JPS59161892A - Pattern circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to pattern wiring technology, and particularly to a pattern wiring technology that is effective when used to connect patterns on a substrate such as a printed circuit board or a wafer prober. .

[Background Art] Generally, when connecting two poles on a board such as a printed circuit board or a wafer probe card, as shown in FIG. It is conceivable to connect the

However, in such a wiring structure, the lead wire 3 has two
When connecting between poles, there is a problem in that the signal line becomes longer and is more susceptible to external influences. Furthermore, when two or more poles are connected, the number of lead wires increases, resulting in many connection errors. There is a problem that work efficiency decreases. Further, there are problems such as more mistakes are made when checking whether the lead wires are correctly wired, and the appearance is not good.

OBJECT OF THE INVENTION] An object of the present invention is to provide a pattern wiring technique that allows pattern wiring on a substrate to be connected directly without lead wires.

The above and other objects and novel features of the present invention will become clear from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

That is, by making it possible to connect the pattern wiring without using lead wires, the pattern wiring connection can be made efficiently and the above object can be achieved.

[Embodiment] FIG. 2 is a plan view showing an embodiment of a patterned wiring board according to the present invention.

In this embodiment, a substrate 1 as a patterned wiring board
1 is, for example, a wafer probe card or a printed circuit board, and a front surface pattern 12 and a back surface pattern 13 are formed in a matrix on both the front and back surfaces of this board 11, respectively.

Therefore, the front pattern 12 and the back pattern 13 intersect at right angles.

As shown in an enlarged view in FIG. 3, such a right-angled intersection 14 is formed in the front surface pattern 12 in a ring shape, while in the back surface pattern 13, a through hole formed from the back surface to the front surface of the substrate 11 is formed in the front surface. The back pattern 13 is made to face approximately the center of the ring-shaped portion of the pattern 12 and to be electrically connected to the front surface side of the substrate 11.

As a result, in this embodiment, the front pattern 12 and the back pattern 13 are formed by directly connecting the ring-shaped part and the through-hole conductive part in the center with solder or the like, as shown in the enlarged view in FIG. Connections between two or more poles can be effectively made without the need for lead wires. Further, by connecting wires at intersections, it is possible to connect a plurality of wires to the same line without using lead wires.

[Effects] According to the present invention, pattern wiring can be connected effectively and efficiently without using lead wires.

Furthermore, since lead wires are not required, work efficiency can be improved and wiring checks can be easily performed.

Furthermore, since lead wires are not required, the appearance of the wiring connection structure is improved.

Although the invention made by the present inventor has been specifically explained above based on examples, it goes without saying that the present invention is not limited to the above-mentioned examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the front surface pattern and the back surface pattern do not necessarily have to be in a matrix shape, and their intersections can also have other structures.

[Field of Application] The above explanation has mainly focused on the case where the invention made by the present inventor is applied to printed circuit boards and wafer probe cards, which are the fields of application that formed the background of the invention.
It can also be widely used for various other wiring boards.

[Brief explanation of the drawing]

1 is a plan view of an example of a printed circuit board, FIG. 2 is a plan view of an embodiment of a patterned wiring board according to the present invention, and FIG. 3 is an enlarged partial view of a pattern intersection in FIG. 2. 11... Substrate, 12... Surface pattern, 13...
Back pattern, 14...intersection. Figure 1 Figure 2 Figure 3, Figure 3-45'

Claims (1)

[Scope of Claims] 1. A patterned wiring board, characterized in that, in a board having patterns formed on both the front and back sides, the patterns are directly connected to each other on one surface of the board. 2. The patterned wiring board according to claim 1, wherein the pattern is formed in a matrix on both the front and back surfaces of the board, and the intersections of the matrix patterns are directly connected on one surface of the board.