JPH0677351A - Semiconductor mounting board - Google Patents

Abstract

PURPOSE:To enable a plurality of packages to be mounted in high density on a board and enable the mounting of another different kind of semiconductor or circuit element, too, by loading a plurality of package semiconductors into multistage. CONSTITUTION:This semiconductor mounting board is constituted by mounting a plurality of package semiconductors 2 such as package ICs, etc., on a board 9. Moreover, for the package semiconductor 2, a plurality of terminal pins 3 are arranged in matrix shape on one side of a package with a built-in semiconductor bare chip. Especially, a plurality of package semiconductors 2 are loaded in such a manner as to insert a plurality of terminal pins 3 of a separate package semiconductor 2 into a plurality of openings 4 of a package semiconductor 2. Hereby, package semiconductors 2 can be mounted in higher density than before.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mounting board on which a plurality of package semiconductors are mounted.

[0002]

2. Description of the Related Art In a conventional semiconductor mounting board, circuit elements such as resistors, capacitors and transistors, and package semiconductors such as package ICs are mounted on a board on which a circuit pattern is laid directly by soldering or through a plug connector. It is configured.

[0003]

However, conventionally, in order to mount a plurality of package semiconductors on a substrate, the board requires an occupied area corresponding to the number of package semiconductors mounted. Therefore, the number of package semiconductors mounted is required. Therefore, the size of the substrate has inevitably increased.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor mounting substrate on which package semiconductors are mounted at a higher density than in the conventional case.

[0005]

In order to solve the above problems, the present invention provides a plurality of terminal pins arranged on one surface of a package and an opening on the other surface of the package and the terminal pins. A semiconductor in which a plurality of package semiconductors, each of which is an electrically connected opening hole and has a plurality of opening holes arranged in the package corresponding to the arrangement positions of the plurality of terminal pins, are mounted. In the mounting substrate, a plurality of package semiconductors are loaded by inserting a plurality of terminal pins of a separate package semiconductor into the plurality of opening holes of the package semiconductor, respectively.

[0006]

By stacking a plurality of package semiconductors in multiple stages, a plurality of packages can be mounted on the substrate at a high density.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings showing its embodiments.

FIG. 1 is a perspective view of an essential part of a semiconductor mounting board according to an embodiment of the present invention, and FIG. 2 is an enlarged sectional view of an essential part of the semiconductor mounting board. The semiconductor mounting substrate is constructed by stacking a plurality of package semiconductors 2 such as package ICs and mounting them on a substrate 9.

The package semiconductor 2 has, for example, as shown in FIG. 1, a plurality of terminal pins 3 arranged in a matrix on one surface of a package 8 having a semiconductor bare chip built therein. In the package 8, the terminal pins 3 corresponding to the matrix arrangement of the plurality of terminal pins 3 are provided.
A plurality of opening holes 4 are provided so as to open on the surface opposite to the arrangement surface of. Further, as shown in FIG. 2, metal plating 7 of copper, nickel, gold or the like is applied to the inner surface of the opening 4 and the vicinity of the opening, and the metal plating 7 is a semiconductor bare chip built in a package 8. (Not shown). As shown in FIG. 2, the terminal pin 3 is press-fitted into the opening hole 4, fixed with solder 6, and electrically connected to the metal plating 7.

The semiconductor mounting substrate 1 includes a plurality of terminal pins 3 of a package semiconductor 2 which are connected to another package semiconductor 2 respectively.
The plurality of package semiconductors 2 are stacked in multiple stages by being fitted into each of the plurality of opening holes 4. This stacking method will be described. Thermosetting cream-like solder 6 is injected into each of the opening holes 4 of the lower package semiconductor 2 as needed, and metal is applied to each of the terminal pins 3 of the upper package semiconductor 2. A spacer 5 having a conductive property, and each terminal pin 3 of the upper package semiconductor 2 is fitted into each opening hole 4 of the lower package semiconductor 2,
Further, the creamy solder 6 is laid on the terminal pins 3 and the metal plating 4. In this way, a plurality of package semiconductors 2 are stacked, and finally the reflow process is performed to thermally cure the creamy solder 6.

The semiconductor mounting board 1 having the above-described structure can be applied to circuit boards for various purposes, but it is possible to realize high density mounting of a circuit board for a computer which requires high density mounting.

[0012]

According to the present invention configured as described above, by mounting a plurality of package semiconductors, the package semiconductors can be mounted on a substrate at a high density, and further different types of semiconductors and circuit elements can be mounted. In addition to being able to be mounted, semiconductors and circuit elements can be mounted at high density even on a substrate having a small area.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part showing a semiconductor mounting substrate according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view of an essential part showing a semiconductor mounting board according to an embodiment of the present invention.

[Explanation of symbols]

 1 semiconductor mounting substrate 2 package semiconductor 3 terminal pin 4 opening hole 8 package 9 substrate

Claims (1)

[Claims] 1. A plurality of terminal pins arranged on one surface of a package, and opening holes opened on the other surface of the package and electrically connected to the terminal pins, wherein the plurality of terminal pins are provided. Of a plurality of package semiconductors having a plurality of opening holes arranged in the package corresponding to the arrangement positions of the package semiconductors. A semiconductor mounting board, characterized in that a plurality of terminal pins of a package semiconductor of a body are respectively inserted and a plurality of package semiconductors are loaded.