JPS6018575U - printed circuit board equipment - Google Patents
printed circuit board equipmentInfo
- Publication number
- JPS6018575U JPS6018575U JP11040583U JP11040583U JPS6018575U JP S6018575 U JPS6018575 U JP S6018575U JP 11040583 U JP11040583 U JP 11040583U JP 11040583 U JP11040583 U JP 11040583U JP S6018575 U JPS6018575 U JP S6018575U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- board equipment
- chip component
- board device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、本考案の一実施例におけるプリント基板装置
の平面図、第２図はそれにクリーム半田を塗布しチップ
部品を装着した状態の平面図、第３図は更に半田付けを
完了した状態の断面図である。
１・・・・・・導体部、２・・・・・・レジスト、３・
・・・・・部品を半田付けする導体部分、４・・・・・
・チップ部品、５・雲・・・・チップ部品の電極、６・
・・・・・クリーム半田、７・・・・・・溶融後の半田
、８・・・・・・プリント基材、９・・・・・・裏面導
体。Fig. 1 is a plan view of a printed circuit board device according to an embodiment of the present invention, Fig. 2 is a plan view of the printed circuit board device after applying cream solder and mounting chip components, and Fig. 3 is a plan view of the printed circuit board device after soldering has been completed. FIG. 1... Conductor part, 2... Resist, 3...
...Conductor part to which parts are soldered, 4...
・Chip parts, 5. Clouds... Electrodes of chip parts, 6.
... Cream solder, 7 ... Solder after melting, 8 ... Print base material, 9 ... Back conductor.
Claims (1)
ップ部品を半田付けする導体部分を残してその周囲を所
定範囲内に限定してレジストで覆ったことを特徴とする
プリント基板装置。1. A printed circuit board device, characterized in that, on a printed circuit board on which a chip component is mounted, a conductor portion to which the chip component is soldered is left, and the periphery thereof is limited to a predetermined range and covered with a resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11040583U JPS6018575U (en) | 1983-07-15 | 1983-07-15 | printed circuit board equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11040583U JPS6018575U (en) | 1983-07-15 | 1983-07-15 | printed circuit board equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6018575U true JPS6018575U (en) | 1985-02-07 |
Family
ID=30256775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11040583U Pending JPS6018575U (en) | 1983-07-15 | 1983-07-15 | printed circuit board equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6018575U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63146492A (en) * | 1986-12-10 | 1988-06-18 | 松下電器産業株式会社 | Printed board |
| JPH0194696A (en) * | 1987-10-06 | 1989-04-13 | Ibiden Co Ltd | Printed wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5769797A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Method of producing hybrid thick film integrated circuit |
-
1983
- 1983-07-15 JP JP11040583U patent/JPS6018575U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5769797A (en) * | 1980-10-17 | 1982-04-28 | Matsushita Electric Ind Co Ltd | Method of producing hybrid thick film integrated circuit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63146492A (en) * | 1986-12-10 | 1988-06-18 | 松下電器産業株式会社 | Printed board |
| JPH0194696A (en) * | 1987-10-06 | 1989-04-13 | Ibiden Co Ltd | Printed wiring board |
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