JP2675135B2 - Structure of hybrid integrated circuit components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention uses a laminated body having at least one of a capacitor network and an inductor network built-in as a substrate, and wiring is provided on one side or both sides of the substrate. The end portion of the wiring is connected through a terminal provided on the side surface of the substrate, and the hybrid integrated circuit component mounted on the substrate by soldering the electronic component on the wiring is described in detail. The present invention relates to a structure for preventing outflow to the side surface of a terminal.

(Prior Art) As shown in FIG. 5, a capacitor network 3 formed by laminating a conductor film 1 and a dielectric 2, a conductor film 4, and a magnetic body 5.
And an inductor network 6 formed so that the conductor film 4 is formed into a coil shape or a spiral shape, or an integrated circuit component having a substrate 7 having a laminated body containing one of the networks. In the above, the wiring 8 and the resistance circuit 9 are formed on one or both sides of the substrate 7 by thick film printing, and the end of the conductor film 1 or 4 exposed on the side surface of the substrate and the wiring 8 are connected to the substrate 7. Terminals formed so as to wrap around from the side surface to the surface
They were connected by 10 to form a circuit. Further, as shown in FIG. 6, a soldering land 8a is provided on a part of the wiring 8, and as shown in FIG. 7, an electronic component 11 such as an IC or a transistor has an electronic component 11 on the land 8a. It was mounted on the substrate 7 by connecting the terminals 12 of the above with solder 13.

(Problems to be Solved by the Invention) However, with the recent progress in miniaturization and high density of ICs, the width and interval of the wiring 8 are becoming smaller year by year, and efforts are being made to make the length as short as possible. For this reason, how to further reduce the size of the board 7 itself or how many components are densely mounted in order to incorporate many functions on the board has become important.

By the way, according to the conventional structure, the land 8a must be formed at a position separated from the wraparound portion of the terminal 10 by a certain distance. The reason is as shown in FIG.
When 8a is provided close to the terminal 10, the solder 13 travels along the wiring 8 and is placed on the terminal 10 on the side surface of the substrate in the process of heating and melting the cream solder to connect the terminal 12 to the land 8a.
As shown in 13a, the solder 13a flows out and adheres, and the solder 13a adhered to the side surface locally projects the part to change the outer dimensions of the entire board 7, and when the board 7 is mounted on another board. This is because the accuracy of handling is deteriorated.

From such a point, as shown in FIG.
The distance L1 from the electronic component 11 to the side surface of the substrate 7 becomes large, and the substrate 7 needs to be widened correspondingly, which is a cause of hindering miniaturization and high density.

In view of the above-mentioned problems of the prior art, it is an object of the present invention to provide a structure of a hybrid integrated circuit component in which electronic components can be mounted close to the side surface of a substrate and miniaturization and high density can be achieved. .

(Means for Solving the Problems) In order to achieve the above-mentioned object, the present invention uses a laminated body containing a capacitor network and / or an inductor network as a substrate, and provides wiring on one side or both sides of the substrate. In a hybrid integrated circuit component in which an end portion of the wiring is connected through a terminal provided on a side surface of the substrate and an electronic component is soldered on the wiring and mounted on the substrate, the electronic component is connected to the wiring. A dam is provided on the surface of the terminal to prevent solder from flowing out to the side surface of the terminal.

(Operation) In the present invention, since the dam that prevents the solder from flowing out is provided on the surface of the terminal that is provided so as to wrap around from the side surface of the board to the surface, even if the land is provided close to the side surface of the board, the melting The dam prevents the solder from flowing out to the side surface of the substrate.

(Embodiment) FIG. 1 is a sectional view showing an embodiment of the structure of a hybrid integrated circuit component according to the present invention, and the same reference numerals as those in FIGS. 5 to 8 indicate the same components or parts. In FIG. 1, 14 is a side surface of the terminal 10 of the solder 13 for connecting the electronic component 11 to the wiring 8,
As shown in the perspective view of FIG. 2, the dam 14 is a dam for preventing the outflow to the terminal, and the dam 14 is made of a material having no affinity for solder such as a resist made of resin or glass. It is formed by thick film printing on the surface of.

If such a dam 14 is provided, molten solder may flow out to the side surface of the terminal 10 when the terminal 12 of the electronic component 11 is connected to the land 8a by the solder 13 as shown in the perspective view of FIG. The area of the solder 13 is regulated, which is prevented by the dam 14.

Therefore, as shown in FIG. 2, the length of the wiring 8 can be shortened and the land 8a can be provided at a position close to the side surface of the substrate 7. As a result, the distance L2 to the electronic component 11 can be shortened. In addition, since the distance L2 can be shortened, the design rule for component placement is expanded, and it becomes possible to mount a large electronic component 11 or a plurality of electronic components 11 on the board 7, which enables high-density mounting. It will be possible. Further, since the space between the side surface of the substrate 7 and the electronic component 11 can be narrowed, it is not necessary to unnecessarily widen the substrate 7, and miniaturization can be achieved.

FIG. 4 is a plan view showing another embodiment of the present invention. As the terminals 12 of the mounting component 11, for example, when four terminals 12A are newly added to four corners to increase the function, a new terminal is provided. 12A
The terminal 10A connected to the new wiring 8A that connects
Dams 14A on the surface of terminal 10A
Wiring of terminal 12A without solder flowing out by providing
It becomes possible to make a connection by soldering to. Therefore, the design of the electronic component 11 can be changed without changing the size or format of the substrate 7.

The present invention provides a surface mount type multilayer inductor network on a multilayer capacitor network,
Alternatively, it can be applied to the case of mounting in the opposite form, and in any case, the effects described above can be obtained.

(Effect of the Invention) According to the present invention, the dam that prevents the solder that connects the electronic component to the wiring on the substrate from flowing out to the side surface portion of the terminal is provided on the surface of the terminal. It is prevented that the solder flows out to the side surface of the terminal and the solder area is regulated by the dam. Therefore, it is not necessary to make a large space between the electronic component and the side surface of the substrate, the size of the substrate can be reduced, and the electronic component can be mounted close to the side surface of the substrate. High density mounting is possible. Further, since the terminals of the electronic component can be soldered close to the side surface of the board, a new component can be economically realized while keeping the size and type of the existing board.

[Brief description of the drawings]

1 is a sectional view showing an embodiment of a hybrid integrated circuit component according to the present invention, FIG. 2 is a perspective view showing an example of forming a dam according to the present invention, and FIG. 3 is an electronic component using the component shown in FIG. FIG. 4 is a plan view showing another embodiment of the present invention, FIG. 5 is a sectional view showing the structure of a conventional hybrid integrated circuit component, and FIG. FIG. 7 is a perspective view showing a wiring for mounting a component, FIG. 7 is a perspective view showing a state where an electronic component is soldered using the component shown in FIG. 6, and FIG. 8 is a state where the electronic component is soldered close to a side surface of a board. FIG. 3: Capacitor network, 6: Inductor network, 7: Substrate, 8: Wiring, 8a: Land, 10: Terminal, 11: Electronic component, 12: Terminal, 13: Solder, 14: Dam

Claims (1)

(57) [Claims] 1. A laminated body having a capacitor network and / or an inductor network built-in is used as a substrate, wiring is provided on one side or both sides of the substrate, and an end portion of the wiring is passed through a terminal provided on a side surface of the substrate. Connect
In a hybrid integrated circuit component in which an electronic component is soldered on the wiring and mounted on a substrate, a dam that prevents the solder connecting the electronic component to the wiring from flowing out to the side surface portion of the terminal is provided. Structure of a hybrid integrated circuit component characterized by being provided on the surface.