JPS5895074U - Electronic component mounting equipment - Google Patents
Electronic component mounting equipmentInfo
- Publication number
- JPS5895074U JPS5895074U JP19045281U JP19045281U JPS5895074U JP S5895074 U JPS5895074 U JP S5895074U JP 19045281 U JP19045281 U JP 19045281U JP 19045281 U JP19045281 U JP 19045281U JP S5895074 U JPS5895074 U JP S5895074U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit pattern
- electronic
- concave
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａ、 Ｂは、従来の電子部品の取り付は装置を示
す断面図、第２図Ａ、 Ｂ、 Ｃは、本考案による電子
部品の取り付は装置の平面図組立平面図及び断面図であ
る。
１・・・・・・回路基板（ガラエポ）、２・・・・・・
回路パターン（銅箔）、３・・・・・・電子部品（チッ
プ抵抗、チップコン）、４・・・・・・予備半田（導電
接着剤）。Figures 1A and B are cross-sectional views showing a conventional device for mounting electronic components, and Figures 2A, B, and C are a plan view, an assembly plan view, and a cross-section of the device for mounting electronic components according to the present invention. It is a diagram. 1... Circuit board (glass epoxy), 2...
Circuit pattern (copper foil), 3... Electronic components (chip resistor, chip controller), 4... Preliminary solder (conductive adhesive).
Claims (2)
ものにおいて、基板の回路パターン部をあらかじめ電子
部品のリード形状に対応できる凹部の回路パターンに形
成し、この凹部回路パターンに電子部品のリード端子を
適確な位置にセットさせ、しかるのち半田付けしてなる
電子部品の取り付は装置。(1) In devices that attach electronic components to circuit patterns on various boards, the circuit pattern portion of the board is formed in advance into a concave circuit pattern that can correspond to the lead shape of the electronic component, and the lead terminals of the electronic component are placed in the concave circuit pattern. The electronic parts are installed by setting the parts in the correct position and then soldering them.
品のリード端子と、該凹部形状をなす回路、パターン部
に各々予備半田し、該半田量は、電子部品のリード端子
外形幅よりも広くすることを特徴とする実用新案登録請
求の範囲第１項に ５記載の電子部品の取り付は装置。(2) Attach the electronic component to the circuit pattern by pre-soldering the lead terminal of the electronic component, the circuit forming the concave shape, and the pattern portion, respectively, and making the amount of solder wider than the external width of the lead terminal of the electronic component. A device for mounting electronic parts according to claim 1 of claim 5, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19045281U JPS5895074U (en) | 1981-12-21 | 1981-12-21 | Electronic component mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19045281U JPS5895074U (en) | 1981-12-21 | 1981-12-21 | Electronic component mounting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5895074U true JPS5895074U (en) | 1983-06-28 |
Family
ID=30104027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19045281U Pending JPS5895074U (en) | 1981-12-21 | 1981-12-21 | Electronic component mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5895074U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017135163A (en) * | 2016-01-25 | 2017-08-03 | Tdk株式会社 | Electronic component |
-
1981
- 1981-12-21 JP JP19045281U patent/JPS5895074U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017135163A (en) * | 2016-01-25 | 2017-08-03 | Tdk株式会社 | Electronic component |
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