JP2556093B2 - Method for manufacturing circuit board unit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] This invention is based on the TAB (Tape Automated Bonding) method.
The present invention relates to a method for manufacturing a circuit board unit including a C unit.

[Prior Art] A TAB type IC unit in which an IC device is bonded to a carrier tape (film tape) is known.
There is also known a method of connecting the TAB type IC unit to a wiring board made of a carrier tape to form a circuit board unit.

In the case of manufacturing such a TAB type IC unit, conventionally, a method of arranging IC devices in a row in the width direction of the carrier tape has been generally adopted.

[Problems to be Solved by the Invention] However, since the carrier tape is formed with sprocket holes along which the feed teeth of the sprocket for feeding mesh, along the both side edges of the carrier tape. In the method of arranging in one row in the width direction, the effective area ratio of the carrier tape is extremely low, which causes a problem that the cost of the IC unit used for the circuit board unit becomes high. Not only that, but after the IC device is bonded, the resin is coated on the connection between the electrode part of the IC device and the finger leads, the resin is potted, the coating resin that is potted is dried, and the cutting to form the specified IC unit is performed. It is inefficient because the processing is performed for each IC device. In addition, conventionally, since the continuity test of the connection pattern was performed after cutting the carrier tape, it is necessary to re-arrange it in the inspection jig again to inspect multiple IC units at once, which is troublesome. It was Furthermore, when the above IC unit is connected to the wiring board, it is inefficient because it is a single-line operation.

The present invention has been made in view of the circumstances as described above, and an object thereof is to increase the effective area ratio of a film tape (carrier tape) that constitutes an IC unit and to efficiently use a circuit board unit. It is to provide a method of manufacturing a circuit board unit that can be manufactured.

[Means for Solving the Problems] In order to achieve the above object, in the method for manufacturing a circuit board unit according to the present invention, a first film in which connection patterns having a plurality of finger leads are arranged in a plurality of rows in the width direction. Bonding an IC device for each of the connection patterns of the tape, coating the connection portion of the bonded IC device with a resin, drying the coating resin, cutting the first film tape, and cutting at least A first processing step including a step of separating an IC unit for each unit having one IC device and a step of moving only non-defective products in the separated IC unit to a predetermined position;
A step of providing a plurality of rows of circuit patterns having connection terminals of the IC unit in the width direction of the second film tape; a step of joining the IC units sent from the first processing step for each circuit pattern; A second processing step including a step of cutting the film tape to separate each unit having at least one IC unit into a circuit board unit.

[Operation] According to the method of manufacturing a circuit board unit of the present invention having such a configuration, the IC device forming the IC unit is the first
Since the film tapes (carrier tapes) are arranged in a plurality of rows in the width direction, the effective area ratio of the first film tapes is significantly increased, which can reduce the cost of the IC unit. Further, since the IC devices are arranged in a plurality of rows in the width direction of the first film tape as described above, the potting of the resin that covers the connection between the electrode parts and the finger leads of the IC device after bonding the IC devices The processing can be done efficiently for each IC device, the inspection of the IC unit can be done efficiently for each before cutting, and the work to connect the IC unit to the second film tape (wiring board) Since this is an efficient multi-row operation, the circuit board unit can be efficiently created.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a manufacturing line for carrying out the method of manufacturing a circuit board unit according to the present invention. This manufacturing line is the first process step 1 for making a TAB IC unit.
And a second processing step 2 in which a circuit board on which the IC unit created in the first processing step 1 is mounted is created and then a circuit board unit is created by the circuit board and the IC unit. FIG. 2 was created in the first processing step 1 above.
The carrier tape (first film tape) 3 for the IC unit is shown, and FIG. 3 shows the IC unit 4 similarly produced in the first processing step. In addition, FIG.
The carrier tape (2nd film tape) 5 for circuit boards produced in the process 2 is shown.

<First Treatment Step> The carrier tape 3 for the IC unit treated in the first treatment step 1 of the above production line is a wide tape made of a resin film having flexibility and insulation such as polyester resin and polyimide resin. The sprocket holes 6, 6 into which the feed teeth of the sprocket for feeding are respectively meshed are provided along both side edges, and a plurality of IC device holes 7 are arranged in the width direction. Then, in the width direction, a connection pattern 9 is formed corresponding to each IC device hole 7 and having a plurality of finger leads 8 extending to the inside of the IC device hole 7. The connection pattern 9 is formed by etching a copper foil laminated on the carrier tape 3, and then tin or solder plating is performed using the plating grid pattern 9a which is also formed by etching the copper foil. There is.

The first processing step 1 for performing a predetermined processing on the carrier tape 3 is a bonding step 1a for bonding the IC device 10 having the electrodes facing the finger leads 8 to each of the connection patterns 9. IC device
A potting step 1b for coating the connection between the electrode 10 and the finger lead 8 with a resin, a pre-drying step 1c for pre-drying the coating resin, and a main drying step for main drying the coating resin
1d and pattern cutting step 1e for cutting the connection pattern 9
An inspection step 1f for inspecting the electrical continuity between the bonded IC device 10 and the finger leads 8, a cutting step 1g for cutting the carrier tape 3, and a take-out step 1h for taking out only non-defective ones of the cut pieces. Step 1i of mounting the chip component 23 on the carrier tape 3 of the IC unit 4 thus prepared. In this case, potting step 1b
The pre-drying step 1c, the pattern cutting step 1e, the inspection step 1f, the cutting step 1g, and the take-out step 1h are respectively a series of steps.

First, the carrier tape 3 having a plurality of connection patterns 9 formed in the width direction is sent to a bonding step 1a, where an ILB (Inner Lead Bonding) device 11
The IC devices 10 prepared in the vicinity of the device 11 are bonded in a plurality of rows. The ILB device 11 reads the pattern of the finger leads 8 with a TV camera, aligns the IC devices 10 placed on the XYθ table with the heater chips, and bonds them one by one. In this case, the heater chip can move in the width direction of the carrier tape 3. When the bonding for one row and a plurality of rows is completed in this manner, a sprocket (not shown) is rotated to bond a plurality of rows for the next row.

The carrier tape 3 to which the IC device 10 has been bonded in the bonding step 1a is sent to the next potting step 1b, in which the potting device 12 performs potting of the coating resin on the connection portion for each row. In this potting device 12, for example, five dispensers are arranged in the width direction of the carrier tape 3, and a solenoid is operated to open and close an air valve, so that five IC devices 10 in one row at a time are operated. Eject resin. The dispenser is movable in the width direction of the carrier tape 3, and after performing the same treatment on the remaining five tapes in one row, a sprocket (not shown) is rotated to perform the treatment in the next row. In this case, ten dispensers may be arranged in the tape width direction to process a plurality of one line at a time. When the coating resin is potted in the potting step 1b, the row is continuously sent to the pre-drying step 1c in the next stage, and the pre-drying device 13 performs pre-drying for each row. The pre-drying device 13 irradiates a plurality of coating resins in a row with infrared rays for a predetermined time. When the pre-drying of one row is completed in this way, the sprocket rotates and the next row is processed. In this case, the feeding by the sprocket in the potting process 1b and the preliminary drying process 1c is synchronized. The carrier tape 3 that has completed the preliminary drying is sent to the next main drying step 1d, where the main drying device 14 performs main drying on a plurality of coating resins in a row. When one row of main drying is completed in this way, a sprocket (not shown) rotates and the next row is processed. Thus, the reason why the drying of the coating resin is separated into the preliminary drying and the main drying is to improve the processing balance because the drying time of the resin is long.

Next, the carrier tape 3 is sent to the next pattern cutting step 1e, where the connection pattern 9 is cut by a pattern cutting device 15 as shown by the dotted line in FIG. 2 for each row, and each finger lead 8 is plated. Separated from the grid pattern 9a. When one row is cut in this way, a sprocket (not shown) rotates and the next row is processed. Then, the row that has completed this cutting process is continuously sent to the next inspection step 1f, and the inspection device 16 performs a predetermined inspection. The inspection device 16 uses the prongs for finger leads 8
, The signal is sent from the program circuit that stores the function inspection program of the IC device 10, the response signal from the IC device 10 is introduced to the good / defective determination circuit, and the RAM
It is judged as good or bad based on the answer data pre-installed in (Random Access Memory). In this case, the inspection device 16 includes a defective product position storage unit that stores the position of the IC unit 4 that is determined to be defective, and the position information of the defective IC position storage unit will be described later.
It is sent to the unit take-out device 18. This inspection is performed simultaneously for a plurality of rows. When the inspection of one row is completed in this way, the sprocket rotates and the next row is processed. Rows that have completed this inspection are continuously cut in the next step 1g
The carrier tape 3 is cut by the cutting device 17 along the tape width direction and separated into individual IC units 4 in each row. When the cutting of one row is completed in this way, the sprocket rotates to process the next row. The IC unit 4 separated by this cutting is taken out in the succeeding succeeding take-out step 1h. An IC unit take-out device 18 is provided in the take-out step 1h. This IC unit take-out device 18 is provided with ten vacuum suction heads corresponding to one row, based on the good / bad information sent from the inspection device 16,
The IC units 4 are individually sucked and the suction heads corresponding to defective products are transferred to the defective product collection box 19 to store the defective products. Move to the stock box 21 and store good products.
In this case, the automatic soldering device 20 does not empty the storage part of the recovery box 19 corresponding to the removed defective product,
A control circuit for controlling the movement of each vacuum suction head is provided so that the good IC unit 4 can be stored in all 19 storage units. When the removal of the IC unit 4 in one row is completed in this way, the sprocket rotates and the processing in the next row is performed. In this case, the sprocket feeding in the pattern cutting step 1e, the inspection step 1f, the cutting step 1g, and the take-out step 1b is synchronized.

Next, the non-defective IC unit 4 stored in the stock box 21 is sent to the next chip component mounting step 1i, where the automatic soldering device 20 shown in FIG.
Chip components 23 such as D (solar battery power rectifying element) are soldered to the soldering terminals 9b, 9b provided on the connection pattern 9 of the IC unit 4 as shown in FIG. The automatic soldering device 20 is of a type capable of automatically soldering the chip component 23 to the carrier tape 3 of the IC unit 4 transported by the transport device 24, and is a rotary device for mounting the IC unit 4 in the center. A table 26 having a stage 25, and various devices installed on the table 26 for executing the soldering work are configured.

The rotary stage 25 turns 45 in the counterclockwise direction (arrow direction).
It is an eight-division index that is configured to rotate at a time and stop at each of the stations S _{1 to} S ₈ arranged at equal intervals on the table 26 for a predetermined time. A metal plate 27 on which the IC unit 4 shown in FIG. 6 is mounted is provided at each portion of the rotary stage 25 corresponding to each station S _{1 to} S ₈ . The metal plate 27 has a recess 28 for accommodating the IC unit 4 and a recess 29 for accommodating the chip component 23 on the upper surface thereof, and is provided on a step portion (not shown) formed on the upper surface of the rotary stage 25. It is fitted. The metal plate 27 is made of stainless steel so that solder does not adhere to it.

Below each metal plate 27 of the rotary stage 25, a void portion which forms a vacuum suction device together with a vacuum generator (not shown) is formed. When the vacuum generator is driven, the air in the void is sucked, and the IC unit 4 housed in the recess 28 of the metal plate 27 is vacuum sucked onto the metal plate 27 through the suction holes 30 formed in the metal plate 27. The chip component 23, which is stored in the recess 29 of the metal plate 27, is vacuum-adsorbed to the metal plate 27 via the suction holes 31 formed in the metal plate 27. The vacuum suction operation by the vacuum suction device starts immediately after the IC unit 4 is placed on the metal plate 27, and is released after the chip component 23 is soldered to the carrier tape 3.

At the station S _{1 of the} table 26, the IC unit setting device 33 connected to the transfer device 24 is installed,
The S ₂ is installed solder supply apparatus 34, the station S ₃ is installed chip component mounting device 35, the air heater 36 is installed in the station S _4, the inspection apparatus in the station S ₆
37 is installed, and a forming device 39 connected to the IC unit take-out device 38 installed in the station S ₉ of the transfer device 24 is installed in the station S ₇ . In the illustrated example, stations S ₅ and S ₈ are idle.

IC unit set device 33 installed in station S ₁
Is a conveyance device by a suction head 42 that can move in the direction of the arrow.
The IC unit 4 in the stock box 21 transported by 24 is suction-held and transported onto the stage 41 on the rotary stage 25 side, and the recess 28 of the metal plate 27 of the rotary stage 25 shown in FIG.
It is designed to fit in. The IC unit 4 fitted in the recess 28 of the metal plate 27 is vacuum-sucked by the metal plate 27 and sent to the next station S ₂ .

The solder supply device 34 installed at the station S ₂ includes a solder applicator in which a solder paste (non-oxidizing solder paste) is enclosed in a cylinder, and a dispenser connected to the solder applicator via an air pipe. When the solder applicator is set at a predetermined position, the air valve provided on the air pipe of the dispenser opens for a predetermined time and a required amount of solder paste 43 is supplied to the rotary stage as shown in FIG.
Potting is applied to the soldering terminals 9b, 9b of the carrier tape 3 of the IC unit 4 placed on the 25. The solder applicator is installed on the table 26. The IC unit 4 on which the solder paste 43 has been applied is sent to the next station S ₃ .

Chip component mounting device 35 installed at station S ₃
The suction head 44 movable in the direction of the arrow sucks and holds the chip components 23 arranged and held on the tape 45 in the vicinity of the table 26, and as shown in FIG.
The IC unit 4 is placed at a predetermined position (recess 29). The set chip component 23 is vacuum-adsorbed on the metal plate 27. And this chip component 23
The IC unit 4 in which is set is sent to the next station S ₄ .

The air heater 36 installed in the station S ₄ is supplied with air from the air pump to the heater main body, and this air is heated by the heater main body so that the nozzle 36a is above the soldering terminals 9b, 9b of the carrier tape 3 of the IC unit 4. It is sprayed toward the solder paste 43 applied to the (see FIG. 6). The air heater 36 injects heated air of 420 to 480 ° C. for 6 seconds. When the solder paste 43 is melted by the jet of heated air, the lead 46 of the chip component 23 that is vacuum-adsorbed on the metal plate 27 bites into the solder paste 43, and in that state, the soldering terminals 9b and 9b of the IC unit 4 are inserted. Soldered. In this case, since the IC unit 4 is vacuum-adsorbed and closely adhered to the metal plate 27 through the suction hole 30, the extra heat of the heated air injected from the air heater 36 is radiated from the metal plate 27 and the rotary stage 25. . After the soldering of the chip component 23, the IC unit 4 is sent to the station S ₆ via the station S ₅ in the next stage.

The inspection device 37 installed in the station S ₆ determines whether the leads 46 of the chip component 23 soldered to the soldering terminals 9b and 9b of the carrier tape 3 are correctly joined to the soldering terminals 9b and 9b. It is to check the conduction state of. The IC unit 4 that has completed this inspection is sent to the next station S ₇ .

The forming device 39 installed in the station S ₇ is
The suction head 47 that can move in the direction of the arrow is a rotary stage.
The chip component 23 soldered to the IC unit 4 adsorbed and taken out from above 25 is formed into a predetermined mounting state by a press machine 48.

The IC unit take-out device 38 installed at the station S ₉ of the transfer device 24 is a suction head 49 that is movable in the arrow direction.
The IC unit 4 after forming is suction-held and stored in the stock box 50 on the transfer device 24.

<Second Treatment Step> The carrier tape 5 for a circuit board treated in the second treatment step 2 of the above production line is a wide tape made of a resin film having flexibility and insulation such as polyester resin and polyimide resin. Is. The second processing step 2 of performing a predetermined process on the carrier tape 5 is a sprocket hole for forming sprocket holes 51, 51 along which the feed teeth of the sprocket for feeding mesh with each other along both side edges of the carrier tape 5. Forming step 2a and a plurality of circuit patterns (a large number of aligned fixed contacts 52 aligned in the width direction of the carrier tape 5
pattern forming step 2b for forming (including a) 52 and pattern drying step 2c for drying the formed circuit pattern 52.
And a connection material printing step 2d for printing the connection material 53 on the connection terminal 52b to which the IC unit 4 of the circuit pattern 52 is connected and the connection terminal 52c to which an LCD not shown is connected, and the printed connection material 53 is dried. Connection material drying process 2e and circuit pattern
Inspection process 2f for inspecting 52 good / defective, marking process 2g for marking defective products, and IC unit connection process 2h for connecting the IC unit 4 created in the first processing process 1 above
And a cutting step 2i for cutting the carrier tape 5. In this case, the pattern forming step 2b and the pattern drying step 2c, the connecting material printing step 2d and the connecting material drying step 2e, the inspection step 2f, the marking step 2g, and the IC unit connecting step 2h.
And the cutting step 2i are a series of steps.

First, the carrier tape 5 is a sprocket hole forming step 2a.
And the sprocket holes 51, 51 are formed on both side edges by the press machine 54, respectively. The carrier tape 5 is provided with sprocket holes 51 on both side edges,
Sprocket with feed teeth that mesh with 51 (not shown)
Is transferred by the rotation of.

Next, the carrier tape 5 is sent to the next pattern formation step 2b, where the circuit pattern 52 is formed by carbon printing by the pattern printing device 55. This pattern printing device
55 can simultaneously form the circuit patterns 52 for a plurality of columns. The circuit pattern 52 may be formed by laminating an aluminum foil, printing the carbon, and then etching the aluminum foil. Alternatively, a double-sided substrate may be used. In order to carry out double-sided wiring on the carrier tape 5, it is effective to provide a through hole with a needle and fill the through hole with carbon. When the circuit pattern 52 is formed in a predetermined row in this way, a sprocket (not shown)
Is rotated, and the next predetermined row is processed. Circuit pattern
The predetermined row on which 52 is formed is continuously sent to the next pattern drying step 2c, and the circuit pattern is formed by the pattern drying device 56.
The carbon ink forming 52 is fired and dried. When this drying is completed, the sprocket rotates and the next predetermined row is processed. In this case, the sprocket feeding in the pattern forming step 2b and the pattern drying step 2c is synchronized.

Next, the carrier tape 5 is sent to the connecting material printing step 2d in the next stage, where the connecting material printing device 57 prints the connecting material (hot melt type anisotropic conductive adhesive) 53 on one line. The connecting material 53 may be provided on the carrier tape 3 side. When the connecting material 53 is printed in this way, a sprocket (not shown) rotates, and the processing of the next row is performed. The line on which the connecting material 53 is printed is continuously sent to the next connecting material drying step 2e, and the connecting material is dried by the connecting material drying device 58.
53 is dried. When the drying of one row is completed in this way, the sprockets rotate and the processing of the next row is performed. In this case, the sprocket feeding in the connecting material printing step 2d and the connecting material drying step 2e is synchronized.

Next, the carrier tape 5 is sent to the next inspection step 2f,
Here, the inspection device 59 inspects the row of circuit patterns 52 for good or bad. In this case, the inspection device 59 uses the defective product position information of the defective product marking device 60 and the
It is sent to the device 61 and the cutting device 61. When this inspection is completed, a sprocket (not shown) rotates and the next row is processed. The line that has been inspected continuously has the next marking step 2g
The defective product marking device 60 marks the defective products in a row. The defective product marking device 60 moves the marking head based on the defective product position information from the inspection device 59 to perform marking (mark X) (see FIG. 4).
This marking may be a punch. When this marking is completed, the sprocket rotates and the next row is processed.
The marked line is continuously sent to the next IC unit connecting step 2h, and the IC unit 4 is printed with the connecting material 53 by the OLB (Outer Lead Bonding) device 61.
Connected to. Based on the defective product information from the inspection device 59, the OLB device 61 only transfers the above-mentioned transfer device to the circuit pattern 52 of the good product.
Connect the IC unit 4 stored in the stock box 50 above 24. When the connection of this IC unit 4 is completed, the sprocket rotates and the process for the next row is performed. The row in which the IC units 4 have been connected is continuously sent to the next cutting step 2i, and the cutting device 62 cuts the carrier tape 5 row by row to separate the circuit board units. After cutting, the defective board and the non-defective circuit unit are sorted and stocked in the vicinity of the cutting device 62 based on the defective product position information from the inspection device 59. When this cutting is completed, the sprocket rotates to process the next row. In this case, the sprocket feed in the inspection process 2f, the marking process 2g, the IC unit connection process 2h, and the cutting process 2i are synchronized. After the cutting step 2i, the non-defective circuit unit performs the inspection by thermocompression bonding the LCD to the connection terminal portion 52c.

The IC unit 4 of FIG. 3 created in the first processing step 1 of the above manufacturing line is one IC device 10 and chip component.
However, in the first treatment step 1, a plurality of
An IC unit having the IC device 10 and the chip component 23 can be produced, and the circuit board unit produced in the second treatment step 2 has one IC unit 4, but the second treatment step 2 Then, it is also possible to create a circuit unit having a plurality of IC units 4.

[Effects of the Invention] As described above, according to the method for manufacturing a circuit board unit of the present invention, the effective area ratio of the film tape (carrier tape) forming the IC unit is increased to reduce the cost of the IC unit. Moreover, there is a practically useful effect that the circuit board unit can be manufactured extremely efficiently.

[Brief description of drawings]

The drawings each show an embodiment of the present invention. FIG. 1 is a plan view of a manufacturing line for carrying out the method for manufacturing a circuit board unit according to the present invention, and FIG. 2 is made in the first processing step of the manufacturing line. A plan view of the carrier tape for the IC unit, and Fig. 3 were created in the first processing step of the manufacturing line.
4 is a plan view of the IC unit, FIG. 4 is a plan view of a carrier tape for a circuit board created in the second processing step of the manufacturing line, and FIG. 5 is automatic soldering that constitutes the first processing step of the manufacturing line. FIG. 6 is a plan view of the apparatus, and FIG. 6 is an enlarged sectional view showing a main part of a rotary stage of the automatic soldering apparatus. 1 ... First treatment step, 1a ... Bonding step, 1b ...
Potting process, 1c …… preliminary drying process, 1e …… main drying process, 1g …… cutting process, 1b …… takeout process, 2 …… second processing process, 2b …… pattern forming process, 2h …… IC unit connection Process, 2i ... Cutting process, 3 ... Carrier tape for IC unit (first film tape), 4 ... IC unit, 5 ... Carrier tape for circuit board (second film tape), 6, 51 …… Sprocket hole, 8 …… Finger lead, 9 …… Connection pattern, 10 …… IC device,
52 …… Circuit pattern, 52b …… Connecting terminal, 53 …… Connecting material.

Claims (1)

(57) [Claims] 1. A first film tape in which sprocket holes are provided along both side edges and each of which has a plurality of finger leads and which is arranged in a plurality of rows in the width direction, faces each of the finger leads. A step of bonding an IC device having electrodes formed thereon for each of the connection patterns, a step of coating the connection part between the electrodes of the IC device and the finger leads with a resin, a step of drying the coating resin, the first step A step of cutting the film tape to separate it into an IC unit for each unit having at least one IC device, and a step of moving only non-defective products in the IC unit separated from the first film tape to a predetermined position. A first processing step including: a connecting end of the IC unit in the width direction of a second film tape having sprocket holes along both side edges. A step of providing a plurality of rows of circuit patterns having children, an IC unit sent from the first processing step for each circuit pattern with a connecting material interposed between the finger leads of the IC unit and the connection terminals of the circuit pattern. Circuit board unit comprising a step of joining the second film tape and a step of cutting the second film tape and separating the second film tape into circuit board units for each unit having at least one IC unit. Manufacturing method.