JPS5869973U - Copper foil pattern for mounting electrodes on chip components on printed circuit boards - Google Patents
Copper foil pattern for mounting electrodes on chip components on printed circuit boardsInfo
- Publication number
- JPS5869973U JPS5869973U JP16553281U JP16553281U JPS5869973U JP S5869973 U JPS5869973 U JP S5869973U JP 16553281 U JP16553281 U JP 16553281U JP 16553281 U JP16553281 U JP 16553281U JP S5869973 U JPS5869973 U JP S5869973U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- copper foil
- foil pattern
- chip components
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案になるプリント基板における
′チップ部品の電極取付は用銅箔パターンの実施例を示
す平面図、第２図はチップ部品の斜視図である。
１．２・・・・・・チップ部品の電極取付用の銅箔パタ
ーン、３・・・・・・プリント基板、４・・・・・・極
性表示用の ゛切欠部、５・・・・・・チップ部
品、６，７・・・・・・チップ部品の半田付は用電極、
８・・・・・・極性表示部。Figure 1 shows the printed circuit board used in this invention.
'A plan view showing an example of a copper foil pattern for attaching electrodes to a chip component, and FIG. 2 is a perspective view of the chip component. 1.2... Copper foil pattern for attaching electrodes of chip components, 3... Printed circuit board, 4... Notch for polarity display, 5...・・・Chip parts, 6, 7... Electrodes for soldering chip parts,
8...Polarity display section.
Claims (1)
部品を半田付けなどによって取付けるためのプリント基
板に設けた一対の銅箔パターンのいずれか一方に極性表
示用の切欠部を形成したことを特徴とするプリント基板
におけるチップ部品の電極取付は用銅箔パターン。A printed circuit board for attaching polarized chip components such as electrolytic capacitors and diodes by soldering or the like, the printed circuit board having a cutout for indicating polarity in one of a pair of copper foil patterns provided on the printed circuit board. Copper foil pattern is used for electrode mounting of chip parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16553281U JPS5869973U (en) | 1981-11-06 | 1981-11-06 | Copper foil pattern for mounting electrodes on chip components on printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16553281U JPS5869973U (en) | 1981-11-06 | 1981-11-06 | Copper foil pattern for mounting electrodes on chip components on printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5869973U true JPS5869973U (en) | 1983-05-12 |
Family
ID=29957725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16553281U Pending JPS5869973U (en) | 1981-11-06 | 1981-11-06 | Copper foil pattern for mounting electrodes on chip components on printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5869973U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009026823A (en) * | 2007-07-17 | 2009-02-05 | Toshiba Corp | Printed wiring board, and electronic device |
-
1981
- 1981-11-06 JP JP16553281U patent/JPS5869973U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009026823A (en) * | 2007-07-17 | 2009-02-05 | Toshiba Corp | Printed wiring board, and electronic device |
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