JP2536002Y2 - Jumper wire - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jumper wire, and more particularly, to a jumper wire used as a substitute for a jumper wire in a board wiring or the like.

[0002]

2. Description of the Related Art For example, when processing an empty pin terminal of an IC (integrated circuit) provided on a printed circuit board in an electronic device, a wiring process using a jumper wire is generally used. That is, in this case, the jumper wire is cut to an appropriate length according to the length between the pin terminals to be jumpered, the path of the jumper, and the like. In addition, the conductor is exposed by removing the insulating coating on the end of the jumper wire cut by a tool such as a wire stripper. A process is performed in which a lead wire portion at this end is connected to an empty pin terminal or a jumper to which this pin terminal is connected, for example, to a GND (ground) line by soldering or the like.

[0003]

However, in the above-mentioned conventional wiring processing, it is very time-consuming to cut the jumper wire according to the length and the path between the pin terminals and to remove the insulating coating at the end. turn into. In addition, it is necessary to individually consider paths for laying jumper wires, and therefore, there is a problem that workability is poor and time is required in wiring processing using jumper wires.

In addition, when a plurality of pin terminals are connected to, for example, the same GND line in one IC in the processing of an empty pin terminal of the IC, jumper wires overlap and the height of the wiring surface of the substrate is taken, making it difficult to see. Alternatively, if the jumping point is close, the jumper wire is shortened accordingly, and there is a problem that it is difficult to remove the insulating coating at the end of the jumper wire by a tool.

Therefore, an object of the present invention is to provide a jumper wire capable of performing wiring processing easily and with good workability.

[0006]

According to the present invention, a thin film is formed.
Strip-shaped flexible conductive coated with insulator
In the direction crossing the conductive substrate and the strip length direction of the conductive substrate.
An end is connected to the conductive substrate and crosses the band length direction.
And a plurality of IC pins.
End of the protruding piece so as to be connected to each of the
Including a pattern exposed portion that is connected to each end
The pattern exposed portion and the protruding piece are the conductive substrate
It is made of the same material as
Unnecessary except for the protruding piece connected to the pin terminal of the IC
It is used by cutting and removing the protruding piece, and the IC is
Connect to the opposite side of the printed circuit board
In jumper wires that, the absolute in the projecting piece
An edge body is coated, and the protruding piece covers the conductive substrate.
Extend in both directions crossing the belt length direction as a reference.
Of the exposed pattern portions adjacent in the band length direction.
The pitch of the pin terminals of the IC in the band length direction is
Have the same spacing to correspond to the
The pattern exposure facing in the intersecting direction.
Parts facing each other in a direction intersecting the belt length direction
Having an interval equal to the opposing interval of the pin terminals of the IC
Thus, a jumper wire characterized by the following characteristics is obtained.

[0007]

In the jumper wire of the present invention configured as described above, a pattern exposed portion to be connected to a pin terminal or the like is formed in advance, so that it is not necessary to remove the insulating coating at the end of the jumper wire as in the prior art. Become.

Further, since the interval between the exposed portions of the pattern is adjusted to the pitch of the pin terminals of the IC and they are connected by a conductive substrate, there is no need for cutting according to the length or the path between the pins as in the prior art. And a jumper between the pin terminals of the IC can be easily realized.

Further, since the whole is thin and hence flexible, the height does not increase so much even when they are superimposed, and it is easy to handle and excellent in strength.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the jumper wire according to the present invention will be described below. Referring to FIG. 1, jumper wire 1
Has a skeleton-shaped conductive substrate 1a. The conductive substrate 1a is a strip-shaped thin plate made of a conductor such as copper.
It is made with flexibility. In addition, jumper
The ear 1 is in a direction intersecting the belt length direction of the conductive substrate 1a.
Is connected at one end to the conductive substrate 1a and crosses the belt length direction
A plurality of projecting pieces 11 extending in the direction of
Protruding piece 1 so as to be connected to each of the
A ring-shaped putter connected to each of the tips
And an exposed portion 2 (land). Pattern exposure part 2 and
The protruding piece 11 is integrally formed of the same material as the conductive base 1a.
Protrusions that are made and connect to the pin terminals of the desired IC
For cutting and removing unnecessary projecting pieces 11 except for the piece 11
I have. The protruding piece 11 is covered with the insulator 3
The piece 11 crosses the strip length direction with the conductive substrate 1a as a reference.
Putters that extend in both directions
The distance between the exposed portions 2 of the IC pin terminals in the band length direction is
If they have equal spacing to correspond to the pitch spacing
Patterns that face each other in the direction that intersects the belt length direction
The facing interval of the exposed portions 2 faces in a direction crossing the band length direction.
With an interval equal to the opposing interval of the pin terminals of the IC
I have . The thickness of the conductive substrate 1a is about 0.3 mm. The surface of the conductive substrate 1a (hatched portion in FIG. 1 ) is coated with a thin film of, for example, a polyimide resin as the insulator 3.

The surface of the pattern exposed portion 2 is plated with a metal that can be easily soldered. The figure
Although the 1 was equal arrangement interval of the pattern exposed portion 2 of all the pitch of the pin terminal of IC, only necessary portions without the total, i.e. the arrangement interval of the pattern exposed portion 2 of a portion I
The pitch may be equal to the pitch of the C pin terminals. Also, for convenience of the following description, the pattern exposed portion 2 will be described below with identification numbers A to L corresponding to the pin terminals of the IC in which the jumper wire 1 is used .

Next, an example of using a jumper wire will be described. That is, when three pin terminals of the IC corresponding to the pattern exposed portions 2 of the identification numbers A, D, and H are short-circuited in the jumper wire 1, the pattern exposed portions 2 other than the identification numbers A, D, and H are short-circuited. and removing by cutting with the projecting piece 11 connected thereto as shown in FIG. 2 (a). Then, the jumper wire 1 thus treated is connected to the pattern exposed portion 2 of the identification numbers A, D and H on the surface opposite to the mounting surface of the printed circuit board on the IC mounting side, for example. Connect to the corresponding pin terminal by soldering and attach.

Further, in the same IC on the printed circuit board, the identification number B, F, I, when it is desired to further short the pin terminal corresponding to the K, the identification number B in the same manner as described above, F, I, The exposed piece 2 other than the K
Remove by cutting one, then shown in Figure 2 (b)
Mounting superimposed in the same manner over the jumper wire 1 mounted above as to the printed circuit board, further identification number B, F, I, soldering said pattern exposed portion 2 of K to the corresponding pin terminal of the IC Just connect.

FIG. 3 shows, for example, a jumper wire 1 that straddles the pin terminals of two ICs 4 and 5 mounted on the same printed circuit board so as to jumper between the desired pin terminals. Are shown as an example of connection. That is, in this case, the jumper wire 1 except for the necessary pattern exposed portion 2 is positioned on the surface of the printed circuit board opposite to the IC mounting side in the same manner as described above. Thereafter, the pattern exposed portion 2 may be connected to the corresponding pin terminals of the ICs 4 and 5 by soldering.

The above description is about the processing of an unused pin terminal of an IC. In addition, the jumper wire 1 of the present invention can also be used as a jumper for a GND line or a signal line at a specific location. is there.

[0016]

As described above, according to the jumper wire of the present invention, a plurality of projecting pieces
Since the pattern has an exposed portion at the tip,
Jumper wiring to the
Wiring can be performed with good workability even after the IC is mounted on the printed circuit board .

[Brief description of the drawings]

FIG. 1 shows an embodiment of a jumper wire according to the present invention.
It is a surface view.

FIGS. 2A and 2B are plan views illustrating examples of use of the jumper wire according to the embodiment of the present invention.

[3] Another use of the present invention jumper wire I
Is a plan view showing with C.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Jumper wire 1a Conductive base 2 Pattern exposed part 3 Insulator 4,5 IC 11 Projection piece

Claims (1)

(57) [Scope of request for utility model registration] 1. A belt-like shape covered with a thin-film insulator
Flexible conductive substrate, and the rectangular shape of the conductive substrate
One end is connected to the conductive substrate in a direction crossing the
A plurality of protrusions extending in a direction intersecting the belt length direction
One-to-one connection to one piece and each of the pin terminals of multiple ICs
A pattern exposing portion connected to each of the tips of the protruding pieces so that the pattern exposing portion and the projecting portion protrude.
The piece is made of the same material as the conductive substrate.
The protrusions to connect to the desired pin terminals of the IC
Unnecessary protruding pieces are cut and removed except for the pieces.
And the mounting surface of the printed circuit board on which the IC is mounted
In the jumper wire connected to the opposite surface, the protruding piece is covered with the insulator,
The piece crosses the band length direction with respect to the conductive substrate.
Extending in both directions, and adjacent to each other in the band length direction.
The distance between the exposed portions of the pattern is equal to the I in the band length direction.
Equal spacing to correspond to the pitch spacing of C pin terminals
And have opposing in the intersecting direction
The facing interval of the pattern exposed portion crosses the band length direction.
The distance between the pin terminals of the IC facing each other in the
Jumper wa, characterized by having equal spacing
Year .