JP2985836B2 - Electronic circuit components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to an electronic circuit component, and more particularly to an electronic circuit component such as a pin grid array having a multilayer wiring board and a plurality of pins.

[0001]

2. Description of the Related Art Conventionally, this kind of electronic circuit component is disclosed in
No. -106062.

[0002] The electronic circuit component described in this publication has a wiring board with a plurality of pins attached to the lower surface. Each of the plurality of pins includes a power supply pin, a ground pin, and a signal pin. The power pin, the ground pin, and the signal pin are electrically connected to a power wiring layer, a ground wiring layer, and a signal wiring layer of the wiring board, respectively, via wiring, through holes, and the like. An integrated circuit device is mounted on the upper surface of the wiring board, and a plurality of input / output terminals of the integrated circuit device are electrically connected to any of a ground wiring layer, a power supply wiring layer, and a signal wiring layer through wiring and through holes. Connected.

[0003]

In the above-mentioned prior art,
Each of the plurality of pins and each wiring layer are connected by wiring or through holes inside the wiring board. Wiring and through holes are formed during the manufacturing process of the wiring board. In other words, of the plurality of pins provided on the lower surface of the wiring board, those serving as power supply pins, those serving as ground pins, and those serving as signal pins are respectively predetermined and cannot be changed. Therefore, when different types of integrated circuit devices are mounted on the wiring board, the arrangement of the power supply pins, the ground pins, or the signal pins and the ratio of the number of each pin are different. There is a problem that the wiring board must be remade.

An object of the present invention is to provide an electronic circuit component which does not need to be re-created even if the arrangement of power supply pins, ground pins or signal pins or the ratio of the number of each pin is changed.

It is another object of the present invention to provide an electronic circuit component on which different integrated circuit devices can be mounted.

[0006]

According to the present invention, there is provided an electronic circuit component comprising: a recess provided in a wiring board; first and second wirings exposed inside the recess; A pin having a tip inserted into the recess and electrically connected to the first and second wirings;

Another electronic circuit component according to the present invention is characterized in that the recess is closed in a stepwise manner, and the first and second wirings are exposed for each step.

Further, in another electronic circuit component of the present invention, the first wiring is exposed at a predetermined position on a side surface in the recess, and the pin is located at a position corresponding to the predetermined position. The semiconductor device has a projection that contacts the first wiring. Further, another electronic circuit component of the present invention includes a wiring substrate, a first concave portion provided on the wiring substrate and exposing a power supply wiring, and a first concave portion provided on a bottom surface of the first concave portion and exposing a signal wiring. And a pin connected to the power supply wiring inside the first recess and the signal wiring inside the second recess. Further, in another electronic circuit component according to the present invention, the pin includes a tip connected to the signal wiring and a projection connected to the power wiring.

Further, another electronic circuit component according to the present invention is characterized in that the exposed power supply wiring is in contact with a side surface of the tip. Further, another electronic circuit component of the present invention includes a wiring board, a first recess provided on the wiring board to expose a first power supply wiring, and a second recess provided on a bottom surface of the first recess. A second recess for exposing the power supply wiring, a third recess provided on the bottom surface of the second recess for exposing the signal wiring, and the first power supply wiring or the first power supply wiring inside the first recess. A pin connected to the second power supply wiring inside the second recess and connected to the signal wiring inside the third recess.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the electronic circuit component of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, a first embodiment of an electronic circuit component according to the present invention comprises a wiring board 100, pins 10,
20 and 30. Each of the pins 10, 20, and 30 is used to electrically and mechanically connect the wiring board 100 and the mounting board when the wiring board 100 is mounted on a mounting board (not shown). In this embodiment, for the sake of simplicity, description will be made using a part of the wiring board 100 and a part of a plurality of pins.

Referring to FIG. 2, wiring substrate 100 includes signal wiring layer 110, ground wiring layer 120, VDD potential wiring layer 130, and recesses 141, 142, and 143. On the upper surface of the wiring board 100, an integrated circuit device (not shown) is mounted. Each of the signal wiring layer 110, the ground wiring layer 120, and the VDD potential wiring layer 130 is stacked via an insulating layer. In the present embodiment, the VDD potential wiring layer 13 is provided on the layer closest to the lower surface of the wiring board 100.
0 is provided. The ground wiring layer 120 is provided above the VDD potential wiring layer 130. The ground wiring layer 120 and the VDD potential wiring layer 130 are adjacent via an insulating layer. The signal wiring layer 110 is the ground wiring layer 12
0. The signal wiring layer 110 and the ground wiring layer 120 are adjacent via an insulating layer.

The signal wiring layer 110 includes signal wirings 111 and 11
2 and 113. Each of the signal wirings 111, 112, and 113 is connected to an input / output terminal of an integrated circuit device mounted on the wiring board 100.

The ground wiring layer 120 is a layer on which ground wiring is provided.

The VDD potential wiring layer 130 is a layer provided with a VDD potential wiring.

The recesses 141, 142 and 143 are provided on the lower surface of the wiring board 100. Recesses 141, 142
Reference numerals 143 and 143 denote holes formed in the lower surface of the wiring board 100 in a stepwise manner. That is, a plurality of holes are provided stepwise. The plurality of recesses 141, 142, and 143 all have the same configuration.

The recess 141 is provided with the signal wiring 111, the ground wiring 121 provided on the ground wiring layer 120, and the VD.
VDD potential wiring 131 provided on D potential wiring layer 130
Are exposed respectively.

The recess 142 is provided with the signal wiring 112, the ground wiring 122 provided on the ground wiring layer 120, and the VD.
VDD potential wiring 132 provided in D potential wiring layer 130
Are exposed respectively.

The concave portion 143 includes the signal wiring 113, the ground wiring 123 provided on the ground wiring layer 120, and the VD.
VDD potential wiring 133 provided in D potential wiring layer 130
Are exposed respectively.

Referring to FIGS. 1, 2 and 3, the recess 1
41 is provided with a pin 10.

The pin 10 includes a tip 11 and a projection 12. More specifically, the pin 10 is formed by penetrating a circular plate into a circular plate, and the circular plate serves as the protrusion 12. The size of the protrusion 12 is the same as or similar to the size of the hole exposing the ground wiring 121.

The tip 11 of the pin 10 is connected to the signal wiring 111. The projection 12 of the pin 10 is connected to a ground wiring 121 provided on the ground wiring layer 120. Thereby, the signal wiring 111 and the ground wiring layer 120 are connected via the pin 10. That is, the pin 10 serves as a ground pin, and the signal wiring 111 serves as a ground wiring for drawing an external ground potential into the integrated circuit device. As described above, in order to form a ground pin, it is only necessary to insert the pin 10 into a concave portion exposing a signal wiring to which a plurality of input / output terminals of the integrated circuit device which must be connected to the ground pin are connected. Good.

Referring to FIGS. 1, 2 and 4, the recess 14
1 is provided with a pin 20.

The pin 20 includes a tip 21. The pin 20 has no projection. The tip 21 of the pin 20 is connected to the signal wiring 112. This allows pin 2
By using 0, a signal transmitted through the signal wiring 112 can be extracted or a signal can be transmitted to the signal wiring 112.
That is, the pin 20 becomes a signal pin. As described above, in order to form a signal pin, it is only necessary to insert the pin 20 into a concave portion exposing a signal wiring to which a plurality of input / output terminals of the integrated circuit device which must be connected to the signal pin are connected. Good.

Referring to FIGS. 1, 2 and 5, the recess 14
3 is provided with a pin 30.

The pin 30 includes a tip 31 and a projection 32. More specifically, the pin 10 is formed by penetrating a circular plate into a circular plate, and the circular plate serves as the protrusion 32. The size of the protrusion 32 is the same as or similar to the size of the hole exposing the VDD potential wiring 133.

The tip 31 of the pin 30 is connected to the signal wiring 113. The protrusion 32 of the pin 30 is connected to the VDD potential wiring 133 provided on the VDD potential wiring layer 130. As a result, the signal wiring 11 is
3 and the VDD potential wiring layer 130 are connected. That is, the pin 30 serves as a power supply pin, and the signal wiring 113 serves as a VDD potential wiring for drawing external power into the integrated circuit device. As described above, in order to form the power supply pin, only the pin 30 is inserted into the recess exposing the signal wiring to which the plurality of input / output terminals of the integrated circuit device which must be connected to the power supply pin are connected. No.

As described above, in the present embodiment, a plurality of recesses 141, 142 and 143 are formed on the lower surface of wiring board 100.
And each of the plurality of recesses 141, 142, and 143 includes a signal wiring 111, 112, or 113, a ground wiring 121, 122, or 123, and a VDD potential wiring 1.
31, 132 or 133 were exposed.
Therefore, by inserting a pin having a protrusion connected to each wiring of a desired wiring layer into each of the plurality of recesses 141, 142 and 143, the arrangement and ratio of the signal pin, the ground pin and the power supply pin can be selectively changed. Can be changed. That is, the electronic circuit component of the present invention can be applied to different types of integrated circuit devices.

Next, a second embodiment of the present invention will be described in detail with reference to the drawings. The feature of the second embodiment resides in that the side surface of the projection of the pin is connected to the ground wiring layer or the VDD potential wiring layer.

Referring to FIG. 6, recesses 241, 242 and 243 are provided on the lower surface of wiring board 200.
The plurality of recesses 241, 242, and 243 all have the same configuration.

The recess 241 exposes the signal wiring 211 provided on the signal wiring layer 210, the ground wiring 221 provided on the ground wiring layer 220, and the VDD potential wiring 231 provided on the VDD potential wiring layer 230, respectively.
The pin 40 is provided in the concave portion 241.

The pin 40 includes a tip 41 and a projection 42. The tip 41 of the pin 40 is connected to the signal wiring 211. The protrusion 42 of the pin 40 is
Is connected to the ground wiring 221 provided in the. The ground wiring 221 is connected to the side surface of the protrusion 42 of the pin 40.

The pin 50 has no projection. Pin 5
0 is connected to the signal wiring 212.

The pin 60 includes a tip 61 and a projection 62. The tip 61 of the pin 60 is connected to the signal wiring 213. The projection 62 of the pin 60 is connected to the VDD potential wiring layer 23.
0 is connected to the VDD potential wiring 231 provided. The VDD potential wiring 231 is connected to the side surface of the protrusion 62 of the pin 60.

As described above, in the present embodiment, there is an effect that the size of the concave portions 241, 242, and 243 provided in the wiring board 200 can be smaller than that in the first embodiment.

[0036]

As apparent from the above description, in the present invention, a plurality of recesses are provided on the lower surface of the wiring board, and each of the plurality of recesses exposes the signal wiring, the ground wiring, and the VDD potential wiring. Configured. For this reason, by inserting a pin having a protrusion connected to the wiring of a desired wiring layer into each of the plurality of recesses, it is possible to selectively change the arrangement and ratio of the signal pin, the ground pin, and the power supply pin, As a result, the electronic circuit component of the present invention can be applied to different types of integrated circuit devices.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a first embodiment of the present invention.

FIG. 2 is a diagram showing a wiring board according to the first embodiment of the present invention.

FIG. 3 is a diagram showing a pin according to the first embodiment of the present invention.

FIG. 4 is a diagram showing a pin according to the first embodiment of the present invention.

FIG. 5 is a diagram showing a pin according to the first embodiment of the present invention.

FIG. 6 is a sectional view of a second embodiment of the present invention.

[Explanation of symbols]

100, 200 Wiring board 110, 210 Signal wiring layer 111, 112, 113, 211, 212, 213 Signal wiring 120, 220 Ground wiring layer 130, 230 VDD potential wiring layer 141, 142, 143, 241, 242, 243 Concave part 10 , 20, 30, 40, 50, 60 pins

Claims (9)

(57) [Claims] 1. A recess provided in a wiring board, first and second wires exposed inside the recess, and a tip inserted into the recess and electrically connected to the first and second wires. An electronic circuit component comprising: a connected pin. 2. The electronic circuit component according to claim 1, wherein said recess is closed in a stepwise manner, and said first and second wirings are exposed for each step. 3. The first wiring is exposed at a predetermined position on a side surface in the recess, and the pin has a projection at a position corresponding to the predetermined position, the projection being in contact with the first wiring. The electronic circuit component according to claim 1, wherein: 4. A wiring board, a first recess provided on the wiring board to expose a power supply wiring, a second recess provided on a bottom surface of the first recess to expose a signal wiring, and An electronic circuit component, comprising: a pin connected to the power supply wiring inside the first recess and the signal wiring inside the second recess. 5. The electronic circuit component according to claim 4, wherein said pin includes a tip connected to said signal wiring and a projection connected to said power supply wiring. 6. The electronic circuit component according to claim 5, wherein the exposed power supply wiring is in contact with a side surface of the tip. 7. A wiring board, a first recess provided on the wiring board to expose a first power supply wiring, and a second recess provided on a bottom surface of the first recess to expose a second power supply wiring. A concave portion provided on the bottom surface of the second concave portion to expose a signal wiring; and a first power supply wiring inside the first concave portion or the third power supply line inside the second concave portion. Second
And a pin connected to the power supply line and to the signal line inside the third recess. 8. The electronic circuit component according to claim 7, wherein said pin includes a tip connected to said signal wiring and a projection connected to said power wiring. 9. The electronic circuit component according to claim 8, wherein the exposed first or second power supply wiring is in contact with a side surface of the tip.