JPH0430590A - Wiring board - Google Patents

Abstract

PURPOSE:To make it possible to distribute a wire between a pair of lands without a short circuit through conductive paste by making recessions independently close to and along the sides of the lands opposite to each other. CONSTITUTION:A conductive pattern is formed on a substrate 1, a pair of lands 2 and a wiring 3 are made, and strip-shaped recessions 4 surrounded by the conductive pattern are made in the lands 2 along their sides opposite to each other. conductive paste 5 squeezed out to between the lands 2 by mounting a chip part 6 thereon stays in the recessions 4 and does not reach the wiring 3, the wiring 3 can be arranged between the lands 2 without short circuit, and high-density packaging is achieved. If for example a 2mm long chip capacitor is mounted, up to two 0.1mm wide wirings can be arranged at a distance of 0.1mm without short circuit even if the land patterns having the recessions in the peripheries are 0.6mm or less distant from each other.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a wiring board, The present invention relates to a wiring board to be mounted.

[Conventional technology]

In particular, the chip component mounting land on a conventional wiring board on which chip components are mounted is the fourth
As shown in FIGS. (a) and (b), a pair of lands 22 are placed on the substrate 1 so that they simply face each other across the exposed surface of the substrate 1.
The surface was flat with no irregularities.

[Problem to be solved by the invention]

In this conventional wiring board, when connecting small chip parts with a length of 2 mm or less to the wiring board using conductive paste instead of soldering such as solder reflow due to the heat resistance of the parts used and problems in the process. By printing or dispensing,
Conductive paste is supplied onto the land of the wiring board to provide sufficient connection strength, and chip components are mounted on top of this. At this time, the conductive paste below the chip component is pushed out, and even if the supply position of the conductive paste and the land dimensions 9 positions are optimized, the surface of the board 1 between the lands 22 as shown in FIG. There is a problem that something flows upward, and in extreme cases, a short circuit occurs between the lands 22 due to the conductive paste 5.

However, in such a state, it was impossible to run wiring between the lands 22.

An object of the present invention is to provide a wiring board that allows wiring to be passed between lands without causing short circuits between lands due to conductive paste.

[Means to solve the problem]

The present invention provides the following features: 1. In a wiring board having a pair of lands on which chip components are mounted, independent recesses are provided near opposing sides of each of the pair of lands and along the opposing sides.

2. Wiring is formed between opposing sides of each of the pair of lands.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1(a) and 1(b) are a plan view and a sectional view taken along the line AA' of a land according to a first embodiment of the present invention.

The first embodiment, as shown in FIGS. 1(a) and (b),
A conductive pattern is formed on the substrate 1, and a pair of lands 2. A rectangular recess 4 surrounded by a conductor pattern is formed in the land 2 on the inside of the opposing sides of each land 2 that constitutes the wiring 3 and faces each other.

FIG. 2 is a sectional view of chip components mounted on the wiring board of FIGS. 1(a) and 1(b) using conductive paste.

As shown in FIG. 2, the conductive paste 5 pushed out between the lands 2 by placing the chip component 6 from above stays in the recess 4 and does not reach the wiring 3 and cause a short circuit. 3 can be passed through, and high-density packaging can be achieved.

For example, if the structure shown in Fig. 2 is applied to a wiring board on which a chip capacitor with a length of 2 mm is mounted, there will be no short circuit and no .1mm wide wiring 0.1m
A maximum of 2 wires can be passed at m intervals.

FIGS. 3(a) and 3(b) are a plan view and a sectional view taken along the line BB' of a land according to a second embodiment of the present invention.

The second embodiment, as shown in FIGS. 3(a) and (b),
A conductor pattern is formed on the substrate 1, and the surface of the substrate 1 immediately inside the opposing sides of the respective opposing lands 2 is counterboiled into a rectangular groove shape to form a recess 14.

A wiring 3 is drawn on the substrate 1 sandwiched between the two recesses 14.

In this embodiment, as in the first embodiment, the conductive paste 5 pushed out to the inside of the land stays in the recess 14, thereby preventing short circuits.

〔Effect of the invention〕

As explained above, in the present invention, independent recesses are formed near the opposite sides of a pair of lands along the opposite sides, so that the conductive paste pushed out between the lands when chip components are mounted is It does not stay in the recess and flow between the lands, causing a short circuit or increasing leakage current, and also allows wiring to be passed between the lands, thereby achieving high-density packaging.

[Brief explanation of drawings]

FIGS. 1(a) and (b) are a plan view and a cross-sectional view taken along the line A-A' of the land of the first embodiment of the present invention, and FIG. 2 is the same as FIG. 1(a).
, (b) is a cross-sectional view of a wiring board in which a chip component is mounted using a conductive paste, and FIGS. 4(a) and 4(b) are a plan view and a sectional view taken along line c-c' of an example of a land of a conventional wiring board, and FIG. 5 is FIG. 4(a). FIG. 3B is a cross-sectional view of the wiring board in which chip components are mounted using conductive paste. 1... Substrate, 2. '12, 22...land, 3...
・Wiring, 4.14... recess, 5... conductive paste,
6...Chip parts.

Claims (2)

[Claims] 1. A wiring board having a pair of lands on which chip components are mounted, characterized in that independent recesses are provided near opposing sides of each of the pair of lands along the opposing sides. 2. 2. The wiring board according to claim 1, wherein wiring is formed between opposing sides of each of the pair of lands.