JP3593249B2 - Conversion module - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a conversion module.
[0002]
[Prior art]
A semiconductor package having a function as a CPU (central processing unit) is mounted on a motherboard in a personal computer via a socket. At present, a PGA (pin grid array) type in which a large number of I / O pins are erected on one side surface is dominant as such a semiconductor package.
[0003]
In some cases, a user of a personal computer desires an upgrade for speeding up processing. In this case, it is necessary to remove the existing semiconductor package from the socket and mount a more sophisticated semiconductor package. At that time, it is proposed that a high-performance semiconductor package be mounted on a conversion module including a plurality of substrates and then indirectly mounted on a socket of a motherboard.
[0004]
As a conventional conversion module, a module having a socket substrate for mounting a semiconductor package and a conversion substrate as main components has been proposed. The conversion board (for example, a double-sided board) has a function of converting a signal. Such a conversion board is provided with a plurality of plated through holes, and the base ends of the external connection pins are inserted into the openings on the lower surface thereof. Note that these external connection pins are fitted into and removed from the sockets on the motherboard. The socket board has a plurality of I / O pins. These I / O pins are protruded at locations corresponding to the plurality of plated through holes on the back side of the socket substrate. Each I / O pin is inserted into each plated through hole and soldered, whereby electrical conduction between the socket board side and the conversion board side is achieved. Further, since the I / O pins of the socket substrate are socket-like pins having an insertion hole at the upper end surface thereof, the I / O pins of the semiconductor package are fitted therein. Therefore, it is considered that the use of such a conversion module makes it possible to adapt the semiconductor package to the motherboard side and to easily exhibit the original performance of the package.
[0005]
[Problems to be solved by the invention]
By the way, recently, as a conversion module structure for a larger upgrade, a conversion module structure in which a signal conversion element such as a semiconductor package is mounted in an area surrounded by a plated through hole group and the signal conversion is performed by the element is proposed. Has been reached. However, when such a structure is adopted, it is necessary to perform a replacement connection for a specific I / O pin. That is, the specific I / O pin is not connected directly to the external connection pin via the corresponding plated through hole, but is connected to the input side of the signal conversion element using a conductor such as a lead wire. This is to obtain a converted signal from the output side.
[0006]
However, when the length of each I / O pin is equal, when the socket board is mounted on the conversion board, the particular I / O pin is also inserted into the opening on the upper surface side of the plated through hole. Conduction directly with the external connection pins. Therefore, conventionally, for example, it is necessary to prepare a short cut pin in advance and use it as the specific I / O pin to prevent a short circuit due to direct conduction. Therefore, there has been a demand for a structure capable of performing the replacement connection without changing the length of the I / O pin.
[0007]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and an object of the present invention is to provide a conversion module having a structure in which replacement connection can be performed relatively easily without changing the length of I / O pins. Is to do.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, in the invention according to claim 1, a signal conversion element is mounted on a conversion board provided with a plurality of plated through holes, and a plurality of plated through holes are provided at positions corresponding to the plurality of plated through holes. In a conversion module in which a socket substrate for mounting a semiconductor package having / O pins projected thereon is mounted, and the I / O pins are inserted into the plated through holes, the two substrates are electrically connected to each other. The socket board mounting side opening of the plated through hole corresponding to the specific I / O pin that needs to be removed is removed in a concave shape together with the plating layer of the portion, and the I / O pin and the replacement connection conductor on the conversion board side are removed. A gist of the present invention is a conversion module characterized by being connected via a conductor.
[0009]
According to a second aspect of the present invention, in the first aspect, a flexible insulator is interposed between the plated through hole having the concave removal portion and the specific I / O pin.
[0010]
According to a third aspect of the present invention, in the first or second aspect, a child substrate having a conductor pattern is disposed between the two substrates, and the child substrate cannot be displaced in a plane direction by the I / O pins. And the replacement connection conductor portion and the specific I / O pin are joined to the conductor pattern using a conductive material.
[0011]
Hereinafter, the “action” of the present invention will be described.
According to the first aspect of the present invention, the specific I / O pin and the exchange connection conductor on the conversion board side are connected via the conductor, so that the exchange connection for the specific I / O pin is performed. Done. When the socket board is mounted on the conversion board, other I / O pins that do not require replacement connection are inserted into the corresponding socket-plate-mounting-side openings of the plated through holes. Therefore, these I / O pins come into contact with the plating layer in that portion, and conduct directly to the corresponding plating through holes. On the other hand, for a specific I / O pin that requires replacement connection, the corresponding plating through-hole opening on the socket substrate mounting side has been removed in a concave shape together with the plating layer of the corresponding portion, so that it must come into contact with that plating layer. There is no. Therefore, the specific I / O pin does not directly conduct to the corresponding plated through hole, thereby avoiding a short circuit. Therefore, the replacement connection can be performed without changing the length of the specific I / O pin to be short.
[0012]
According to the second aspect of the present invention, the specific I / O pin is separated from the plated through hole having the concave removal portion by the interposition of the insulator, so that the two are not in direct contact with each other to conduct. . Therefore, a short circuit caused by direct conduction is more reliably avoided, and reliability is improved. In addition, since it is not necessary to set the concave removing portion deeper in anticipation of safety in order to avoid direct conduction, the concave removing portion can be provided with a minimum depth, which makes the manufacturing easier. Furthermore, the flexible insulator does not break even when pressed by the tip of the specific I / O pin, but flexes and follows the inner wall surface of the concave removal portion.
[0013]
According to the third aspect of the present invention, since a conductor pattern is formed in advance on the sub-substrate disposed between the two substrates, the sub-substrate is cut to a predetermined length or insulated, unlike the case where lead wires are used, for example. A troublesome operation such as peeling off the coating is not required. In addition, since the daughter board is held by the I / O pins so as not to be displaced in the plane direction, the positioning operation itself becomes extremely easy. As a result, the workability during manufacturing is excellent, and the connection reliability is excellent. Further, a simple structure such as a double-sided board is sufficient for the conversion board, and it is not necessary to perform the replacement connection depending on the multilayer board or the build-up layer. Therefore, an increase in cost is reliably avoided.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a PGA conversion module 1 according to an embodiment of the present invention will be described in detail with reference to FIGS.
[0015]
As shown in FIGS. 1 and 4, the conversion module 1 of this embodiment is a device for performing signal conversion on the PGA 2 and mounting the PGA 2 on the motherboard MB. The conversion module 1 includes a plurality of substrates, that is, a conversion substrate 3 and a socket substrate 4 as main components.
[0016]
The conversion substrate 3 is a rigid double-sided plate having a rectangular shape. The conversion board 3 includes a plated through hole group in which a plurality of plated through holes 5 are arranged in a substantially rectangular shape. Each plating through hole 5 has a copper plating layer G1 on the inner wall surface. As shown in FIG. 3, the plated through holes 5 are arranged in a staggered manner at a constant pitch. As shown in FIG. 4, the base end of the external connection pin 6 is inserted into the opening of each plating through hole 5 on the non-socket substrate mounting side (that is, the lower surface side). The pins 6 may be joined by soldering.
[0017]
One die pad 7 and a plurality of pads 8 surrounding the die pad 7 are formed in a substantially square region surrounded by the plated through hole group. A QFP (quad flat package) 9 for signal conversion as a signal conversion element is surface-mounted on the die pad 7. This QFP 9 has a large number of so-called gull-wing-shaped leads 9a. Each lead 9a is joined to each pad 8 by using solder S1 which is a conductive material. Note that one of the pads 8 is assigned as a replacement connection pad 8a as a replacement connection conductor.
[0018]
On the socket substrate mounting side (that is, the upper surface side) of the conversion substrate 3, pads 10 for connecting electronic components are formed in a region not surrounded by the through-hole group. A DIP (dual in-line package) 11 is surface-mounted on the pad 10. An electronic component connection pad 12 is also formed on the lower surface side of the conversion board 3, and a chip resistor 13 is surface-mounted thereon. These electronic components 11 and 13 are also joined to the respective pads 10 and 12 using solder S1. On the upper and lower surfaces of the conversion board 3, conductor patterns (not shown) are formed. The conductor pattern electrically connects the lands 5a and 5b of the plated through hole 5, the QFP 9 and the electronic components 11 and 13 to each other.
[0019]
The conversion substrate 3 has a mini via hole (not shown). Here, the mini-via hole has a smaller diameter (several tens of μmφ) than a normal plated through hole for the purpose of pin insertion and front-to-back conduction, and refers to only the front-to-back conduction. At the upper end of the mini via hole penetrating the upper and lower surfaces of the conversion board 3, one of the pads 8 corresponding to the side from which the conversion signal is output (8b in FIG. 1) is electrically connected.
[0020]
Next, the configuration of the semiconductor package mounting socket substrate 4 will be described. As shown in FIGS. 1 and 4, the insulating base material 21 constituting the socket substrate 4 has a square shape and a frame shape, and the size of the outer shape is substantially the same as the size of the PGA 2 which is a mounted object. equal. The insulating base 21 has a square central hole 22. The reason why such a center hole 22 is provided is to secure a space for accommodating the QFP 9, facilitate soldering, and efficiently dissipate the heat generated by the QFP 9. Therefore, the center hole 22 may be formed slightly larger than the QFP 9 at a position corresponding to the QFP 9.
[0021]
Around the central hole 22, a large number of pin insertion holes 23 having a circular cross section and a diameter much smaller than that of the central hole 22 are formed in a staggered manner. Socket-shaped I / O pins 24 are inserted into the respective pin insertion holes 23. The lower end of the I / O pin 24 protrudes from the back side (lower side) of the insulating base 21. Each socket-like I / O pin 24 is formed with an insertion hole 25 extending along the axial direction. An I / O pin 26 on the PGA 2 side can be inserted into and removed from the insertion hole 25. That is, the socket substrate 4 has a structure on the front side (upper side) on which the PGA 2 can be attached and detached.
[0022]
For convenience of description, among the socket-like I / O pins 24, a specific I / O pin that requires replacement connection is represented by 24A, and is distinguished from other I / O pins 24 that do not require replacement connection. Further, a plated through hole corresponding to a specific I / O pin 24A is represented by 5A, and is distinguished from other plated through holes 5.
[0023]
The land 5Ab in the opening on the lower surface side of the plating through hole 5A and the lower end of the mini via hole are electrically connected by a conductor pattern (not shown). Accordingly, the output side of the QFP 9 is electrically connected to the land 5Ab of the opening on the lower surface side, and the state is schematically indicated by a broken arrow A1 in FIG.
[0024]
As shown in FIG. 4, the opening on the upper surface side of the plated through hole 5A corresponding to the specific I / O pin 24A is removed in a concave shape together with the copper plating layer G1 of the portion. Specifically, in the present embodiment, the portion is removed in a mortar shape by a conventionally known counterboring process, and as a result, a mortar-shaped removal portion 44 as a concave removal portion is formed. The depth of the mortar-shaped removing portion 44 reaches about half of the plated through hole 5A. The reason why the counterbore processing is adopted is that it is an inexpensive and reliable method.
[0025]
In FIG. 4, other I / O pins 24 that do not require the replacement connection are inserted into the openings on the upper surface side of the corresponding plated through holes 5 and are soldered to the plated through holes 5. On the other hand, the distal end surface of the specific I / O pin 24A that requires replacement connection is located at a position lower than the upper surface of the conversion board 3 and reaches the inside of the mortar-shaped removing portion 44 of the corresponding plated through hole 5A.
[0026]
As shown in FIG. 1, a socket 30 is fixed to the motherboard MB in advance by soldering so as not to be detachable, and the conversion module 1 is used in a state mounted on the upper surface side of the socket 30. At this time, the external connection pins 6 are inserted into the insertion holes of the socket-like pins 31 of the socket 30. Note that, for convenience in performing component replacement, no soldering is performed on the connection portion.
[0027]
The conversion module 1 of the present embodiment further includes, in addition to the conversion board 3 and the socket board 4, a daughter board 36 and a resin film 43. First, the structure of the daughter board 36 will be described.
[0028]
As shown in FIG. 2 and the like, the daughter board 36 of the present embodiment is a so-called double-sided board provided with a conductor pattern 38 as a conductor on one side of an insulating base material 37. The conductor pattern 38 is preferably formed by a conventionally known subtractive method. The insulating base material 37 used here is substantially rectangular and rigid, and has a thickness of 0.8 mm. As shown in FIG. 3, the width W1 of the insulating base material 37 is set to be slightly smaller than the pitch of the I / O pins 24 (for example, 2.54 mm, 1.27 mm). Therefore, one end of the insulating base material 37 can be easily inserted between the plurality of I / O pins 24 that do not require replacement connection.
[0029]
The conductor pattern 38 is formed to extend along the longitudinal direction of the insulating base 37. A primary pad 39 is formed at one end of the conductor pattern 38, and a secondary pad 40 is formed at the other end. The primary pad 39 has a substantially circular outer shape, and is located near the insertion end of the insulating base 37. A slit 42 is formed in the center of the insertion side end of the insulating base material 37. The slit 42 extends along the longitudinal direction of the insulating base 37, and its tip extends to the center of the primary side pad 39. As shown in FIG. 3, the width of the slit 42 is set to a size at which at least the small-diameter portion of the specific I / O pin 24A can be inserted.
[0030]
The secondary pad 40 has a rectangular shape and is located at an end of the insulating base material 37. From the viewpoint of improving the connection reliability of the soldered portion, the two pads 39 and 40 are preferably formed as large as possible. However, it is preferable that the diameter of the primary side pad 39 is set to be slightly smaller than the width W1 of the insulating base material 37. This is to prevent a short circuit due to contact between the primary pad 39 and the I / O pin 24.
[0031]
As shown in FIG. 4, the sub board 36 provided with the conductor pattern 38 is used in a state where it is arranged between the two boards 3 and 4. At this time, the pattern formation surface of the daughter board 36 faces the socket board 4 side. The sub-board 36 disposed between the two boards 3 and 4 is held in a state where it cannot be displaced in its own plane direction by contacting the outer peripheral surfaces of the I / O pins 24 and 24A. In the present embodiment, the daughter board 36 is configured to contact three pins including the specific I / O pin 24A, and to be positioned from three directions. It should be noted that even if the daughter board 36 has a structure in which it contacts only the I / O pins 24A, a certain degree of positioning can be achieved.
[0032]
In such a positioning state, a specific I / O pin 24A is located exactly at the center of the primary pad 39. On the other hand, the secondary pad 40 takes a position corresponding to the replacement connection pad 8 a on the conversion board 3. The outer peripheral surface of the small-diameter portion of the specific I / O pin 24A and the primary pad 39 are joined together using the solder S1, and the replacement connection pad 8a with the secondary pad 40 is joined. That is, the specific I / O pin 24A and the replacement connection pad 8a are electrically connected via the conductive pattern 38 of the daughter board 36.
[0033]
Next, the structure of the resin film 43 as a flexible insulator will be described. As shown in FIGS. 3 and 4, the resin film 43 is interposed between the plated through hole 5A having the mortar-shaped removal portion 44 and the specific I / O pin 24A. The resin film 43 of this embodiment has a rectangular shape and a thickness of several tens of μm, and is small enough to be inserted between six I / O pins 24 surrounding a specific I / O pin 24A ( (See FIG. 3). More specifically, in this embodiment, a PI (polyimide) film is used as the resin film 43. Instead, for example, an epoxy film or the like may be used.
[0034]
The resin film 43 may be fixed to the conversion substrate 3 in advance with an adhesive or the like, or may be disposed in a free state without using any adhesive or the like. It is also allowed to arrange the I / O pins 24 that do not require the replacement connection so as to pierce the resin film 43. In addition, the resin film 43 is bent by being pressed downward by the tip of the specific I / O pin 24, and substantially follows the inner wall surface of the mortar-shaped removing portion 44.
[0035]
Next, an example of a method of manufacturing the conversion module 1 will be described.
First, the conversion board 3, the socket board 4, and the slave board 36 are prepared in advance. The socket substrate 4 can be obtained by piercing the pin insertion holes 23 in the frame-shaped insulating base material 21 and then inserting the socket-shaped I / O pins 24 and 24A of the same length into them. The sub-substrate 36 is manufactured by a subtractive method using, as a starting material, a copper foil laminate obtained by attaching a copper foil to one surface of a glass epoxy insulating base material, for example. In the case of multiple boards, the multiple board may be divided and the required number of sub-boards 36 may be obtained. The conversion substrate 3 is manufactured as follows. First, a conventionally known pattern formation such as a subtractive method is performed using a copper foil laminate obtained by attaching copper foil to both surfaces of a glass epoxy insulating base material as a starting material. Thereby, plated through holes 5, 5A, mini via holes, die pad 7, pads 8, 8a, 8b, etc. are formed in the insulating base material. Instead of glass epoxy, a copper-clad laminate made of glass polyimide may be selected. Thereafter, by performing a counterboring process, the opening on the upper surface side of the plating through hole 5A is removed together with the copper plating layer G1 of the corresponding portion, thereby forming a mortar-shaped removal portion 44.
[0036]
In the subsequent first pin setting step, the base end of the external connection pin 6 is press-fitted into the opening on the lower surface side of each of the plated through holes 5 and 5A of the conversion board 3 by a press.
In the subsequent solder printing step, cream solder is printed on the lands 5a of the plated through holes 5 located on the upper surface side of the conversion board 3 by a screen printing technique. This is because the upper surface of the conversion substrate 3 is flat, unlike the lower surface from which the external connection pins 6 protrude, and is therefore suitable for printing. The printing of the cream solder may be performed by a method other than the screen printing. As the cream solder, for example, one obtained by dispersing powder of eutectic solder (Pb: Sn = 37: 63, melting point: 183 ° C.) in a vehicle is used. At this time, the cream solder is also printed on the pads 8, 8a, 8b surrounding the QFP 9.
[0037]
Next, the resin film 43 cut into a predetermined shape in advance is arranged on the conversion substrate 3. As described above, bonding may be performed as necessary. Note that such an insulator disposing step can be performed before the solder printing step or before the first pinning step.
[0038]
In the subsequent second pin setting step, the tip of each socket-like I / O pin 24 is inserted into the opening on the upper surface side of the plating through hole 5 of the conversion board 3, and the QFP 9 is fixed on the die pad 7.
[0039]
In the subsequent reflow step, after setting the conversion board 3 on which the socket board 4 is mounted in a reflow furnace, the temperature in the furnace is raised to a temperature near the melting point of the cream solder to melt the solder S1. When the molten solder S1 cools and hardens, the socket-like I / O pins 24 are joined to the plated through holes 5, and the leads 9a of the QFP 9 are joined to the pads 8, 8a, 8b.
[0040]
Next, the daughter board 36 is inserted between the I / O pins 24. The daughter board 36 can be inserted, for example, through the central hole 22 of the socket board 4 (see a solid arrow A2 in FIG. 1). Then, the sub-board 36 positioned as described above by being inserted between the I / O pins 24 is individually soldered using the solder S1. At this time, the electronic components 11 and 13 are individually soldered to the corresponding pads 10 and 12 at the same time.
[0041]
After completing the desired conversion module 1 as described above, the PGA 2 is mounted on the conversion module 1 and further mounted on the socket 30 of the motherboard MB. In this case, the signal of PGA2 flowing through the specific I / O pin 24A is input to the QFP 9 via a route of the primary pad 39, the conductor pattern 38, the secondary pad 40, and the replacement connection pad 8a. The converted signal is further output from the QFP 9, and then passes through the route of the pad 8b, the mini via hole, the conductor pattern, the land 5Ab of the plated through hole 5A, the external connection pin 6, and the socket-like pin 31, and passes through the mother board MB. Supplied to the side. That is, the specific I / O pin 24A is not directly conducted to the external connection pin 6 via the corresponding plated through hole 5A, but is indirectly conducted to the external connection pin 6. .
[0042]
When the specific I / O pins 24A are switched as described above, signal conversion is mainly performed by the QFP 9, and the original functions of the PGA 2 can be sufficiently exhibited.
[0043]
Now, the characteristic effects of the present embodiment will be listed below.
(A) In the present embodiment, when the socket board 4 is mounted on the conversion board 3, the other I / O pins 24 that do not require replacement connection come into contact with the corresponding copper plating layer G <b> 1 of the plated through hole 5. Conducted directly with plating through hole 5. Here, with respect to the plated through hole 5A corresponding to the specific I / O pin 24A, the opening on the upper surface side is removed in a mortar shape unlike the normal plated through hole 5. Therefore, the specific I / O pin 24A does not come into contact with the copper plating layer G1 of the plating through hole 5A, even though it has the same length as the other I / O pins 24. Therefore, the specific I / O pin 24A does not directly conduct to the corresponding plated through hole 5A, thereby avoiding a short circuit. For this reason, the length of the specific I / O pin 24A does not need to be intentionally shortened, and it is sufficient to use only one type of I / O pin 24. Therefore, the replacement connection can be easily performed as compared with the case where the I / O pins 24 and 24A having two types of lengths are required.
[0044]
(B) In the conversion module 1 of the present embodiment, the resin film 43 is interposed between the plated through hole 5A having the mortar-shaped removing portion 44 and the specific I / O pin 24A. Since the specific I / O pin 24A is separated from the plated through hole 5A by the interposition of the resin film 43, a short circuit caused by direct conduction is more reliably avoided. This also improves the reliability of the device. In addition, in order to avoid direct conduction, it is not necessary to set the processing depth of the mortar-shaped removing portion 44 to be deeper than necessary in view of safety. Therefore, the concave removal portion 44 is required with a minimum processing depth, thereby making the manufacture of the conversion substrate 3 easier. Furthermore, since the resin film 43 such as a PI film has flexibility, the resin film 43 does not break even when pressed by the tip of the specific I / O pin 24A. It can follow the inner wall surface.
[0045]
(C) In the conversion module 1 of the present embodiment, the sub-substrate 36 on which the conductor pattern 38 is formed in advance is disposed between the substrates 3 and 4. Therefore, unlike the case where a lead wire is used, for example, a troublesome operation such as cutting to a predetermined length or peeling off an insulating coating is not required. In addition, since the sub-board 36 is held by the three I / O pins 24 and 24A so as not to be displaced in the plane direction, the positioning operation itself becomes extremely easy. Therefore, the structure is excellent in workability at the time of manufacturing and excellent in connection reliability of a soldered portion.
[0046]
(D) In the conversion module 1 of the present embodiment, since the conversion board 3 has a simple structure of a double-sided board, for example, the conversion board 3 may be a multilayer board, or a build-up layer may be formed on the conversion board 3. It becomes unnecessary. Therefore, the replacement connection can be performed while avoiding a complicated structure and a high cost.
[0047]
(E) In the conversion module 1 of the present embodiment, by using the area surrounded by the plated through-hole group, a relatively large QFP 9 can be mounted without increasing the external size of the conversion board 3 itself. it can. This is advantageous, for example, when performing an upgrade using a large PGA2.
[0048]
(F) The sub-substrate 36 and the resin film 43 used in the present embodiment are much smaller in area than the conversion substrate 3 and the socket substrate 4. Moreover, a large number of the sub-boards 36 can be obtained from a single plate material by a large number of pieces. These contribute to prevention of cost increase.
[0049]
Note that the present invention is not limited to the above embodiment, and can be changed to, for example, the following forms.
The conversion module 51 of another example shown in FIG. 5 may be used. A so-called cross-sectional through hole 52 is formed in the side wall surface of the insertion side end of the daughter board 54. The cross-sectional through-hole 52 is connected to the primary pad 39 and is soldered in contact with the outer peripheral surface of the small-diameter portion of the specific I / O pin 24A. Similarly, a through-hole 53 is formed in the side wall surface of the non-insertion side end of the daughter board 54. This through hole 53 is connected to the secondary pad 40 and is soldered to the replacement connection pad 8a. Here, the cross-sectional through holes 52 and 53 are formed by forming a normal plated through hole by performing copper plating or the like, and then dividing the insulating base material at the plated through hole to expose the cross section. Generally refers to. With such another structure, the number of bonding surfaces between conductors increases, so that soldering can be performed reliably and connection reliability is further improved.
[0050]
A configuration in which the resin film 43 is omitted as in the conversion module 61 of another example shown in FIG. 6 is also allowed.
The concave removing portion is not limited to a mortar shape as in the embodiment, and may be, for example, a substantially hemispherical shape or a columnar shape.
[0051]
The conductor pattern 38 as a conductor may be formed by a method other than the subtractive method, for example, a printing method. It is also possible to use lead wires or the like instead of the sub-boards 36 and 54 having the conductor pattern 37.
[0052]
The insulator is not limited to the resin film 43 as in the embodiment, but may be used even if it is not a film.
◎ Since the process of forming the concave removal portion such as the counterboring process is sufficient to be performed before the step of arranging the resin film 43 on the conversion substrate 3, it may be performed, for example, after the first pinning step. . It should be noted that, when the counterboring process is performed at the same time when the conversion substrate 3 is drilled, the production efficiency is improved.
[0053]
In place of the external connection pins 6 erected on the lower surface side of the conversion substrate 3, for example, solder balls or the like may be provided in the openings on the lower surface side of the plated through holes 5 and 5A.
Here, in addition to the technical ideas described in the claims, technical ideas grasped by the above-described embodiments are listed below together with their effects.
[0054]
(1) The conversion module according to any one of claims 1 to 3, wherein a signal conversion element is mounted in a region of the conversion substrate surrounded by a group of plated through holes. This configuration is advantageous for an upgrade using, for example, a large signal conversion element.
[0055]
(2) The conversion module according to (3) or the technical idea (1), wherein the sub-substrate has a cross-sectional through hole connected to the conductor pattern on an end side wall surface. With this configuration, the number of bonding surfaces between the conductors increases, and the connection reliability further improves.
[0056]
(3) The conversion module according to any one of claims 2 and 3, and the technical ideas 1 and 2, wherein the insulator is a resin film (for example, a PI film). A resin film has a suitable flexibility and can be arranged between the substrates without any trouble since it is thin.
[0057]
(4) The conversion module according to any one of claims 1 to 3, and the technical ideas 1 to 3, wherein the socket substrate for mounting a semiconductor package has a central hole at a position corresponding to the signal conversion element. With this configuration, the daughter board can be easily inserted into a predetermined position between the boards, and workability is improved.
[0058]
(5) The double-sided board according to any one of claims 1 to 3 and technical ideas 1 to 4, wherein the conversion substrate has a conductor pattern formed by a subtractive method on both surfaces thereof and has a mini via hole. Is a conversion module. With this configuration, the conversion board is inexpensive, and high cost can be prevented.
[0059]
(6) A conversion board for a conversion module having a plated-through-hole structure in which an external connection pin can be inserted into one opening and the other opening is concavely removed together with the plating layer of the portion. . By using such a conversion board, the excellent conversion module of the present invention can be reliably obtained.
[0060]
【The invention's effect】
As described in detail above, according to the first to third aspects of the present invention, there is provided a conversion module having a structure in which replacement connection can be performed relatively easily without changing the length of I / O pins. can do.
[0061]
According to the second aspect of the present invention, it is possible to provide a structure that is excellent in reliability and easy to manufacture.
According to the third aspect of the present invention, it is possible to provide a structure which is excellent in workability and connection reliability at the time of manufacturing, and which can reliably avoid high cost.
[Brief description of the drawings]
FIG. 1 is a schematic side view for explaining a use state of a conversion module according to an embodiment of the present invention.
FIG. 2 is a plan view of a child substrate used in the embodiment.
FIG. 3 is a plan view showing a state in which a child substrate according to the embodiment is arranged.
FIG. 4 is a partially enlarged cross-sectional view of the conversion module according to the embodiment.
FIG. 5 is a partially enlarged cross-sectional view of another conversion module.
FIG. 6 is a partially enlarged cross-sectional view of another conversion module.
[Explanation of symbols]
1, 51, 61: Conversion module, 3: Conversion board, 4: Socket board for mounting semiconductor package, 5, 5A: Plating through hole, 8a: Replacement connection pad as replacement connection conductor, 9: Signal conversion element QFP, 24: socket-like I / O pins, 24A: specific socket-like I / O pins requiring replacement connection, 36, 54: child board, 38: conductor pattern as conductor, 43: insulator Resin film, G1 ... copper plating layer as plating layer, S1 ... solder as conductive material.

Claims (3)

On a conversion board on which a signal conversion element is mounted and a plurality of plated through holes are provided, a semiconductor package mounting socket board having I / O pins protruded at locations corresponding to the plurality of plated through holes, In a conversion module in which both substrates are electrically connected by inserting the I / O pins into the plated through holes,
The socket board mounting side opening of the plated through hole corresponding to the specific I / O pin requiring replacement connection is removed in a concave shape together with the plating layer of the portion, and the I / O pin and the replacement connection conductor on the conversion board side are removed. A conversion module, wherein the units are connected via a conductor. 2. The conversion module according to claim 1, wherein a flexible insulator is interposed between the plated through hole having the concave removal portion and the specific I / O pin. 3. A sub-board having a conductor pattern is disposed between the two substrates, and the sub-board is held by the I / O pins so as not to be displaced in a plane direction. The conversion module according to claim 1, wherein the O-pin is joined to the conductive pattern using a conductive material.

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