JPS6112699Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a printed wiring board, and more specifically, the present invention relates to a printed wiring board, and more specifically, a semiconductor device formed into a substantially flat rectangular shape and provided with a plurality of lead wires protruding from each side. This invention relates to improvements to printed wiring boards for mounting.

2. Description of the Related Art One type of semiconductor device is one that is formed into a flat rectangular shape and has a plurality of lead wires protruding from each side. FIG. 1 is a configuration explanatory diagram showing an example of such a semiconductor device, in which a is a plan view, b is a front view, and c is a side view.

Conventionally, when attaching such a semiconductor device to a printed wiring board, a plurality of conductor patterns and each lead wire are provided on the printed wiring board so as to correspond to the lead wires on each side of the semiconductor device. Soldering is performed while visually aligning the positions so that they overlap, and a window section is used to invert and fit the semiconductor device while providing multiple conductor patterns corresponding to the lead wires on each side of the semiconductor device on the printed wiring board. In this method, a predetermined lead wire is provided and a conductive pattern is soldered to the predetermined lead wire.

However, the former configuration requires a considerable number of man-hours for positioning and is inefficient, while the latter configuration reduces the space utilization rate of the printed wiring board.

The present invention solves these drawbacks and will be described in detail below with reference to the drawings.

FIG. 2 is a configuration explanatory diagram showing an example of a printed wiring board according to the present invention, and FIG. 3 is a configuration explanatory diagram showing a state in which the semiconductor device shown in FIG. 1 is attached to the printed wiring board shown in FIG. 2. be. In these drawings, 10 is a semiconductor device, 20 is a printed wiring board, and 30 is a jig plate.

The semiconductor device 10 used is, for example, as shown in FIG. 1, formed into a substantially flat rectangular shape and provided with a plurality of lead wires L protruding from each side 11-14. Note that in FIG. 1, one corner 15 of the semiconductor device 10 is cut away.

A plurality of conductor patterns 21 are provided on the printed wiring board 20 so as to correspond to the lead wires L on each side 11 to 14 of the semiconductor device 10, and at least three sides of the semiconductor device 10 to be attached to these conductor patterns 21 are provided. Through holes 22 to 24 are provided so as to be located between the conductor patterns 21 and between the extension lines of the conductor pattern 21, respectively. In addition, in this embodiment, in addition to these through holes 22 to 24, a through hole 25 is provided so as to correspond to the cutout portion 15 of the semiconductor device 10, and a through hole 25 is provided at a location slightly away from the mounting position of the semiconductor device 10. Holes 26 and 27 are provided. The diameters of the through holes 22 to 27 are such that the through hole 25 is larger than the diameters of the through holes 22 to 24, and the through holes 26 and 27 are formed larger than the through hole 25.

The jig base 30 supports the printed wiring board 20, and a portion of the printed wiring board 20 corresponding to the position where the semiconductor device 10 is attached is formed as a stepped portion 31 higher than other portions. The height difference of this jig base 30 is set to be larger than the mounting height of other circuit components to be mounted on the printed wiring board 20. The stepped portion 31 includes through holes 22 to 22 provided in the printed wiring board 20.
Pins 32 to 34 (34 is not shown) that fit into the through hole 24 are implanted, and a pin 35 that fits into the through hole 25 is implanted, but is not shown. Also,
Pins 36 and 37 that fit into through holes 26 and 27 provided in the printed wiring board 20 are implanted in other parts. Here, the pins 32 to 34 are connected to the through hole 22
The pins 35 to 37 are formed with high precision so that there is almost no play relative to the through holes 25.
It is formed so that there is some play with respect to ~27. Further, the pins 35 to 37 are formed longer than the pins 32 to 34, and the pins 36 and 37 are provided with stepped portions having the same height as the stepped portion 31.

In such a configuration, first, the printed wiring 20 is attached to the jig base 30. For installation, fit pins 35 to 37 into through holes 25 to 27, and then fit pins 32 into through holes 22 to 24.
- Fit 34. Here, through holes 26, 27
And the pins 36, 37 will act as a guide mechanism. In this way, printed wiring board 1
0 to the jig base 30, the semiconductor device 10 is attached to the printed wiring board 20. When installing the semiconductor device 10, pins 32 to 3
4 is inserted between predetermined lead lines of the semiconductor device 10. Thereby, each lead wire L of the semiconductor device 10 and the corresponding conductor pattern 21 of the printed wiring board 20 overlap with high accuracy. In the case of this embodiment, a semiconductor device 10 with a corner 15 cut away is used, a through hole 25 is provided in the printed wiring board 20 to correspond to the corner 15, and a jig base 30 is provided with a through hole 25 to correspond to the corner 15. Since the pin 35 is provided to fit into the through hole 25, the semiconductor device 10 will not be mounted in the wrong direction. Note that, if necessary, the interrupt positions of the pins 32 to 34 may be displayed on the surface of the case of the semiconductor device 10. As a result, even semiconductor devices whose angles are not cut can be accurately mounted without making a mistake in the mounting direction. After the semiconductor device 10 is attached to the printed wiring board 20 in this manner, the lead wires L are soldered to the conductive patterns 21. For soldering, a known automatic soldering device can also be used.

As is clear from these, according to the present invention,
A printed wiring board that is formed into a nearly flat rectangular shape and has multiple lead wires protruding from each side can be mounted efficiently and has virtually no reduction in space utilization. It can be done, and the practical effects are great.

[Brief explanation of the drawing]

FIG. 1 is a configuration explanatory diagram showing an example of a semiconductor device attached to a printed wiring board according to the present invention, FIG. 2 is a configuration explanatory diagram showing an example of a printed wiring board according to the present invention, and FIG. FIG. 2 is a configuration explanatory diagram showing a state in which the semiconductor device shown in FIG. 1 is attached to the printed wiring board shown in FIG. 10...Semiconductor device, 20...Printed wiring board, 30...Jig base.

Claims (1)

[Scope of utility model registration request] A printed wiring board on which a semiconductor device is mounted, which is formed into a substantially flat rectangular shape and is provided with a plurality of lead wires protruding from each side, and is provided so as to correspond to the lead wires on each side of the semiconductor device. a plurality of conductor patterns, and at least one through hole provided between the conductor patterns and at least three sides of the semiconductor device to be attached, and between the extension lines of the conductor patterns. Printed wiring board.