JPS60261188A - Axial lead short jumper - Google Patents
Axial lead short jumperInfo
- Publication number
- JPS60261188A JPS60261188A JP11667484A JP11667484A JPS60261188A JP S60261188 A JPS60261188 A JP S60261188A JP 11667484 A JP11667484 A JP 11667484A JP 11667484 A JP11667484 A JP 11667484A JP S60261188 A JPS60261188 A JP S60261188A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- axial lead
- board
- wiring
- short jumper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は産業用及び民生用電子機器等のプリント基板に
利用されるンヨートノヤン・ぐに関し、更に具体的に述
べれば、電子部品を高密度に実装するために表裏両面に
形成した配線回路を接続するンヨートソヤンｉｅに関す
るものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to printed circuit boards used in industrial and consumer electronic devices, and more specifically, to high-density electronic components. The present invention relates to a wiring board that connects wiring circuits formed on both the front and back surfaces for mounting.
（従来例の構成とその問題点）
基板の表裏両面に形成された配線回路を接続する方法に
ついて、第１図によシ説明する。同図において、基板１
の表裏両面に形成された配線回路２及び３を接続するた
めに、表裏の両回路２及び３を貫くように貫通孔４を開
け、その内径面に銀等の金属箔５を形成し、この金属箔
５によって基板の表裏両面の回路２及び３を接続してい
た。上記貫通孔４は基板１に対する電子部品の装着にも
使用され、第１図には示してないが電子部品の端子に装
着されたリード線を貫通孔４に挿通したのち、はんだバ
スに浸漬して基板１の裏面に形成された配線回路３とは
んだ付けされる。はんだバスに浸漬する工程では、基板
１の表面に形成された配線回路２と上記電子部品のリー
ド線とのはんだ付けは行われないので、基板１の表裏両
面に形成された配線回路２及び３０間の接続は、上記の
貫通孔４の内径面に形成された金属箔５に依存するが、
貫通孔４と基板１の表面とでできるエツジ部は鋭い角と
なるため金属箔の形成がむつかしく、接続が不完全とな
ることがらシ、配線基板の信頼ｌ
性を低下するという問題点があった。更に、基板１には
ガラス、エポキシ樹脂等の高価な基板材を使用する必要
がちシ、製造コストを上げる要因となっていた。(Structure of conventional example and its problems) A method for connecting wiring circuits formed on both the front and back surfaces of a substrate will be explained with reference to FIG. In the figure, substrate 1
In order to connect the wiring circuits 2 and 3 formed on both the front and back sides, a through hole 4 is made to pass through both the front and back circuits 2 and 3, and a metal foil 5 such as silver is formed on the inner diameter surface of the through hole 4. The circuits 2 and 3 on both the front and back sides of the board were connected by the metal foil 5. The through hole 4 is also used to attach electronic components to the board 1. Although not shown in FIG. 1, a lead wire attached to a terminal of an electronic component is inserted through the through hole 4 and then immersed in a solder bath. Then, it is soldered to the wiring circuit 3 formed on the back surface of the substrate 1. In the solder bath immersion process, the wiring circuits 2 and 30 formed on the front and back surfaces of the substrate 1 are not soldered together with the lead wires of the electronic components. The connection between them depends on the metal foil 5 formed on the inner diameter surface of the through hole 4, but
The edge formed by the through hole 4 and the surface of the board 1 has a sharp corner, which makes it difficult to form a metal foil, which may result in incomplete connection and reduce the reliability of the wiring board. Ta. Furthermore, it is necessary to use an expensive substrate material such as glass or epoxy resin for the substrate 1, which increases the manufacturing cost.
（発明の目的）
本発明は上記の欠点を解消するもので、基板の表裏両面
に形成された配線回路を貫く貫通孔が孔を開けたままで
よく、アキシャルリード形のｉ子部品の自動装着機を使
用することができるばかシでなく、表裏両面の配線回路
とショートジャンパとを両面ともにはんだ付けによ多接
続されるショートシャン・ぐを提供しようとするもので
おる。(Object of the Invention) The present invention solves the above-mentioned drawbacks, and the through-holes passing through the wiring circuits formed on both the front and back sides of the board can remain open. The purpose of this invention is to provide a short shunt in which wiring circuits on both the front and back sides and short jumpers are connected by soldering on both sides, rather than using a simple circuit.
更に本発明は、溶融点が１８０℃以下のヤニ入シはんだ
を使用することによシ、基板として安価なフェノール樹
脂系の基板材の使用を可能にす不ものである。Furthermore, the present invention allows use of an inexpensive phenolic resin substrate material as a substrate by using resin-cored solder having a melting point of 180° C. or lower.
以上によって、装着作業の全自動化が可能となシ、安価
で信頼性の高いシリンド基板を提供しようとするもので
ある。As described above, the present invention aims to provide an inexpensive and highly reliable cylinder board that allows fully automated mounting work.
（発明の構成）
本発明は上記の目的を達成するために、以下に示すよう
に構成されている。(Configuration of the Invention) In order to achieve the above object, the present invention is configured as shown below.
基板の表裏両面に形成された配線回路を基板を貫く貫通
孔の両端で、−回のはんだバスに浸漬する工程で同時に
はんだ付けが行われるように、更に、アキシャルリード
形電子部品の自動装着装置を使用できるように、リード
線を固着した椀形又は円板形の端子を、円筒形のフラッ
クス入シはんだの両端に装着した構造のアキシャルリー
ド形ショートノヤンノやとする。In addition, an automatic mounting device for axial lead type electronic components is installed so that the wiring circuits formed on both the front and back sides of the board can be soldered simultaneously at both ends of the through-hole penetrating the board during the -times of immersion in the solder bath. This is an axial lead type short solder with a structure in which a bowl-shaped or disc-shaped terminal with a lead wire fixed to it is attached to both ends of a cylindrical flux-cored solder.
更に、円筒形のフラックス入りはんだを溶融点が１８０
℃以下の低融点のはんだにすることによって、基板を安
価なフェノール樹脂系の基板材が使えるようにする。Furthermore, the melting point of the cylindrical flux-cored solder is 180.
By using solder with a low melting point below ℃, it is possible to use an inexpensive phenolic resin substrate material for the board.
（実施例の説明）
本発明の一実施例を第２図ないし第３図によシ説明する
。第２図において、本発明のアキシャルリード形ショー
トソヤンパは、リード線１１及び１２をそれぞれ固着し
た椀形の端子１３及び１４を円筒形のヤニ入りはんだ１
５の両端に装着して構成されている。(Description of Embodiment) An embodiment of the present invention will be explained with reference to FIGS. 2 and 3. In FIG. 2, the axial lead type short solder pump of the present invention connects bowl-shaped terminals 13 and 14 to which lead wires 11 and 12 are fixed, respectively, to a cylindrical resin-cored solder 1.
It is configured by being attached to both ends of the 5.
第３図は、配線基板ｆの表裏両面に形成された配線回路
２及び３を貫く貫通孔６及び７に１アキンヤルリ一ド形
電子部品の自動装着装置を利用して第２図のアキシャル
リード形ショートジャンノ々を基板１に装着した状態を
示す。FIG. 3 shows the axial lead type shown in FIG. The state in which short jackets are attached to the board 1 is shown.
第４図は第３図の状態の配線基板１をはんだバスに浸漬
した後の状態を示したもので、裏面の配線回路３は、は
んだバスによってリード線１１及び１２とはんだ１７で
接続され、表面の配線回路２は、はんだバスから伝達さ
れた熱によって溶融した前記のヤニ入シはんだにょシ、
リード線１１及び１２と端子１３及び１４とが一緒には
んだ１６によって接続されている。FIG. 4 shows the wiring board 1 in the state shown in FIG. 3 after being immersed in a solder bath. The wiring circuit 2 on the surface includes the resin-filled solder, which is melted by the heat transferred from the solder bus.
Lead wires 11 and 12 and terminals 13 and 14 are connected together by solder 16.
第５図は本発明の他の実施例を説明するもので、リード
線１１及び１２をそれぞれ固着した円板形の端子１８及
び１９を円筒形のヤニ入シはんだ１５の両端に装着した
アキシャルリード形ショートジャンパである。FIG. 5 explains another embodiment of the present invention, in which disc-shaped terminals 18 and 19 to which lead wires 11 and 12 are fixed, respectively, are attached to both ends of a cylindrical resin-filled solder 15. It is a short jumper.
（発明の効果）
以上説明したように、本発明によれば以下に示す効果が
得られる。(Effects of the Invention) As explained above, according to the present invention, the following effects can be obtained.
配線基板の表裏両面に形成された配線回路は、アキシャ
ルリード形ショートジャンノｅのリード線の上下両端の
双方においてそれぞれはんだ付けで接続されるので、配
線基板の信頼性が著しく向上する。Since the wiring circuits formed on both the front and back surfaces of the wiring board are connected by soldering at both the upper and lower ends of the lead wires of the axial lead type short Janno e, the reliability of the wiring board is significantly improved.
配線基板の表裏両面に形成された配線回路を貫く貫通孔
は、孔開は加工のみとなシ、内径面に金属箔を形成する
工程が省略されるばかシでなく、アキシャルリード形電
子部品の自動装着装置の利用を可能にする〇
溶融点が１８０℃以下の低溶融点のヤニ入シはんだの採
用によシ、基板は安価なフェノール樹脂系の基板材の使
用を可能にする。The through-holes that pass through the wiring circuits formed on both the front and back sides of the wiring board require only machining, and the process of forming metal foil on the inner diameter surface is not a foolproof process, but it is an axial lead type electronic component. Enables use of automatic mounting equipment. By using resin-filled solder with a low melting point of 180°C or less, it is possible to use an inexpensive phenolic resin board material for the board.
以上の効果によって、製造工数が少なく、安価でしかも
信頼性の高い配線基板の提供を可能とする。The above effects make it possible to provide an inexpensive and highly reliable wiring board with fewer manufacturing steps.
第１図は従来の基板両面回路の短絡路の断面図、第２図
は本発明によるアキシャルリード形ショートノヤンパの
断面図、第３図は第２図のアキシャルリード形ショート
ジャンパを配線基板に取シ付けた状態の断面図、第４図
は配線基板にアキシャルリード形ショートジャンパをは
んだ付けした状態の断面図、第５図は本発明による他の
アキンヤルリード形ショー トジャンノ９の断面図であ
る。
１・・・基板、２，３・・・配線回路、４，６．７・・
・貫通孔、５・・・金属箔、１１．１２・・・リード線
、１３゜１４．１８，１９・・・端子、１５・・・ヤニ
入シはんだ、１６．１７・・はんだ。
第１図
第２図
第３図
１に １１Fig. 1 is a cross-sectional view of a short-circuit path in a conventional double-sided circuit on a circuit board, Fig. 2 is a cross-sectional view of an axial lead type short jumper according to the present invention, and Fig. 3 is a cross-sectional view of the axial lead type short jumper of Fig. 2 on a wiring board. Figure 4 is a cross-sectional view of the axial lead type short jumper soldered to the wiring board, and Figure 5 is a cross-sectional view of another axial lead type short jumper 9 according to the present invention. be. 1... Board, 2, 3... Wiring circuit, 4, 6.7...
- Through hole, 5... Metal foil, 11.12... Lead wire, 13° 14.18, 19... Terminal, 15... Resin-filled solder, 16.17... Solder. Figure 1 Figure 2 Figure 3 Figure 1 11
Claims (2)
筒形の低融点のヤニ入シはんだの両端に装着したことを
特徴とするアキシャルリード形ショートノヤンパ。(1) An axial lead type short jumper characterized in that arm-shaped or disc-shaped terminals to which lead wires are fixed are attached to both ends of a cylindrical low-melting-point resin-filled solder.
下のはんだとしたことを特徴とする特許請求の範囲第（
１）項記載のアキシャルリード形ショートノヤンパ。(2) The cylindrical resin-filled solder is a solder with a melting point of 180°C or less (
Axial lead type short jumper described in section 1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11667484A JPS60261188A (en) | 1984-06-08 | 1984-06-08 | Axial lead short jumper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11667484A JPS60261188A (en) | 1984-06-08 | 1984-06-08 | Axial lead short jumper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60261188A true JPS60261188A (en) | 1985-12-24 |
Family
ID=14693078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11667484A Pending JPS60261188A (en) | 1984-06-08 | 1984-06-08 | Axial lead short jumper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60261188A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016051798A (en) * | 2014-08-29 | 2016-04-11 | 大日本印刷株式会社 | Method of manufacturing mounting board and mounting board |
-
1984
- 1984-06-08 JP JP11667484A patent/JPS60261188A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016051798A (en) * | 2014-08-29 | 2016-04-11 | 大日本印刷株式会社 | Method of manufacturing mounting board and mounting board |
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