JPS5842966U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5842966U JPS5842966U JP13774381U JP13774381U JPS5842966U JP S5842966 U JPS5842966 U JP S5842966U JP 13774381 U JP13774381 U JP 13774381U JP 13774381 U JP13774381 U JP 13774381U JP S5842966 U JPS5842966 U JP S5842966U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- chip
- adhesive
- fixation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図〜第4図は、従来のプリント板における半田によ
る橋状短絡成立の過程に関し、第1図は平面図、第2図
〜第4図は断面図である。第5図〜第8図は、チップ使
用のプリント板におけるチップ固着過程に関し第5図、
第6図は平面図、第7図、第8図は断面図である。第9
図〜第11図は本考案実施例に関し、第9図は要部平面
図、第10図は第9図のA−Aでの断面図である。第[
1図は、部品端子6を孔11に挿入して半田付けした状
態を示す断面図である。
1・・・・・・プリント板、11・・・・・・孔、2・
・・・・・導電パターン、3・・・・・・ソルダレジス
ト、4・・・・・・半田、5・・・・・・橋状短絡部、
6・・・・・・端子、7・・・・・・接着剤、8・・・
・・・チップ。1 to 4 relate to the process of establishing a bridge-like short circuit by solder on a conventional printed board, with FIG. 1 being a plan view and FIGS. 2 to 4 being sectional views. Figures 5 to 8 show the process of fixing chips on a printed board using chips.
FIG. 6 is a plan view, and FIGS. 7 and 8 are sectional views. 9th
9 to 11 relate to an embodiment of the present invention, FIG. 9 is a plan view of a main part, and FIG. 10 is a sectional view taken along line A-A in FIG. 9. Part [
FIG. 1 is a sectional view showing a state in which the component terminal 6 is inserted into the hole 11 and soldered. 1...Printed board, 11...hole, 2.
... Conductive pattern, 3 ... Solder resist, 4 ... Solder, 5 ... Bridge-like short circuit part,
6...terminal, 7...adhesive, 8...
...chip.
Claims (1)
ップ固着用の接着剤の取付けと同一の工程で、上記チッ
プ固着用と同じ接着剤を導電パターン相互の間隔の狭い
部分に半田の橋状短絡を防止するための盛り上りとして
取付けたことを特徴とするプリント配線基板。In the same process as attaching the adhesive for chip fixation to use the chip as a capacitor or resistor, apply the same adhesive for chip fixation to the closely spaced parts of the conductive patterns to prevent solder bridge-like short circuits. A printed wiring board characterized in that it is attached as a raised part for the purpose of
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13774381U JPS5842966U (en) | 1981-09-18 | 1981-09-18 | printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13774381U JPS5842966U (en) | 1981-09-18 | 1981-09-18 | printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5842966U true JPS5842966U (en) | 1983-03-23 |
Family
ID=29930998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13774381U Pending JPS5842966U (en) | 1981-09-18 | 1981-09-18 | printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5842966U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0188905U (en) * | 1987-12-02 | 1989-06-12 |
-
1981
- 1981-09-18 JP JP13774381U patent/JPS5842966U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0188905U (en) * | 1987-12-02 | 1989-06-12 |
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