JPS63131592A - Wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a wiring board on which various components are mounted by soldering.

[Conventional technology]

For electronic components such as general transistors and diodes,
Many types have external lead wires. The above components are mounted on the circuit board by inserting lead wires into lands with through holes on the circuit board and then connecting them by soldering.

Figures 2 (ar), (b), and (e) show a state in which components are mounted on a conventional flexible wiring board, and are shown in a plan view, a side view, and a bottom view, respectively, and (d)
This shows the component mounting area of the wiring board, where the CU foil is exposed. The wiring board is a conductor wiring pattern 1a made of IFiCu foil laminated with polyimide film 1b from both the upper and lower sides, and the Cu foil exposed pattern part 2 at one end is a part to be connected to another circuit board via a connector etc. . In addition, the Cu foil exposed pattern portion 3 is a portion provided for mounting components, and exposes the back side KCu foil 1a of the board, and as shown in FIG. It is being Part 6 is shown in the same figure (a) (
b) As shown in (c), the lead wire 6a is inserted into the through hole 5.
After inserting it into the flexible wiring board l, it is soldered and fixed with solder 7 on the back side of the flexible wiring board l.

Note that the Cu foil exposed pattern portion 2.3 is subjected to solder plating, Sn plating, etc. in order to improve solderability and corrosion resistance.

[Problem that the invention seeks to solve]

The conventional process of inserting component lead wires into a wiring board and fixing them with solder, etc. has the disadvantage that the lead wires become deformed and bent during insertion, making it difficult to insert, resulting in poor work efficiency and increased man-hours. be. The through-hole can be made larger to improve workability, but since the lead wire spacing of parts is standardized, increasing the through-hole diameter will reduce the insulation width between the lands, making it difficult to use solder for soldering. Short circuits are more likely to occur. Increasing the spacing between the lands not only increases the area of the wire board and increases the cost, but also makes automatic insertion difficult because the lead wires of the components must be spread out before insertion.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and provide a low-cost wiring board with a structure that allows easy mounting of components having external lead wires.

[Means for solving problems]

The wiring board of the present invention has a land on the side surface of the board that passes through a lead wire of a component having an external lead wire, and the land passes through a through hole and is divided into approximately semicircles, and the through hole is located on the outside. It is opened to form a round shape.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings. Figure 1 (al (b) (cl) shows a state in which components are mounted on a flexible wiring board (hereinafter referred to as wiring board) of the embodiment, and represents a plan view, a side view, and a wide view, respectively. (d) shows the component mounting area of the wiring board, where the Cu foil is exposed.

The wiring board 11 is made by laminating a conductive wiring pattern 11a with a polyimide film 11b from both upper and lower sides, and has a Cu foil exposed pattern part 12 at one end, which is connected to a connector, in the same way as described in the conventional example. ing. Parts are installed using C with the polyimide film removed on one side.
As shown in FIG.
5 is open to the outside.

Mounting a component on the wiring board 11 is extremely easy; the lead 6a of the component 6 is inserted into the through hole 15 of the land 140 from the open side, and solder 7 is applied to the exposed land 14 on the back surface of the wiring board 11. Contact with wax.

〔Effect of the invention〕

As described above and as follows, in the present invention, the area of the land is reduced by a half circle, so the area of the board can be reduced and the cost thereof can be reduced.

If the notch of the through-hole of the land is properly made, it is extremely easy to insert the lead wire of the component, and the work can be completed quickly. Since wiring boards usually have spring properties, parts can be held as long as they fit into them, which is advantageous in terms of work. In addition,
It goes without saying that the wiring board is not limited to a flexible wiring board, but can also be applied to a normal glass epoxy board.

[Brief explanation of the drawing]

FIGS. 1(a), (b), and (c) are plan views showing the next state after parts are mounted on a wiring board according to an embodiment of the present invention.
Side view/bottom view, (d) shows C with parts mounted on the wiring board
FIG. 2, a diagram showing the U-foil exposed pattern portion, is a diagram corresponding to FIG. 1 of the conventional example. 6...Parts, 6JL...Lead wire,
7...Solder, 11...(Flexible) wiring board, 11a...
Conductor wiring pattern, 11b... Polyimide film, 12, 13... Cu foil exposed pattern portion, 14...
Land, 15-...through hole.

Claims (1)

[Claims] The side surface of the board has a land that passes through the lead wire of a component having an external lead wire, and the land passes through the through hole and is divided into approximately semicircular shapes, with the through hole opening outward. A wiring board characterized by: