JPS5987892A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS5987892A JPS5987892A JP19820282A JP19820282A JPS5987892A JP S5987892 A JPS5987892 A JP S5987892A JP 19820282 A JP19820282 A JP 19820282A JP 19820282 A JP19820282 A JP 19820282A JP S5987892 A JPS5987892 A JP S5987892A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- land
- diameter
- components
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、集積回路等の部品を配設して回路を構成す
るための印刷配線板に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a printed wiring board on which components such as integrated circuits are arranged to form a circuit.
一般に、印刷配線板は、複数の集積回路等の部品を配設
して回路を構成する基板であり、各種の電子装置等に多
用されている。このような印刷配線板は、通常、絶縁板
の表面上に銅箔等の櫛体部（以下ランドと称する）のパ
ターンがプリント形成されており、さらに部品挿入用ス
ルーホールおよび信号接続用スルーホールを備えている
。In general, a printed wiring board is a board on which a plurality of components such as integrated circuits are arranged to form a circuit, and is widely used in various electronic devices. Such printed wiring boards usually have a pattern of comb parts (hereinafter referred to as lands) made of copper foil or the like printed on the surface of an insulating board, as well as through holes for inserting components and through holes for signal connections. It is equipped with
ところで、近年、印刷配線板は面密度化が進み、部品挿
入用スルーホールの径は小さくなり、信号接続用スルー
ホールの径の大きさ翁が少なくなりつつある。例えば、
２．５４μ間隔のスルーホール間を２本の信号ラインが
形成されるパターンにおいては、上記のような両者のス
ルーホールの径の大きさはほぼ同一である。そのため、
このような従来の印刷配線板では、部品を挿入する際、
部品挿入用スルーホールと信号接続用スルーホールの区
別が不明確と方る。これにより、部品を誤まった位置に
取付けたり、また信号接続用スルーホールに対して部品
挿入用スルーホールを信号接続用に使用した場合に信号
接続の信頼性が低下する欠点があった。Incidentally, in recent years, as the surface density of printed wiring boards has increased, the diameter of through holes for inserting components has become smaller, and the diameter of through holes for signal connections has become smaller. for example,
In a pattern in which two signal lines are formed between through holes spaced apart by 2.54 μm, the diameters of the two through holes are approximately the same as described above. Therefore,
In conventional printed wiring boards like this, when inserting components,
The distinction between through-holes for inserting components and through-holes for signal connections is unclear. This has the drawback that the reliability of signal connections decreases when components are installed in incorrect positions or when through holes for inserting components are used for signal connections instead of through holes for signal connections.
（発明の目的〕
、 この発明は上記の事情に４みてなされたもので、そ
の目的は、部品を所定の位置に確実に配設でき、しかも
回路構成に必要な信号ラインの接続の信頼性を高めるこ
とができる印刷配線板を提供することにある。(Objective of the Invention) This invention has been made in view of the above circumstances, and its object is to ensure that components are placed in predetermined positions and to ensure reliability of connection of signal lines necessary for circuit configuration. The purpose of the present invention is to provide a printed wiring board that can be improved.
この発明は、部品挿入用スルーホールの径を信号接続用
スルーホールの径よりも大きく形成する。そして、この
場合、両者のランドの径を同一にするものである。In this invention, the diameter of the through hole for component insertion is formed larger than the diameter of the through hole for signal connection. In this case, the diameters of both lands are made the same.
実施例
以下図面を参照してこの発明の一実施例について説明す
る。図はこの発明に係る印刷配線板の構成を示すもので
、１０は絶縁基板で例えばエポキシ系樹脂等の積層板で
ある。この基板ｌＯの表面上には、部品挿入用スルーホ
ール１１および信号接続用スルーホール１２のそれぞれ
が、所定の位置に形成される。この場合、スルーホール
１１の径が、スルーホール１２の径よりも大きくなるよ
うに形成される。さらに、各スルーホール１１．１２の
それぞれの周囲には、導体部（通常、銅箔からなる）で
あるラン□ド１３．１４が形成され文。この各ランド１
３．１４の径は、同一になるように形成される。Embodiment An embodiment of the present invention will be described below with reference to the drawings. The figure shows the structure of a printed wiring board according to the present invention, and 10 is an insulating substrate, for example, a laminated board made of epoxy resin or the like. A component insertion through hole 11 and a signal connection through hole 12 are formed at predetermined positions on the surface of the substrate IO. In this case, the diameter of the through hole 11 is formed to be larger than the diameter of the through hole 12. Furthermore, a land 13.14, which is a conductive portion (usually made of copper foil), is formed around each through hole 11.12. Each land 1
3.14 diameters are formed to be the same.
そして、各ランド１３．１４において、回路構成に応じ
てランド間を接続する信号パターン１５が形成される。Then, in each land 13, 14, a signal pattern 15 is formed to connect the lands depending on the circuit configuration.
この信号パターン１５は、通常、ランド１３．１４と同
材質の導体部である。This signal pattern 15 is usually a conductor made of the same material as the lands 13 and 14.
このような印刷配線板において、その作用を説明する。The operation of such a printed wiring board will be explained.
回路構成にｄ要な集積回路等の部品を基板１０に配設す
るには、その部品のリード線を部品挿入用スルーホール
１１に挿入して、基板ｌＯの裏面に形成されているラン
ドに半田付けする。この場合、部品挿入用スルーホール
１１の径は、信号接続用スルーホール１２の径よシ大き
いため、誤まって部品のリード線を信号接続用スルーホ
ール１２に挿入するような事態を大幅に減少することが
できる。このようにして配設された部品において、他の
部品に対する接闇は、信号接続用スルーホール１２を利
用してそれぞれの部品のリード線間が接続されてなされ
る。そして、部品間の信号交換は、信号パターン１５を
介して行なわれることになる。To place components such as integrated circuits that are necessary for the circuit configuration on the board 10, the lead wires of the components are inserted into the component insertion through-holes 11, and soldered onto the lands formed on the back surface of the board 10. Attach. In this case, since the diameter of the component insertion through hole 11 is larger than the diameter of the signal connection through hole 12, the possibility of accidentally inserting a component lead wire into the signal connection through hole 12 is greatly reduced. can do. In the components arranged in this manner, the lead wires of the respective components are connected to each other by using the signal connection through holes 12 to connect the components to other components. Then, signal exchange between the parts is performed via the signal pattern 15.
ところで、上記のような印刷配線板は、通常、ＯＡ Ｄ
（ｃｏｍｐｓｔｅｒ ａｉｄｅｄ ｄｅｓｉｇｎ ）
等を利用して、自動的に製造されている。この場合
、まずランド１３．１４および信号パターンＪ５が形成
された後、各スルーホール１１．１２が形成されるとす
る。このとき、信号接続用スルーホール１２のランド１
３の径は、上記のように部品挿入用スルーホール１１の
ランド１４の径と同一である。このため、スルーホール
１２を形成する際、確実にランド１４の中心部に孔を形
成することができる。即ち、スルーホール１２の大きさ
に応じてランド１３の径を小さくした場合に比較して、
スルーホール１２がランド１３をはみ出して形成される
ような事態を確実に防止できる。また、ランド１３．１
４の大きさを同一にすることによシ、ランド１３゜１４
の自動製造上の効率を高めることができる。By the way, printed wiring boards as mentioned above are usually OAD
(compster aided design)
It is automatically manufactured using In this case, it is assumed that the lands 13.14 and the signal pattern J5 are first formed, and then the through holes 11.12 are formed. At this time, land 1 of the signal connection through hole 12
3 is the same as the diameter of the land 14 of the component insertion through hole 11 as described above. Therefore, when forming the through hole 12, the hole can be reliably formed in the center of the land 14. That is, compared to the case where the diameter of the land 13 is made smaller according to the size of the through hole 12,
A situation in which the through hole 12 is formed protruding from the land 13 can be reliably prevented. Also, land 13.1
By making the size of 4 the same, land 13°14
The efficiency of automatic manufacturing can be increased.
以上詳述したようにこの発明によれば、部品挿入用スル
ーホールの径を、信号接続用スルーホールの径より大き
く形成することにより１回路構成に必要な部品を所定の
位置に確実に配設できる。また、信号接続用スルーホー
ルのランドの径を１部品挿入用スルーホールのランドと
同一にすることにより、信号接続用スルーホールをラン
ドの中心に確実に形成でき、回路構成に必要な信号ライ
ンの接続の信頼性を向上できるものである。As described in detail above, according to the present invention, the diameter of the through hole for inserting components is formed larger than the diameter of the through hole for signal connection, thereby ensuring that components necessary for one circuit configuration are arranged at predetermined positions. can. In addition, by making the diameter of the land of the through hole for signal connection the same as the land of the through hole for inserting one component, the through hole for signal connection can be reliably formed in the center of the land, and the signal line necessary for the circuit configuration can be formed. This can improve the reliability of the connection.
４、図面ノＲｊ）ＭＡ ’ｌ 説明
図はこの発明の一実施例に係る印刷配線板の構成を示す
図である。4. Drawing No. Rj) MA'l The explanatory diagram is a diagram showing the configuration of a printed wiring board according to an embodiment of the present invention.
１０・・・絶縁基板、１１・・・部品挿入用スルーホー
ｋ、１２・・・信号接ａ 用スルーホール、１３゜１４
・・・ランド、１５・・・信号パターン。10...Insulating board, 11...Through hole k for component insertion, 12...Through hole for signal connection a, 13゜14
...Land, 15...Signal pattern.
出願人代理人 弁理土鈴 江 武 彦Applicant's agent: Patent attorney Takehiko E
Claims (1)
とを有する印刷配線板において、部品Ｆｉ４ｊ 入用ス
ルーホールのランドおよび信号接続用スルーホールの両
者のランドの径が同一で、上記部品挿入用スルーホール
の径が上記信号接続用スルーホールの径よりも大きく形
成されてなることを特徴とする印刷配線板。In a printed wiring board having a through hole for component insertion and a through hole for signal connection, the diameter of both the land of the required through hole and the land of the signal connection through hole is the same, and the diameter of the land of the through hole for component insertion is the same. A printed wiring board characterized in that the diameter is larger than the diameter of the signal connection through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19820282A JPS5987892A (en) | 1982-11-11 | 1982-11-11 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19820282A JPS5987892A (en) | 1982-11-11 | 1982-11-11 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5987892A true JPS5987892A (en) | 1984-05-21 |
Family
ID=16387173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19820282A Pending JPS5987892A (en) | 1982-11-11 | 1982-11-11 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5987892A (en) |
-
1982
- 1982-11-11 JP JP19820282A patent/JPS5987892A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS594873B2 (en) | printed wiring board | |
| US5042147A (en) | Method of preparing surface-mounted wiring board | |
| JPS61131498A (en) | Wiring structure of termination circuit | |
| JPS5987892A (en) | Printed circuit board | |
| JPS6384190A (en) | Chip parts mounting board | |
| JPS5998584A (en) | Printed circuit board | |
| JPS6286894A (en) | Printed wiring board | |
| JPS6141272Y2 (en) | ||
| JPS6240460Y2 (en) | ||
| JPS6010275Y2 (en) | insulated terminal | |
| JPH0138920Y2 (en) | ||
| JPS5843245Y2 (en) | multilayer printed board | |
| JPS6136995A (en) | Multilayer printed circuit board | |
| JPS60218864A (en) | Mounting method of electronic-parts package and structure of electronic-parts package | |
| JPS58182292A (en) | High density mounting method | |
| JPS6094791A (en) | Printed circuit board | |
| JPS59161892A (en) | Pattern circuit board | |
| JPS5933769A (en) | Wiring structure between circuit boards | |
| JPS58159359A (en) | Chip case for integrated circuit | |
| JPS63131592A (en) | Wiring board | |
| JPS62200788A (en) | Multilayer printed board | |
| JPS6010799A (en) | Electronic circuit device | |
| JPS60164389A (en) | Printed board | |
| JPH01276690A (en) | Printed wiring board and its manufacture | |
| JPS6089992A (en) | Printed board |