JPS5833711Y2 - Printed circuit board for electronic circuits - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a printed circuit board for electronic circuits for accurately mounting so-called chip components without lead wires at predetermined positions on the printed board.

Insertion machine automatically inserts electronic components with two lead wires, such as resistors, capacitors, and diodes, into predetermined positions on electronic circuit printed circuit boards.
For example, when installing the NC data by
As shown in Publication No. 3-87866, there was a method in which a hole for setting the mounting position of an electronic component and two holes for inserting the lead wire of this component were provided on the printed circuit board, and these holes were measured and created. However, these holes are generally drilled by machining after forming copper foil for the circuit on the printed circuit board, which increases the number of man-hours required to process the board.
In addition, there is a drawback that it is difficult to achieve precision in the mounting position of parts due to machining errors in the position of the hole that occur during hole machining.

Furthermore, in recent years, due to demands for miniaturization, resource saving, and cost reduction of electronic components, so-called chip components without lead wires have been put into practical use, and chip components have come to be attached to printed circuit boards by automatic mounting machines.

This invention provides a printed circuit board for electronic circuits for obtaining NC data when this chip component is attached to a printed circuit board by an automatic mounting machine, and will be explained below with reference to the embodiments shown in the figures.

What is shown in FIG. 1 is an example of a pattern when a chip component used in a so-called home appliance is attached to a printed circuit board 5, and will be explained by showing an example of actual dimensions.

The length of the chip component 1 is 3.2 mm, the width is 1.6 mm, and the thickness is 0.7 mm, and the length L of the copper foil 2 is 2 to 3 mm, and the width W is
is set to 1.6 to 2 mm, and further, the pitch P between copper foils is set to 2 m.
If m, the intersection A of the center line WX of the width W of the copper foil 2 and the center line PY of the pitch P between the copper foils becomes a point indicating the center of the chip component 1.

Align the center point of the chip component 1 with this center point A, and
When the chip component 1 is installed with its axial direction aligned with the center line WX, the copper foil 2 and the electrode portions 3 at both ends of the chip component 1
An overlapping portion t is obtained, and this t is 0.6 mm.

The chip component 1 is temporarily fixed at this position, and the position indicated by the shaded area B is soldered to electrically connect the chip component 1 and the copper foil 2.

In this way, the copper foil 2 is formed on the printed circuit board 5 at the position of the printed circuit board corresponding to the center point A, and at the same time, a copper foil of, for example, about 0.4 mmφ is formed. By using a marker M to indicate the pick-up position of a chip component, NC data can be created by measuring this marker M with a digitizer or the like and processing it in a predetermined format with an automatic placement machine.

What is shown in FIG. 2 is another embodiment of this invention.
This is for making a marker M when there is another copper foil 4 in the center of the two copper foils 2 @box pitch P, and in this case, the above copper foil at the position corresponding to the center point A. Assume that the copper foil of No. 4 is removed by Q, approximately 4 mmφ, and this is marked as marker M.
That's what I said.

In this way, since the marker M is formed using the copper foil portion on the printed circuit board, the marker M can be easily formed at the same time as forming the copper foil for the circuit by etching or the like.
Moreover, it is possible to improve the accuracy of the mounting position of the chip component on the printed circuit board.

As described above, this invention is a printed circuit board in which chip components are mounted by an automatic mounting machine, and a marker for indicating the mounting position of the chip component is placed on the printed circuit board on the side where the chip component is mounted. In addition, since we provide a printed circuit board for electronic circuits made of copper foil at a position corresponding to the center of the chip component to be mounted, this marker is measured and processed in a predetermined format by an automatic mounting machine. Then, NCC data can be created, which improves the efficiency of digitizing work to create NC data.Since the copper foil part is used as a marker, this marker can be placed on the printed circuit board at the same time as the copper foil for the circuit is formed. can be formed, thus making it extremely easy to form, and
The position of the marker is highly accurate compared to the copper foil used for circuits, and this has the advantage of allowing chip components to be mounted in the correct position.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an embodiment of a printed circuit board for electronic circuits according to this invention, and FIG. 2 is a plan view showing another embodiment of this invention. 1...Chip parts, 2...Copper foil, 3.
...Electrode part, 4...Copper foil, 5...
・Printed circuit board, M... Marker.

Claims (1)

[Scope of utility model registration request] A printed circuit board in which a chip component is mounted by an automatic mounting machine, and a marker is placed on the printed circuit board to indicate the mounting position of the chip component on the mounting position side of the central component of the chip component. A printed circuit board for electronic circuits, characterized in that a copper foil section is formed at a position corresponding to the center of a chip component.