JPS6384190A - Chip parts mounting board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a chip component mounting board used for electrical equipment such as a television receiver.

(Prior Art) In recent years, as electrical equipment has become smaller and lighter, the mounting density of electronic components on circuit boards has increased, and chip-type components without electrode lead wires are increasingly being used. As a board on which such chip components are mounted to increase the mounting density, a double-sided conductive board in which conductive patterns are formed on both sides of the board is used.

FIG. 4 is an explanatory diagram showing a double-sided through-ball board in which conductors are formed on both sides of the board.

In FIG. 4, conductive patterns 22 and 23 are formed on both sides of a substrate 21 made of an insulating material such as ceramic, and through holes 24 are formed in the substrate 21 so as to pass through the facing conductor patterns 22 and 23. is formed. Further, by applying metal plating 25 to the through hole 24 portion, conductive connection is established between the cross body patterns 22 and 23. Each of the conductor patterns 22 and 23 provided with the metal plating 25 has a depth part 26 fixed thereto by a half Fn 27.

However, in the above-mentioned double-sided through-hole board, the etching process and the through-holes 24 are performed to form conductors on both sides of the board.
Some parts require plating.

This has the drawback of increasing manufacturing man-hours and increasing costs.

Therefore, when the density of components mounted on the board is medium, a single-sided conductor board in which a conductor is formed on one side of the board is used.

FIG. 5 is an explanatory diagram showing the single-sided conductive substrate. Fifth
In the figure, a conductive pattern 32 is formed on the lower surface of a substrate 31, and a soldering land 32 is formed on a part of this conductive pattern 32.
a is formed. The soldering land 32a is provided with an n-through hole 34 that passes through the front and back surfaces of the board 31, and a lead wire 35 or jumper lead 36 of an electronic component is inserted into the through hole 34 and fixed with solder 37. In addition, a chip component 38 is mounted and fixed on the soldering land 32a,
It constitutes a circuit board.

However, although the conventional single-sided conductive substrate described above can reduce the manufacturing cost of the substrate, it has a drawback that it is difficult to improve the mounting density of electronic components because the conductive pattern is formed only on one side.

(Problems to be Solved by the Invention) As mentioned above, when a single-sided conductor 15 board is used as a conventional chip component mounting board, there is a drawback that it is difficult to improve the mounting density of electronic components. In addition, when using four double-sided conductor plates, etching is required to form conductors on both sides of the board, and plating is required for through-holes, which increases manufacturing man-hours and increases costs. be.

The present invention has been made in order to solve the above-mentioned problems, and it is possible to mount chip components at a high density by using the jumper lead wiring of a single-sided conductor board, and also to realize a chip component mounting board at low cost. It is assumed that providing [-1].

[Structure 1 of the Invention (Means for Solving Problems) The chip component mounting board of the present invention is a printed circuit board in which a conductive pattern is formed on one side of an insulating board, and a through hole is formed in the soldering land of this conductive pattern. a first jumper wire that connects the soldering lands by inserting both ends of conductive wires into respective through holes on the non-conductor forming surface of the printed circuit board; and a first jumper wire that is installed at a predetermined interval with respect to the first jumper wire. a second jumper wire connected to the first and second jumper wires;
A chip component is provided which bridges the jumpers 74 to 7 and forms a circuit.

In the present invention, by mounting chip components between the first and second jumper wires installed on the board, chip components can be mounted on both the front and back sides of the single-sided conductor board, and high density Implementation becomes possible.

(Embodiments) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an explanatory view showing a chip component mounting board according to the present invention, and FIG. 2 is a perspective view showing a state in which the chip component mounting board of FIG. 1 is mounted.

In FIG. 1, reference numeral 1 is a board made of an insulating material, etc. A conductor pattern 2 is formed on the bottom surface of this board 1, and a part of the conductor pattern 2 is bulged out to form a soldering land 2a.
is formed. The soldering land 2a is provided with a through hole 4 that penetrates the board 1, and a lead wire 5a of an electronic component 5 and a lead portion 6a of a jumper wire 6 having both ends bent are inserted into the through hole 4 from the top side. They are respectively inserted and fixed with solder 7 or the like. Furthermore, land 2a with 1 half-piece.

The conductive parts 8a and 8b of the chip component 8 are placed on 2b and fixed with solder 7.

The jumper wires 6.6 arranged on the top surface of the M board 1 are made of, for example, plated annealed copper wires, and as shown in FIG. has been done.

In the chip component mounting board of the present invention, as shown in FIG.
The conductive parts 8a, 8b of the chip component 8 and the jumper wire 6.6 are electrically connected using the jumper wire 6.6. That is, a circuit is constructed by bridging the jumper wires X76.6 that are spaced apart from each other using the chip component 8 and the solder 7, and the chip components can be mounted on both sides of the board 1.

Note that the reference numeral 10 indicates a discrete component such as a capacitor.

Next, the solder connection between the jumper wire 6 and the chip component 8 will be explained based on FIG. 3. FIG. 3(a) is an enlarged perspective view of a part of the chip component mounting board of the present invention;
FIG. 3(b) is a perspective view showing a modification of the chip component mounting board shown in FIG. 3(a), in which members functionally corresponding to those in FIG. 1 are denoted by the same reference numerals.

The jumper wire 6.6 shown in FIG. 3(a) has a round cross section, and the IJff of the chip component 8 is
The i parts Qa and Qb are placed on the substrate without directly contacting the jumper wires, and are electrically connected by solder 7. Further, the jumper wire 6.6 has a round cross-section, but the conductive portion 8 of the chip component 8
a, 8b! In order to facilitate placement, the jumper wire 6.6 shown in FIG. 3(b) is provided with a recess 6b. Providing this recess 6b prevents the chip component 8 from shifting when it is mounted, and also allows direct contact between the jumper wire 6.6 and the conductive portions 8a, 8b, thereby increasing stability.

According to the chip component mounting board of the present invention, a circuit can be constructed by mounting a large number of chip components on the non-conductor forming surface of the single-sided conductive board, and the actual area of the board can be reduced. In addition, even without using a double-sided through-hole board, it is possible to obtain a mounting density close to that of a screen through-hole board.
Plating treatment, etching treatment, etc. of the through-hole portions are no longer necessary, and costs can be reduced. Furthermore, more solder base can be removed from the conductive parts, and the soldering properties are improved, making it possible to provide a highly reliable chip component mounting board.

Although the jumper wire of the present invention has been described using an example in which the cross-sectional shape is round, the jumper wire is not limited to this, and the cross-sectional shape may be square.

(Effects of the Invention) As described above, according to the present invention, electronic components can be mounted on both the front and back surfaces of a single-sided conductive substrate, and high-density mounting is possible. Furthermore, it is possible to provide a highly reliable chip component mounting board at a lower cost than when chip components are mounted on a double-sided through-hole board.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing a deep component mounting board according to the present invention, FIG. 2 is a perspective view showing a mounting state of the chip component mounting board of FIG. 1, and FIG. FIG. 4 is an explanatory view showing a double-sided through-hole board in which conductors are formed on both sides of the board, and FIG. 5 is an explanatory view showing a single-sided conductor board. 1... Insulating substrate 2... Conductor pattern 2a
... Soldering land 4 ... Satellite hole 6 ... Jumper wire 6a ... Lead part 7 ... Half 1)
8...Chip parts agent Patent attorney Chika Nori
Ken Hiroshi Uji Figure 1 Figure 2

Claims (1)

[Scope of Claims] A printed circuit board in which a conductive pattern is formed on one side of an insulating substrate, and through holes are formed in the soldering lands of the conductive pattern, and each through hole is formed in a non-conductor forming surface of the printed circuit board. Insert both ends of the conductor into the first
a jumper wire, a second jumper wire attached to the first jumper wire at a predetermined interval, and a chip component that bridges the first and second jumper wires and forms a circuit. A chip component mounting board characterized by: