CN116075074A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN116075074A CN116075074A CN202111289354.9A CN202111289354A CN116075074A CN 116075074 A CN116075074 A CN 116075074A CN 202111289354 A CN202111289354 A CN 202111289354A CN 116075074 A CN116075074 A CN 116075074A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 254
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 54
- 239000011889 copper foil Substances 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 11
- 239000011241 protective layer Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims 3
- 238000005476 soldering Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- -1 Polyethylene terephthalate Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model provides a circuit board, includes first substrate layer, inboard circuit layer, circuit substrate and a plurality of first conductor, inboard circuit layer set up in one side of first substrate layer, the substrate layer run through and be provided with first trompil, part inboard circuit layer in the bottom of first trompil exposes, first conductor is located in the first trompil, first conductor electric connection inboard circuit layer, every first conductor has the connection terminal surface of keeping away from inboard circuit layer, a plurality of the connection terminal surface expose in first substrate layer, every two the difference in height of connection terminal surface is no more than 3 microns, circuit substrate set up in on the connection terminal surface. The circuit board that this application provided can reduce empty risk of welding, improves first conductor and circuit substrate's electric connection's stability. In addition, the application also provides a manufacturing method of the circuit board.
Description
Technical Field
The application relates to a circuit board and a manufacturing method thereof.
Background
Hot melt soldering (Hot bar) is a technique that can join together flexible and rigid boards, the general process of which includes: firstly, solder paste is arranged on a plurality of welding pads of a hard board, then a soft board is placed on the welding pads provided with the solder paste, finally, the solder paste is heated into molten solder paste through a hot pressing head, and after the molten solder paste is cooled and solidified, the electric connection between the soft board and the hard board can be realized.
However, the hot-press tin-melting soldering technique has a high requirement on the end surface flatness of each bonding pad, for example, for two bonding pads with a large end surface height difference (the height difference is greater than 30 micrometers), wherein one bonding pad with a small height may not be soldered to the flexible board, resulting in empty soldering, which is unfavorable for stable electrical connection between the flexible board and the hard board.
Disclosure of Invention
In order to solve the problems in the background art, the application provides a circuit board.
In addition, the application also provides a manufacturing method of the circuit board.
A method of manufacturing a circuit board, comprising the steps of: the double-sided copper-clad substrate comprises a first base material layer, a first copper foil layer and a second copper foil layer, wherein the first copper foil layer and the second copper foil layer are respectively arranged on two opposite surfaces of the first base material layer, a plurality of first open holes are formed in the double-sided copper-clad substrate at intervals, and the first open holes penetrate through the first copper foil layer, the first base material layer and the second copper foil layer. And a first electroplated layer and a second electroplated layer are respectively arranged on the first copper foil layer and the second copper foil layer, part of the first electroplated layer or part of the second electroplated layer is filled into the first opening to form a first conductive body, each first conductive body is provided with a connecting end face connected with the first electroplated layer, and the height difference of each two connecting end faces is not more than 3 microns.
Etching the second electroplated layer and the second copper foil layer to form an inner circuit layer, wherein the first conductive body is electrically connected with the inner circuit layer. And removing the first copper foil layer and the first electroplated layer to enable a plurality of connecting end faces to be exposed out of the first base material layer, arranging circuit substrates on a plurality of end faces, and electrically connecting the first conductive bodies with the circuit substrates to obtain the circuit board.
Further, before removing the first copper foil layer and the first electroplated layer, the method further comprises the steps of: the single-sided copper-clad substrate is arranged on the inner circuit layer and comprises a second base material layer and a third copper foil layer, the second base material layer is arranged between the third copper foil layer and the inner circuit layer, the single-sided copper-clad substrate is provided with a second open hole, the second open hole penetrates through the second base material layer and the third copper foil layer, and part of the inner circuit layer is exposed out of the bottom of the second open hole. The third copper foil layer is provided with a third electroplated layer, a part of the third electroplated layer is filled into the second opening to form a second conductive body, the second conductive body is electrically connected with the inner circuit layer, the third electroplated layer and the third copper foil layer are etched to form an outer circuit layer, and the second conductive body is electrically connected with the outer circuit layer and the inner circuit layer.
Further, the circuit board is provided on the end face by means of hot-press solder melting.
Further, before the circuit substrate is arranged, the method further comprises the steps of: and removing part of the first substrate layer around the first conducting body to form a first accommodating space, wherein the first accommodating space is used for accommodating redundant solder generated in the hot-press tin-melting welding process.
Further, before the circuit substrate is arranged, the method further comprises the steps of: and a second opening is formed in the substrate layer, and part of the inner circuit layer is exposed out of the bottom of the second opening. And arranging an electronic element in the second opening, wherein the electronic element is electrically connected with the inner circuit layer.
Further, before the circuit substrate and the electronic component are disposed, the method further comprises the steps of: and a protective layer is arranged on the outer surface of the first conducting body and the part of the inner circuit layer exposed out of the second opening.
The utility model provides a circuit board, includes first substrate layer, inboard circuit layer, circuit substrate and a plurality of first conductor, inboard circuit layer set up in one side of first substrate layer, the substrate layer run through and be provided with first trompil, part inboard circuit layer in the bottom of first trompil exposes, first conductor is located in the first trompil, first conductor electric connection inboard circuit layer, every first conductor has the connection terminal surface of keeping away from inboard circuit layer, a plurality of the connection terminal surface expose in first substrate layer, every two the difference in height of connection terminal surface is no more than 3 microns, circuit substrate set up in on the connection terminal surface.
Further, the circuit board further comprises a second substrate layer, an outer circuit layer and a second conducting body, wherein the second substrate layer is arranged between the outer circuit layer and the inner circuit layer, a second opening is formed in the second substrate layer in a penetrating mode, the second conducting body is arranged in the second opening, and the second conducting body is electrically connected with the inner circuit layer and the outer circuit layer.
Further, the first substrate layer is further provided with a first accommodating space, and the first accommodating space is enclosed on the periphery of the first conducting body.
Further, the electronic device further comprises a second accommodating space and an electronic element, wherein the second accommodating space is arranged on the first substrate layer, a part of the inner circuit layer is exposed out of the bottom of the second accommodating space, the electronic element is arranged in the second accommodating space, and the electronic element is electrically connected with the inner circuit layer.
Compared with the prior art, the manufacturing method of the circuit board provided by the application is characterized in that the first electroplated layer and the second electroplated layer are arranged on two sides of the double-sided copper-clad substrate, part of the first electroplated layer or the second electroplated layer is filled into the first opening to form the first conductive body, then the connecting end face of the first conductive body is exposed through the first copper foil layer and the first electroplated layer on one side of the first conductive body, and the exposed connecting end face height difference is within a micron, so that the connecting end face is ensured to be neat, the air welding risk is reduced, and the stability of the electric connection between the first conductive body and the circuit substrate is improved.
Drawings
Fig. 1 is a schematic diagram of a double-sided copper-clad substrate according to an embodiment of the present application.
Fig. 2 is a schematic view of the double-sided copper-clad substrate shown in fig. 1 after the first via is disposed.
Fig. 3 is a schematic view of etching the second plating layer and the second copper foil layer shown in fig. 2 to form an inner circuit layer.
Fig. 4 is a schematic view of a single-sided copper-clad substrate disposed on the inner circuit layer shown in fig. 3.
Fig. 5 is a schematic view of the third electroplated layer and the third copper foil layer shown in fig. 4 after etching to form an outer circuit layer.
Fig. 6 is a schematic view of the outer circuit layer shown in fig. 5 with a solder mask layer.
Fig. 7 is a schematic view of the first substrate layer shown in fig. 6 with a first accommodating space and a second accommodating space.
Fig. 8 is a schematic diagram of the first conductive body shown in fig. 7 after a passivation layer is disposed on the periphery and a portion of the inner circuit layer.
Fig. 9 is a schematic diagram of the portion of the inner circuit layer with the protective layer shown in fig. 8 after the electronic component is disposed thereon.
Fig. 10 is a schematic diagram of a circuit board according to an embodiment of the present application.
Description of the main reference signs
Double-sided copper-clad substrate 10
First copper foil layer 12
Second copper foil layer 13
First opening 14
Second electroplated layer 22
First conductive body 31
Single-sided copper-clad substrate 50
Second substrate layer 51
Third copper foil layer 52
Second conductive body 62
First accommodation space D
Second accommodation space E
The following detailed description will further illustrate the application in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may be present.
Referring to fig. 1 to 10, the present application provides a method for manufacturing a circuit board 100, which includes the steps of:
referring to fig. 1, a double-sided copper-clad substrate 10 is provided, wherein the double-sided copper-clad substrate 10 includes a first base material layer 11, a first copper foil layer 12 and a second copper foil layer 13. The first copper foil layer 12 and the second copper foil layer 13 are respectively disposed on two opposite surfaces of the first substrate layer 11. The double-sided copper-clad substrate 10 is provided with a plurality of first openings 14 at intervals, and the first openings 14 sequentially penetrate through the first copper foil layer 12, the first base material layer 11 and the second copper foil layer 13.
In this embodiment, the material of the first substrate layer 11 includes, but is not limited to, polyimide (PI), polyester resin (Polyethylene terephthalate, PET), polyethylene naphthalate (Polyethylene naphthalate two formic acid glycol ester, PEN), liquid crystal polymer (liquid crystal polymer, LCP), and modified Polyimide (modified Polyimide, MPI), and preferably, the material of the first substrate layer 11 is Polyimide.
S2 referring to FIG. 2, a first plating layer 21 is disposed on the first copper foil layer 12, and a second plating layer 22 is disposed on the second copper foil layer 13, wherein a part of the first plating layer 21 or a part of the second plating layer 22 fills the first openings 14 to form first via bodies 31, each of the first via bodies 31 has a connection end surface 311 connected to the first plating layer 21, and a height difference between each of the connection end surfaces 311 is not more than 3 μm.
Referring to fig. 3, the second electroplated layer 22 and the second copper foil layer 13 are etched to form an inner circuit layer 41, and the first via 31 is electrically connected to the inner circuit layer 41.
In this embodiment, referring to fig. 4 to 6, the method for manufacturing the circuit board 100 further includes the steps of:
referring to fig. 4, a single-sided copper-clad substrate 50 is disposed on the inner circuit layer 41, and the single-sided copper-clad substrate 50 includes a second base material layer 51 and a third copper foil layer 52. The second base material layer 51 is disposed between the third copper foil layer 52 and the inner circuit layer 41, the single-sided copper-clad substrate 50 is provided with a second opening 53, the second opening 53 penetrates through the second base material layer 51 and the third copper foil layer 52, and a part of the inner circuit layer 41 is exposed at the bottom of the second opening 53.
Referring to fig. 4, a third electroplated layer 61 is disposed on the third copper foil layer 52, and a portion of the third electroplated layer 61 fills into the second opening 53 to form a second via 62, wherein the second via 62 is electrically connected to the inner circuit layer 41.
Referring to fig. 5, the third electroplated layer 61 and the third copper foil layer 52 are etched to form an outer circuit layer 71, and the second via 62 electrically connects the outer circuit layer 71 and the inner circuit layer 41.
Referring to fig. 6, a solder mask layer 81 is disposed on the outer circuit layer 71, and a portion of the solder mask layer 81 is filled into the slot 711 of the outer circuit layer 71.
Referring to fig. 7, the first copper foil layer 12 and the first electroplated layer 21 are removed by laser etching or liquid medicine etching, so that the plurality of connection end faces 311 are exposed from the first substrate layer 11, and the first substrate layer 11 can be disposed on the inner circuit layer 41 as a cover protection layer.
In this embodiment, referring to fig. 7 to 9, the method for manufacturing the circuit board 100 further includes the steps of:
referring to fig. 7, a portion of the first substrate layer 11 around the first via 31 is removed by laser cutting or liquid medicine etching to form an annular first accommodating space D, where the first accommodating space D may be used to accommodate the excessive solder, so as to prevent bridge short circuit caused by the excessive solder.
Referring to fig. 7, a second accommodating space E is provided on the first substrate layer 11, and a portion of the inner circuit layer 41 is exposed at the bottom of the second accommodating space E;
referring to fig. 8, a protective layer 82 is disposed on the outer surface of the first conductive body 31 and the portion of the inner circuit layer 41 exposed in the second accommodating space E. The protective layer 82 may be formed by any one of gold plating, nickel plating, or tin plating.
Referring to fig. 9, an electronic component 83 is disposed in the second accommodating space E, and the electronic component 83 is electrically connected to the inner circuit layer 41 with the protective layer 82 disposed thereon.
Referring to fig. 10, a circuit substrate 90 is disposed on the connection end face 311 provided with the protective layer 82 by means of hot-pressing soldering, a solder layer 91 is disposed between the circuit substrate 90 and the protective layer 82, the solder layer 91 is electrically connected with the first conductive body 31 and the circuit substrate 90, the circuit board 100 is obtained, the protective layer 82 and the circuit substrate 90 are directly connected by means of hot-pressing soldering, the connector is omitted, the cost can be saved, and the height of the first conductive body 31 can be adjusted according to the thickness of the first substrate layer 11, which is beneficial to manufacturing the first conductive body 31 with smaller height, thereby reducing the overall thickness of the circuit board 100.
Compared with the prior art, the manufacturing method of the circuit board 100 provided by the application has the following advantages:
first, by providing the first plating layer 21 and the second plating layer 22 on two sides of the double-sided copper-clad substrate 10, a part of the first plating layer 21 or the second plating layer 22 is filled into the first opening 14 to form the first conductive body 31, and then the connection end surface 311 of the first conductive body 31 is exposed through the first copper foil layer 12 on one side of the first conductive body 31 and the first plating layer 21, and the exposed connection end surface 311 has a height difference within 3 micrometers, so that the connection end surface 311 is ensured to be neat, the risk of empty soldering is reduced, and the stability of the electrical connection between the first conductive body 31 and the circuit substrate 90 is improved.
And (II) the first through-hole 31 is formed by filling holes in the first opening 14, and then the inner circuit layer 41 is etched on one side of the first through-hole 31, so that the inner circuit layer 41 can be made into fine circuits with small pitch, thereby being beneficial to the high integration of the circuit board 100.
Referring to fig. 10, the embodiment of the present application further provides a circuit board 100, the circuit board 100 includes a first substrate layer 11, an inner circuit layer 41, a circuit substrate 90 and a plurality of first vias 31, the inner circuit layer 41 is disposed on one side of the first substrate layer 11, the first substrate layer 11 is provided with a first opening 14 in a penetrating manner, a portion of the inner circuit layer 41 is exposed at the bottom of the first opening 14, the first vias 31 are disposed in the first opening 14, the first vias 31 are electrically connected to the inner circuit layer 41, each first via 31 has a connection end face 311 far away from the inner circuit layer 41, a plurality of connection end faces 311 are exposed from the first substrate layer 11, a height difference between each two connection end faces 311 is not more than 3 micrometers, and the circuit substrate 90 is disposed on the connection end faces 311.
Referring to fig. 10, in the present embodiment, the circuit board 100 further includes a second substrate layer 51, an outer circuit layer 71, and a second conductive body 62, wherein the second substrate layer 51 is disposed between the outer circuit layer 71 and the inner circuit layer 41, the second substrate layer 51 is provided with a second opening 53 in a penetrating manner, the second conductive body 62 is disposed in the second opening 53, and the second conductive body 62 is electrically connected to the inner circuit layer 41 and the outer circuit layer 71.
Referring to fig. 10, in the present embodiment, the first substrate layer 11 is further provided with a first accommodating space D and a second accommodating space E, and the first accommodating space D is enclosed on the periphery of the first conductive body 31. The second accommodating space E penetrates through the first substrate layer 11, a portion of the inner circuit layer 41 is exposed at the bottom of the second accommodating space E, the electronic component 83 is disposed in the second accommodating space E, and the electronic component 83 is electrically connected to the inner circuit layer 41.
Claims (10)
1. A method of manufacturing a circuit board, comprising the steps of:
providing a double-sided copper-clad substrate, wherein the double-sided copper-clad substrate comprises a first base material layer, a first copper foil layer and a second copper foil layer, the first copper foil layer and the second copper foil layer are respectively arranged on two opposite surfaces of the first base material layer, a plurality of first open holes are formed in the double-sided copper-clad substrate at intervals, and the first open holes penetrate through the first copper foil layer, the first base material layer and the second copper foil layer;
a first electroplated layer and a second electroplated layer are respectively arranged on the first copper foil layer and the second copper foil layer, part of the first electroplated layer or part of the second electroplated layer is filled into the first open hole to form a first conductive body, each first conductive body is provided with a connecting end face connected with the first electroplated layer, and the height difference of each two connecting end faces is smaller than or equal to 3 microns;
etching the second electroplated layer and the second copper foil layer to form an inner circuit layer, wherein the first conductor is electrically connected with the inner circuit layer;
removing the first copper foil layer and the first electroplated layer, so that a plurality of connecting end faces are exposed out of the first substrate layer; and
and arranging circuit substrates on the end surfaces, wherein the first conductive bodies are electrically connected with the circuit substrates to obtain the circuit board.
2. The method of manufacturing according to claim 1, wherein before removing the first copper foil layer and the first plating layer, further comprising the steps of:
a single-sided copper-clad substrate is arranged on the inner circuit layer, the single-sided copper-clad substrate comprises a second base material layer and a third copper foil layer, the second base material layer is arranged between the third copper foil layer and the inner circuit layer, the single-sided copper-clad substrate is provided with a second open pore, the second open pore penetrates through the second base material layer and the third copper foil layer, and part of the inner circuit layer is exposed out of the bottom of the second open pore;
a third electroplated layer is arranged on the third copper foil layer, part of the third electroplated layer is filled into the second open hole to form a second conductive body, and the second conductive body is electrically connected with the inner circuit layer; and
and etching the third electroplated layer and the third copper foil layer to form an outer circuit layer, wherein the second conductive body electrically conducts the outer circuit layer and the inner circuit layer.
3. The method of manufacturing of claim 1, comprising the steps of:
and arranging the circuit substrate on the connecting end face in a hot-pressing tin-melting welding mode.
4. The method of manufacturing of claim 1, further comprising the step of, prior to disposing the wiring substrate:
and removing part of the first substrate layer around the first conducting body to form a first accommodating space, wherein the first accommodating space is used for accommodating redundant solder generated in the hot-press tin-melting welding process.
5. The method of manufacturing of claim 2, further comprising the step of, prior to disposing the wiring substrate:
a second accommodating space is arranged on the substrate layer, and part of the inner circuit layer is exposed out of the bottom of the second accommodating space;
and an electronic element is arranged in the second accommodating space and is electrically connected with the inner circuit layer.
6. The method of manufacturing of claim 5, further comprising the step of, prior to disposing the circuit substrate and the electronic component:
and a protective layer is arranged on the outer surface of the first conducting body and the part of the inner circuit layer exposed out of the second opening.
7. The utility model provides a circuit board, its characterized in that includes first substrate layer, inboard circuit layer, circuit substrate and a plurality of first conductor, inboard circuit layer set up in one side of first substrate layer, the substrate layer runs through and is provided with first trompil, part inboard circuit layer in the bottom of first trompil is exposed, first conductor is located in the first trompil, first conductor electric connection inboard circuit layer, every first conductor has the connection terminal surface of keeping away from inboard circuit layer, a plurality of the connection terminal surface expose in first substrate layer, every two the difference in height of connection terminal surface is no more than 3 microns, circuit substrate set up in on the connection terminal surface.
8. The circuit board of claim 7, further comprising a second substrate layer disposed between the outer circuit layer and the inner circuit layer, an outer circuit layer, and a second conductive body disposed in the second opening, the second conductive body electrically connecting the inner circuit layer and the outer circuit layer.
9. The circuit board of claim 7, wherein the first substrate layer is further provided with a first accommodating space, and the first accommodating space is surrounded on the periphery of the first conductive body.
10. The circuit board of claim 7, further comprising a second receiving space and an electronic component, wherein the second receiving space is disposed in the first substrate layer, a portion of the inner circuit layer is exposed at the bottom of the second receiving space, the electronic component is disposed in the second receiving space, and the electronic component is electrically connected to the inner circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111289354.9A CN116075074A (en) | 2021-11-02 | 2021-11-02 | Circuit board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111289354.9A CN116075074A (en) | 2021-11-02 | 2021-11-02 | Circuit board and manufacturing method thereof |
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| CN116075074A true CN116075074A (en) | 2023-05-05 |
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| CN212413515U (en) * | 2020-05-22 | 2021-01-26 | 东莞联桥电子有限公司 | Circuit board structure with stable welding position |
| CN112822834A (en) * | 2021-02-25 | 2021-05-18 | 京东方科技集团股份有限公司 | Circuit board and electronic equipment |
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