JP2938010B1 - Semiconductor device mounting positioning jig and semiconductor device mounting positioning method - Google Patents
Semiconductor device mounting positioning jig and semiconductor device mounting positioning methodInfo
- Publication number
- JP2938010B1 JP2938010B1 JP10091891A JP9189198A JP2938010B1 JP 2938010 B1 JP2938010 B1 JP 2938010B1 JP 10091891 A JP10091891 A JP 10091891A JP 9189198 A JP9189198 A JP 9189198A JP 2938010 B1 JP2938010 B1 JP 2938010B1
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mounting
- device mounting
- positioning jig
- mounting positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
【要約】
【課題】 リワーク作業等で、新しい半導体装置をプリ
ント基板上に実装する場合、容易に半導体装置の位置決
めを行うことのできる半導体装置実装位置決め治具及び
この治具を用いる半導体装置の実装位置決め方法を提供
する。
【解決手段】 本発明の半導体装置の実装位置決め治具
は、半導体装置の上面に隣接し、この半導体装置の対角
線上にある２つの角を挟持する本体と、この本体の両端
から半導体装置の下面側に平行に延びる２つのリード部
とからなることを特徴とする。A semiconductor device mounting positioning jig capable of easily positioning a semiconductor device when a new semiconductor device is mounted on a printed circuit board in a rework operation or the like, and mounting of the semiconductor device using the jig. A positioning method is provided. A mounting jig for mounting a semiconductor device according to the present invention includes a main body that is adjacent to an upper surface of a semiconductor device and sandwiches two diagonal corners of the semiconductor device, and a lower surface of the semiconductor device from both ends of the main body. And two lead portions extending parallel to the side.
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＱＦＰ等の半導体装
置をプリント基板上などに実装する際に用いる半導体装
置実装位置決め治具及びこの治具を用いる半導体装置の
実装位置決め方法に関する。[0001] 1. Field of the Invention [0002] The present invention relates to a semiconductor device mounting / positioning jig used for mounting a semiconductor device such as a QFP on a printed circuit board or the like, and to a semiconductor device mounting / positioning method using the jig.
【０００２】近年、半導体装置の大型化、高集積度化が
著しく進行している。このような半導体装置の代表的な
パッケージ形状としては、ＳＯＰ（Ｓｍａｌｌ Ｏｕｔ
ｌｉｎｅ Ｐａｃｋａｇｅ）、ＱＦＰ（Ｑｕａｄ Ｆｌ
ａｔ Ｐａｃｋａｇｅ）等を例示することができる。近
年、これらの半導体装置の端子の数は増加し、端子と端
子との間隔は狭まる傾向にある。In recent years, semiconductor devices have been significantly increased in size and integration. A typical package shape of such a semiconductor device is SOP (Small Out).
line Package), QFP (Quad Fl)
at Package) and the like. In recent years, the number of terminals of these semiconductor devices has increased, and the distance between terminals has tended to decrease.
【０００３】図２は、ＱＦＰの一例を示す斜視図であ
る。このＱＦＰ２１は、板状の本体２２の４つの側面に
多数の端子２３、２３…が突設されて構成されている。
従来、この端子間のピッチは０．５ｍｍ程度であった
が、最近は０．３ｍｍピッチのＱＦＰも販売されてい
る。FIG. 2 is a perspective view showing an example of a QFP. The QFP 21 has a large number of terminals 23 projecting from four side surfaces of a plate-shaped main body 22.
Conventionally, the pitch between the terminals was about 0.5 mm, but recently, QFPs having a pitch of 0.3 mm have been sold.
【０００４】[0004]
【発明が解決しようとする課題】リワーク作業等で半導
体装置を交換する必要が生じて、新しい半導体装置をプ
リント基板上に実装する場合、半導体装置の位置決めを
行うためには局所的な部品実装が可能な特殊設備を必要
としていた。またそのような特殊設備を使用しない場合
は、手作業で半導体装置の多数の端子とプリント基板上
の配線パターンとの位置合わせを行うため、多大な工数
を要するとともにこのような作業に対する熟練が必要で
あった。本発明は、このような問題を解決することので
きる半導体装置実装位置決め治具及びこの治具を用いる
半導体装置の実装位置決め方法を提供することを目的と
する。When it is necessary to replace a semiconductor device in a rework operation or the like, and a new semiconductor device is mounted on a printed circuit board, local component mounting is required to position the semiconductor device. Needed special equipment possible. If such special equipment is not used, many terminals of the semiconductor device are manually aligned with the wiring patterns on the printed circuit board, which requires a great deal of man-hours and requires skill in such operations. Met. It is an object of the present invention to provide a semiconductor device mounting positioning jig capable of solving such a problem and a semiconductor device mounting positioning jig using the jig.
【０００５】[0005]
【課題を解決するための手段】本発明に係る半導体装置
実装位置決め治具は、半導体装置の上面の対角線に沿っ
て前記半導体装置に隣接する本体と、この本体の両端に
設けられ、半導体装置の対角線上にある２つの角の近傍
に設けられた、半導体装置を厚み方向に貫通する孔部を
挿通する２つのリード部とからなることを特徴とする。
このような治具を用いることで、これまで困難であった
半導体装置の実装位置決めを容易に行うことができる。A semiconductor device mounting and positioning jig according to the present invention is provided on a main body adjacent to the semiconductor device along a diagonal line on an upper surface of the semiconductor device, and at both ends of the main body. The semiconductor device is characterized by comprising two lead portions provided in the vicinity of two diagonal corners and penetrating through a hole penetrating the semiconductor device in the thickness direction.
By using such a jig, mounting positioning of the semiconductor device, which has been difficult so far, can be easily performed.
【０００６】本発明に係る半導体装置の実装位置決め方
法は、基板上に２つの凹部が設けられ、この凹部に半導
体装置を装着した半導体装置実装位置決め治具のリード
部が嵌着されることで半導体装置を基板上に仮固定する
ことを特徴とする。このような方法を用いれば、半導体
装置の実装位置を高精度で決定することができるので、
半導体装置の端子のハンダ付けを容易に行うことができ
る。In the method of mounting and positioning a semiconductor device according to the present invention, two concave portions are provided on a substrate, and a lead portion of a semiconductor device mounting and positioning jig on which the semiconductor device is mounted is fitted into the concave portion. The device is temporarily fixed on a substrate. With such a method, the mounting position of the semiconductor device can be determined with high accuracy.
The terminals of the semiconductor device can be easily soldered.
【０００７】[0007]
【発明の実施の形態】以下、図面により本発明について
詳細に説明するが、本発明はこれらの実施形態のみに限
定されるものではない。図１は、本発明に係る実施形態
の半導体装置実装位置決め治具及びこれを用いてＱＦＰ
を仮固定する工程を示す概略構成図である。半導体装置
実装位置決め治具１０は、かすがい状となっており、本
体９と、本体９の下面部両端に設けられたリード部１
１、１１とを備えている。ＱＦＰ１２の対角線上にある
２つの角の近傍には、ＱＦＰ１２を厚み方向に貫通する
孔部１３、１３が設けられている。半導体装置実装位置
決め治具１０のリード部１１、１１を孔部１３、１３に
挿通させることで、半導体装置実装位置決め治具１０を
ＱＦＰ１２に取付ける。この時、２つのリード部１１、
１１の先端は、ＱＦＰ１２の端子１４、１４…の下端よ
りも低い位置まで延びている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited to only these embodiments. FIG. 1 shows a semiconductor device mounting positioning jig according to an embodiment of the present invention and a QFP using the same.
It is a schematic block diagram which shows the process of temporarily fixing. The semiconductor device mounting and positioning jig 10 is in the shape of a bevel, and includes a main body 9 and lead portions 1 provided at both ends of the lower surface of the main body 9.
1 and 11 are provided. In the vicinity of two corners on the diagonal line of the QFP 12, holes 13, 13 penetrating the QFP 12 in the thickness direction are provided. The semiconductor device mounting positioning jig 10 is attached to the QFP 12 by inserting the leads 11, 11 of the semiconductor device mounting positioning jig 10 into the holes 13, 13. At this time, two lead portions 11,
11 extend to a position lower than the lower ends of the terminals 14, 14,... Of the QFP 12.
【０００８】プリント基板１５には、半導体装置実装位
置決め治具１０のリード部１１、１１が嵌入する凹部１
６、１６が、配線パターン１７の位置に合わせて形成さ
れている。リード部１１、１１を凹部１６、１６に嵌入
することで、半導体装置実装位置決め治具１０を取り付
けたＱＦＰ１２をプリント基板１５に仮固定する。その
後、端子１４、１４…と配線パターン１７をハンダ付け
することで、ＱＦＰ１２をプリント基板１５に固定す
る。ＱＦＰ１２の固定後、不要になった半導体装置実装
位置決め治具１０はＱＦＰ１２から取り外される。The printed board 15 has a concave portion 1 into which the lead portions 11 of the semiconductor device mounting positioning jig 10 are fitted.
6 and 16 are formed in accordance with the position of the wiring pattern 17. By fitting the leads 11, 11 into the recesses 16, 16, the QFP 12 to which the semiconductor device mounting positioning jig 10 is attached is temporarily fixed to the printed circuit board 15. Thereafter, the QFP 12 is fixed to the printed circuit board 15 by soldering the terminals 14, 14,... And the wiring pattern 17. After the QFP 12 is fixed, the unnecessary semiconductor device mounting and positioning jig 10 is removed from the QFP 12.
【０００９】なお、本発明の技術範囲は上記実施の形態
に限定されるものではなく、本発明の趣旨を逸脱しない
範囲において種々の変更を加えることが可能である。The technical scope of the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the spirit of the present invention.
【００１０】[0010]
【発明の効果】以上詳細に説明した通り、本発明の半導
体装置実装位置決め治具を用いることで、リワーク作業
等で半導体装置をプリント基板上に実装する場合、特殊
な部品搭載機を使用することなく、容易にプリント基板
上に半導体装置を位置決めすることができる。本発明の
半導体装置実装位置決め治具を半導体装置に取り付け、
プリント基板上の凹部に差し込むだけで、半導体装置の
位置決めを行うことができる。As described above in detail, when the semiconductor device is mounted on a printed circuit board in a rework operation or the like by using the semiconductor device mounting positioning jig of the present invention, a special component mounting machine is used. In addition, the semiconductor device can be easily positioned on the printed circuit board. Attach the semiconductor device mounting positioning jig of the present invention to the semiconductor device,
The semiconductor device can be positioned simply by inserting it into the recess on the printed circuit board.
【図１】 本発明に係る実施形態の半導体装置実装位置
決め治具およびこれを用いてＱＦＰを仮固定する工程を
示す概略図である。FIG. 1 is a schematic view showing a semiconductor device mounting positioning jig according to an embodiment of the present invention and a step of temporarily fixing a QFP using the jig.
【図２】 ＱＦＰの一例を示す斜視図である。FIG. 2 is a perspective view showing an example of a QFP.
９ 本体 １０ 半導体装置実装位置決め治具 １１ リード部 １２ ＱＦＰ １３ 孔部 １４ 端子 １５ プリント基板 １６ 凹部 １７ 配線パターン 9 Body 10 Semiconductor Device Mounting Positioning Jig 11 Lead 12 QFP 13 Hole 14 Terminal 15 Printed Circuit Board 16 Concave 17 Wiring Pattern
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 13/04 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 13/04
Claims (2)
半導体装置に隣接する本体と、 該本体の両端に設けられ、半導体装置の対角線上にある
２つの角の近傍に設けられた前記半導体装置を厚み方向
に貫通する孔部を挿通する２つのリード部とからなるこ
とを特徴とする半導体装置実装位置決め治具。1. A main body adjacent to the semiconductor device along a diagonal line on an upper surface of the semiconductor device; and the semiconductor device provided at both ends of the main body and near two corners on a diagonal line of the semiconductor device. A semiconductor device mounting positioning jig, comprising: two lead portions that pass through holes that penetrate through in a thickness direction.
治具を用いる半導体装置の実装位置決め方法であって、 基板上に２つの凹部が設けられ、該凹部に前記半導体装
置を装着した前記半導体装置実装位置決め治具のリード
部が嵌着されることで半導体装置を基板上に仮固定する
ことを特徴とする半導体装置の実装位置決め方法。2. A semiconductor device mounting and positioning method using the semiconductor device mounting and positioning jig according to claim 1, wherein the semiconductor device has two recesses provided on a substrate, and the semiconductor device is mounted in the recesses. A method of mounting and positioning a semiconductor device, comprising temporarily fixing a semiconductor device on a substrate by fitting a lead portion of a mounting positioning jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10091891A JP2938010B1 (en) | 1998-04-03 | 1998-04-03 | Semiconductor device mounting positioning jig and semiconductor device mounting positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10091891A JP2938010B1 (en) | 1998-04-03 | 1998-04-03 | Semiconductor device mounting positioning jig and semiconductor device mounting positioning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2938010B1 true JP2938010B1 (en) | 1999-08-23 |
| JPH11289196A JPH11289196A (en) | 1999-10-19 |
Family
ID=14039192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10091891A Expired - Lifetime JP2938010B1 (en) | 1998-04-03 | 1998-04-03 | Semiconductor device mounting positioning jig and semiconductor device mounting positioning method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2938010B1 (en) |
-
1998
- 1998-04-03 JP JP10091891A patent/JP2938010B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11289196A (en) | 1999-10-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19990518 |