JPH04105390A - Substrate mechanism - Google Patents
Substrate mechanismInfo
- Publication number
- JPH04105390A JPH04105390A JP22099890A JP22099890A JPH04105390A JP H04105390 A JPH04105390 A JP H04105390A JP 22099890 A JP22099890 A JP 22099890A JP 22099890 A JP22099890 A JP 22099890A JP H04105390 A JPH04105390 A JP H04105390A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- box
- electrically connected
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 28
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 239000011295 pitch Substances 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/047—Box-like arrangements of PCBs
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野]
本発明は基板上の電子部品等の上部にも部品を載置てき
る構成をとる高密度実装か可能な基板機構に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a board mechanism that allows high-density mounting and has a configuration in which components can be placed on top of electronic components and the like on the board.
[従来の技術]
第3図は、従来の基板機構の概略構成を示す断面図であ
る。第3図に示すように、従来、基板lO上に載置され
たIC等の電子部品11の上面に他の部品を実装しよう
とする際には、既設の基板10の上部に隣接して新規の
基板12を設けて電子部品13を実装し、これら2つの
基板lO及び12を不図示のビンを介して半田工4てパ
ターン15とハイフリットIC等の端子17と半田付け
するなど、ハイフリットICのように構成していた。[Prior Art] FIG. 3 is a sectional view showing a schematic configuration of a conventional board mechanism. As shown in FIG. 3, conventionally, when trying to mount other components on the upper surface of the electronic component 11 such as an IC mounted on the board 10, a new component is mounted adjacent to the top of the existing board 10. A high frit board 12 is provided and an electronic component 13 is mounted thereon, and these two boards lO and 12 are soldered to a pattern 15 and a terminal 17 of a high frit IC or the like using a soldering machine 4 through a bottle (not shown). It was configured like an IC.
[発明か解決しようとする課題]
しかしなから、上記従来例ては、ハイフリットICのよ
うに決められたピッチ間て2つの基板を接続するため、
配線に制約を強いられるような欠点かあった。[Problem to be solved by the invention] However, in the above conventional example, in order to connect two substrates at a predetermined pitch like a high frit IC,
There were some drawbacks such as restrictions on wiring.
この発明はかかる課題を解決するためになされたもので
、配線に制約を強いることなく、自由なピーツチで複数
の基板を接続することのできる基板機構を提供すること
を目的とする。The present invention was made to solve this problem, and an object of the present invention is to provide a board mechanism that can connect a plurality of boards with free pitches without imposing restrictions on the wiring.
[課題を解決するための手段]
上記の目的を達成するために、この発明の基板機構は上
面に少くとも1つの電子部品か載置されて電気的に接続
された第1の基板の上部に、箱型を形成する第2の基板
を設け、この第2の基板上に他の電子部品類をJ!置し
て電気的に接続し、かつ、上記第1の基板と第2の基板
とを相互に電気的に接続した構成を有するものである。[Means for Solving the Problems] In order to achieve the above object, the board mechanism of the present invention includes a first board on which at least one electronic component is placed and electrically connected. , a second board forming a box shape is provided, and other electronic components are mounted on this second board. The first substrate and the second substrate are electrically connected to each other.
[作用]
本発明によれば、第1の基板上にahaされたIC等の
電子部品の北部に箱型を形成する第2の基板を設けるこ
とにより、この箱型を形成する基板上に他の電子部品等
を載置てきるようになり、更に第1の基板の側面にも直
立した2面以上の箱型の第2の基板の側面かあるため、
パターンて自由に、箱怨の第2の基板上の部品と第1の
基板上の部品とを電気的に接続することを可能にしたも
のである。また、箱型の第2の基板側面に部品を実装す
ることも可能であり、さらなる高密度化を可能にしてい
る。[Function] According to the present invention, by providing the second substrate forming a box shape in the northern part of the electronic components such as ICs formed on the first substrate, other substrates forming the box shape can be formed. electronic components, etc. can now be placed on the board, and since there are two or more upright sides of the box-shaped second board on the sides of the first board,
This makes it possible to electrically connect parts on the second board and parts on the first board in any pattern. Furthermore, it is also possible to mount components on the side surface of the box-shaped second board, making it possible to further increase the density.
[実施例] 本発明の実施例を図面を参照しなから説明する。[Example] Embodiments of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例の基板機構の斜視図であり、
第2図は第1図の線イーイの断面図である。FIG. 1 is a perspective view of a board mechanism according to an embodiment of the present invention,
FIG. 2 is a sectional view taken along line E in FIG. 1.
第1図、第2図において、■はIC等の電子部品かJ!
置されている基板、2は電子部品、3は箱型の基板の上
面部、4は箱型の基板の側面部、5は箱型の基板3上に
IINされた部品、6.7は半田、8は基板1 、hの
パターン、9は箱型の基板3.4上のパターンである。In Figures 1 and 2, ■ is an electronic component such as an IC or J!
2 is the electronic component, 3 is the top surface of the box-shaped board, 4 is the side surface of the box-shaped board, 5 is the component IINed on the box-shaped board 3, 6.7 is the solder , 8 is the pattern on the substrate 1, h, and 9 is the pattern on the box-shaped substrate 3.4.
半田6て箱型の基板の側面部4と他方の基板lとを機械
的に、また箱型の基板3.4上の電子部品5と他方の基
板1上の電子部品2とを電気的に接続する。同様に半田
7て箱型の基板3,4の上面部3と側面部4とを機械的
並びに電気的に接続する。Solder 6 mechanically connects the side surface 4 of the box-shaped board 3.4 to the other board 1, and electrically connects the electronic component 5 on the box-shaped board 3.4 to the electronic component 2 on the other board 1. Connecting. Similarly, the top surface 3 and side surface 4 of the box-shaped substrates 3, 4 are mechanically and electrically connected using solder 7.
[発明の効果]
以上説明したように、本発明は第1の基板上に載置され
たIC等の電子部品の上部に箱型を形成する基板を新設
することにより、箱型基板上に他の部品を載置すること
かでき、しかも箱型基板と第1の基板間でIC端子等の
ピッチに制約されずにパターンを設けることかできる効
果かある。[Effects of the Invention] As explained above, the present invention provides a new box-shaped board on top of electronic components such as ICs mounted on a first board, thereby allowing other devices to be placed on the box-shaped board. This has the effect of allowing parts to be placed thereon, and also allowing a pattern to be provided between the box-shaped board and the first board without being restricted by the pitch of IC terminals, etc.
第1図は本発明の一実施例の基板機構の斜視図、第2図
は第1図の線イーイの断面図、第3図は従来の基板機構
の概略構成を示す断面図である。
図中。
1.3,4,10,12:基板
2、5.11.13:電子部品
6.7.14:半田
8、9.15.16:パターン
17:端子
代理人 弁理士 1)北 嵩 晴
第1図FIG. 1 is a perspective view of a substrate mechanism according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line E-II in FIG. 1, and FIG. 3 is a sectional view showing a schematic configuration of a conventional substrate mechanism. In the figure. 1.3, 4, 10, 12: Board 2, 5.11.13: Electronic components 6.7.14: Solder 8, 9.15.16: Pattern 17: Terminal agent Patent attorney 1) Haruichi Kitatake Figure 1
Claims (1)
接続された第1の基板の上部に、箱型を形成する第2の
基板を設け、この第2の基板上に他の電子部品類を載置
して電気的に接続し、かつ、上記第1の基板と第2の基
板とを相互に電気的に接続したことを特徴とする基板機
構。A second board forming a box shape is provided on top of the first board on which at least one electronic component is placed and electrically connected, and other electronic parts are placed on the second board. 1. A board mechanism, wherein the first board and the second board are electrically connected to each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22099890A JPH04105390A (en) | 1990-08-24 | 1990-08-24 | Substrate mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22099890A JPH04105390A (en) | 1990-08-24 | 1990-08-24 | Substrate mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04105390A true JPH04105390A (en) | 1992-04-07 |
Family
ID=16759868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22099890A Pending JPH04105390A (en) | 1990-08-24 | 1990-08-24 | Substrate mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04105390A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5570274A (en) * | 1993-11-29 | 1996-10-29 | Nec Corporation | High density multichip module packaging structure |
WO1997029621A1 (en) * | 1996-02-06 | 1997-08-14 | Kabushiki Kaisha Toshiba | Printed-circuit board and electronic apparatus provided with the same |
CN108513436A (en) * | 2018-04-27 | 2018-09-07 | 维沃移动通信有限公司 | The circuit board and preparation method thereof of mobile terminal, mobile terminal |
-
1990
- 1990-08-24 JP JP22099890A patent/JPH04105390A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5570274A (en) * | 1993-11-29 | 1996-10-29 | Nec Corporation | High density multichip module packaging structure |
WO1997029621A1 (en) * | 1996-02-06 | 1997-08-14 | Kabushiki Kaisha Toshiba | Printed-circuit board and electronic apparatus provided with the same |
US6084780A (en) * | 1996-02-06 | 2000-07-04 | Kabushiki Kaisha Toshiba | Printed circuit board with high electronic component density |
CN108513436A (en) * | 2018-04-27 | 2018-09-07 | 维沃移动通信有限公司 | The circuit board and preparation method thereof of mobile terminal, mobile terminal |
CN108513436B (en) * | 2018-04-27 | 2019-09-27 | 维沃移动通信有限公司 | Mobile terminal, circuit board of mobile terminal and preparation method thereof |
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