JPS58168169U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS58168169U JPS58168169U JP6480882U JP6480882U JPS58168169U JP S58168169 U JPS58168169 U JP S58168169U JP 6480882 U JP6480882 U JP 6480882U JP 6480882 U JP6480882 U JP 6480882U JP S58168169 U JPS58168169 U JP S58168169U
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed circuit
- mounting position
- circuit board
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本案プリント基板の要部断面図、第２図乃至第
４図は本案プリント基板に対するチップ部品の取付順序
を説明する断面図であって、第２図はチップ部品が接着
固定される前、第３図はチップ部品が接着固定された状
態、又第４図は両端リード部がパターン面に半田付は固
定されてチップ部品の基板への取付けが完了した状態を
夫々示している。
１・・・・・・基板、１ａ・・・・・・部品装着位置、
２，３・・・ 。
・・・導電パターン、７・・・・・・基板突出片、Ａ・
・・・・・チップ部品、４，５・・・・・・端部、８・
・・・・・接着剤、９・・・・・・空隙、１０・・・・
・・半田、ａ・・・・・・ケーシング、ｂ、ｂ・・・・
・・リー・ド部。Figure 1 is a cross-sectional view of the main parts of the printed circuit board according to the present invention, and Figures 2 to 4 are cross-sectional views explaining the order in which chip components are attached to the printed circuit board according to the present invention, and Figure 2 shows how the chip components are fixed with adhesive. 3 shows a state in which the chip component is fixed with adhesive, and FIG. 4 shows a state in which the lead portions at both ends are soldered and fixed to the pattern surface, and the mounting of the chip component to the substrate is completed. 1... Board, 1a... Component mounting position,
2, 3... ... Conductive pattern, 7... Board protruding piece, A.
... Chip parts, 4, 5 ... Ends, 8.
...Adhesive, 9...Gap, 10...
...Solder, a...Casing, b, b...
... Lee Do Department.
Claims (1)
電パターンを有し、チップ部品のケーシングが部品装着
位置に接着固定された後、その両端リード部が前記パタ
ーンの夫々の端部に半田付は接合されるプリント基板に
おいて、前記基板の部品装着位置に前記パターン面より
も更に所定高さ高くなるように基板突出片を突出形成し
、この基板突出片に設置されるチップ部品と前記端部上
面′との間に所定間隔の空隙が形成されるようになした
ことを特徴とするプリント基板。It has a conductive pattern to which chip components are connected to the component mounting position of the board and on the left and right sides, and after the casing of the chip component is adhesively fixed to the component mounting position, the lead portions at both ends are soldered to the respective ends of the pattern. In the printed circuit board to be bonded, a board protruding piece is formed to protrude from the component mounting position of the board so as to be higher than the pattern surface by a predetermined height, and the chip components installed on the board protruding piece and the end portion 1. A printed circuit board characterized in that a gap is formed at a predetermined interval between the printed circuit board and the upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6480882U JPS58168169U (en) | 1982-04-30 | 1982-04-30 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6480882U JPS58168169U (en) | 1982-04-30 | 1982-04-30 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58168169U true JPS58168169U (en) | 1983-11-09 |
Family
ID=30074821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6480882U Pending JPS58168169U (en) | 1982-04-30 | 1982-04-30 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58168169U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53110068A (en) * | 1977-03-07 | 1978-09-26 | Matsushita Electric Ind Co Ltd | Method of attaching chip circuit element to printed circuit board |
| JPS5647957U (en) * | 1979-09-21 | 1981-04-28 |
-
1982
- 1982-04-30 JP JP6480882U patent/JPS58168169U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53110068A (en) * | 1977-03-07 | 1978-09-26 | Matsushita Electric Ind Co Ltd | Method of attaching chip circuit element to printed circuit board |
| JPS5647957U (en) * | 1979-09-21 | 1981-04-28 |
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