JPH08315877A - Mounting method for surface mount type connector - Google Patents

Abstract

PURPOSE: To provide a mounting method for a surface mount type connector in which soldering can be performed in a fixed position without displacement even under a small vibration and a pad area can be reduced by inserting an electrode into the dish-form part of a pad provided in a printed wiring board and melting solder and after that, cooling it down to a normal temperature. CONSTITUTION: Hemispheric solder is made to adhere to the tip of an electrode terminal of the soldering side of a pin 2 of a connector 1 by a plating method, and it is inserted into a dish-form pad 5 for conducting a pattern 6 of a printed wiring board 4. After that, it is heated so that the solder is melted and the dish-form pad 5 is wetted by the solder and after that, it is cooled down to a normal temperature. Therefore, the connector 1 is soldered in a fixed position to the printed wiring board 4 through the solder 3a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a method of mounting a surface mount type connector on a printed wiring board used in electronic equipment.

[0002]

2. Description of the Related Art A printed wiring board with an electronic component according to the present invention is used in many electronic devices and apparatuses whose size is rapidly decreasing, and there is a strong demand for further size reduction. For this reason, the so-called substrate of a printed wiring board is becoming more dense and multi-layered for wiring, and for electronic components, the surface-mounting type, in which electrodes are soldered to the pads on the surface of the printed wiring board without using through holes, is more common. It has been raised.

A connector capable of simultaneously achieving a plurality of electrical connections between printed wiring boards and between a printed wiring board and another object is used in various printed wiring boards. This connector has generally been soldered by inserting a pin into each through hole penetrating a printed wiring board, but like other electronic components, a surface mount connector as shown in FIG. 3 is being widely adopted. . In this manufacturing method, the flat surface of several or a few leads 11a integrated with the connector 11 is placed on a pad 13a of a printed wiring board 13 to which a so-called solder paste (also known as cream solder) is attached. The solder 12 having a diameter of several μm is melted by heating and then cooled to room temperature to form the solder 12. When this connector is used, there is an advantage that this back surface portion of the printed wiring board 13 can be used for mounting other components.

[0004]

The connector of the example of FIG. 3 described in the prior art has a shape that is difficult to mount by a commercially available automatic component mounting machine, has no positioning portion between the connector and the printed wiring board, and Larger and heavier than other parts,
Positioning is difficult until it is placed on a printed wiring board and soldered, and it is necessary to fix it with an adhesive or the like before soldering. When the number of pins is large and long, a positioning tool is sometimes used.

An object of the present invention is to provide a method of mounting a surface mount type connector on a printed wiring board, which can be easily positioned during soldering.

[0006]

SUMMARY OF THE INVENTION According to the present invention, a hemispherical solder is attached to an electrode on a soldering surface of a surface mount type connector, and the electrode is placed in a plate-shaped portion of a pad provided on a printed wiring board and heated. This is a mounting method in which the solder is melted and then cooled to room temperature.

[0007]

According to the present invention, the normally flat pad of the printed wiring board is used as a recess, and the hemispherical soldered electrode of the connector is placed on this recessed pad to heat the connector. It sinks and is cooled after it is positioned accurately.

[0008]

FIG. 1 shows an embodiment of the present invention. Connector 1
A hemispherical solder is attached to the tip of the electrode terminal on the soldering side of the pin 2 by a plating method or the like, and is put into the dish-shaped pad 5 which is electrically connected to the pattern 6 of the printed wiring board 4. After that, when the solder is melted and the dish-shaped pad 5 is heated so as to be wet with the solder and then cooled to room temperature, the connector 1 is soldered in place through the printed wiring board 4 and the solder 3a as shown in FIG. To be done.

The dish-shaped pad 5 is machined into a dish shape in the initial stage when the copper foil is attached to the entire surface of the printed wiring board 4.
After forming a pattern with a pattern 6 by etching, after making a copper plating with a catalyst and bringing it into close contact with the surrounding copper foil and conducting it, or after making a printed wiring board with a dish-shaped portion of the dish-shaped pad 5 by molding By the so-called mold printed wiring board 4 to which the pad 5 and the pattern 6 are attached.

[0010]

According to the present invention, since the solder is attached to the pins and the pads and the pins can be positioned relative to each other before soldering, it is not necessary to apply solder paste and the solder does not shift even with some vibration. Since the solder can be attached in a fixed position and the solder does not flow out from the dish-shaped pad, there is no short circuit between pins,
It is possible to provide a method for mounting a surface-mounted connector on a printed wiring board, which does not require modification and can reduce the pad area.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an embodiment of the present invention.

FIG. 2 is a structural diagram of an embodiment of the present invention.

FIG. 3 is a structural diagram of a conventional example.

[Explanation of symbols]

 1 Connector 2 Pin 3 Solder 3a Solder 4 Printed Wiring Board 5 Dish Pad 6 Pattern 11a Lead 13a Pad

Claims (1)

[Claims] 1. A solder is attached in a hemispherical shape to a shaft-shaped electrode on a soldering surface of a surface-mounted connector, the electrode is put in a dish-shaped portion of a pad provided on a printed wiring board, and the solder is melted by heating, A method for mounting a surface mount type connector characterized by cooling to room temperature.