JP4170463B2 - Conversion module - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a conversion module.
[0002]
[Prior art]
A semiconductor package having a function as a CPU (Central Processing Unit) is mounted on a motherboard in the personal computer via a dedicated PGA socket. As such a semiconductor package, at present, a PGA (pin grid array) type in which a large number of I / O pins are erected on one side dominates.
[0003]
Incidentally, a user of a personal computer may desire an upgrade for the purpose of speeding up the processing. In this case, it is necessary to remove the existing semiconductor package from the PGA socket and newly mount a higher-performance semiconductor package. At that time, it is proposed that a high-performance semiconductor package is mounted on the conversion module and then indirectly mounted on the PGA socket of the motherboard. Here, FIG. 8 shows an example of a conventional conversion module 61.
[0004]
The conversion module 61 of the conventional example includes a socket substrate 62 and a conversion substrate 63 as main components. The conversion substrate 62 is provided with a plurality of plated through holes, and the base end portions of the external connection pins 64 are inserted into the opening portions on the back surface side. These external connection pins 64 are inserted into and removed from the PGA socket 65 on the motherboard MB. The socket substrate 62 includes a plurality of I / O pins 66. These I / O pins 66 project from the back surface side of the socket substrate 62 at locations corresponding to the plurality of plated through holes. Each I / O pin 66 is inserted into each plated through hole and soldered, whereby electrical conduction between the socket substrate 62 side and the conversion substrate 63 side is achieved. Further, since the I / O pin 66 of the socket substrate 62 is a socket-like pin having an insertion hole in its upper end surface, the I / O pin 68 of the semiconductor package 67 is fitted therein. Therefore, it is considered that if such a conversion module 61 is used, the semiconductor package 67 can be adapted to the motherboard MB side, and the original performance of the package can be easily exhibited.
[0005]
Also, the PGA socket 65 used for mounting the semiconductor package 67 and the conversion module 61 on the motherboard MB generally has a structure as shown in FIG. That is, this type of PGA socket 65 includes a socket body 69 composed of a fixed member and a movable member. A plurality of pins 70 protrude from the lower surface side of the fixing member constituting the socket body 69. The movable member having a plurality of pin insertion / extraction holes 71 into which the external connection pins 64 can be inserted / removed is arranged on the upper surface side of the fixed member. Such a movable member slides with respect to the fixed member by the rotation of the operation lever 72. As a result, each pin insertion / extraction hole 71 is narrowed, and each external connection pin 64 is fixed to the PGA socket 65 so that it cannot be pulled out.
[0006]
[Problems to be solved by the invention]
By the way, recently, as a conversion module structure for a greater upgrade, a signal conversion element 74 such as a semiconductor package is mounted in a region surrounded by a plated through hole group, and the element 74 performs signal conversion. Has been. However, when this structure is adopted, it is necessary to make a replacement connection for a specific I / O pin 66A.
[0007]
That is, the specific I / O pin 66A is not directly connected to the external connection pin 64 through the corresponding plated through hole, but once connected to the input side of the signal conversion element 74 and converted from the output side. This is to obtain a signal.
[0008]
As means for realizing such replacement connection, the present inventors have already proposed the following. That is, the sub board 75 having a conductor pattern is provided between the conversion board 63 and the socket board 62 (see the one-dot chain line in FIG. 8). The specific I / O pin 66A and the input side of the signal conversion element 74 are electrically connected through this conductor pattern.
[0009]
However, in this method, since the sub board 75 needs to be provided in a narrow space between the conversion board 63 and the socket board 62, the soldering operation may be difficult. Therefore, a conversion module structure that is easier to manufacture has been desired.
[0010]
Further, when inserting / removing to / from the PGA socket 65, an external force is easily applied to the external connection pin 64. For this reason, as a result of pin bending, the relative positional relationship between the pins 64 may collapse. In particular, in the case of FIG. 8, a so-called long pin is employed because the gap between the back surface of the conversion substrate 63 and the upper surface of the PGA socket 65 is large. Therefore, even in terms of structure, pin bending is more likely to occur than in the normal case.
[0011]
Further, since the stepped portion 73 generally exists on the upper surface side of the PGA socket 65, when the conversion module 61 is mounted in a state as shown in FIG. 8, the end portion on the side far from the stepped portion 73 is The conversion module 61 is inclined due to the weight (see the two-dot chain line in FIG. 8). In order to avoid this, it is considered that the conversion module 61 may be mounted in a state as shown in FIG. 9, for example.
[0012]
However, in such a method, a portion protruding in the horizontal direction from the PGA socket 65 is formed, and this portion is not preferable because it interferes with an electronic component mounted on the motherboard MB side.
[0013]
The present invention has been made to solve the above-mentioned problems, and a first object of the present invention is to provide a conversion module that can be replaced and connected relatively easily and is easy to manufacture.
[0014]
A second object of the present invention is to provide a conversion module in which bending of an external connection pin and inclination of the entire module when mounted on a PGA socket hardly occur.
[0015]
[Means for Solving the Problems]
In order to solve the above problems, in the invention according to claim 1, a conversion board having a signal conversion element or the like and having a plurality of external connection pins protruding on the back surface side, and a plurality of I / O pins And a package mounting socket substrate mounted on the surface side of the conversion substrate using them, and inserting the external connection pins into the PGA socket having a stepped portion on the upper surface side. In a PGA type conversion module that is electrically connected to a motherboard, a first pin provided at a position corresponding to a specific I / O pin that requires replacement connection and one end of the first pin are electrically connected the daughter board having an attached conductive pattern, the lower surface of the arrangement to and child board on the back side of the conversion substrate is supported in contact with the upper surface of the PGA socket, prior to the conversion board A second pin shorter than the external connection pin is protruded, the second pin is electrically connected to the other end of the conductor pattern, and the specific I / O pin and the second pin are connected to each other. The gist of the present invention is a conversion module characterized in that the signal conversion element or the like is provided on a path.
[0016]
According to a second aspect of the present invention, in the first aspect, the sub board has a pin insertion hole for inserting the external connection pin, and the plurality of external connection pins are the pin insertion holes. And the length from the back surface of the conversion substrate to the lower surface of the child substrate is set to be larger than the height of the stepped portion.
[0017]
According to a third aspect of the present invention, in the first or second aspect, the area of the sub board is larger than the area of the pin formation area in the conversion board.
Hereinafter, the “action” of the present invention will be described.
[0018]
According to the first aspect of the present invention, the specific I / O pin, the signal conversion element, etc., the second pin, the conductor pattern, and the second pin are electrically connected, and as a result, the specific I / O pin The replacement connection for can be made relatively easily. In addition, since the sub-board having the conductor pattern is arranged on the back side of the conversion board, it is possible to perform operations such as soldering without difficulty, and the manufacturing can be facilitated.
[0019]
According to the second aspect of the present invention, since the plurality of pins are fixed to each other in an inserted state, even if an external force causing bending, for example, is applied to one pin, the external force is applied via the sub-board. Will be distributed to each pin. Therefore, it can be set as the suitable conversion module which a pin bend is hard to produce.
[0020]
In addition, when the PGA socket is mounted, the lower surface of the sub-board is supported in contact with the upper surface of the socket. Since the length from the back surface of the substrate to the bottom surface of the sub-substrate is larger than the height of the step portion, the end portion on the side far from the step portion does not drop at this time. Therefore, even when a weight is added, the conversion module is less likely to be inclined. In addition, the conversion module can be mounted without protruding from the PGA socket.
[0021]
According to the invention described in claim 3, since the area of the sub board is larger than the area of the pin formation area in the conversion board, a space for forming a plurality of conductor patterns, complicated and long conductor patterns, etc. is secured. Yes. Therefore, the structure is suitable when there are a plurality of places where replacement connection is to be made, or when the replacement connection path is complicated and long. In addition, with this configuration, the area supported by the upper surface of the PGA socket is increased, so that a conversion module that can withstand a large weight can be obtained.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a PGA signal conversion module 1 according to an embodiment of the present invention will be described in detail with reference to FIGS.
[0023]
As shown in FIGS. 1 and 5, the conversion module 1 of this embodiment is a device for mounting a PGA 2 for CPU on a motherboard MB after performing signal conversion. The conversion module 1 includes a plurality of substrates, that is, a conversion substrate 3 and a socket substrate 4 as main components.
[0024]
The conversion substrate 3 is a rigid double-sided board having a rectangular shape. The conversion substrate 3 includes a plated through hole group in which a large number (321 in the present embodiment) of plated through holes 5 are arranged in a substantially square shape. The plated through holes 5 are arranged in a lattice or staggered pattern at a constant pitch. As shown in FIG. 5, the base end portions of the external connection pins 6, 6 </ b> A are inserted (press-fitted) into the openings on the back side of the plated through holes 5. These pins 6 and 6A may be joined by soldering. The four external connection pins 6A located at each corner are further provided with another flange 17 called a standoff in addition to the conventional flange 18. On the other hand, the external connection pins 6 occupying the majority have a general shape with only one collar 18.
[0025]
One die pad 7 and a plurality of pads 8 surrounding it are formed in a substantially square region surrounded by the plated through hole group on the surface side of the conversion substrate 3. A signal conversion QFP (quad flat package) 9 as a signal conversion element is surface-mounted on the die pad 7. Each lead of the QFP 9 is bonded to each pad 8 using solder S1 which is a conductive material. One of the plurality of pads 8 is assigned as an input pad 8a for replacement connection, and the other one is assigned as an output pad 8b for replacement connection.
[0026]
As shown in FIGS. 1 and 5, a specific socket-like I / O pin that requires a replacement connection is provided for the surface side opening of one of a plurality of plated through holes 5 (indicated by 5A). 24A is inserted and soldered. The surface side land 5Aa of the plated through hole 5A and the input side pad 8a are electrically connected via a conductor pattern 16 provided on the conversion board 3. The external connection pins 6 and 6A are not particularly provided in the opening on the back surface side of the plated through hole 5A.
[0027]
In a region outside the pin formation area in the conversion substrate 3, more specifically, in a substantially square region surrounded by the plated through hole group, another plated through different from the plated through holes 5 and 5A described above is provided. A hole 5B is provided. The socket-like I / O pins 24 and 24A are not inserted into the surface side opening of the plated through hole 5B. On the other hand, the base end portion of the second pin 31 is inserted into the opening on the back surface side and soldered. The pin 31 is formed somewhat shorter than the external connection pins 6 and 6A.
[0028]
A mini via hole 14 is further provided in a substantially square area surrounded by the plated through hole group in the conversion substrate 3. The mini via hole 14 has a smaller diameter (several tens of μmφ) than that of a normal plated through hole 5 for the purpose of pin insertion and front / back conduction, and is intended only for front / back conduction. The output side pad 8 b is electrically connected to the upper end of the mini via hole 14. The lower end of the mini via hole 14 and the back surface side land 5Bb of the plated through hole 5B are electrically connected via a conductor pattern 15 provided on the conversion substrate 3.
[0029]
A pad 10 for connecting electronic components is formed in a region not surrounded by the through hole group on the surface side of the conversion substrate 3. A DIP (dual in-line package) 11 is surface-mounted on the pad 10. An electronic component connection pad 12 is also formed on the back side of the conversion substrate 3, and a chip resistor 13 is surface-mounted thereon. These electronic components 11 and 13 are also bonded to the pads 10 and 12 by using solder S1.
[0030]
However, some other conductor patterns (not shown) are formed on the back side of the conversion substrate 3. Such a conductor pattern electrically connects between the land 5 b of the plated through hole 5 and the pad 12 for the electronic component 13. Some similar conductor patterns (not shown) are also formed on the surface side of the conversion substrate 3. Such a conductor pattern electrically connects the land 5 a of the plated through hole 5, the pad 8 of the QFP 9, and the pad 10 for the electronic component 11.
[0031]
Next, the configuration of the socket substrate 4 will be described. As shown in FIGS. 1 and 5, the insulating base material 21 constituting the socket substrate 4 has a square shape and a frame shape, and the size of the outer shape is substantially equal to the size of the PGA 2 that is the mounted object. . The insulating base 21 has a square central hole 22. The reason for providing such a central hole 22 is to secure the accommodation space for the QFP 9 and to efficiently dissipate the heat generated by the QFP 9. Accordingly, the central hole 22 is preferably formed slightly larger than the QFP 9 at a position corresponding to the QFP 9.
[0032]
Around the center hole 22, a large number of pin insertion holes 23 having a circular cross section and having a diameter smaller than that of the center hole 22 are formed. Socket-like I / O pins 24 and 24A are inserted into the respective pin insertion holes 23. The number of socket-like I / O pins 24 and 24A is 321 in this embodiment. The lower ends of the I / O pins 24, 24 </ b> A protrude from the lower surface side of the insulating base material 21. Each socket-like I / O pin 24, 24A is formed with an insertion hole 25 extending along the axial direction. The I / O pin 26 on the PGA 2 side can be inserted into and removed from the insertion hole 25. That is, the socket substrate 4 has a structure on the upper surface side to which the PGA 2 can be attached and detached.
[0033]
In addition to the conversion board 3 and the socket board 4, the conversion module 1 of the present embodiment further includes a sub board 32 as its constituent elements. Hereinafter, the structure of the child substrate 32 will be described.
[0034]
The sub board | substrate 32 is arrange | positioned in the state spaced apart from the conversion board 3 in the back surface side of the conversion board 3 at predetermined intervals. The insulating base material 33 which is a constituent member of the sub board 32 is rectangular and rigid, and includes a pentagonal center hole 35. The outer shape and outer dimensions of the insulating base material 33 are substantially equal to those of the signal conversion QFP 9 which is a mounted object. A large number of pin insertion holes 36 having a circular cross section are formed around the center hole 35. Corresponding external connection pins 6, 6 </ b> A are respectively inserted into the pin insertion holes 36. That is, the lower ends of the external connection pins 6 and 6 </ b> A protrude from the lower surface side of the insulating base material 33.
[0035]
Land-like patterns 38, 39, and 40 are formed at a plurality of locations on the upper surface side of the insulating substrate 33 (six locations in the figure). The land pattern 38 is provided corresponding to the opening on the upper surface side of the pin insertion hole 36 into which the external connection pin 6A is to be inserted. Therefore, the four land-like patterns 38 are located at each corner portion in the insulating base material 33. The land pattern 39 is provided corresponding to the opening on the upper surface side of the pin insertion hole 36 into which the first pin 37 is to be inserted. The land pattern 40 is provided corresponding to the upper surface side opening of the pin insertion hole 36 into which the second pin 31 is to be inserted. These land-shaped patterns 39 and 40 are located at the peripheral edge of the central hole 35 in the insulating base material 33.
[0036]
As shown in FIG. 5, the land-like patterns 39 and 40 are relatively close to each other and are electrically connected via the conductor pattern 34. The land-like patterns 38, 39, 40 and the conductor pattern 34 can be formed by, for example, a conventionally known subtractive method. As described above, the sub board 32 of the present embodiment is a so-called single-sided board in which the conductor pattern 34 is provided only on the upper surface of the insulating base material 33. In FIG. 5, the number of pin insertion holes 36 is smaller than the actual number for convenience of drawing.
[0037]
The upper end portion of the first pin 37 is inserted into a pin insertion hole 36 at a position corresponding to the plated through hole 5A (that is, a position corresponding to a specific I / O pin 24A requiring replacement connection), and is land-shaped. Soldered to the pattern 39.
[0038]
The lower end portion of the second pin 31 is inserted into the pin insertion hole 36 at a position corresponding to the plated through hole 5 </ b> B, and is soldered to the land pattern 40. As a result, the second pin 31 and the first pin 37 are electrically connected through the conductor pattern 34.
[0039]
When the four external connection pins 6 </ b> A in the corner portion are inserted into the pin insertion holes 36, the lower end surface of the flange portion 17 is supported by coming into contact with the upper surface of the land pattern 38. In this state, the flange portion 17 of the external connection pin 6A and the land pattern 38 are soldered.
[0040]
As shown in FIG. 5, the length from the back surface of the conversion substrate 3 to the lower surface of the child substrate 32 is basically determined by the distance between the flange portion 17 and the flange portion 18. A value obtained by adding the thickness of the insulating base material 33 to the separation distance substantially corresponds to the length L2 from the back surface of the conversion substrate 3 to the lower surface of the child substrate 32.
[0041]
Next, the structure of the PGA socket 41 will be described.
As shown in FIGS. 2 and 3, the PGA socket 41 includes a socket main body 42 including a fixed member 42a and a movable member 42b. A plurality of pins 43 protrude from the lower surface side of the fixing member 42a constituting the socket body 42. These pins 43 are soldered to the plated through holes on the motherboard MB side.
[0042]
On the upper surface side of the fixed member 42a, a movable member 42b is disposed so as to cover it. The movable member 42a includes a plurality of pin insertion / extraction holes 44 into which the external connection pins 6 and 6A can be inserted and extracted. These pin insertion / extraction holes 44 have a positional relationship corresponding to the external connection pins 6, 6 </ b> A and the first pin 37.
[0043]
A stepped portion 46 having a height L1 exists on the upper surface side of the movable member 42b. An operation lever 45 as an operation means is inserted through the through hole penetrating the stepped portion 46 in the horizontal direction so as to be rotatable about 90 °. The operation lever 45 moves between a lock position indicated by a solid line in FIG. 3 and a lock release position indicated by a two-dot chain line. When the operation lever 45 is turned, the movable member 42b slides slightly along the horizontal direction (arrow A1 in FIGS. 2 and 3). The external connection pins 6 and 6A are inserted into the pin insertion / removal holes 44 in a state where the operation lever 45 is rotated to the unlocking position. When the operation lever 45 is rotated to the lock position, the pin insertion / removal holes 44 are narrowed, and the external connection pins 6 and 6A are fixed to the PGA socket 41 so as not to be pulled out. At this time, as a result of the contacts in the pin insertion / removal holes 44 coming into contact with the pins 6, 6A, 37, electrical continuity with the motherboard MB side is achieved.
[0044]
In the present embodiment, “Socket 5” or “Socket 7” (both ZIF series) manufactured by Thomas and Betz are used as the PGA socket 41. Further, the length L2 from the back surface of the conversion substrate 3 to the lower surface of the child substrate 32 is set to be larger than the height L1 of the stepped portion 46.
[0045]
When the PGA 2 is mounted on the conversion module 1 configured as described above and further mounted in the PGA socket 41 of the motherboard MB, the following is obtained.
The signal of PGA2 flowing through the specific I / O pin 24A is input to the QFP 9 via the route of the land 5Aa of the plated through hole 5A → the conductor pattern 16 → the input side pad 8a. The converted signal is output from the QFP 9 and then reaches the second pin 31 through the route of the output side pad 8b → the mini via hole 14 → the conductor pattern 15 → the land 5Bb of the plated through hole 5B. The converted signal reaching the second pin 31 further passes through the route of the land pattern 40 → the conductor pattern 34 → the land pattern 39 → the first pin 37 → the pin 43 of the PGA socket 41, and the motherboard MB side. To be supplied. That is, the specific I / O pin 24A is not directly conducted to the external connection pin 6 through the corresponding plated through hole 5A. As a result of the replacement connection using the sub-board 32 as described above, signal conversion is mainly performed by the QFP 9 so that the original function of the PGA 2 can be fully exhibited.
[0046]
Therefore, according to the present embodiment, the following effects can be obtained.
(1) The conversion module 1 of this embodiment is characterized in that the sub board 32 having the conductor pattern 34 is arranged on the back side of the conversion board 3. Therefore, unlike the configuration in which the sub board 32 is provided between the conversion board 3 and the socket board 4, the surrounding members do not get in the way and the operation such as soldering can be performed without difficulty. Therefore, it can be set as the conversion module 1 with easy manufacture.
[0047]
(2) The conversion module 1 of the present embodiment includes a sub board 32 having a pin insertion hole 36. All the external connection pins 6, 6 </ b> A are fixed to each other in a state of being inserted into the pin insertion holes 36. Therefore, even if an external force that causes bending is applied to one external connection pin 6, 6 A, the external force is distributed to each pin 6, 6 A via the sub board 32. Therefore, it is possible to realize a suitable conversion module 1 in which pin bending is unlikely to occur. For this reason, the relative positional relationship between the external connection pins 6 and 6A is prevented from being disturbed, and there is no trouble in inserting and removing the pins 6 and 6A.
[0048]
(3) In the present embodiment, when the conversion module 1 is mounted, the lower surface of the sub board 32 is supported in a state of being in total contact with the upper surface of the PGA socket 41. Here, the length L2 from the back surface of the conversion substrate 3 to the lower surface of the child substrate 32 is set to be larger than the height L1 of the stepped portion 46. Therefore, the end on the side far from the stepped portion 46 does not drop at this time. Therefore, even when a weight is applied by mounting the PGA 2, it is possible to withstand it, and the conversion module 1 is less likely to be inclined. In addition, the conversion module 1 can be mounted without projecting from the PGA socket 41 from the above, and there is an advantage that the electronic components mounted on the motherboard MB are not disturbed.
[0049]
(4) In the conversion module 1, four external connection pins 6 </ b> A including the flange portion 17 are provided. Since these flanges 17 can be supported by the upper surface of the sub board 32, it is possible to reliably hold a suitable length from the back surface of the conversion board 3 to the lower surface of the sub board 32. In particular, in this embodiment, external connection pins 6A are arranged at each corner, in other words, at a plurality of locations separated from each other. As a result, a parallel relationship between the conversion substrate 3 and the child substrate 32, and a parallel relationship between the conversion substrate 3 and the PGA socket 41 is secured.
[0050]
(5) Since the sub board | substrate 32 used in this embodiment is a single-sided board which has a simple structure, even if it provides, it does not lead to the whole cost increase.
In addition, since the insulating substrate 33 is used for the sub board 32, even if the external connection pins 6 and 6A are inserted into the pin insertion holes 36, they are short-circuited between the 6 and 6A. Nor.
[0051]
(6) In this conversion module 1, the area of the sub board 32 is set to be larger than the area of the pin formation area in the conversion board 3. For this reason, a space for forming a plurality of conductor patterns 34, complicated and long conductor patterns 34, and the like is secured. Therefore, the structure is suitable when there are a plurality of places where replacement connection is to be made, or when the replacement connection path is complicated and long. Therefore, replacement connection is possible for the plurality of I / O pins 24A, and even when the PGA 2 that is an ultra-high performance CPU is mounted, it can be surely adapted to the motherboard MB side. FIG. 6 shows an example of a sub board 32A on which two conductor patterns 34 are formed.
[0052]
In addition, with such a configuration, the area supported by the upper surface of the PGA socket 41 is widened, so that the conversion module 1 that can withstand a large weight can be obtained.
[0053]
In addition, you may change embodiment of this invention as follows.
The child boards 32 and 32A of the embodiment are single-sided plates provided with land-like patterns 38, 39, and 40. Instead of doing this, a sub-board 52 like the conversion module 51 in another example shown in FIG. 7 may be used. That is, the child substrate 52 of this other example is a double-sided board, and is provided with a plated through hole TH at a place where the land-like patterns 38, 39, 40 are to be formed. In this case, the upper surface side land in each plated through hole TH plays the same role as the land-like patterns 38, 39, 40.
[0054]
Further, like the conversion module 51 of the other example shown in FIG. 6, the second pin 31 can be further shortened and the corresponding pin insertion hole 36 can be omitted.
[0055]
The number of conductor patterns 34 on the sub boards 32 and 32A may be three or more.
-The installation position and the number of installation of the external connection pin 6A having the flange portion 17 can be arbitrarily changed. Further, instead of using the external connection pin 6A, a normal external connection pin 6 may be used instead.
[0056]
The conductor pattern 34 may be formed on the lower surface side of the sub boards 32 and 32A.
The conductor pattern 34 and the land patterns 38, 39, and 40 as the conductor may be formed by a technique other than the subtractive method, for example, a printing method.
[0057]
In the embodiment, only one sub-board 32, 32A having a relatively large area is used. However, the present invention is not limited to this, and a plurality of daughter boards having a relatively small area may be used. Even with such a configuration, replacement connection for a specific I / O pin 24A can be realized. Of course, it is possible to avoid pin bending and inclination when the PGA socket 41 is mounted.
[0058]
-QFP9 which is a signal conversion element may be mounted in the surface side of the conversion board 3, and may be mounted in the back surface side.
Next, in addition to the technical ideas described in the claims, the technical ideas grasped by the above-described embodiments are listed below together with their effects.
[0059]
(1) In any one of Claims 1-3, the said sub board | substrate is provided with two or more said conductor patterns which connect a said 1st pin and a said 2nd pin. Therefore, according to the invention described in this technical idea 1, as a result of replacement connection for a plurality of pins, even when a semiconductor package of an ultra-high performance CPU is mounted, the package can be surely adapted to the motherboard side. it can.
[0060]
(2) In any one of claims 1 to 3 and technical idea 1, the first and second pins are joined to land patterns provided at both ends of the conductor pattern by soldering. That.
[0061]
(3) The double-sided board according to any one of claims 1 to 3, and the technical ideas 1 and 2, wherein the conversion board has a conductor pattern formed by a subtractive method on both sides thereof and a mini via hole. Be. With this configuration, the conversion substrate is inexpensive, and the overall cost can be prevented.
[0062]
(4) In any one of claims 1 to 3 and technical ideas 1 to 3, the insulating substrate has the conductor pattern and the land pattern only on one side surface, and each pin insertion hole A conversion module characterized by being a single-sided plate having no plating layer on the inner wall surface thereof. With this configuration, the sub-board becomes inexpensive and the overall cost can be prevented.
[0063]
(5) In any one of claims 1 to 3 and technical ideas 1 to 3, the PGA socket includes a socket body including a fixed member and a movable member, and the fixed member includes a plurality of pins on a lower surface side. The movable member has a plurality of pin insertion / extraction holes and is slidably provided with respect to the fixed member, and operating means for providing a driving force for sliding the movable member, Each pin insertion / removal hole is narrowed by operation of the operation means, so that each pin on the conversion module side is fixed so as not to come out.
[0064]
【The invention's effect】
As described in detail above, according to the first to third aspects of the present invention, a replacement module can be provided relatively easily, so that a conversion module that is easy to manufacture can be provided.
[0065]
According to the second aspect of the present invention, it is possible to provide a conversion module in which bending of external connection pins and tilting of the entire module when mounting a PGA socket hardly occur.
[0066]
According to the third aspect of the present invention, it is possible to provide a conversion module structure suitable for a case where there are a plurality of locations where replacement connection is to be performed, or when a replacement connection path is complicated and long.
[Brief description of the drawings]
FIG. 1 is a schematic side view showing a use state of a conversion module according to an embodiment of the present invention.
FIG. 2 is a schematic plan view of a socket for PGA used in the embodiment.
FIG. 3 is a schematic side view of the same PGA socket.
FIG. 4 is a plan view of a daughter board that also has one conductor pattern.
FIG. 5 is a partially enlarged sectional view of the conversion module.
FIG. 6 is a plan view of a daughter board that similarly includes a plurality of conductor patterns.
FIG. 7 is a schematic side view showing a usage state of another example of the conversion module.
FIG. 8 is a schematic side view showing a usage state of a conventional electronic component mounting module.
9 is a schematic side view showing a use state when a mounting method different from FIG. 8 is adopted.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1,51 ... PGA type conversion module, 6, 6A ... External connection pin, 3 ... Conversion board, 4 ... Package mounting socket board, 9 ... QFP as signal conversion element, 24 ... I / O pin, 24A ... Specific I / O pins requiring replacement connection, 31 ... second pin, 32, 32A, 52 ... child board, 34 ... conductor pattern, 36 ... pin through hole, 37 ... first pin, 41 ... for PGA Socket, 46... Stepped portion, L1... Height of the stepped portion, L2... Length from the back surface of the conversion board to the bottom surface of the sub board, MB.

Claims (3)

A conversion board having a signal conversion element and the like and having a plurality of external connection pins projecting on the back surface side, and a plurality of I / O pins projecting and mounted on the surface side of the conversion board using them A PGA type conversion module that is electrically connected to a motherboard by inserting the external connection pin into a PGA socket having a stepped portion on the upper surface side.
A first pin provided at a position corresponding to a particular I / O pins that require replacement connection, the daughter board with its one end to the first pin electrically connected to conductor patterns, the back side of the converter board And a second pin shorter than the external connection pin protrudes from the conversion substrate , and is supported by the lower surface of the child board in contact with the upper surface of the PGA socket . The conversion module is characterized in that the signal conversion element or the like is provided on a path connecting the specific I / O pin and the second pin electrically to the other end of the conductor pattern. The child board has pin insertion holes for inserting the external connection pins, and the plurality of external connection pins are fixed to each other in a state of being inserted into the pin insertion holes. 2. The conversion module according to claim 1, wherein a length from a back surface of the conversion substrate to a lower surface of the sub-substrate is set to be greater than a height of the stepped portion. The conversion module according to claim 1, wherein an area of the sub-board is larger than an area of a pin formation area in the conversion board.

Images