JP2000138329A - Manufacture of conversion module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a conversion module, which can bond socket pins to a conversion board simply and securely at accurate positions on the board, therefore can obtain products superior in connection reliability. SOLUTION: This manufacturing method, wherein conductive fusible bodies 48 are respectively kept formed previously on each of the surfaces of conductor parts 14 for connection provided on the side of the upper surface of a conversion board and under at least either of the lower end surfaces of socket pins 24 and 24A. By performing temporary fixing of the fusible bodies 48, the fusible bodies 48 are brought into contact with the lower end surfaces of the pins 24 and 24A and the surfaces of the conductor parts 14. In this state, through thermal fusion of the fusible bodies 48, the pins 24 and 24A are subjected to surface-mounting on the conductor parts 14. As a result, a desired conversion module 1 is manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a conversion module.

[0002]

2. Description of the Related Art A semiconductor package having a function as a CPU (central processing unit) is mounted on a motherboard in a personal computer via a socket.
As such a semiconductor package, at present,
A PGA (pin grid array) type in which a large number of I / O pins are erected on one side is dominant.

In some cases, a user of a personal computer desires an upgrade for speeding up processing. In this case, it is necessary to remove the existing semiconductor package from the PGA socket and mount a more sophisticated semiconductor package. At that time, it is proposed that a high-performance semiconductor package be mounted on the conversion module and then indirectly mounted on the PGA socket of the motherboard. FIG. 6 shows an example of a conventional conversion module 61.

A conventional conversion module 61 has a socket board 62 and a conversion board 63 as main components. The conversion board 63 is provided with a plurality of plated through holes 65 and mounted with an element 70 for performing signal conversion. The base end of the external connection pin 64 is inserted into the opening on the lower surface side of each plating through hole 65 and soldered. Each external connection pin 64 is inserted into and extracted from each pin insertion hole 71 of the PGA socket 69 on the motherboard MB. The socket substrate 62 has a plurality of socket pins 66 on the lower surface side. The distal end of each socket pin 66 has a small diameter, and is inserted into the opening on the upper surface side of each plating through hole 65 and soldered. An insertion hole is formed in the upper end surface of each socket pin 66, and an I-hole of the semiconductor package 67 is formed therein.
The / O pin 68 can be fitted and removed. Therefore, it is considered that the semiconductor package 67 can be adapted to the motherboard MB side by using such a conversion module 61, and the original performance of the package is easily exhibited.

[0005]

However, the small-diameter portion of the tip of the socket pin 66 is apt to bend, and in that case, it is necessary to completely insert the entirety into the upper opening of the plated through hole 65. become unable. Therefore, even if through-hole insertion mounting is performed by reflow soldering, since the socket pins 66 are not arranged at accurate positions, high reliability cannot be ensured at the connection portion between the socket board 62 and the conversion board 63.

Further, in order to eliminate the above-described bending of the pins, it is necessary to perform a predetermined repair work before soldering, which leads to a cause of a reduction in productivity.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a product having excellent connection reliability because socket pins can be easily and reliably joined to a correct position on a conversion board. It is another object of the present invention to provide a method for manufacturing a conversion module capable of obtaining the following.

[0008]

According to a first aspect of the present invention, there is provided a conversion board having an element for performing signal conversion and the like, and a grid array provided on an upper surface of the conversion board. A plurality of socket pins to which a plurality of terminals on the lower surface are attached and detached, and a method of manufacturing a conversion module in which electrical connection with a motherboard is achieved through a PGA socket having a plurality of pin insertion / extraction holes. A conductive fusible material is previously formed on at least one of the surface of each connection conductor provided on the upper surface side of the conversion board and the lower end surface of each socket pin, and the conductive material is temporarily fixed. The conductive fusible material is brought into contact with the lower end surface of the socket pin and the surface of the connecting conductor portion, and the conductive fusible material is heated and melted in this state, whereby The manufacturing method of the conversion module, wherein a surface mounting Topin as its gist.

According to a second aspect of the present invention, in the first aspect, the conductive fusible material is one selected from a solder plating layer, a solder cream printing layer, and a solder ball.

According to a third aspect of the present invention, in the first or second aspect, the conductive fusible body is simultaneously heated and melted at the time of reflow for soldering electronic components on the upper surface side of the conversion board. .

Hereinafter, the "action" of the present invention will be described. According to the first to third aspects of the present invention, the conductive fusible material is heated and melted in a state in which the temporary fixing is performed, so that the lower end surface of the socket pin and the surface of the connecting conductor portion are interposed through the conductive fusible material. Are joined. At that time, the socket pins are self-aligned by the fluidity of the molten conductive fusible material, and the positional displacement in the plane direction with respect to the connection conductor is corrected. Therefore, unlike the case where the through-hole insertion mounting method is adopted, the socket pins can be easily and reliably mounted at accurate positions, and high reliability can be secured at the connection portion.

Further, according to the present invention employing the surface mounting method, since there is no portion to be inserted into the through hole of the conversion board, there is no need to worry about bending of the inserted portion. Therefore, a repair work before soldering is not required, and a decrease in productivity due to the repair work is avoided.

According to the second aspect of the present invention, the solder which is a conductive fusible material has not only a favorable conductivity but also a suitable property that it can be melted at a relatively low temperature (around 200 ° C.). ing. Therefore, it can be heated and melted by a general reflow process, whereby the lower end surface of the socket pin and the surface of the connection conductor can be more easily and reliably joined.

According to the third aspect of the present invention, unlike the case where a step of heating and melting the conductive fusible body is provided separately from the reflow, complication of the entire process is prevented and productivity is improved. Is achieved.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a PGA conversion module 1 according to an embodiment of the present invention will be described in detail with reference to FIGS.

As shown in FIGS. 1 and 2, the conversion module 1 of this embodiment is a device for mounting a PGA 2 which is a kind of a chip module on a motherboard MB after performing a predetermined signal conversion. is there. On the lower surface of the PGA 2, I / O pins 26 as a plurality of terminals are regularly provided.

The conversion board 3 constituting the PGA 2 comprises a rigid core board 17 having a rectangular shape. The core substrate 17 is a so-called double-sided board having a conductor layer on both sides. The core substrate 17 includes a group of plated through holes in which a large number (several hundreds in the present embodiment) of plated through holes 5 are arranged in a substantially rectangular shape. Each plated through hole 5
Are arranged in a lattice or staggered pattern at a constant pitch.

One of the plurality of plated through holes 5 (indicated by 5A) is formed at a position corresponding to one of a plurality of socket pins 24, which will be described later, which requires replacement connection (indicated by 24A). Have been.

The base end of the external connection pin 6 is press-fitted (press-fitted) to the lower surface side opening of each of the plated through holes 5 and 5A without soldering.
As a result, conduction between each external connection pin 6 and each plating through hole 5, 5A is achieved.

On the lower surface side of the core substrate 17, sub-substrates 32 are arranged at predetermined intervals. Each of the external connection pins 6 is inserted through the pin insertion hole 36 of the sub-board 32 so as not to be able to come out, and its tip protrudes from the lower surface of the sub-board 32 by a predetermined length. Since the external connection pins 6 are fixed to each other, the bending of the pins is prevented, so that it is hard to hinder the insertion and removal of the pins 6.

As shown in FIGS. 1 and 2, the core substrate 1
7, a build-up layer B1 is formed on the entire upper surface. The build-up layer B1 is manufactured through a build-up process, and refers to a layer obtained by alternately laminating insulating layers and conductor layers. More specifically, in the conversion module 1 of the present embodiment, the two insulating layers I1, I2
A build-up layer B1 comprising two and two conductor layers C1 and C2 is formed.

On the upper surface of the insulating layer I1 on the inner layer side, an inner conductor layer C1 (specifically, the conductor pattern 15) is formed. The inner conductor layer C1 and the land 5a on the upper surface of the core substrate 17 are connected to the via hole 1 formed in the insulating layer I1.
8 are electrically connected to each other. An outer conductor layer C2 (specifically, various pads 7, 8, 8a, 8b, 10, 14, and a conductor pattern 16) is formed on the upper surface of the insulating layer I2 on the outer layer side. The outer conductor layer C2 and the inner conductor layer C1 are connected to the via hole 1 formed in the insulating layer I2.
9 are electrically connected to each other.

The upper surface of the build-up layer B1 (that is, the insulating layer I)
2 upper surface), one die pad 7 is provided in a substantially square region surrounded by the plated through hole group.
A plurality of bonding pads 8 surrounding it are formed. On the die pad 7, a QFP (quad flat package) 9 for signal conversion as an element for performing signal conversion is surface-mounted. Each lead of the QFP 9 is joined to each pad 8 using solder S1 which is a conductive material. One of the plurality of pads 8 is assigned as an input pad 8a for replacement connection, and another one is assigned as an output pad 8b for replacement connection.

The input pad 8a is connected to the secondary end of the conductor pattern 16 formed on the upper surface of the insulating layer I2. The output-side pad 8b is connected to the conductor pattern 15 on the inner layer.
Are connected to each other through a via hole 19 with respect to the primary side end. Further, the secondary side end of the conductor pattern 15 is connected via a via hole 18 to the upper surface side land 5Aa of the specific plated through hole 5A that requires replacement connection.

In the plated through hole 5 which does not require the replacement connection, the via holes 18 and 19 are arranged so as to be arranged substantially in series along the axial direction of the plated through hole 5. As a result, conduction between the upper surface side land 5a and the bump connection pad 14 located directly above the land 5a is achieved.

As shown in FIG. 1, the build-up layer B
Pads 10 for connecting electronic components are formed in a region not surrounded by the through-hole group on the upper surface of the device 1. A DIP (dual in-line package) 11 is surface-mounted on the pad 10. Conversion board 3
A pad 12 for connecting electronic components is also formed on the lower surface side of the device, and a chip resistor 13 is surface-mounted thereon. These electronic components 11 and 13 are also joined to the pads 10 and 12 using solder S1.

However, some other conductor patterns (not shown) are formed on the lower surface of the conversion board 3. The conductor pattern electrically connects the land 5b of the plated through hole 5 and the pad 12 for the electronic component 13 to each other. A conductor pattern (not shown) for electrically connecting the pads 8 and 10 is also formed on the upper surface of the insulating layer I2 on the outer layer side.

As shown in FIGS. 1 and 2, the insulating base material 21 constituting the socket substrate 4 has a square shape and a frame shape, and the size of the outer shape is the size of the PGA 2 to be mounted. Is approximately equal to The insulating substrate 21 has a square central hole 2
2 is provided. Around the central hole 22, a pin holding hole 2 having a circular cross section and having a diameter much smaller than that of the central hole 22.
3 are formed in large numbers. The socket pins 24 and 24A are inserted into the pin holding holes 23 and are held so as not to come out. Socket pins 24 and 2 of the present embodiment
4A is for PGA, and the number is about several hundred.
Each socket pin 24, 24A is formed with an insertion hole 25 extending along the axial direction. This insertion hole 25
Are opened at the center of the upper end surfaces of the socket pins 24 and 24A, and the I / O pins 26 of the PGA 2 can be inserted and removed therefrom. That is, the socket substrate 4 has a structure on the upper surface side where the PGA 2 can be attached and detached. An engagement protrusion (not shown) for securely holding the I / O pin 26 may be provided on the inner wall surface of the insertion hole 25 so as to face the same. The lower end surfaces of the socket pins 24 and 24A slightly protrude from the lower surface side of the insulating base material 21.

The lower end surface of the socket pin 24 which does not require replacement connection is provided with a solder cream printing layer 4 as a conductive fusible material.
8 is joined to the upper end surface of the pad 14. Therefore, the socket pin 24 has two via holes 18,
It is electrically connected to the plated through hole 5 via a simple connection path consisting of 19. On the other hand, a specific socket pin 2
The lower end surface of 4A is also joined to the primary end 16a of the conductor pattern 16 by the solder cream print layer 48. Therefore, the socket pin 24A is connected through a slightly more complicated connection path than the socket pin 24 described above.
It is conducted to the plating through hole 5A.

The latter connection path is, so to speak, a specific socket pin 24A and a corresponding plated through hole 5A.
Can be grasped as a connection path for conducting through the QFP 9. The conductor layers C1 and C2 in the build-up layer B1 are used as a part of the connection path.

Next, the structure of the PGA socket 41 will be described. The PGA socket 41 includes a socket body 42 including a fixed member and a movable member. A plurality of pins 43 are protrudingly provided on the lower surface side of the fixing member constituting the socket body 42. These pins 43 are soldered to plated through holes on the motherboard MB side.

A movable member is disposed on the upper surface side of the fixed member so as to cover. The movable member has a plurality of pin insertion / extraction holes 44 through which the socket pins 24 and 24A can be inserted / extracted. These pin insertion / extraction holes 44 have a positional relationship corresponding to the socket pins 24 and 24A.

On the upper surface side of the movable member, there is a step 46 having a height L1. An operation lever 45 as an operation means is provided in a through hole passing through the step portion 46 in the horizontal direction by about 90 degrees.
It is inserted so that it can rotate about °. This operation lever 45
Moves between a locked position and an unlocked position. When the operation lever 45 is rotated, the movable member slides slightly along the horizontal direction. Socket pins 24, 24
A is inserted into each pin insertion / extraction hole 44 with the operation lever 45 rotated to the unlock position. Operation lever 45
Is rotated to the lock position, the pin insertion / extraction holes 44 are narrowed, and the socket pins 24 and 24A are
1 is fixed so that it cannot escape. At this time, the contacts in each pin insertion hole 44 are connected to each socket pin 24, 24.
As a result, electrical continuity with the motherboard MB is achieved.

In this embodiment, the socket 41 for PGA is "Socket" manufactured by Thomas & Bets Company.
5 "or" Socket 7 "(both ZIF series). The length L2 from the lower surface of the conversion substrate 3 to the lower surface of the sub-substrate 32 is equal to the height L1 of the step 46.
It is set to be larger than. Therefore, the end on the side far from the step 46 does not drop during mounting, and the conversion module 1 is less likely to tilt.

Next, an example of a method for manufacturing the conversion module 1 will be described. First, the conversion board 3 and the socket board 4 are prepared in advance. The conversion substrate 3 can be obtained by performing a conventionally known pattern formation such as a subtractive method using, as a starting material, a core substrate 17 in which a copper foil is adhered to both surfaces of an insulating substrate made of glass epoxy, for example. Thereby, the conversion substrate 3 in which the plated through holes 5, 5A and the pads 12 are formed in the core substrate 17 is manufactured.

In manufacturing the socket substrate 4,
A commercially available product having short socket pins 24, 24A may be prepared, and solder cream may be screen-printed on the lower end surfaces of the socket pins 24, 24A. As a result, a solder cream print layer 48 having a thickness of about several hundred μm is formed. As the solder cream, for example, one obtained by dispersing a powder of eutectic solder (Pb: Sn = 37: 63, melting point: 183 ° C.) in a vehicle is used. The solder cream print layer 48 is, as it were, the socket pins 24, 24A.
And serves as a bump for connection between the conversion board 3 and the connection conductor (ie, the primary end 16a of the land 14 or the conductor pattern 16). After this, the solder cream print layer 48
Is applied with a flux FL according to a conventionally known method (see FIG. 3A).

In the subsequent build-up layer forming step, a build-up layer B1 is formed on the upper surface of the core substrate 17 constituting the conversion substrate 3 by a build-up process. here,
First, a photosensitive epoxy-based additive adhesive is applied to the upper surface of the core substrate 17. The photosensitive epoxy-based additive adhesive refers to a resin matrix in which a resin filler relatively soluble in an oxidizing agent is dispersed in a resin matrix relatively insoluble in an oxidizing agent. Next, by performing exposure and development, an insulating layer I1 having a via hole forming hole having an inner diameter of about several tens of micrometers is formed. Next, a roughening agent (oxidizing agent)
The insulating layer I1 is chemically roughened using chromic acid. Thereafter, a catalyst nucleus is provided, a permanent resist (not shown) is formed, plating pretreatment, and electroless copper pattern plating are performed. After the above-described plating process, a copper plating layer is deposited on a portion where a permanent resist is not formed or on an inner wall surface of a via hole forming hole. Therefore, the conductor pattern 1 is formed on the insulating layer I1.
5 and via holes 18 are formed. The via hole 18 thus formed is a so-called filled via in which the inside of the via hole forming hole is completely filled with the copper plating layer.

Further, the upper surface of the insulating layer I1 having the via hole 18 formed thereon is coated in the same manner as described above, and is coated with an adhesive layer, exposed and developed, roughened, provided with catalyst nuclei, formed with a permanent resist, and plated before. Perform processing and electroless copper pattern plating. As a result, pads 7, 8, 8 are formed on insulating layer I2.
a, 8b, 10, and 14, the conductor pattern 16, and the via hole 19 are formed, and a desired build-up layer B1 is completed.

In the subsequent first soldering step, solder cream is printed on the pads 12 on the lower surface side of the conversion board 3 by, for example, a screen printing technique. As the solder cream, for example, one obtained by dispersing eutectic solder powder in a vehicle is used. In this state, pad 1
The electronic component 13 is soldered to the pad 12 by performing reflow while the electronic component 13 is placed and temporarily fixed on the pad 2.

In the following pin setting step (pin press-in fixing step), the side with the build-up layer B1 faces downward, and in this state, the conversion board 3 is placed on the work table of the pin driving device. At this time, it is preferable that an elastic body such as a rubber sheet or the like capable of buffering an impact at the time of press-fitting and fixing the pin is disposed between the upper surface of the worktable and the upper surface of the build-up layer B1. Then, the base end of the external connection pin 6 is press-fitted into each of the plated through holes 5 and 5A of the conversion board 3 from the opening on the lower surface side and fixed. At this time, the projecting portions formed at predetermined positions on the peripheral surface of the press-fitting portion are plated through holes 5 and 5.
A state is obtained in which the copper plating layer in A slightly penetrates. As a result, electrical continuity between the external connection pins 6 and the plated through holes 5 and 5A is achieved without soldering.

In the next second soldering step, the conversion board 3 is turned upside down and the side having the build-up layer B1 is directed upward, and the pads 8, 8a, 8b, 1 on the build-up layer B1 are turned up.
Solder cream is printed on the primary side of the conductor pattern 16 and the conductor pattern 16.

Then, a QFP is applied to each of the pads 8, 8a and 8b.
9 are mounted, and the electronic component 11 is mounted on the pad 10 and temporarily fixed. Also, the solder cream print layer 48 of each socket pin 24 is placed on the upper end surface of the corresponding land 14,
The solder cream print layer 48 of the socket pin 24A is placed on the primary end 16a of the conductor pattern 16 and temporarily fixed. That is, the solder cream print layer 48 is
And the surface of the primary end 16a of the conductor pattern 16 and the lower surface of the socket pin 24A and the surface of the pad 14.

By performing the reflow in such a state, the QFP 9, the electronic component 11, and the socket pins 24, 2 are formed.
4A is soldered to a predetermined location by a surface mounting method. As a result of the soldering performed on the upper surface side of the core board 17 as described above, the socket board 4 is mounted on the conversion board 3.

Next, the desired conversion module 1 is completed by inserting the external connection pins 6 into the pin insertion holes 36 of the sub-board 32 and fixing the external connection pins 6 so that the pins 6 cannot be pulled out. The PGA 2 is added to the conversion module 1 thus configured.
Is mounted, and further mounted on the PGA socket 41 of the motherboard MB, the result is as follows.

PGA flowing through a specific socket pin 24A
The signal No. 2 is input to the QFP 9 via a route of the conductor pattern 16 → the input side pad 8a. The converted signal is output from the QFP 9 and then passes through the route of the output side pad 8b → via hole 19 → conductor pattern 15 → via hole 18 to the plated through hole 5A.
5Aa. The converted signal reaching the land 5Aa is supplied to the motherboard MB through a route of the copper plating layer in the plated through hole 5A → the lower surface side land 5Ab → the external connection pin 6 → the pin 43 of the PGA socket 41. You. Such a build-up layer B1
As a result of the exchange connection using the conductor layers C1 and C2, signal conversion is mainly performed by the QFP 9 and PGA
2 The original function is fully exhibited.

Therefore, according to the present embodiment, the following effects can be obtained. (1) In the present embodiment, the socket pins 24 and 24A are surface-mounted on the conversion board 3 by heating and melting the solder cream print layer 48 by reflow in a temporarily fixed state. At this time, the molten solder cream print layer 4
8, the socket pins 24 and 24A are self-aligned. For this reason, even if there is a positional displacement in the surface direction with respect to the primary side end 16a or the pad 14 of the conductor pattern 16 during the temporary fixing, it is surely corrected through the reflow. Therefore, unlike the case where the through-hole insertion mounting method is adopted, the socket pins 24 and 24A can be simply and reliably mounted at accurate positions. Therefore, high reliability can be ensured at the connection portion between the socket pin 24 and the primary end 16a and at the connection portion between the socket pin 24A and the pad 14.

In the conversion module 1 employing the surface mounting method, the upper surface of the conversion board 3
There is no portion to be inserted into the through holes 5 and 5A. Therefore, there is no need to worry about bending of the insertion portion. Therefore, a repair work before soldering is not required, and a decrease in productivity due to the repair work can be avoided.

(2) In the present embodiment, the solder cream print layer 48 is formed as a conductive fusible material. The reason for selecting the solder (eutectic solder in the present embodiment) is not only because it has suitable conductivity, but also because it has a suitable property that it can be melted at a relatively low temperature of 183 ° C. Therefore, it can be heated and melted by a general reflow process, whereby the socket pins 24,
This is because the lower end surface of 24A and the surface of the connecting conductor can be more easily and reliably joined.

The solder cream print layer 48 is advantageous in that a thicker conductive fusible body can be formed in a shorter time than when a plating method or the like is employed. Further, the solder cream print layer 48 can be formed by diverting an existing screen printing device. Therefore, it is not necessary to separately provide a dedicated device, and it is possible to prevent a cost increase.

(3) In the present embodiment, the solder cream print layer 48, which is a conductive fusible material, is simultaneously heated and melted during reflow for soldering the electronic components 9 and 11 on the upper surface side of the conversion board 3. It has become. Therefore,
Unlike the case where a step of heating and melting is provided separately from the reflow, the complication of the entire process is prevented and the productivity can be improved.

The embodiment of the present invention may be modified as follows. In the above embodiment, as schematically shown in FIG. 3A, a solder cream printing layer 48 is previously formed on the socket pins 24 and 24A, and a flux FL is applied to the surface of the same layer 48. Temporary fixation was performed. On the other hand, for example, FIGS.
It may be changed as in another example shown in (e).

In another example of FIG. 3B, a solder cream print layer 48 is previously formed on the surface of the connection conductor such as the land 14, and the flux FL is applied to the surface of the layer 48 temporarily. Fixed. That is, the conductive fusible element does not necessarily have to be formed on the socket pin 24 side. In this case, the solder cream print layer 48 may be printed at the same time as the second soldering step in the embodiment.

In another example of FIG. 3C, the socket pins 24
A solder cream print layer 48 is formed in advance on the lower end surface of the substrate, and temporary fixing is performed in a state where the flux FL is applied to the surface of the connection conductor such as the pad 14. That is,
The flux FL does not necessarily have to be applied to the conductive fusible body side.

In another example of FIG. 3D, a solder cream print layer 48 is formed in advance on the surface of the connection conductive portion such as the pad 14, and the flux FL is applied to the lower end surface of the socket pin 24. Temporarily fixed.

In another example of FIG. 3E, the socket pins 24
Is formed in advance on the lower end surface of the substrate, and the flux FL is applied to both the layer 48 and the surface of the connecting conductive portion for temporary fixing.

As shown in FIG. 4A, in the above-described embodiment, a structure in which a solder cream print layer 48 having a predetermined thickness is formed on the lower end face of the socket pin 24 for PGA is adopted. 4 (b) to 4 (d)
Another example shown in FIG.

FIG. 4B shows another example in which a solder plating layer 51 is formed on the lower end face of the socket pin 24 for PGA. Although the formation of the solder plating layer 51 by the plating method requires a long time for thickening, it has an advantage that it can be formed relatively easily and inexpensively by a general method.

FIG. 4C shows another example in which a spherical solder ball 52 is joined to the lower end face of the socket pin 24 for PGA. A special ball mounting device is required to join the solder balls 52, which increases equipment costs.
Since a necessary and sufficient amount of solder is secured, there is an advantage that further improvement in connection reliability can be expected.

FIG. 4D shows another example in which a solder cream print layer 48 is formed on the lower end surface of the BGA socket pin 54. The socket pins 54 include:
A bump of a BGA (bump grid array), which is a kind of a chip module, is connected. Socket pin 54
Has a structure in which a lower half 55 and an upper half 56 are connected by a spring 57. The lower half 55 is held in the lower opening of the pin holding hole 23 so as not to come off. The upper half portion 56 is accommodated in the pin holding hole 23 so as to be slidable in the vertical direction. A hemispherical concave portion is formed on the upper end surface of the upper half portion 56. Note that a solder plating layer 51 or a solder ball 52 may be provided instead of the solder cream printing layer 48.

As shown in FIGS. 5A and 5B, a structure in which the socket board 4 is omitted and only the socket pins 58 are mounted is allowed. As the socket pin 58 used in this case, a so-called jaw-attached socket pin 58 having a substantially drum shape as a whole is convenient. At the time of pin supply, the polyimide film 59
The jaws of each socket pin 58 are inserted and held in the holding holes. Since the film 59 has flexibility, it can be easily removed after the pinning step if unnecessary. Of course, if necessary, the film 59 may be used as it is.

The conductive fusible material using the eutectic solder as exemplified in the embodiment is not limited, and may be a conductive fusible material using other solders. Of course, the present invention is not limited to the solder, and for example, a conductive metal material such as gold may be used.

As an alternative to the build-up layer B 1, for example, a flexible substrate is joined to the upper surface of the conversion substrate 3, and a socket pin 2 is connected to the connection conductor of the flexible substrate.
4, 24A, 54, 58 may be connected.

The sub-board 32 for preventing pin bending and tilt on the lower surface side of the conversion board 3 may be omitted if unnecessary. Next, in addition to the technical ideas described in the claims, technical ideas grasped by the above-described embodiments are listed below together with their effects.

(1) The plurality of socket pins according to any one of claims 1 to 3, wherein the plurality of socket pins are maintained in a relative positional relationship with each other by being fixed to an insulating base material. (2) In any one of the first to third aspects and the technical idea 1, before performing the temporary fixing, the surface of the connection conductor, the lower end surface of the socket pin, and the surface of the conductive fusible material may be used. Flux must be attached to at least one of them in advance. Therefore, according to the invention described in the technical idea 2, the oxidation of the metal surface is prevented and the solder wettability is improved, so that the connection reliability can be further improved.

(3) Claims 1 to 3, technical idea 1,
2. In any one of the above (2), a build-up layer formed by alternately laminating insulating layers and conductive layers is formed on the upper surface of the conversion substrate, and a part of the conductive layer is used as the connection conductor. .

[0066]

As described in detail above, according to the first to third aspects of the present invention, the socket pins can be easily and surely joined to the correct positions on the conversion board, so that the connection reliability is excellent. And a method of manufacturing a conversion module capable of obtaining a finished product.

According to the third aspect of the present invention, it is possible to prevent the process from becoming complicated and improve the productivity.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing a use state of a conversion module according to an embodiment of the present invention.

FIG. 2 is a partially enlarged cross-sectional view of the conversion module according to the embodiment.

FIG. 3A is a schematic diagram illustrating a state of temporarily fixing a pin in the embodiment, and FIGS. 3B to 3E are schematic diagrams illustrating a state of temporarily fixing a pin in another example.

FIG. 4A is an enlarged sectional view of a socket pin according to the embodiment, and FIGS. 4B to 4D are enlarged sectional views of another example of a socket pin.

FIGS. 5A and 5B are enlarged schematic cross-sectional views of a main part showing another example using a socket pin with a jaw.

FIG. 6 is a partially enlarged cross-sectional view showing a usage state of a conventional conversion module.

[Explanation of symbols]

1. Conversion module 2. PG as grid array
A, 3 ... conversion board, 9: QFP as an element, 11, 1
3 ... Electronic component, 14 ... Conductor layer on build-up layer as connection conductor, 16a ... Primary end of conductor pattern as connection conductor, 24, 24A, 58 ... (for PGA)
Socket pins, 26: Pins as terminals, 41: PGA
Socket 44, Pin insertion hole, 48 Solder cream printed layer as conductive fusible material, 51 Solder plating layer as conductive fusible material, 52 Solder ball as conductive fusible material, 54 (for BGA ) Socket pin, MB: Motherboard.

Claims (3)

[Claims] 1. A plurality of pin insertion / extraction holes, comprising: a conversion board having an element for performing signal conversion or the like; and a plurality of socket pins provided on an upper surface of the conversion board and to which a plurality of terminals on a lower surface of a grid array are attached and detached. A method of manufacturing a conversion module that can be electrically connected to a motherboard via a PGA socket having: a surface of each connection conductor provided on an upper surface side of the conversion board and a surface of each of the socket pins. On at least one of the lower end surfaces, a conductive fusible material is formed in advance, and the conductive fusible material is brought into contact with the lower end surface of the socket pin and the surface of the connecting conductor portion by performing temporary fixing, A method for manufacturing a conversion module, wherein the socket pins are surface-mounted by heating and melting the conductive fusible body in this state. 2. The method according to claim 1, wherein the conductive fusible material is one selected from a solder plating layer, a solder cream printing layer, and a solder ball. 3. The conversion module according to claim 1, wherein the conductive fusible material is heated and melted simultaneously with reflow for soldering the electronic component on the upper surface side of the conversion board. Production method.