WO1991005369A1 - Heatsink for semiconductor devices - Google Patents

Heatsink for semiconductor devices Download PDF

Info

Publication number
WO1991005369A1
WO1991005369A1 PCT/GB1990/001482 GB9001482W WO9105369A1 WO 1991005369 A1 WO1991005369 A1 WO 1991005369A1 GB 9001482 W GB9001482 W GB 9001482W WO 9105369 A1 WO9105369 A1 WO 9105369A1
Authority
WO
WIPO (PCT)
Prior art keywords
heatsink
aluminium
circuit board
portions
solder
Prior art date
Application number
PCT/GB1990/001482
Other languages
French (fr)
Inventor
Robin Douglas Johnson
Original Assignee
Redpoint Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Redpoint Limited filed Critical Redpoint Limited
Publication of WO1991005369A1 publication Critical patent/WO1991005369A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10878—Means for retention of a lead in a hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Definitions

  • the present invention relates to aluminium heatsinks for semiconductor devices, of the type in which said semiconductor devices include solderable means arranged to be soldered to a circuit board with tin/lead solder.
  • heatsinks in the electronics art is very well known and essentially consists of increasing the surface area of a heat-dissapating device, using a material with good thermal conduction properties.
  • the material most commonly used for fabricating heatsinks is aluminium and a suitable shape may be obtained by either pressing aluminium plate or extruding the heated material through a die.
  • an aluminium heatsink comprising means for receiving a semiconductor device, said semiconductor device including solderable means arranged to be soldered to a circuit board with tin/lead solder; characterised by securing means arranged to secure said heatsink to said circuit board, wherein said securing means is a portion of said aluminium heatsink arranged to securably engage with said circuit board.
  • An advantage of the invention is that it allows heatsinks to be included in the design of a circuit, after the main circuit design has been completed.
  • Heatsinks may be applied to active components at any position on the circuit board and the designer is not restrained by having to place all active, ie. heat- dissipating, components at positions determined by their respective heatsinks.
  • the heatsink is secured to the circuit board by a portion of the heatsink which extends downwards in the same direction as the electrical contacts of the electronic device.
  • the circuit designer need only provide additional holes for securing the heatsink, in a similar way to which holes are provided for the electrical contacts, which are used to restrain the heatsink, thereby taking the weight of the heatsink away from the electrical contacts by providing its own support means.
  • two portions of aluminium form the securing means and each of said portions are coated with solder, allowing them to be soldered into the circuit board.
  • the heatsink may be soldered to the circuit board during the operation for soldering the electrical contacts to said circuit board.
  • said portions are coated with aluminium solder, onto which conventional tin/lead solder may be applied, providing the advantage of allowing electrical contacts and heatsink portions to be soldered to the circuit board during a common operation, as performed during the mass production of circuit boards.
  • said portions of said heatsink include means for engaging into respective holes in a circuit board to provide an interference fit, thereby securing said heatsink to the circuit board.
  • said securing means is an angled tine, facilitating the entry of said portion into said hole, whereafter said tine prevents removal of said portion from said hole.
  • Figure 2 shows an alternative means for connecting a heatsink to a circuit board.
  • An aluminium heatsink 15 is shown in Figure 1, fabricated by cold- pressing a piece of aluminium sheet, typically having a thickness of 0.5-2.5 mm.
  • the heatsink is arranged to receive a semiconductor device 16 (such as a Texas Instruments 8827, TIP 31 A, transistor or similar package) having a metal plate connected thereto to facilitate heat transfer.
  • the transistor is housed within an enclosure 17, formed by the heatsink, with the metal plate forced into contact with the back of the inner surface of the heatsink by means of leaf springs 18, formed at the edges of the pressed plate.
  • the terminal legs of the transistor extend from the transistor-body/heatsink assembly, for connection to a circuit board using conventional tin/lead solder.
  • securing portions 21 Extending from the side walls 19 of the heatsink, in the direction of contacts 20, are securing portions 21, arranged to engage with holes in the circuit board.
  • the securing portions ensure that the transistor/heatsink assembly is held firmly to the circuit board, thereby substantially reducing the possibility of the heatsink being accidentally moved from the transistor and also substantially reducing the risk of transistor-contact (20) breakage.
  • the transistor contacts 20 are secured to the circuit board by means of tin/lead solder which, in addition to providing mechanical retention, also facilitates electrical conduction.
  • the securing portions 21 are also arranged to engage with holes in the circuit board and are secured to said holes by a soldering process, similar to that used for securing the contacts.
  • a small area of copper is provided on the circuit board, which does not make electrical contact with any other copper tracks, however, in some applications, a designer may wish to place said portions 21 in circuit, usually by connecting them to ground.
  • solder is applied to the ends of the portion during manufacture which, during the application of a soldering iron, melts to form a mechanical bond.
  • the ends of portion 21 are coated, to ensure that they attract the type of solder used when applying solder to the circuit board as a whole.
  • the securing portions 21 are first coated with aluminium solder 22, such as that manufactured in the United KingdorJl by Multicore Solders Limited and sold under the Trade Mark ALUSOL 45. '
  • the aluminium solder is not actually used as solder, but provides a coating for the conventional tin/lead solder, used to connect the heatsink to the circuit board.
  • the aluminium solder melts at a significantly higher temperature than that of the tin/lead solder and therefore said aluminium solder does not melt during the soldering process.
  • the heatsink is fabricated by pressing and forming the required shape from a sheet of aluminium.
  • the aluminium is anodised, using an electrolyte of sulphuric acid, to produce a very thin porous layer of oxide.
  • the anodised aluminium is then introduced to a black dye, which is fixed to give a smooth, homogeneous black finish to the device which, at this stage, extends to the ends of the securing portions 21.
  • the black dye and oxide layer is removed from the ends of portions 21 by dipping said portions into a solution of sodium hydroxide, after which, ALUSOL 45 flux is applied before dipping them into a bath of aluminium solder, maintained at a temperature of 250-350 °C.
  • FIG. 2 An alternative embodiment is therefore shown in Figure 2, in which, like the device shown in rigure 1, securing means are arranged to secure the heatsink to the circuit board, wherein said securing means are portions of the aluminium heatsink, arranged to securably engage with the circuit board.
  • the heatsink 25 of Figure 2 shown in outline, however, its shape and manner of manufacture is styled substantially the same to that used in the manufacture of the device shown in Figure 1.
  • Securing portions 26 extend through holes 27 in a circuit board 28 but the size of the portions and the size of the holes are such that force must be exerted to place portions in said holes 27, which are then retained by an interference fit.
  • the securing portions 26 are stamped so as to create a barbed tine 29, which facilitates the entry of the portions 26 into the holes 27, while providing substantial resistance to the removal of said portions from said holes.

Abstract

An aluminium heatsink (15) for semiconducting devices (16) includes at least one portion, and preferably two portions (21), formed so as to be solderable into a circuit board. The portions are coated with aluminium solder (22) which, may itself, not melt during the securing process, but allows the portions to be soldered using conventional tin/lead solder. In an alternative embodiment, portions extending from said heatsink have a tine (29) which is secured by a hole in the circuit board.

Description

HEATSINK FOR SEMICONDUCTOR DEVICES BACKGROUND OF THE INVENTION
The present invention relates to aluminium heatsinks for semiconductor devices, of the type in which said semiconductor devices include solderable means arranged to be soldered to a circuit board with tin/lead solder.
The use of heatsinks in the electronics art is very well known and essentially consists of increasing the surface area of a heat-dissapating device, using a material with good thermal conduction properties. The material most commonly used for fabricating heatsinks is aluminium and a suitable shape may be obtained by either pressing aluminium plate or extruding the heated material through a die.
When fabricating low volume circuits, often using expensive electronic components, the cost of making heatsinks and applying them to the circuit is relatively small compared to the total cost of designing and making the circuit, however, over recent years the cost of electronic components has reduced significantly and many circuits are now mass produced in their thousands. The field is also highly competitive, therefore, manufacturers are constantly looking for ways in which the cost of passive components and board assembly may be reduced.
Large power transistors require large heat sinks and these are often secured to a metal back-plane or cabinet by means of a bolt. However, in many applications, a large number of smaller transistors are required and it would be impossible to arrange all of these along the edges of the circuit board. An arrangement for providing a heat sink for many transistors of this type is shown in European Patent Application No. 0 124 715 of International Business Machines Corporation, US in which a plurality of transistors are supported in a row along a common heatsink, which maybe bolted or glued to the circuit board. However, a problem with this approach is that the transistors must be regularly spaced over the circuit board, placing an additional restriction on the circuit designer.
It is also known to provide a separate heatsink for each transistor on a board and many transistors are provided with a metal support plate, having a hole therein, allowing said plate to be bolted to a suitable heatsink. However, if the heatsink is not secured to a back-plane etc. the weight of the heatsink must be supported by the electrical contacts (legs) of the electronic device, which may in turn lead to failure, due to excessive force being applied to said contacts. Bolting a heatsink to an active device is also an expensive operation and, for this reason, heatsinks are also available which include interference clipping means, for holding the transistor while ensuring good thermal conductivity at the interface of the two components. However, in addition to the risk of applying excessive force to the legs of the active device, it is also possible for this type of heatsink to become dislodged, again leading to failure. It is therefore an object of the present invention to provide an improved heatsink for semiconductor devices, such as transistors, voltage regulators and amplifiers etc. SUMMARY OF THE INVENΗON
According to a first aspect of the invention, there is provided an aluminium heatsink, comprising means for receiving a semiconductor device, said semiconductor device including solderable means arranged to be soldered to a circuit board with tin/lead solder; characterised by securing means arranged to secure said heatsink to said circuit board, wherein said securing means is a portion of said aluminium heatsink arranged to securably engage with said circuit board.
An advantage of the invention is that it allows heatsinks to be included in the design of a circuit, after the main circuit design has been completed. Heatsinks may be applied to active components at any position on the circuit board and the designer is not restrained by having to place all active, ie. heat- dissipating, components at positions determined by their respective heatsinks. Furthermore, the heatsink is secured to the circuit board by a portion of the heatsink which extends downwards in the same direction as the electrical contacts of the electronic device. Thus, the circuit designer need only provide additional holes for securing the heatsink, in a similar way to which holes are provided for the electrical contacts, which are used to restrain the heatsink, thereby taking the weight of the heatsink away from the electrical contacts by providing its own support means.
In a preferred embodiment, two portions of aluminium form the securing means and each of said portions are coated with solder, allowing them to be soldered into the circuit board. In this way, the heatsink may be soldered to the circuit board during the operation for soldering the electrical contacts to said circuit board. Preferably, said portions are coated with aluminium solder, onto which conventional tin/lead solder may be applied, providing the advantage of allowing electrical contacts and heatsink portions to be soldered to the circuit board during a common operation, as performed during the mass production of circuit boards.
In an alternative embodiment, said portions of said heatsink include means for engaging into respective holes in a circuit board to provide an interference fit, thereby securing said heatsink to the circuit board. Preferably, said securing means is an angled tine, facilitating the entry of said portion into said hole, whereafter said tine prevents removal of said portion from said hole. BRIEF DESCRIPTION )F THE DRAWINGS Figure 1 shows a heatsink with means for connecting said heatsink to a circuit board, and a transistor suitable for co-operating with said heatsink; and,
Figure 2 shows an alternative means for connecting a heatsink to a circuit board. DESCRIPTION OF THE PREFERRED EMBODIMENTS
An aluminium heatsink 15 is shown in Figure 1, fabricated by cold- pressing a piece of aluminium sheet, typically having a thickness of 0.5-2.5 mm. The heatsink is arranged to receive a semiconductor device 16 (such as a Texas Instruments 8827, TIP 31 A, transistor or similar package) having a metal plate connected thereto to facilitate heat transfer. The transistor is housed within an enclosure 17, formed by the heatsink, with the metal plate forced into contact with the back of the inner surface of the heatsink by means of leaf springs 18, formed at the edges of the pressed plate. The terminal legs of the transistor extend from the transistor-body/heatsink assembly, for connection to a circuit board using conventional tin/lead solder.
Extending from the side walls 19 of the heatsink, in the direction of contacts 20, are securing portions 21, arranged to engage with holes in the circuit board. The securing portions ensure that the transistor/heatsink assembly is held firmly to the circuit board, thereby substantially reducing the possibility of the heatsink being accidentally moved from the transistor and also substantially reducing the risk of transistor-contact (20) breakage.
The transistor contacts 20 are secured to the circuit board by means of tin/lead solder which, in addition to providing mechanical retention, also facilitates electrical conduction. In a first embodiment, the securing portions 21 are also arranged to engage with holes in the circuit board and are secured to said holes by a soldering process, similar to that used for securing the contacts. In most applications, a small area of copper is provided on the circuit board, which does not make electrical contact with any other copper tracks, however, in some applications, a designer may wish to place said portions 21 in circuit, usually by connecting them to ground.
To facilitate the manual assembly of components, solder is applied to the ends of the portion during manufacture which, during the application of a soldering iron, melts to form a mechanical bond. However, in an alternative embodiment, particularly suited for mass production, the ends of portion 21 are coated, to ensure that they attract the type of solder used when applying solder to the circuit board as a whole.
In a preferred embodiment, the securing portions 21 are first coated with aluminium solder 22, such as that manufactured in the United KingdorJl by Multicore Solders Limited and sold under the Trade Mark ALUSOL 45.' However, once applied, the aluminium solder is not actually used as solder, but provides a coating for the conventional tin/lead solder, used to connect the heatsink to the circuit board. The aluminium solder melts at a significantly higher temperature than that of the tin/lead solder and therefore said aluminium solder does not melt during the soldering process.
The heatsink is fabricated by pressing and forming the required shape from a sheet of aluminium. After fabrication, the aluminium is anodised, using an electrolyte of sulphuric acid, to produce a very thin porous layer of oxide. The anodised aluminium is then introduced to a black dye, which is fixed to give a smooth, homogeneous black finish to the device which, at this stage, extends to the ends of the securing portions 21. The black dye and oxide layer is removed from the ends of portions 21 by dipping said portions into a solution of sodium hydroxide, after which, ALUSOL 45 flux is applied before dipping them into a bath of aluminium solder, maintained at a temperature of 250-350 °C.
In some situations, a designer may wish to apply heatsinks after the soldering process has been completed, in which case it is not appropriate to solder the heatsinks to the circuit board as this may affect components soldered during the earlier operation. An alternative embodiment is therefore shown in Figure 2, in which, like the device shown in rigure 1, securing means are arranged to secure the heatsink to the circuit board, wherein said securing means are portions of the aluminium heatsink, arranged to securably engage with the circuit board. The heatsink 25 of Figure 2 shown in outline, however, its shape and manner of manufacture is styled substantially the same to that used in the manufacture of the device shown in Figure 1. Securing portions 26 extend through holes 27 in a circuit board 28 but the size of the portions and the size of the holes are such that force must be exerted to place portions in said holes 27, which are then retained by an interference fit. In addition, the securing portions 26 are stamped so as to create a barbed tine 29, which facilitates the entry of the portions 26 into the holes 27, while providing substantial resistance to the removal of said portions from said holes.

Claims

1. An aluminium heatsink, comprising means (18, 19) for receiving a semiconductor device (16), said semiconductor device including solderable means (20) arranged to be soldered to a circuit board with tin/lead solder, characterised by means (21, 22) arranged to secure said heatsink to a circuit board (28), wherein said securing means is a portion of said aluminium heatsink arranged to securably engage with said circuit board.
2. An aluminium heatsink according to claim 1, characterised in that two portions of aluminium (21) form securing means, each coated with solder (22) and each arranged to be soldered to a circuit board.
3. An aluminium heatsink according to clai 2, characterised in that the solder coating said securing means is aluminium solder (22).
4. An aluminium heatsink according to any of claims 1 to 3, characterised in that solderable portions of said heatsink are arranged to enter cooperating holes in said circuit board.
5. An aluminium heatsink according to any preceding claim, characterised in that said heatsink is pressed from a sheet of aluminium and includes mechanical retention means (18) for forcing a semicon uctor device (16) into contact with the surface of said heatsink.
6. An aluminium heatsink according to any preceding claim, wherein all of the heatsink except for portions covered by the aluminium solder, are anodised.
7. A method of fabricating and aluminium heatsink, comprising the steps of forming securing-portions arranged to cooperate with a circuit board, applying aluminium solder to said securing-portions, wherein said soldered portions are arranged to secure said heatsink to a circuit board by means of tin/lead solder.
8. A method according to claim 5, wherein said portions are formed by pressing a plate of aluminium.
9. A method of soldering a semiconductor device to a circuit board, comprising the steps of applying aluminium solder to securing-portions of an aluminium heatsink, assembling said heatsink with a co-operating semiconductor device and soldering said semiconductor device and said securing-portions of said heatsink to a circuit board using tin/lead solder.
10. A method according to claim 7, characterised in that said aluminium solder does no melt during the application of said tin/lead solder.
11. An aluminium heatsink according to claim 1, characterised in that said means (21, 22) arranged to secure said heatsink includes means for engaging in a hole of circuit board to provide an interference fit, thereby mechanically securing said heatsink to said circuit board.
12. An aluminium heatsink according to claim 11, characterised in that said securing means includes an angled tine, facilitating the entry of said portion into said hole while reducing the ability to remove the portion from said hole.
PCT/GB1990/001482 1989-09-28 1990-09-27 Heatsink for semiconductor devices WO1991005369A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8921884A GB2237682A (en) 1989-09-28 1989-09-28 Heatsink for semiconductor devices
GB8921884.6 1989-09-28

Publications (1)

Publication Number Publication Date
WO1991005369A1 true WO1991005369A1 (en) 1991-04-18

Family

ID=10663740

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1990/001482 WO1991005369A1 (en) 1989-09-28 1990-09-27 Heatsink for semiconductor devices

Country Status (2)

Country Link
GB (1) GB2237682A (en)
WO (1) WO1991005369A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5381041A (en) * 1994-04-05 1995-01-10 Wakefield Engineering, Inc. Self clamping heat sink
US5576933A (en) * 1995-05-15 1996-11-19 Wakefield Engineering, Inc. Clamping heat sink for an electric device
WO1997008750A1 (en) * 1995-08-28 1997-03-06 Siemens Aktiengesellschaft Cooling element for electronic components

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003523620A (en) 2000-02-17 2003-08-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Heat sink with integrated components pressed against equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
DE3301481A1 (en) * 1982-02-22 1983-09-08 Aavid Engineering Inc., Laconia, N.H. Heat sink with riveted-on connecting metal sheet
US4605058A (en) * 1985-04-01 1986-08-12 The Staver Company, Inc. Heat dissipating retainer for electronic package
GB2192492A (en) * 1986-07-09 1988-01-13 Thermalloy Inc Alignment device for connecting an electronic component to a printed circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL164425C (en) * 1971-02-05 1980-12-15 Philips Nv SEMICONDUCTOR DEVICE FITTED WITH A COOLING BODY.
NL159818B (en) * 1972-04-06 1979-03-15 Philips Nv SEMI-CONDUCTOR DEVICE CONTAINING A FLEXIBLE INSULATING FILM WITH METAL TRACKS ON ONE SIDE.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
DE3301481A1 (en) * 1982-02-22 1983-09-08 Aavid Engineering Inc., Laconia, N.H. Heat sink with riveted-on connecting metal sheet
US4605058A (en) * 1985-04-01 1986-08-12 The Staver Company, Inc. Heat dissipating retainer for electronic package
GB2192492A (en) * 1986-07-09 1988-01-13 Thermalloy Inc Alignment device for connecting an electronic component to a printed circuit board

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM Technical Disclosure Bulletin, Vol. 24, No. 7B, December 1981, (New York, US), A.B. HABICH: "Clip on Heat Sink", page 3725 *
IBM Technical Disclosure Bulletin, Vol. 28, No. 12, May 1986, (New York, US), "Surface-Mounted Power Transistor and Heatsink", pages 5502-5503 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5381041A (en) * 1994-04-05 1995-01-10 Wakefield Engineering, Inc. Self clamping heat sink
US5576933A (en) * 1995-05-15 1996-11-19 Wakefield Engineering, Inc. Clamping heat sink for an electric device
WO1997008750A1 (en) * 1995-08-28 1997-03-06 Siemens Aktiengesellschaft Cooling element for electronic components

Also Published As

Publication number Publication date
GB2237682A (en) 1991-05-08
GB8921884D0 (en) 1989-11-15

Similar Documents

Publication Publication Date Title
JP2716336B2 (en) Integrated circuit device
DE102010038246B4 (en) Surface mount, open cavity, wireless package for high power RF applications, method of manufacturing an RF semiconductor package and an RF semiconductor package assembly
KR101388328B1 (en) Lead frame based, over-molded semiconductor package with integrated through hole technology(tht) heat spreader pin(s) and associated method of manufacturing
EP1450404B1 (en) Assembly in pressure contact with a power semiconductor module
JP3168242B2 (en) Interconnection element of circuit element and its application method
KR970067801A (en) Semiconductor device and manufacturing method thereof
EP1207727A2 (en) Compliant laminate connector
DE112007000183T5 (en) High performance module with open frame assembly
JP2000357866A (en) Power source which can be surface-mounted, and its manufacture
US6884939B2 (en) Constructing of an electronic assembly having a decoupling capacitor
US4446504A (en) Mounting means with solderable studs
US4970781A (en) Process plate for plastic pin grid array manufacturing
US6781839B2 (en) Vertical surface mount apparatus with thermal carrier and method
JPH0513504A (en) Vertical semiconductor interconnecting method and structure
JPH10313089A (en) Electronic parts and mounting structure therefor
US6747875B2 (en) Surface mount power supplies for standard assembly process
WO1991005369A1 (en) Heatsink for semiconductor devices
US6292368B1 (en) Electrical power component mounted by brazing on a support and corresponding mounting process
US4536825A (en) Leadframe having severable fingers for aligning one or more electronic circuit device components
GB2345576A (en) Heat-sink of ICs and method of mounting to PCBs
JPS617692A (en) Method of securing conductor pin and printed circuit board secured with conductor pin
JP2005503005A (en) PCB assembly without soldering
JP2004172260A (en) Wiring board
JPH05327161A (en) Electronic circuit module
JPS62282456A (en) Manufacture of hybrid ic

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB IT LU NL SE