JPH0611522Y2 - Laminated circuit board device - Google Patents

Description

[Detailed description of the device]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated circuit board device formed by laminating wiring boards and configured as a surface mounting hybrid IC.

[Prior art]

FIGS. 7 and 8 show the appearance of a conventional laminated circuit board device of this type. In recent years, there has been an increasing demand for higher density packaging of hybrid ICs. However, since there is a limit to making the wiring patterns on both main surfaces of the circuit board dense, a plurality of circuit boards on which circuit wiring patterns (not shown) are formed are laminated to form the laminated circuit board 1. Then, the wiring patterns of the laminated circuit boards are connected by through holes, and the electrode pads 13 are formed on the edges of the laminated circuit board 1, and the metal fittings 14 are fitted therein to electrically connect them, and external connection is made. The terminal electrode for was provided. In this case, the terminal electrode fittings 14 are fitted so as to sandwich the edges of the laminated circuit board 1 from both sides.

[Problems that the device is trying to solve]

When the terminal electrode fitting 14 is attached to the laminated circuit board 1, the terminal electrode fitting 14 is fitted into the electrode pad 13 as shown in FIGS. 7 and 8 and melted in this state. Immersed in solder. However, in this case, the metal fitting 14 for the terminal electrode fitted in the portion of the electrode pad 13 may be displaced due to the pressure of the solder or the like. Then, the connection between the electrode pad 13 and the metal fitting 14 becomes defective, or the connection between the terminal electrode and the electrode land on the parent board becomes defective. In view of the above conventional problems, the present invention is to provide a laminated circuit board device in which a terminal electrode can be attached to a predetermined position of the laminated circuit board.

[Means for Solving the Problems]

The present invention provides the following means in order to achieve the above object. That is, in a laminated circuit board device having a laminated board 1 formed by laminating circuit boards 2 and 3 on which wiring patterns are formed, and a terminal electrode attached to an edge portion of the laminated board 1, the laminated board 1 comprises: Notches 6, 7 with different depths of cut on the edge
A multi-layer circuit board in which two types of circuit boards 2 and 3 having the above are alternately laminated so that the cutouts 6 and 7 overlap each other, and the terminal electrode is formed by the cutouts 6 and 7 of the circuit boards 2 and 3. The laminated circuit board device is characterized in that it is formed by fitting a metal fitting 10 having irregularities corresponding to the step into the recess having the step.

[Action]

In the laminated circuit board device according to the present invention, two kinds of circuit boards 2 and 3 having notches 6 and 7 having different cut depths at the edges are alternately laminated so that the notches 6 and 7 overlap each other to form the laminated circuit board 1. Since it is configured, a concave portion in which a step is formed for each of the circuit boards 2 and 3 is formed at the edge of the laminated circuit board 1.
A metal fitting 10 having an unevenness corresponding to the step in the recess
By fitting, the metal fitting 10 can be fitted so as not to move in the direction along the edge of the laminated circuit board 1 and in the thickness direction thereof. Therefore, when soldering this, the metal fitting 1
0 does not move, and the terminal electrode can be accurately formed at a predetermined position of the laminated circuit board 1.

【Example】

Next, an embodiment of the present invention will be specifically described with reference to the drawings. As shown in FIG. 3, a first circuit board 2 having a rectangular first notch 6 at the lower edge and a second circuit board 3 having a notch 7 deeper than the notch 6 are prepared. In this case, cutout 6
Both 7 and 7 are formed at equal intervals. Also,
As shown in FIG. 4, the first and second circuit boards 2, 3
A wiring pattern is formed on the main surface of the conductor layers 4 and 5, and the conductor layers 4 and 5 on the respective main surfaces are led out into the notches 6 and 7, and for example, as shown in FIG. Conductor layers 4 and 5 are also formed in succession on the surfaces 8 and 9 of the conductor layers 7 and 7. The conductor layer 5 formed on the edge of the cutout of the first circuit board 1 is a rectangular electrode land. Then, as shown in FIGS. 3 and 4, the first circuit board 2 is sandwiched between the second circuit board 3 and the second circuit board 3 on both sides thereof.
3 are laminated to form a laminated circuit board 1. in this case,
As shown in FIG. 4, the circuit boards 2 and 3 are overlapped so that the notches 6 and 7 overlap each other. As shown in FIGS. 1 and 2, a concave portion is formed by the notches 6 and 7 in the lower edge portion of the laminated circuit board 1 laminated in this way, and the concave portion of the first circuit board 2 is formed in this concave portion. A step portion is formed due to a difference in depth between the notch portion 6 and the notch portion 7 of the second circuit board 3. Conductor films 4 and 5 which are electrically connected to any of the wiring patterns of the circuit boards 2 and 3 are formed on all the planes forming the step portion. In the embodiment shown in FIG. 1, the first and second wiring boards 2, 3
The conductor layers 4 and 5 are electrically connected to each other in the recess, but when it is not necessary to conduct electricity, for example, the conductor is provided only inside the notches 6 and 7 of the first or second circuit boards 2 and 3. The layer 4 or 5 may be formed. Further, the metal fitting 10 as shown in FIGS. 1 and 2 is inserted into the concave portion of the multilayer circuit board 1 and soldered, and this is used as a terminal electrode. The metal fitting 10 serving as the terminal electrode has a width slightly narrower than the width of the notches 6 and 7, and has a side wall U-shape having a recess 11 on the upper surface.
The first circuit board 2 having a shallow depth is inserted into the recess of the laminated circuit board 1 so as to sandwich the edge of the first circuit board 2. The metal fitting 10 for the terminal electrode and the conductor layers 4, 5 of the multilayer circuit board 1 are connected by bringing the lower end surface of the laminated circuit board 1 into contact with molten solder. At this time, due to the capillary phenomenon, the paste-like solder penetrates into the recess through the gap between the metal fitting 10 and the laminated circuit board 1, and the conductor devices 4, 5 and the metal fitting 10 are soldered. Another embodiment of the present invention is shown in FIGS. In this embodiment, the first circuit boards 2 and 2 having shallow notches 6 and 6 and the second circuit boards 3 and 3 having deep notches 7 and 7 are alternately laminated to form a laminated circuit board 1. is doing. in this case,
The metal fitting 10 for forming the terminal electrode is also the laminated circuit board 1
The shape that matches the step formed in the concave portion is used.

[Effect of device]

As is clear from the above description, according to the present invention, when the metal fitting 10 is soldered by bringing the lower end surface of the laminated circuit board 1 into contact with the melted solder in the manufacturing process to provide the terminal electrode, the metal fitting 10 is Since the solder is accurately soldered to a predetermined position without being displaced, it is possible to provide a laminated circuit board device in which poor connection is unlikely to occur.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view of a metal part of a laminated circuit board device which is a first embodiment of the present invention, and FIG. 2 is a metal part of a laminated circuit board device which is the first embodiment. 3 is an exploded perspective view showing a laminated state of the circuit boards of the laminated circuit board device of the first embodiment, FIG.
FIG. 5 is a vertical sectional side view of a main part showing a laminated state of a circuit board of the laminated circuit board device of the first embodiment, and FIG. 5 is an exploded view of a metal fitting of the laminated circuit board device of the second embodiment. FIG. 6 is an exploded perspective view showing a laminated state of circuit boards of the laminated circuit board device of the first embodiment, and FIG. 7 is an external perspective view of a conventional laminated circuit board device. , Fig. 8 shows
It is a principal part side view of the same conventional laminated circuit board apparatus. DESCRIPTION OF SYMBOLS 1 ... Laminated circuit board, 2 ... 1st circuit board, 3 ... 2nd circuit board, 4, 5 ... Conductor layer, 6 ... Notch of 1st circuit board,
7 ... Notch of second circuit board, 10 ... Metal fitting for terminal electrode

Claims (1)

[Scope of utility model registration request] 1. A laminated circuit board device comprising: a laminated board 1 formed by laminating circuit boards 2 and 3 on which wiring patterns are formed; and a terminal electrode mounted on an edge of the laminated board 1. 1 is a notch 6 having different depths of cut at the edge,
A laminated circuit in which two types of circuit boards 2 and 3 having 7 are alternately laminated so that the notches 6 and 7 overlap, and the terminal electrode is formed at the notches 6 and 7 of the circuit boards 2 and 3. A laminated circuit board device, which is formed by fitting a metal fitting 10 having irregularities corresponding to the step into a recess having a step of the substrate 1.