explanatory diagram of a main part of a third embodiment of the present invention.

[Explanation of symbols]

1, 10, 15 ... Suction jig (collet) 2, 10a,
15a ... Suction port, 3 ... Punching blade, 4 ... Mesh part, 5 ...
Punching jig (lower die), 6a ... Solder sheet, 6b ... Solder piece, 7 ... Printed wiring board, 8 ... Electrode pad, 9 ... Adhesive agent, 11, 16 ... Solder sheet punched part (bottom view).

Claims (4)

[Claims] 1. A solder supply device for supplying solder to a predetermined position of an electronic circuit board, comprising means for punching a solder piece from a solder sheet, and means for holding the punched solder piece and releasing it as necessary. A solder supply device comprising: a solder piece punching / holding means provided with; and an aligning means for moving the solder piece punching / holding means to a predetermined position of the electronic circuit board. 2. The solder supply device according to claim 1, wherein the means for punching out the solder pieces is such that the solder pieces having a predetermined shape are punched out in a row or a rectangular array from the solder sheet. Solder supply device. 3. The solder supply device according to claim 1, wherein the means for holding and releasing the solder piece has a mesh portion, and holds and releases the solder piece by sucking and releasing air. A solder supply device. 4. A solder supply method for supplying solder to a predetermined position of an electronic circuit board, wherein a solder piece obtained from a solder sheet is moved to a predetermined position on the electronic circuit board, and the predetermined position. A solder supply method characterized in that it is mounted on.