JPH0617329Y2 - Flexible printed circuit board - Google Patents

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to an improvement of a flexible printed circuit (FPC) used in electronic equipment.

[Prior art and its problems]

As electronic devices become lighter, thinner, shorter, smaller, and thinner, they are as thin as paper,
The FPC was developed as a flexible and bendable printed circuit board.

However, as shown in the example of Fig. 3, the FPC is easily bent due to its thinness and flexibility.
In addition, the component 3 cannot be normally mounted on No. 1 and the print pattern of the FPC 1 and the electrodes and leads of the component 3 cannot be normally joined.

Also, in the test work, since the components are mounted at a high density and the board is easily bent, the test pin 5 of the test jig 4 cannot be accurately brought into contact with the regular test point, and the test point may be incorrect. The test pin 4 hits and damages the FPC 1 and the component 3 electrically and mechanically.

From these facts, generally, a hard substrate system is widely adopted in which the hard substrate 2 is used as an underlay and the FPC 1 is attached thereto to improve the efficiency of various work processes.

However, in the FPC mounted in high density, the print pattern therein is also wired in high density. Therefore, the test pins 5 in the jig 4 that come into contact with each test point easily come into contact with each other, and thus the number of test pins 5 to be installed is restricted, and the FP is limited.
It is not possible to carry out a sufficient test as a C unit, and it is necessary to carry out the rest of the tests after comprehensive assembly and wiring, which reduces efficiency and makes it impossible to detect defects as a FPC unit at an early stage.

〔Purpose〕

The present invention is applicable to an FPC including an FPC and a hard substrate.
A plurality of sub-FPCs that aggregate the signal lines in the PC are provided at the end of the FPC, and the signal lines aggregated in the sub-FPCs and the corresponding printed pattern on the hard board are connected by a conductor at the joints, and they are apparent. It is characterized in that it is an upper integrated printed circuit board, and its purpose is to improve the test accuracy and efficiency in the test process of the FPC on which the components are mounted.

〔Example〕

 An embodiment of the present invention will be described below with reference to FIG.

The signal line 6 in the FPC 1 is wired with high density. The signal line 6 is extended and integrated in the sub FPC 7 by a print pattern. The integrated signal line 8 and the test print pattern 9 corresponding to the signal line 8 are provided on the hard substrate 2 and the joint portion 10 is provided.
Are connected by a conductor such as solder and jumper wires. The test print pattern 9 provided on the hard board 2 is diffused to the test point 11 on the hard board 2, and the connector 12 is provided on the extension line.

Since the hard substrate 2 is not conventionally formed into a print pattern, the pattern interval can be set sufficiently wide and many test points can be set. Further, by using the connector 12 provided on the hard substrate 2, the number of test pins of the test jig can be greatly reduced.

As a result, the number of test pins installed tended to be limited due to the contact of test pins of test jigs with high-density mounting and high-density wiring, but this can be solved and the test accuracy can be improved. After finishing, cut the cutting part 13 and FPC
Take 1 out.

FIG. 2 shows another embodiment of the present invention.

The sub FPC 7 is extended to the end of the hard substrate 2 and the signal line 8 gathered in the sub FPC 7 is also diffused and extended, and a connector is provided at the tip thereof. Form the connector 12. Test signals are input and output between the test connector 14 and the printed board connector 12. As a result, the test can be easily performed without preparing a special jig, and the jig cost can be reduced and the test accuracy can be improved. After the test, cut the cutting part 13 and cut the FPC1
Take out.

〔effect〕

As described above, according to the present invention, the utilization of the rigid board, which has conventionally been focused on the component mounting process on the FPC, is expanded to the test process, and the test accuracy is improved, the efficiency in the test process is improved, and the jig manufacturing cost is increased. Can be reduced.

[Brief description of drawings]

FIG. 3 shows a conventional example, (a) is a sectional view of a component mounting FPC and a test jig, (b) is a sectional view of a component mounting FPC and a hard substrate, and FIGS. 1 and 2 are the embodiments of the present invention. FIG. 6 is a plan view of an FPC and a rigid substrate according to an example. 1: FPC, 2: hard board, 3: mounted component, 4: test jig, 5: test pin, 6: FPC signal line, 7: sub-FPC, 8: signal line integrated in sub-FPC, 9: Printed pattern on hard board, 10: pattern connection points,
11: Test point, 12: Printed board connector, 13: Cut part, 14: Test plug.

Claims (1)

[Scope of utility model registration request] 1. An FPC comprising a flexible printed circuit board and a rigid substrate, wherein a sub-FPC in which a power line, an earth line, and various signal lines (hereinafter referred to as signal lines) in the FPC are integrated is provided at an end of the flexible printed circuit board. The FP characterized in that the signal line aggregated in 1) and the corresponding printed pattern on the hard substrate are connected by a conductor at the joint to form a seemingly integrated printed circuit board.
C.