JP2001119133A - Solder paste printing method, solder printing method, and method of manufacturing wiring board and electrical device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder paste printing device which can supply a sufficient amount of solder paste, even if pad is small. SOLUTION: This solder paste printing device is provided with a mask frame removing part 30, which aligns an opening 103 of a metal mask 100 with a pad P of a printed board B, a squeezes part 60 which supplies a solder paste S onto the pad P via the opening 103, a mask frame moving part 30 which separates the printed board B from the metal mask 100, and a jig 110 which is arranged on a side opposite to the printed board B of the metal mask 100. When the metal mask 100 is separated from the printed board B, the jig 110 is inserted into the opening 103, so that the solder paste S supplied to the opening 103 is made to be left on the pad P.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder paste printing apparatus and a solder paste printing method for printing a solder paste on a pad of a wiring board via a mask, and a solder paste printed by the printing method. The present invention relates to a wiring board and an electric element, and particularly to a wiring board and an electric element in which an opening of a mask is minute.

[0002]

2. Description of the Related Art Conventionally, a solder paste printing method for supplying a solder paste to pads formed on a wiring board such as a printed board using a metal mask has been used. As shown in FIG. 2, the solder paste printing method uses a pad P of a printed circuit board and an opening 1 of a metal mask 100.
After the solder paste S is positioned so as to correspond to 03, the solder paste S is supplied onto the mask 102 of the metal mask 100,
The squeegee 64 moves the solder paste S while pressing it against the mask 102. As a result, the solder paste S is filled in the opening 103, and the metal mask 10
The printing of the solder paste S on the pad P is completed by separating 0 from the printed circuit board B.

[0003]

The above-mentioned conventional solder paste printing method has the following problems. That is, in recent years, as the size of mounted components has been reduced, the size of pads has also become smaller. At the same time, the size of the opening of the metal mask has been reduced. On the other hand, the thickness of the metal mask is the same as that of the related art in order to supply the solder paste S in an amount necessary for soldering.

Therefore, the size of the pad P and the size of the opening 103 of the metal mask 100 are different from those of the metal mask 10.
When the thickness is smaller than the thickness of 0, the force of the solder paste S filled in the opening 103 to contact the pad P is stronger than the force of the solder paste S to contact the inner wall 103a of the opening 103.
For this reason, as shown in FIG.
0, the solder paste S
There is a problem that the amount of the solder paste S remaining on the pad P becomes insufficient as shown in FIG.

[0005] Accordingly, the present invention provides a solder paste printing apparatus, a solder paste printing method, and a solder paste printing method that can supply a sufficient amount of solder paste even when the pad is small.
An object of the present invention is to provide a method for manufacturing a wiring board, an electric element, and an electric device.

[0006]

SUMMARY OF THE INVENTION In order to solve the above problems and achieve the object, a solder paste printing apparatus, a solder paste printing method, a wiring board and a method of manufacturing an electric device according to the present invention are configured as follows. I have.

(1) Mask positioning means for arranging a mask having an opening at a predetermined relative position on a wiring board, and solder paste for supplying the solder paste from above the mask via the opening to the wiring board. Supply means, when the mask is separated from the wiring substrate,
A jig for transferring the solder paste supplied to the opening by inserting the protrusion into the opening onto the wiring board, and a jig for disposing the jig at a predetermined relative position on the mask And supplying means.

(2) A mask positioning step of arranging a mask having an opening on a wiring substrate at a predetermined relative position, and supplying the solder paste from above the mask to the wiring board through the opening. A supplying step, and a mask separating step of separating the mask from the wiring board, inserting a projection into the opening, and transferring the solder paste onto a pad of the wiring board. .

(3) A mask positioning step of superposing a mask having an opening on a wiring board having a pad and aligning the opening with the pad, and supplying the solder paste on the mask. A supplying step, an extruding step of supplying the solder paste onto the pad from above the mask through the opening, and separating the mask from the wiring substrate, and applying the solder paste supplied to the opening to the pad. The solder paste is printed by a mask separating step of remaining on the pads of the wiring board.

(4) A mask positioning step of superposing a mask having an opening on a wiring board having a pad and aligning the opening with the pad, and supplying a solder paste on the mask. And an extrusion step of supplying the solder paste from above the mask through the opening onto the pad,
A mask separating step of separating the mask from the wiring board and leaving the solder paste supplied to the opening on a pad of the wiring board.

[0011]

FIG. 1A is a perspective view showing a solder paste printing apparatus 10 for printing a solder paste S on a printed circuit board (wiring board) B, and FIG. FIG. 4 is a perspective view showing a squeegee head 61 incorporated in the squeegee. In the drawings, arrows XYZ indicate three directions orthogonal to each other, arrow XY indicates a horizontal direction, and arrow Z indicates a vertical direction.

The solder paste printing apparatus 10 includes a base 11
It has. A board transfer conveyor 20 for transferring the printed board B and a metal mask 1 described later are provided on the base 11.
00, a visual recognition unit 40 for recognizing a positional relationship between the metal mask 100 and the printed circuit board B, and a solder paste S for the metal mask 100.
A solder paste supply unit 50 for supplying the solder paste S to the upper side, a squeegee unit 60 for supplying the solder paste S to the pad P on the printed circuit board B from the opening 103 of the metal mask 100, A substrate table 70 for supporting the substrate B is provided.

The board transport conveyor 20 transports the printed board B before printing the solder paste S to the board table 70 along the arrow X direction in the figure, and carries out the printed board B outside the solder paste printing apparatus 10 along the arrow X direction after printing. I do.

The printing section 30 is provided with a pair of guides 31 provided on the base section 11 and movably provided on these guides 31 in the direction of arrow Y in the figure, supports the metal mask 100, and A mask support portion 32 for positioning vertically, and a jig support portion 33 provided above the mask support portion 32 for supporting a jig 110 to be described later and for positioning vertically. I have.

The visual recognition section 40 is provided with a guide 41 provided on the base section 11 and a camera head 43, which is movably provided along the arrow X direction on the guide 41, and positions a camera head 43 described later in the arrow YZ directions in FIG. A camera stage 42 for performing
Camera head 43 supported by this camera stage 42
And

The solder paste supply unit 50 includes a guide 41
A dispenser 51 is provided to supply the solder paste P onto the metal mask 100.

The squeegee section 60 includes a squeegee moving section 61 for reciprocating a squeegee head 62 described later along the arrow X direction in the figure, and a squeegee head 62 supported by the squeegee moving section 61. Squeegee head 62
As shown in FIG. 1B, a head main body 63 and a spatula-shaped squeegee 64 provided at a lower portion of the head main body 63 for extruding the solder paste S from the opening 103.
And

The board table 70 has a function of preventing the printed board P from escaping downward during printing of the solder paste S.

The metal mask 100 has a frame 101, on which a mask 102 is provided.
The mask 102 has an opening 103 corresponding to the pad P.
Are formed.

As shown in FIG. 3, the jig 110 is a plate-shaped jig main body 111 made of a metal material, and is provided on the jig main body 111 at a position corresponding to the opening 103 of the metal mask 100. And a projection 112 provided.
Further, a material having a property that the solder paste S is difficult to adhere, for example, a resin material such as Teflon is coated on a tip side of the protrusion 112. Note that the entire jig 110 may be formed of plastic.

In the solder paste printing apparatus 10 configured as described above, FIGS. 2A to 2C and FIG.
As shown in (d), the solder paste S is printed on the pad P of the printed circuit board B.

First, the printed board B is transferred to the position of the board table 70 by the board transfer conveyor 20, and the metal mask 100 is positioned on the printed board B by the mask frame moving unit 30. At this time, the visual recognition unit 4
0, the position of the printed board B and the position of the metal mask 100 are recognized, and as shown in FIG.
Positioning is performed with high accuracy so that

Next, a predetermined amount of solder paste S is supplied onto the mask 102 of the metal mask 100 by the dispenser 51 of the solder paste supply unit 50. Subsequently, the squeegee unit 60 is operated to move the squeegee 64 while pressing the solder paste S against the mask 102 as shown in FIG. 2B. As a result, the opening 103 is filled with the solder paste S, as shown in FIG.

Next, as shown in FIG. 3A, the jig 110 is positioned above the metal mask 100 so that the projection 111 thereof corresponds to the opening 103.

Next, as shown in FIG.
The metal mask 100 is raised while the position of 10 is fixed. The protrusion 111 of the jig 110 is connected to the opening 10.
3 is inserted. Thus, the solder paste S is transferred onto the pad P without remaining on the inner wall 103a of the opening 103.

When the metal mask 100 is further raised and the protrusion 111 has been inserted into the opening 103, the metal mask 100 and the jig 110 are simultaneously raised to complete printing.

As described above, according to the solder paste printing apparatus 10 according to the present embodiment, the solder paste S supplied to the opening 103 of the metal mask 100 can be transferred onto the pad P of the printed circuit board B. Therefore, the amount of solder paste S required for soldering can be reliably supplied onto the pad P, and the quality of the soldered joint of the electronic component using the printed board B can be improved.
Therefore, it is possible to improve the quality of an electric element and an electric device using the printed circuit board to which the solder paste S has been supplied.

It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the spirit of the present invention.

[0029]

According to the present invention, since all the solder paste adhering to the opening of the mask can be supplied to the pad, a sufficient amount of solder paste is supplied even when the area of the pad is small. It becomes possible.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a solder paste printing apparatus.

FIG. 2 is a cross-sectional view of a printed board and a metal mask in a step of supplying a solder paste to the printed board using the solder paste printing apparatus.

FIG. 3 is a cross-sectional view of a printed board, a metal mask, and a jig in a step of supplying a solder paste to the printed board using the solder paste printing apparatus.

FIG. 4 is a cross-sectional view of a printed board and a metal mask for explaining a problem in a conventional solder paste printing method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Solder paste printing apparatus 20 ... Board transfer conveyor 30 ... Mask frame moving part 40 ... Visual recognition part 50 ... Solder paste supply part 60 ... Squeegee part 70 ... Substrate table 100 ... Metal mask 103 ... Opening 110 ... Jig 112 ... Projection S: Solder paste

Claims (4)

[Claims] 1. A mask positioning means for arranging a mask having an opening on a wiring board at a predetermined relative position, and a solder paste supply for supplying the solder paste onto the wiring board from above the mask via the opening. A jig for transferring the solder paste supplied to the opening by inserting a protrusion into the opening when the mask is separated from the wiring board, on the wiring board; Jig supply means for arranging a tool at a predetermined relative position on the mask. 2. A mask positioning step of disposing a mask having an opening on a wiring substrate at a predetermined relative position; and supplying a solder paste from above the mask through the opening to the wiring substrate. And a mask separating step of separating the mask from the wiring board, inserting a protrusion into the opening, and transferring the solder paste onto a pad of the wiring board. Paste printing method. 3. A mask positioning step of superposing a mask having an opening on a wiring board having a pad and aligning the opening with the pad, and supplying a solder paste on the mask. An extruding step of supplying the solder paste from above the mask through the opening onto the pad; separating the mask from the wiring substrate and applying the solder paste supplied to the opening to the wiring A wiring board, wherein the solder paste is printed by a mask separating step of remaining on a pad of the board. 4. A mask positioning step of superposing a mask having an opening on a wiring board having a pad and aligning the opening with the pad, and supplying a solder paste on the mask. An extruding step of supplying the solder paste from above the mask through the opening to the pad; and separating the mask from the wiring board and applying the solder paste supplied to the opening to the wiring board. And a mask separating step for leaving the mask on the pad.