CN106658960A - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN106658960A CN106658960A CN201510718407.2A CN201510718407A CN106658960A CN 106658960 A CN106658960 A CN 106658960A CN 201510718407 A CN201510718407 A CN 201510718407A CN 106658960 A CN106658960 A CN 106658960A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit
- flexible pcb
- conductor
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
Abstract
A flexible circuit board includes a base material layer and a first conducting circuit layer formed on the surface of the base material layer, the first conducting circuit layer includes at least one first power circuit, an opening penetrating through the base material layer is formed in the base material layer, a conductor is embedded in the opening, and the conductor is closely combined and electrically connected with the first power circuit. The invention also relates to a method for manufacturing the flexible circuit board.
Description
Technical field
The present invention relates to field of circuit boards, more particularly to it is a kind of can increasing circuit plate dam ability
Flexible PCB and preparation method thereof.
Background technology
Flexible PCB (flexible print circuit board, FPCB) product is widely used in
The items electronics field such as computerized information, consumer electronics, can be substantially reduced electronic product
Volume.
It is electric to the FPCB of the charging module of electronic product with developing rapidly for rapid nitriding
The requirement of the ability of damming of source line is increasing.
At this stage, typically the ability of damming of power line is increased by increasing copper thickness and live width.However,
Increase copper thickness or live width are unfavorable for the development of " little, thin, light, thin " of flexible PCB.
The content of the invention
In view of this, the present invention provides a kind of ability of damming that can improve flexible PCB, and energy
Enough ensure constant flexible PCB of the thickness of conductive circuit layer and preparation method thereof.
A kind of flexible PCB, it includes：One substrate layer and the substrate layer is formed in respect to two surfaces
One first conductive circuit layer, first conductive circuit layer include at least one first power circuit, should
An opening for running through the substrate layer is formed with substrate layer, a conductor is embedded into the opening, the conductor
Combine closely and electrically connect with first power circuit.
A kind of preparation method of flexible PCB, it includes step：A copper-clad base plate is provided, this covers
Copper base includes a substrate layer and is formed in the first copper foil layer of the base material layer surface；This cover it is copper-based
At least one opening for running through the substrate layer is formed on plate；A conductor is formed in the opening；And should
First copper foil layer forms one first conductive circuit layer, and first conducting wire includes layer by layer at least 1 the
One power circuit, the opening is relative with the first power circuit position, the conductor and first power supply
Circuit is combined closely and is electrically connected.
Flexible PCB that the present invention is provided and preparation method thereof, in base material corresponding with power circuit
It is embedded into a conductor in layer, and conductor is closely electrically connected with power circuit, increased power circuit
In the case of gross thickness, the thickness of the conductive circuit layer on relative two surfaces of substrate layer are not affected,
Substantially increase the ability of damming of flexible PCB.
Description of the drawings
Fig. 1 is the sectional view of the copper-clad base plate that the present invention is provided.
Fig. 2 is that the top view after opening is formed on the copper-clad base plate shown in Fig. 1.
Fig. 3 is that the sectional view after opening is formed on the copper-clad base plate shown in Fig. 1.
Fig. 4 is that the sectional view after a conductor is formed in the opening shown in Fig. 2 and Fig. 3.
Fig. 5 is one first electrodeposited coating of formation on the first copper foil layer and the second copper foil layer shown in Fig. 4
With the sectional view after one second electrodeposited coating.
Fig. 6 is by the first copper foil layer and the first electrodeposited coating, the second copper foil layer and second shown in Fig. 5
Electrodeposited coating makes to form the first conductive circuit layer and the sectional view after the second conductive circuit layer.
Fig. 7 is formed on the surface of the first conductive circuit layer shown in Fig. 6 and the second conductive circuit layer
Sectional view after cover layer.
Main element symbol description
| Flexible PCB | 100 |
| Copper-clad base plate | 10 |
| Substrate layer | 11 |
| First copper foil layer | 12 |
| Second copper foil layer | 13 |
| Opening | 14 |
| Conductor | 15 |
| First electrodeposited coating | 16 |
| Second electrodeposited coating | 17 |
| First conductive circuit layer | 18 |
| First signal line | 181 |
| First power circuit | 182 |
| Second conductive circuit layer | 19 |
| Secondary signal circuit | 191 |
| Second source circuit | 192 |
| First cover layer | 20 |
| Second cover layer | 21 |
Following specific embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Specific embodiment
With reference to will with reference to drawings and Examples, flexible PCB that the technical program is provided and
Its preparation method is described in further detail.
Refer to Fig. 7, a kind of flexible PCB 100 provided in an embodiment of the present invention, the flexible circuit
Plate 100 includes a substrate layer 11, is formed in the conductive with respect to the one first of two surfaces of the substrate layer 11
The conductive circuit layer 19, one of line layer 18 and 1 second be formed in first conductive circuit layer 18 away from
The first cover layer 20 and on the surface of the substrate layer 11 is formed in second conductive circuit layer
19 away from the second cover layer 21 on the surface of the substrate layer 11.
The material of the substrate layer 11 can be polyimides (polyimide, PI), poly- terephthaldehyde
Sour glycol ester (Polyethylene Terephthalate, PET), PEN
One kind in materials such as (Polyethylene Naphthalate, PEN).
First conductive circuit layer 18 is electric including at least one first signal line 181 and at least one first
Source circuit 182.
In the present embodiment, first signal line 181 has three.First power circuit 182
There is 1.
Second conductive circuit layer 19 is electric including an at least secondary signal circuit 191 and at least one second
Source circuit 192.In the present embodiment, first power circuit 182 and the second source circuit 192
Correspond.
In the present embodiment, the secondary signal circuit 191 has two, the second source circuit 192
There is 1.
Fig. 6 is referred to, the flexible PCB 100 also includes an opening 14 for running through the substrate layer 11,
The opening 14 is just to first power circuit 182 and the second source circuit 192.In the present embodiment
In, the width D 1 of the opening 14 is slightly less than the width D 2 of first power circuit 182.At other
In embodiment, the width D 1 of the opening 14 can also be equal to the width of first power circuit 182
D2.Specifically, this can be formed by methods such as chemical etching, laser ablation, machinery punchings to open
Mouth 14.In the present embodiment, the opening 14 is formed by the method for laser.
A conductor 15 is embedded with the opening 14, the conductor 15 and first power circuit 182 and
The position of second source circuit 192 is relative and combines closely integral.The conductor 15 is equivalent to power supply
A part for circuit, the conductor 15 electrically connects first power circuit 182 and the second source circuit
192.Specifically, the method for can adopt copper facing, filling out copper is embedded into the conductor 15, it would however also be possible to employ
Printing or the method for spraying are embedded into the conductor 15, can also directly by agree with the opening 14 this
Conductor 15 is embedded in the opening 14.The conductor 15 can also be conductive paste.
A kind of preparation method of flexible PCB 100, it comprises the steps：
The first step, refers to Fig. 1, there is provided a copper-clad base plate 10.
In the present embodiment, the copper-clad base plate 10 is a two-sided copper-clad base plate.The copper-clad base plate 10
Including a substrate layer 11, one first copper foil layer 12 and one second copper foil layer 13.First copper foil layer
12 and second copper foil layer 13 be respectively formed on the two relative surfaces of the substrate layer 11.
The material of the substrate layer 11 can be polyimides (polyimide, PI), poly- terephthaldehyde
Sour glycol ester (Polyethylene Terephthalate, PET), PEN
One kind in materials such as (Polyethylene Naphthalate, PEN).
Second step, refers to Fig. 2-3, one is formed on the copper-clad base plate 10 and runs through the substrate layer 11
Opening 14.
In the present embodiment, the opening 14 is recessed to second copper foil layer 13 from first copper foil layer 12
Fall into and through first copper foil layer 12 and the substrate layer 11.In other embodiments, the opening 14
Through first copper foil layer 12, the substrate layer 11 and second copper foil layer 13.
Specifically, this can be formed by methods such as chemical etching, laser ablation, machinery punchings to open
Mouth 14.In the present embodiment, the opening 14 is formed by the method for laser.
3rd step, refers to Fig. 4, and in the opening 14 conductor 15 is embedded into.
The conductor 15 is combined closely integral with first copper foil layer 12 and second copper foil layer 13.
In the present embodiment, the surface away from the substrate layer 11 of the conductor 15 and first copper foil layer 12
Concordantly.Specifically, the method for can adopt copper facing, filling out copper is embedded into the conductor 15, it would however also be possible to employ
Printing or the method for spraying are embedded into the conductor 15, directly can also agree with one and the opening 14
Conductor 15 is embedded in the opening 14.In the present embodiment, form this by copper coating to lead
Body 15.
4th step, refers to Fig. 5, in the remote of first copper foil layer 12 and second copper foil layer 13
One first electrodeposited coating 16 and one second electrodeposited coating 17 are formed respectively from the surface of the substrate layer 11.
First electrodeposited coating 16 and second electrodeposited coating 17 can be formed by copper coating mode.
5th step, refers to Fig. 6, and first copper foil layer 12 and first electrodeposited coating 16 are made
One first conductive circuit layer 18 is formed, second copper foil layer 13 and second electrodeposited coating 17 are made
Form one second conductive circuit layer 19.
First conductive circuit layer 18 is electric including at least one first signal line 181 and at least one first
Source circuit 182.Second conductive circuit layer 19 is including an at least secondary signal circuit 191 and at least
One second source circuit 192.The opening 14 is just to first power circuit 182 and the second source
Circuit 192.In the present embodiment, first power circuit 182 and the second source circuit 192
Width D 2 slightly larger than the opening 14 width D 1.In other embodiments, first power supply
The width D 2 of circuit 182 and the second source circuit 192 can also be equal to the width of the opening 14
D2.The conductor 15 is closely integrated into first power circuit 182 and the second source circuit 192
Integrally.The conductor 15 electrically connects first power circuit 182 and the second source circuit 192.
6th step, refers to Fig. 7, in first conductive circuit layer 18 and second conductive circuit layer
19 surface away from the substrate layer 11 forms respectively one first cover layer 20 and one second and covers
Film layer 21, and then form the flexible PCB 100.
Flexible PCB that the present invention is provided and preparation method thereof, a conductor is embedded in substrate layer,
And it is integral to make the conductor closely combine closely with the conductive circuit layer of the flexible PCB, 1) significantly
Improve the general thickness of power circuit, and then improve damming for the power circuit of flexible PCB
Ability；2) conductor is embedded into substrate layer, while increased power circuit general thickness simultaneously
The thickness and line-spacing of the conducting wire of base material layer surface are not interfered with, flexible PCB will not be increased
General thickness；3) it is soft improving because the thickness of the conductive circuit layer of base material layer surface does not increase
The power circuit of property circuit board dam ability while, do not interfere with covering for flexible circuit plate surface
The filling capacity of epiphragma layer.
It is understood that above example is only used for illustrating the present invention, it is not used as to the present invention
Restriction.For the person of ordinary skill of the art, technology according to the present invention design is made
Other it is various it is corresponding change with deformation, all fall within the protection domain of the claims in the present invention.
Claims (10)
1. a kind of flexible PCB, it includes：One substrate layer and it is formed in the one of the base material layer surface
First conductive circuit layer, first conductive circuit layer includes at least one first power circuit, its feature
It is that an opening for running through the substrate layer is formed with the substrate layer, a conductor is embedded into the opening,
The conductor is combined closely and is electrically connected with first power circuit.
2. flexible PCB as claimed in claim 1, it is characterised in that the opening just to this
One power circuit.
3. flexible PCB as claimed in claim 2, it is characterised in that the flexible PCB is also
Including one second conductive circuit layer, second conductive circuit layer includes an at least second source circuit,
The second source circuit is relative with first power circuit, and the second source circuit is tight with the conductor
With reference to and electrically connect.
4. flexible PCB as claimed in claim 1, it is characterised in that the width of the opening is not
More than first power circuit and the width of the second source circuit.
5. flexible PCB as claimed in claim 1, it is characterised in that such as claim 1 institute
The flexible PCB stated, it is characterised in that the flexible PCB is also formed in this and first leads including one
The first cover layer and one on the surface away from the substrate layer of electric line layer is formed in this and second leads
Electric line layer is away from the second cover layer on the surface of the substrate layer.
6. a kind of preparation method of flexible PCB, it includes step：
A copper-clad base plate is provided, the copper-clad base plate includes a substrate layer and is formed in the base material layer surface
The first copper foil layer；
At least one opening for running through the substrate layer is formed on the copper-clad base plate；
A conductor is formed in the opening；And
First copper foil layer is formed into one first conductive circuit layer, first conducting wire includes layer by layer
At least one first power circuit, the conductor is combined closely and is electrically connected with first power circuit.
7. the preparation method of flexible PCB as claimed in claim 6, it is characterised in that this covers
Second copper foil layer relative with first copper foil layer is also formed with the surface of copper base, should
While first copper foil layer forms first conductive circuit layer, also including step：By second Copper Foil
Layer forms one second conductive circuit layer, and second conductive circuit layer includes at least one first power circuit,
The opening just to first power circuit, the second source circuit and the first power circuit position phase
Right, the second source circuit is combined closely and is electrically connected with the conductor.
8. the preparation method of flexible PCB as claimed in claim 7, it is characterised in that in shape
Into after the step of the conductor, first conductive circuit layer and the step of second conductive circuit layer are formed
Before rapid, also including step：In first copper foil layer and second copper foil layer away from the substrate layer
Surface form one first electrodeposited coating and one second electrodeposited coating respectively.
9. the preparation method of flexible PCB as claimed in claim 8, it is characterised in that in shape
Into after the step of first electrodeposited coating and second electrodeposited coating, first copper foil layer is being made into shape
While into first conductive circuit layer, also including step, first electrodeposited coating is made to form this
First conductive circuit layer, second electrodeposited coating is made to form second conductive circuit layer.
10. the preparation method of flexible PCB as claimed in claim 6, it is characterised in that this is opened
Mouthful be dimensioned slightly smaller than first power circuit and the size of the second source circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510718407.2A CN106658960A (en) | 2015-10-29 | 2015-10-29 | Flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510718407.2A CN106658960A (en) | 2015-10-29 | 2015-10-29 | Flexible circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106658960A true CN106658960A (en) | 2017-05-10 |
Family
ID=58830869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510718407.2A Pending CN106658960A (en) | 2015-10-29 | 2015-10-29 | Flexible circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106658960A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1456030A (en) * | 2001-01-30 | 2003-11-12 | 松下电器产业株式会社 | Laminating double-side circuit board and prouction method therefor and multi-layer printed circuit board using it |
| CN1817072A (en) * | 2003-06-30 | 2006-08-09 | Tdk株式会社 | Method of manufacturing electronic part and electronic part |
| CN104363707A (en) * | 2014-11-05 | 2015-02-18 | 共青城超群科技股份有限公司 | Method for manufacturing high-heat-dissipativity LED baseplate |
-
2015
- 2015-10-29 CN CN201510718407.2A patent/CN106658960A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1456030A (en) * | 2001-01-30 | 2003-11-12 | 松下电器产业株式会社 | Laminating double-side circuit board and prouction method therefor and multi-layer printed circuit board using it |
| CN1817072A (en) * | 2003-06-30 | 2006-08-09 | Tdk株式会社 | Method of manufacturing electronic part and electronic part |
| CN104363707A (en) * | 2014-11-05 | 2015-02-18 | 共青城超群科技股份有限公司 | Method for manufacturing high-heat-dissipativity LED baseplate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
| CB02 | Change of applicant information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190114 Address after: 223065 No. 11 Honghai North Road, Huaian Economic and Technological Development Zone, Jiangsu Province Applicant after: Qing Ding precision electronic (Huaian) Co., Ltd. Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518105 Yanchuan Yanluo Road, Songgang Street, Baoan District, Shenzhen City, Guangdong Province Applicant before: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
| TA01 | Transfer of patent application right | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170510 |
|
| WD01 | Invention patent application deemed withdrawn after publication |