JPH02177386A - Electronic device - Google Patents

Abstract

PURPOSE:To make possible the connection of electronic devices with other electronic device by a method wherein part of each surface of the substrates of the electronic devices is formed into a rough form and a plurality of signal terminals are arranged on the surfaces of the rough parts. CONSTITUTION:Part of each surface of substrates 1 and 2 of respective electronic devices is formed into a rough form and a plurality of input/output signal terminals 11 to 14 and 21 to 24 of a circuit or an element are respectively arranged on the surfaces of these rough parts. By this constitution, the fellow rough parts are fitted into one another, the devices can be connected with other electronic device and a reduction in the physical configuration of the electronic devices, an increase in the number of the signal terminals and an increase in the density of mounted electronic devices become possible without restricted by the effect of solder bridges and the like.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is an IC, L, which realizes a desired function by using a plurality of devices and connecting each device with a signal line.
The present invention relates to electronic devices including SI and the like, and particularly relates to electronic devices in which terminal portions are formed into uneven shapes and pairs of terminals are directly coupled.

[Conventional technology] Conventionally, when connecting multiple electronic devices, signal lines are realized by soldering using printed wiring and wire materials formed on a printed circuit board, and the placement and fixing of devices is also done on the printed circuit board. It was also used for soldering. Further, the external shape of the device was also rectangular, and only lead wires were provided as terminals. That is, when connecting a plurality of devices to realize a desired function, conventionally, pairs of signal terminals 11-21 . to be connected are connected as shown in FIG.
12-22, 13-23, 14-24 were connected by soldering using printed wiring or wires formed on a printed circuit board.

[Problems to be Solved by the Invention] In conventional devices, the distance between each terminal is limited due to effects such as solder bridges caused by soldering to printed circuit boards and wires.

Furthermore, since signal lines are arranged vertically and horizontally between devices, functional quality is affected by signal propagation delays, noise, etc.

[Means for Solving the Problems] The present invention provides an electronic device having a base on which a circuit or an element is provided, and a plurality of terminals for human input and output signals of the circuit or element. The electronic device has an uneven surface, the plurality of terminals are arranged on the surface of these uneven parts, and the uneven parts are fitted to each other, thereby making it possible to connect to other electronic devices.

[Embodiment] FIGS. 1 to 4 are drawings showing an embodiment of the present invention.

In the present invention, as shown in FIGS. 1 and 2, the input and output sides of a pair of terminals are assigned to the concave portion and the convex portion, respectively, and are directly coupled, and the connection distance and device placement distance are 11! Signal propagation can be realized under the minimum and best conditions.

In the figure, 11-14.21-24 are signal terminals, 1,
2 indicates the base of each electronic device.

Furthermore, as shown in Figs. 3 and 4, the spacing between adjacent terminals, which was conventionally limited by the influence of solder bridges, etc., is also reduced by the planar distance L2 even when the same distance L1 as before is secured.
can be shortened. Here, devices include IC, LSI,
It may be an electronic element itself such as a resistor or a capacitor, or a composite element thereof.

[Effects of the Invention] As explained above, by making the terminal portion of the device uneven, it is possible to reduce the physical shape of the device, increase the number of signal terminals, and increase the number of signal terminals without being restricted by the effects of solder bridges, etc. This makes it possible to increase the loading capacity and improve functional quality.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the present invention, FIG. 2 is a plan view showing a state in which electronic devices are connected to each other, and FIG. 3 is a perspective view showing the shape of the uneven terminal portion in the present invention. FIG. 4 is a schematic diagram illustrating the planar distance between each terminal, and FIG. 5 is a plan view showing a conventional example. 1.2... Device (substrate), If,
12. 13. 14゜21.22,23,24...Signal terminal, Ll...
・・・・・・・・・Minimum distance between terminals, L2・・・・・・
・・・・・・Distance between flat terminals.

Claims (1)

[Scope of Claims] An electronic device having a substrate provided with a circuit or an element, and a plurality of terminals for input and output signals of the circuit or element, wherein a part of the surface of the substrate is formed into an uneven shape. , an electronic device which can be connected to other electronic devices by disposing the plurality of terminals on the surfaces of these uneven portions and fitting the uneven portions together.