JPH04105390A - Substrate mechanism - Google Patents

Abstract

PURPOSE:To make it possible to connect a plurality of substrates with each other at free pitches without imposing constrains on a wiring by a method wherein a second substrate formed into a box type is provided on the upper part of a first substrate with at least one electronic component, which is placed on the upper surface of the first substrate and is electrically connected to the first substrate, other electronic components and the like are placed on this second substrate and are electrically connected to the electronic component on the first substrate and the first and second substrates are electrically connected to each other. CONSTITUTION:A second substrate 3 formed into a box type is provided over an electronic component 2, such as an IC or the like, placed on a first substrate 1 and other electronic components 5 and the like are placed on this substrate 3 formed into a box type. The side surface parts 4 of the box-type substrate are mechanically connected with the other substrate 1 using a solder 6 and the electronic components 5 on the box-type substrate 3 are electrically connected with the component 2 on the other substrate 1. Similarly, the upper surface part 3 and the side surface parts 4 of the box-type substrate 3 are mechanically connected with each other using a solder 7 and the parts 3 and 4 are electrically connected with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a board mechanism that allows high-density mounting and has a configuration in which components can be placed on top of electronic components and the like on the board.

[Prior Art] FIG. 3 is a sectional view showing a schematic configuration of a conventional board mechanism. As shown in FIG. 3, conventionally, when trying to mount other components on the upper surface of the electronic component 11 such as an IC mounted on the board 10, a new component is mounted adjacent to the top of the existing board 10. A high frit board 12 is provided and an electronic component 13 is mounted thereon, and these two boards lO and 12 are soldered to a pattern 15 and a terminal 17 of a high frit IC or the like using a soldering machine 4 through a bottle (not shown). It was configured like an IC.

[Problem to be solved by the invention] However, in the above conventional example, in order to connect two substrates at a predetermined pitch like a high frit IC,
There were some drawbacks such as restrictions on wiring.

The present invention was made to solve this problem, and an object of the present invention is to provide a board mechanism that can connect a plurality of boards with free pitches without imposing restrictions on the wiring.

[Means for Solving the Problems] In order to achieve the above object, the board mechanism of the present invention includes a first board on which at least one electronic component is placed and electrically connected. , a second board forming a box shape is provided, and other electronic components are mounted on this second board. The first substrate and the second substrate are electrically connected to each other.

[Function] According to the present invention, by providing the second substrate forming a box shape in the northern part of the electronic components such as ICs formed on the first substrate, other substrates forming the box shape can be formed. electronic components, etc. can now be placed on the board, and since there are two or more upright sides of the box-shaped second board on the sides of the first board,
This makes it possible to electrically connect parts on the second board and parts on the first board in any pattern. Furthermore, it is also possible to mount components on the side surface of the box-shaped second board, making it possible to further increase the density.

[Example] Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a board mechanism according to an embodiment of the present invention,
FIG. 2 is a sectional view taken along line E in FIG. 1.

In Figures 1 and 2, ■ is an electronic component such as an IC or J!
2 is the electronic component, 3 is the top surface of the box-shaped board, 4 is the side surface of the box-shaped board, 5 is the component IINed on the box-shaped board 3, 6.7 is the solder , 8 is the pattern on the substrate 1, h, and 9 is the pattern on the box-shaped substrate 3.4.

Solder 6 mechanically connects the side surface 4 of the box-shaped board 3.4 to the other board 1, and electrically connects the electronic component 5 on the box-shaped board 3.4 to the electronic component 2 on the other board 1. Connecting. Similarly, the top surface 3 and side surface 4 of the box-shaped substrates 3, 4 are mechanically and electrically connected using solder 7.

[Effects of the Invention] As explained above, the present invention provides a new box-shaped board on top of electronic components such as ICs mounted on a first board, thereby allowing other devices to be placed on the box-shaped board. This has the effect of allowing parts to be placed thereon, and also allowing a pattern to be provided between the box-shaped board and the first board without being restricted by the pitch of IC terminals, etc.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a substrate mechanism according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line E-II in FIG. 1, and FIG. 3 is a sectional view showing a schematic configuration of a conventional substrate mechanism. In the figure. 1.3, 4, 10, 12: Board 2, 5.11.13: Electronic components 6.7.14: Solder 8, 9.15.16: Pattern 17: Terminal agent Patent attorney 1) Haruichi Kitatake Figure 1

Claims (1)

[Claims] A second board forming a box shape is provided on top of the first board on which at least one electronic component is placed and electrically connected, and other electronic parts are placed on the second board. 1. A board mechanism, wherein the first board and the second board are electrically connected to each other.