JPS6076065U - Printed board - Google Patents

Printed board

Info

Publication number
JPS6076065U
JPS6076065U JP16829483U JP16829483U JPS6076065U JP S6076065 U JPS6076065 U JP S6076065U JP 16829483 U JP16829483 U JP 16829483U JP 16829483 U JP16829483 U JP 16829483U JP S6076065 U JPS6076065 U JP S6076065U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
copper foil
base
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16829483U
Other languages
Japanese (ja)
Inventor
久保田　則幸
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP16829483U priority Critical patent/JPS6076065U/en
Publication of JPS6076065U publication Critical patent/JPS6076065U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案のプリント基板の実施例の要部の平面
図、第２図および第３図は同上プリント基板の半田付は
性の良否の判断を説明するための図、第４図ａないし第
４図Ｃはそれぞれこの考案のプリント基板の他の実施例
の要部の平面図である。 １ａ〜１ｎ１５〜７・・・・・・銅箔パターン、２・・
・・・・プリント基板、３・・・・・・基部、４・・・
・・・半田ブリッジ、Ａ〜Ｄ・・・・・・目盛部、ＡＩ
、Ａ２・・・・・・目盛。Figure 1 is a plan view of the main parts of the printed circuit board of this invention, Figures 2 and 3 are diagrams for explaining the determination of the quality of soldering on the same printed circuit board, and Figure 4 a. 4C to 4C are plan views of main parts of other embodiments of the printed circuit board of this invention. 1a~1n15~7...Copper foil pattern, 2...
...Printed circuit board, 3...Base, 4...
... Solder bridge, A to D ... Scale section, AI
, A2... Scale.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板またはプリント基板の割り捨て部分に所定
の形状を有し、間隔が漸増する銅箔パターンを形成し、
この銅箔パターンの間隔の狭い部分を基部としてその基
部から所定の領域の部分に目盛部を設け、この目盛部内
あるいは目盛部外に半田ブリッジが形成されるか否かに
応じて半田付は性の良否判断をすることを特徴とするプ
リント基板。Forming a copper foil pattern having a predetermined shape on a printed circuit board or a disposable part of the printed circuit board, and with gradually increasing intervals,
A scale part is provided in a predetermined area from the base using the narrow part of this copper foil pattern as a base, and soldering is performed depending on whether a solder bridge is formed inside or outside the scale part. A printed circuit board that is characterized by determining whether it is good or bad.
JP16829483U 1983-10-29 1983-10-29 Printed board Pending JPS6076065U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16829483U JPS6076065U (en) 1983-10-29 1983-10-29 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16829483U JPS6076065U (en) 1983-10-29 1983-10-29 Printed board

Publications (1)

Publication Number Publication Date
JPS6076065U true JPS6076065U (en) 1985-05-28

Family

ID=30367958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16829483U Pending JPS6076065U (en) 1983-10-29 1983-10-29 Printed board

Country Status (1)

Country Link
JP (1) JPS6076065U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109396A (en) * 1985-11-08 1987-05-20 ソニー株式会社 Printed circuit substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109396A (en) * 1985-11-08 1987-05-20 ソニー株式会社 Printed circuit substrate

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