JPH06342964A - One-side printed circuit board - Google Patents

Abstract

PURPOSE:To prevent generation of noise due to electromagnetic induction by crossing a pair of wiring patterns formed on a one-side printed circuit board through surface mounting components at each predetermined zone. CONSTITUTION:A one-side printed circuit board comprises a pair of wiring patterns 3a, 3b formed parallel to one surface of a board 2, wherein the one pattern 3a is crossed to the other pattern 3b through a surface mounting component 4 having a resistance of 0OMEGA at each predetermined zone. Further, the pattern 3a is disposed upside down to a pattern surface of the board 2 to the other pattern 3b at intersections P1, P2. Thus, electromagnetic fields generated by signal currents of the patterns cancel each other thereby to prevent generation of noise.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having a wiring pattern formed on one surface thereof, and more particularly to the structure of the wiring pattern.

[0002]

2. Description of the Related Art Generally, a double-sided printed wiring board having a high packaging density is often used as a circuit board mounted in an electronic device, but in the case of an audio device, the product cost is kept as low as possible. A single-sided printed wiring board may be used. In such a case, when two wiring patterns are arranged in parallel on the substrate, noise due to electromagnetic induction is generated. As a means for avoiding this, conventionally, as shown in FIG.
As shown in FIG. 3, a so-called twisted pair wire in which two covered conductive wires 1a and 1b are twisted together to form a set is mounted on the substrate.

[0003]

However, in the conventional single-sided printed wiring board described above, due to the difficulty in handling the twisted pair wire, it cannot be automatically mounted on the board like other mounting components. Therefore, of the components mounted on the board, only the twisted pair wires need to be mounted on the lands and through holes provided on the board by soldering work.This soldering work is very troublesome and single-sided printing is required. This has been a factor that significantly deteriorates the assemblability of the wiring board.

The present invention has been made to solve the above problems, and an object thereof is to provide a single-sided printed wiring board which prevents noise due to electromagnetic induction between wirings and is excellent in assembling.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above object, and in a single-sided printed wiring board in which at least a pair of wiring patterns parallel to each other are formed on one surface of a substrate, one wiring The pattern and the other wiring pattern intersect each other at predetermined intervals with a surface mount component having a resistance of 0Ω. Further, the above-mentioned one wiring pattern and the other wiring pattern have the vertical relationship inverted with respect to the pattern surface of the substrate at the intersections thereof.

[0006]

In the single-sided printed wiring board of the present invention, one wiring pattern and the other wiring pattern intersect with each other at predetermined intervals via the surface-mounting component, and therefore are generated by the signal current of each wiring pattern. The electromagnetic fields cancel each other out to prevent noise generation.

[0007]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a plan view of an essential part for explaining a first embodiment of a single-sided printed wiring board according to the present invention. In the illustrated single-sided printed wiring board, the board 2
A pair of wiring patterns 3a and 3b which are parallel to each other are formed on the top. The one wiring pattern 3a and the other wiring pattern 3b have a resistance of 0Ω for each predetermined section L.
Of the surface mount component, for example, a 0Ω chip resistor (hereinafter, simply referred to as a chip resistor) 4 crosses each other.

Next, an example of manufacturing the single-sided printed wiring board of the first embodiment will be described. First, a pair of wiring patterns 3a and 3b is printed on a substrate 2 made of an insulating material, for example.
To form. At this time, one wiring pattern 3a is formed in a continuous waveform, and in parallel with this, the other wiring pattern 3b is formed in a discontinuous arc shape. Is formed. Subsequently, the chip resistor 4 is temporarily attached onto the land of the other wiring pattern 3b via a solder paste, and then the chip resistor 4 and the land are joined by reflow soldering. As a result, a single-sided printed wiring board as shown in FIG. 1 is obtained.

As described above, in the single-sided printed wiring board of the first embodiment, the one wiring pattern 3a and the other wiring pattern 3b intersect each other through the chip resistor 4 at every predetermined section L. These wiring patterns 3a, 3b
Since signal currents of the same magnitude and opposite directions (phases) will flow through, the electromagnetic fields generated by the signal currents will act to cancel each other, thereby preventing the generation of noise due to electromagnetic induction. It In the configuration of the first embodiment, the pair of wiring patterns 3a, 3a formed on the substrate 2
Since b is crossed by the chip resistor 4 which is a surface mount component, all components mounted on the substrate 2 can be automatically mounted by a mounter device or the like.

FIG. 2 is a plan view of an essential part for explaining a second embodiment of the single-sided printed wiring board according to the present invention. In the configuration of the single-sided printed wiring board shown in the figure, one wiring pattern 3 formed on the substrate 2 as in the above embodiment.
a and the other wiring pattern 3b have a resistance of 0 at predetermined intervals.
Ohmic surface-mount components, that is, the chip resistors 4 intersect each other, and the intersection, that is, the chip resistor 4
In the mounting portion, the vertical relationship between the two wiring patterns 3a and 3b is reversed with respect to the pattern surface of the substrate 2.

That is, at the intersection of P1 in the figure, one wiring pattern 3a passes under the other wiring pattern 3b connected by the chip resistor 4, and P2 in the figure following it.
On the other hand, since the other wiring pattern 3b passes under the one wiring pattern 3a connected by the chip resistor 4 on the contrary, at the intersection of P1 in the drawing and the intersection of P2 in the drawing, The vertical relationship of both wiring patterns 3a and 3b is reversed.

As described above, in the single-sided printed wiring board of the second embodiment, not only one wiring pattern 3a and the other wiring pattern 3b simply intersect, but also each wiring pattern 3a at the intersection. Since a so-called twisted pair structure in which the vertical relation of 3b is also inverted, higher noise resistance characteristics can be obtained.

[0013]

As described above, according to the single-sided printed wiring board of the present invention, since the pair of wiring patterns formed on the substrate cross each other at predetermined intervals via the surface mount component, The electromagnetic fields generated by the signal currents of the wiring patterns cancel each other out, which makes it possible to prevent the generation of noise due to electromagnetic induction. Further, in addition to this, the single-sided printed wiring board of the present invention has a so-called twisted pair structure in which the vertical relationship between the patterns is reversed at the intersections of the wiring patterns, so that the wiring patterns are simply crossed. Also, good noise resistance characteristics can be obtained. Furthermore, since the wiring patterns are made to intersect each other with surface mount components, it becomes possible to automatically mount all the components mounted on the board.
This makes it possible to significantly improve the assembling property of the single-sided printed wiring board. As a result, it is possible to increase the component mounting density and reduce the manufacturing cost of the wiring board itself, as compared with the conventional case where the twisted pair wires are mounted.

[Brief description of drawings]

FIG. 1 is a plan view of relevant parts for explaining a first embodiment of a single-sided printed wiring board according to the present invention.

FIG. 2 is a main part plan view for explaining a second embodiment of the single-sided printed wiring board according to the present invention.

FIG. 3 is a diagram for explaining a conventional example.

[Explanation of symbols]

 2 Substrate 3a One wiring pattern 3b The other wiring pattern 40 Ω Chip resistor (surface mount component)

Claims (2)

[Claims] 1. A single-sided printed wiring board in which at least a pair of wiring patterns parallel to each other are formed on one surface of a substrate, and one wiring pattern and the other wiring pattern are surface-mounted components having a resistance of 0Ω at predetermined intervals. A single-sided printed wiring board, which is characterized by intersecting through. 2. The one-sided printed wiring according to claim 1, wherein the one wiring pattern and the other wiring pattern are inverted in vertical relationship with respect to a pattern surface of the substrate at an intersection thereof. Board.