JPS63253692A - Through-hole substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a through-hole substrate having through-holes for connecting one surface wiring and back surface wiring.

[Prior Art] A conventional through-hole board has a structure as shown in FIGS. 4 to 6. FIG. 4 is a plan view showing a partial surface pattern of a conventional through-hole board, FIG. 5 is a plan view similarly showing a partial back surface pattern, and FIG. 6 is a sectional view taken along the line B--B in FIG. 4.

In the drawing, IO is a component mounting pad provided on the surface of the through-hole board, and various electronic components are attached to this pad. A wiring 11 comes out from this component mounting pad 10, while a resistor 12 is provided on the back side of the through-hole board.
A wiring 613 to which electrical parts such as the like are attached is exposed.

Reference numeral 14 denotes a through hole, which is provided to penetrate through the through hole substrate body. The inner surface of this through hole 14 has 1
Connection wiring 15 is provided to connect the front and back wiring, and the front wiring l! and connection wiring 15, connection wiring 15 and back wiring 1
By connecting 3, the wiring 11 and the wiring 13 are electrically connected.

Here, the through holes 14 were configured to connect one wiring through - number of through holes.

That is, on the inner surface of the through hole 14, a conductive thin film was formed over the entire circumference, and this was used as the connection wiring 15. Therefore, when connecting two or more wires, it was necessary to provide as many through holes as the number of wires.

[Problems to be solved] As mentioned above, conventional through-hole boards have a structure in which a single wire is connected with - through holes, so when the number of wires to be connected increases, It was necessary to provide a large number of Therefore, there is a problem in that the area for providing patterns other than through-holes is reduced, and the scale of the circuit accommodated on the through-hole substrate must be reduced.

Furthermore, there was also the problem that the strength of the through-hole substrate weakened when the number of through-holes increased.

The present invention has been made in view of the above-mentioned problems.
The purpose of the present invention is to provide a through-pole board that can connect multiple wires using - through-holes.

[Solving the Problem in Stage F] In order to achieve the above object, the present invention provides a through-hole board having a through-pole for connecting front-side wiring and back-side wiring formed on a board main body. The structure is characterized by the provision of connection wiring.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing a partial surface pattern of a through-hole board according to an embodiment of the present invention, FIG. 2 is a top view showing a partial back pattern of the through-hole board, and FIG. 3 is the same as that shown in FIG. FIG. 2 is a sectional view taken along line A-A.

In the drawings, l represents a through hole, which is provided to penetrate through the through hole substrate body. Two connection wiring lines 1a are provided on the inner surface of this through hole 1.

1b are formed so as to maintain an insulated state from each other.

The surface of the through-hole board is provided with surface areas vi2 and 3 connected to the connection wirings la and lb, and these surface wirings 2.3 are connected to the component mounting pads 4.5, respectively. Various electronic components are mounted on the mounting pad 4.5.

Also, on the back side of the through-hole board, the above connection wiring la, l
The backside wiring 6.7 connected to b is provided. The back wiring 6.7 is connected to electronic components 8, 9 such as resistors.

In order to form a through-hole substrate having such a configuration, screen printing may be performed while sucking the inside of the through-hole from the back side of the printing surface.

Note that the present invention is not limited to the one embodiment described above, and by providing two or more connection wires in the through hole, two or more wires can be connected.

[Effects of the Invention] As described above, the present invention makes it possible to connect a plurality of wires with - through holes, so the area occupied by the through holes on the board can be reduced. This has the effect of increasing the scale of the circuit accommodated on the board.

Furthermore, since there is no need to increase the number of through holes as the number of wiring lines increases, there is also the effect that the strength of the through hole board can be maintained at a constant level without being affected by the number of wiring lines.

[Brief explanation of drawings]

FIG. 1 is a top view showing a partial surface pattern of a through-hole board according to an embodiment of the present invention, FIG. 2 is a top view showing a partial back pattern of the through-hole board, and FIG. FIG. 4 is a top view showing a partial surface pattern of a conventional through-hole board, FIG. 5 is a plan view showing a partial back surface pattern, and FIG. -B sectional view.

Claims (1)

[Claims] 1. A through-hole board having a through-hole for connecting front-side wiring and back-side wiring formed on a board body, characterized in that a plurality of connection wirings are provided in the through-hole.