JPH0410710Y2 - - Google Patents

Description

[Detailed description of the invention] [Summary] A board is provided that has a through hole for fixing the lead terminal of an electronic component, and first and second lands connected to the through hole, and the second land is multilayer printed. By fixing it to a predetermined land on the board and mounting the electronic component through the board, it is possible to easily change the wiring of the electronic component by remodeling, and to improve the mounting efficiency.

[Industrial application field]

The present invention relates to an electronic component mounting structure in which electronic components are mounted on a multilayer printed circuit board via a board, and particularly to an electronic component mounting structure formed so that wiring of the electronic component can be easily changed by modification.

Printed circuit boards, which are widely used in electronic devices, have come to be equipped with high-density LSI elements and other electronic components, and multilayer printed circuit boards have come to be used.

When such an electronic component is modified, it may be necessary to change the connection of the signal line input and output to the lead terminal.

Therefore, it is important that the mounting structure for such electronic components be designed so that wiring can be easily cut and added due to connection changes, and that the mounting efficiency is high.

[Conventional technology]

Conventionally, the configuration was as shown in the conventional explanatory diagram of FIG. In FIG. 3, a is a perspective view, and b is a plan view.

As shown in FIG. 3a, the multilayer printed circuit board 1
An electronic component 2 such as an LSI element to be mounted on the mounting surface 1B is mounted by fixing lead terminals 2A to a reflow pattern 10 provided on the multilayer printed circuit board 1 by soldering.

This reflow pattern 10 is the drawer pattern 1
1, modified pattern 12, and drawer pattern 13
is connected to the through hole 1C via
It is formed so as to be connected to the pattern wiring 1D provided inside the multilayer printed circuit board 1 from the through hole 1C.

Therefore, as shown in b, there are a reflow pattern 10, drawer patterns 11 and 13, and a modified pattern 12 at the location where the electronic component 2 is mounted.
and through holes 1C are arranged, and the electronic component 2
By soldering each lead terminal 2A to the reflow pattern 10, the lead terminal 2A is connected to a predetermined pattern wiring 1D of the multilayer printed circuit board 1.

With this configuration, when it is desired to change the wiring connected to the electronic component 2 by modification, the drawer pattern 13 is cut, the connection with the through hole is cut off, and a new wire is soldered to the modified pattern 12. This makes it possible to change the signals input and output to the lead terminal 2A.

[Problem that the invention attempts to solve]

However, in such a configuration, since the drawer pattern 13 and the modified pattern 12 are provided in the vicinity where the electronic component 2 is mounted, the space occupied by the electronic component 2 is reduced by providing the drawer pattern 13 and the modified pattern 12. , the mounting density is reduced, and the number of electronic components 2 to be mounted on a given multilayer printed circuit board 1 is reduced, resulting in poor mounting efficiency.

[Means for solving problems]

FIG. 1 is a side view of the principle of the present invention.

As shown in FIG. 1, the board 3 includes a through hole 3A to which a lead terminal 2A is fixed, and a first land 3B is provided on one side of the board 3, and a second land 3B is provided on the other side.
A land 3C is provided, and the second land 3C is connected to one end of the through hole 3A via the pattern wiring 4B. By connecting the second land 3C and a predetermined land 1A, electronic The component 2 is mounted via the substrate 3, and the first land 3B is connected to the other end of the through hole 3A via a pattern wiring 4A.

[Effect]

That is, a board having through holes to which lead terminals are fixed is provided, a first land is connected to the through hole by pattern wiring on one side of the board, and a first land is connected to the through hole by pattern wiring on the other side. A second land connected to the substrate is provided, and electronic components are mounted via the substrate.

As a result, if it is necessary to change the connection due to modification, the pattern wiring connected to the second land is cut off, the wiring to be changed is cut, and a new wire is soldered to the first land. By doing this, you can change the connection.

Therefore, on the mounting surface of a multilayer printed circuit board,
It is no longer necessary to provide a drawer pattern and a modification pattern near where electronic components are mounted as in the conventional case.

〔Example〕

The present invention will be explained in detail below with reference to FIG.
FIG. 2 is an explanatory view of an embodiment of the present invention, in which a is a perspective view of the main part and b and c are plan views. The same reference numerals indicate the same objects throughout the figures.

As shown in FIG. 2a, the board 3 has a through hole 3A to which the lead terminal 2A is connected, a first land 3B connected to one of the through holes 3A by the pattern wiring 4A, and a first land 3B connected to the pattern wiring 4A from the other side. A second land 3C connected by a wiring 4B is provided, and the second land 3C is fixed to a predetermined land 1A of the multilayer printed circuit board 1.

In this way, each lead terminal 2A of the electronic component 2 is connected to the through hole 3A of the board 3,
Second land 3C of substrate 3 and multilayer printed circuit board 1
The mounting is performed by fixing the land 1A to the land 1A by soldering or the like.

With this configuration, it is only necessary to provide the land 1A shown in b on the mounting surface 1B of the multilayer printed circuit board 1, and to provide the through hole 3A, the first land 3B, and the pattern wiring 4A shown in C on the board 3. ,
Further, a second land 3C and a pattern wiring 4 are formed on the back surface opposite to the first land 3B and the pattern wiring 4A.
B can be provided.

Therefore, when changing the connection due to remodeling, etc., first cut the pattern wiring 4B at the location shown in a, and then connect the wire 5 to be connected to the new location to the first land 3B at the location. You can do it by doing this.

Further, the land 1A of the multilayer printed circuit board 1 may be formed as a through hole, and the same effect can be obtained in this case as well.

[Effect of idea]

As described above, according to the present invention, electronic components are mounted on a substrate provided with through holes for connecting lead terminals and first and second lands.

As a result, it is only necessary to provide a land or a through hole corresponding to the second land on the multilayer printed circuit board 1, and there is no need to create a modified pattern as in the conventional case.

Therefore, the space occupied by electronic components can be reduced, the packaging density can be improved, and the practical effects are great.

[Brief explanation of the drawing]

Fig. 1 is a side view of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment of the present invention, and a is a perspective view of the main parts;
b and c are plan views, FIG. 3 is a conventional explanatory view, a is a perspective view, and b is a plan view. In the figure, 1 is a multilayer printed circuit board, 2 is an electronic component, 3 is a board, 4A and 4B are pattern wiring, 1
A is a land, 2A is a lead terminal, 3A is a through hole, 3B is a first land, 3C is a second land, and 1B is a mounting surface.

Claims (1)

[Claims for Utility Model Registration] Mounting of an electronic component mounted on the mounting surface 1B of the multilayer printed circuit board 1 such that the lead terminal 2A of the electronic component 2 has electrical continuity with a predetermined land 1A of the multilayer printed circuit board 1. The structure includes a substrate 3 having a through hole 3A to which the lead terminal 2A is fixed, a first land 3B on one side of the substrate 3, a second land 3C on the other side, A second land 3C is connected to one end of the through hole 3A via a pattern wiring 4B, and by connecting the second land 3C and the predetermined land 1A, the electronic component 2 can be mounted on the board. 3
An electronic component mounting structure characterized in that the first land 3B is connected to the other end of the through hole 3A via a pattern wiring 4A.