JPH02224393A - Method of soldering mixed mounting metal core printed board assembly - Google Patents
Method of soldering mixed mounting metal core printed board assemblyInfo
- Publication number
- JPH02224393A JPH02224393A JP4629989A JP4629989A JPH02224393A JP H02224393 A JPH02224393 A JP H02224393A JP 4629989 A JP4629989 A JP 4629989A JP 4629989 A JP4629989 A JP 4629989A JP H02224393 A JPH02224393 A JP H02224393A
- Authority
- JP
- Japan
- Prior art keywords
- metal core
- soldering
- wiring board
- printed wiring
- core printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 23
- 239000002184 metal Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 238000002844 melting Methods 0.000 claims abstract description 9
- 230000008018 melting Effects 0.000 claims abstract description 9
- 238000003780 insertion Methods 0.000 claims description 14
- 230000037431 insertion Effects 0.000 claims description 14
- 238000007639 printing Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子交換機等の通信処理装置に使用されるプリ
ント配線基板組立体のはんだ付け方法に関し、特に混載
実装メタルコアプリント配線基板組立体のはんだ付け方
法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for soldering printed wiring board assemblies used in communication processing equipment such as electronic exchanges, and in particular to a method for soldering a mixed mounting metal core printed wiring board assembly. Regarding the attachment method.
従来、プリント配線基板組立体の実装方法として、表面
実装部品と挿入実装部品を同一のプリント配線基板には
んだ付けする場合１表面実装部品はプリント配線基板の
部品面にはんだペーストを使用してリフローはんだ付け
され、一方挿入実装部品はウェーブ式はんだ付けされて
いた。Conventionally, as a mounting method for printed wiring board assemblies, when surface mount components and insertion mount components are soldered to the same printed wiring board, 1.Surface mount components are reflow soldered using solder paste on the component surface of the printed wiring board. The inserted components were wave soldered.
上述した従来の表面実装部品と挿入実装部品混載のプリ
ント配線基板組立体のはんだ付け方法は、リフローはん
だ付けとウェーブはんだ付けの２回のはんだ付け工程が
必要なために設備費用が増加すること、またはんだ付け
工数が増加するという欠点がある。The above-described conventional soldering method for a printed wiring board assembly in which surface mount components and insertion mount components are mixed requires two soldering processes: reflow soldering and wave soldering, which increases equipment costs; Another disadvantage is that the number of soldering steps increases.
さらに、樹脂封止ＱＦＰ型ＬＳＩを赤外線等のりフロー
はんだ付け装置ではんだ付けを行うと、加熱温度が高＜
、ＬＳＩの樹脂部に微細なりラックが発生し、ＬＳＩの
信頼性を損うという欠点がある。Furthermore, when a resin-sealed QFP type LSI is soldered using a glue flow soldering device such as an infrared ray, the heating temperature is high.
However, there is a drawback that fine cracks are generated in the resin part of the LSI, which impairs the reliability of the LSI.
本発明の目的は前記課題を解決した混載実装メタルコア
プリント配線基板組立体のはんだ付け方法を提供するこ
とにある。An object of the present invention is to provide a method for soldering a mixed mounting metal core printed wiring board assembly that solves the above-mentioned problems.
前記目的を達成するため、本発明は表面実装部品と挿入
実装部品を同一のメタルコアプリント配線基板組立体に
はんだ付けする方法において、低融点のはんだペースト
をメタルコアプリント配線基板の部品面のマウントパッ
ドに印刷した後、表面実装部品ははんだペースト上に搭
載し、挿入実装部品はスルーホールに挿入した後に、ウ
ェーブ式はんだ槽の溶融はんだを使用して表面実装部品
と挿入実装部品を同時にはんだ付けを行うものである。To achieve the above object, the present invention provides a method for soldering surface mount components and insertion mount components to the same metal core printed wiring board assembly, in which a low melting point solder paste is applied to the mounting pad on the component side of the metal core printed wiring board. After printing, the surface mount components are mounted on the solder paste, and the insert mount components are inserted into the through holes, and then the surface mount components and the insert mount components are soldered at the same time using molten solder in a wave solder bath. It is something.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing one embodiment of the present invention.
図において、メタルコアプリント配線基板１の部品面上
のマウントパッド２に印刷された溶融温度が１８３６Ｃ
以下のビスマス系合金からなるはんだペースト３にＳＯ
Ｐ型ＩＣやＱＦＰ型ＬＳＩ等の表面実装部品４が搭載さ
れている。ＤＩＰ型ＩＣ等の挿入実装部品５はメタルコ
アプリント配線基板１に設けられたスルーホール６に挿
入されている６表面実装部品４と挿入実装部品５が同一
のメタルコアプリント配線基板１に配置された混載実装
メタルコアプリント配線基板組立体をはんだ温度が約２
４５°Ｃのウェーブ式はんだ槽の溶融はんだ７に浸漬さ
せると、溶融温度１８３６Ｃ以下のはんだペースト３は
メタルコア８の高熱伝導により溶融し、表面実装部品４
の端子９とマウントパッド２がはんだ接続される。一方
、挿入実装部品５はメタルコアプリント配線基板１に設
けたスルーホール６内を溶融はんだ７が上昇し、挿入実
装部品５の端子１０とはんだ接続される。In the figure, the melting temperature printed on the mounting pad 2 on the component surface of the metal core printed wiring board 1 is 1836C.
Solder paste 3 made of the following bismuth alloy
Surface mount components 4 such as P-type ICs and QFP-type LSIs are mounted. An insertion mounting component 5 such as a DIP type IC is inserted into a through hole 6 provided in a metal core printed wiring board 1. 6A surface mounting component 4 and an insertion mounting component 5 are placed on the same metal core printed wiring board 1. The soldering temperature of the mounted metal core printed wiring board assembly is approx.
When immersed in molten solder 7 in a wave solder bath at 45°C, solder paste 3 with a melting temperature of 1836°C or less melts due to high heat conduction of metal core 8, and surface mount component 4
The terminal 9 and the mount pad 2 are connected by solder. On the other hand, the molten solder 7 of the insertion mounting component 5 rises in the through hole 6 provided in the metal core printed wiring board 1, and the insertion mounting component 5 is connected to the terminal 10 of the insertion mounting component 5 by solder.
尚、部品面側に補助加熱を行いはんだペースト３のリフ
ローを促進させることも可能である。Note that it is also possible to perform auxiliary heating on the component side to promote reflow of the solder paste 3.
以上説明したように本発明はメタルコアプリント配線基
板を使用した混載実装型組立体のはんだ付け方法におい
て、メタルコアプリント配線基板の部品面のマウントパ
ッド部に溶融温度１８３°Ｃ以下の低融点はんだペース
トを使用して表面実装部品のりフローはんだ付けを、挿
入実装部品のウェーブはんだ付けと同時に行えることに
より、設備費用並びにはんだ付け工数の削減が可能であ
り、また、樹脂封止ＱＦＰ型ＬＳＩ等の表面実装部品を
強く加熱することなく、リフローはんだ付けが可能とな
るため、ＬＳＩの高信頼性が確保できるという大きな効
果がある。As explained above, the present invention provides a method for soldering a mixed mounting assembly using a metal core printed wiring board, in which a low melting point solder paste with a melting temperature of 183°C or less is applied to the mounting pad portion of the component surface of the metal core printed wiring board. By using glue flow soldering for surface mount components and wave soldering for insertion mount components at the same time, it is possible to reduce equipment costs and soldering man-hours. Since reflow soldering is possible without strongly heating the components, this has the great effect of ensuring high reliability of LSIs.
第１図は本発明の混載実装メタルコアプリント配線基板
組立体のはんだ付け方法を示す断面図である。
１・・・メタルコアプリント配線基板
２・・・マウントパッド
３・・・溶融温度１８３℃以下のはんだペース１−４・
・・表面実装部品 ５・・・挿入実装部品６・・
・スルーホール ７・・・溶融はんだ８・・・メ
タルコア ９・・・表面実装部品端子１０・・
・挿入実装部品端子
第η 区FIG. 1 is a sectional view showing a method of soldering a mixed mounting metal core printed wiring board assembly according to the present invention. 1...Metal core printed wiring board 2...Mount pad 3...Solder paste with a melting temperature of 183°C or less 1-4.
・・Surface mount components 5 ・Insertion mount components 6 ・・
・Through hole 7... Molten solder 8... Metal core 9... Surface mount component terminal 10...
・Insert mounting component terminal η section
Claims (1)
プリント配線基板組立体にはんだ付けする方法において
、低融点のはんだペーストをメタルコアプリント配線基
板の部品面のマウントパッドに印刷した後、表面実装部
品ははんだペースト上に搭載し、挿入実装部品はスルー
ホールに挿入した後に、ウェーブ式はんだ槽の溶融はん
だを使用して表面実装部品と挿入実装部品を同時にはん
だ付けを行うことを特徴とする混載実装メタルコアプリ
ント配線基板組立体のはんだ付け方法。(1) In the method of soldering surface mount components and insertion mount components to the same metal core printed wiring board assembly, after printing a low melting point solder paste on the mounting pad on the component side of the metal core printed wiring board, the surface mount components This is a mixed mounting method in which the surface mount components and the insertion mount components are mounted on solder paste, the insertion mount components are inserted into the through holes, and then the surface mount components and the insertion mount components are simultaneously soldered using molten solder in a wave solder bath. How to solder a metal core printed wiring board assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4629989A JPH02224393A (en) | 1989-02-27 | 1989-02-27 | Method of soldering mixed mounting metal core printed board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4629989A JPH02224393A (en) | 1989-02-27 | 1989-02-27 | Method of soldering mixed mounting metal core printed board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02224393A true JPH02224393A (en) | 1990-09-06 |
Family
ID=12743328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4629989A Pending JPH02224393A (en) | 1989-02-27 | 1989-02-27 | Method of soldering mixed mounting metal core printed board assembly |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02224393A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04167496A (en) * | 1990-10-31 | 1992-06-15 | Nippon Avionics Co Ltd | Soldering method of printed-wiring board |
| JP2006270008A (en) * | 2005-02-23 | 2006-10-05 | Furukawa Electric Co Ltd:The | Lead-free soldering board and its manufacturing method |
| GB2471497A (en) * | 2009-07-01 | 2011-01-05 | Tdk Lambda Uk Ltd | Double sided multi-layer metal substrate PCB with SMD components mounted to top traces and lead wire components mounted to opposite side for heat dissipation |
-
1989
- 1989-02-27 JP JP4629989A patent/JPH02224393A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04167496A (en) * | 1990-10-31 | 1992-06-15 | Nippon Avionics Co Ltd | Soldering method of printed-wiring board |
| JP2006270008A (en) * | 2005-02-23 | 2006-10-05 | Furukawa Electric Co Ltd:The | Lead-free soldering board and its manufacturing method |
| JP4570505B2 (en) * | 2005-02-23 | 2010-10-27 | 古河電気工業株式会社 | Lead-free soldering substrate and manufacturing method thereof |
| GB2471497A (en) * | 2009-07-01 | 2011-01-05 | Tdk Lambda Uk Ltd | Double sided multi-layer metal substrate PCB with SMD components mounted to top traces and lead wire components mounted to opposite side for heat dissipation |
| GB2471497B (en) * | 2009-07-01 | 2014-08-20 | Tdk Lambda Uk Ltd | Heat sink |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0555438A (en) | Lead terminal structure of electronic component | |
| US4972989A (en) | Through the lead soldering | |
| JPH11233910A (en) | Method for mounting component | |
| JPH02224393A (en) | Method of soldering mixed mounting metal core printed board assembly | |
| JPH0738246A (en) | Soldering method and molding solder used therein | |
| JPH09219581A (en) | Method for mounting electronic parts | |
| JPH01290293A (en) | Soldering equipment | |
| JPS6043897A (en) | Method of soldering electronic part carrying board | |
| JPS6097656A (en) | Method for mounting hybrid integrated circuit | |
| JPS61115343A (en) | Semiconductor integrated circuit | |
| JPH05343593A (en) | Connecting terminal | |
| JPH10144850A (en) | Connecting pin and mounting method of substrate | |
| KR19990026398A (en) | Parts mounting method of printed circuit board | |
| JPH02101775A (en) | Double-faced printed board and its mounting method | |
| JPH0563355A (en) | Mount assembling method for electronic parts | |
| JPS6151945A (en) | Semiconductor device | |
| JPS63299855A (en) | Soldering method | |
| JP2534837B2 (en) | Method of soldering parts to circuit board | |
| JPH0945808A (en) | Electronic part | |
| JPS6114791A (en) | Printed board for mounting electronic part | |
| JP3082599B2 (en) | Connector soldering method | |
| JPS6259461B2 (en) | ||
| JPS60261188A (en) | Axial lead short jumper | |
| JPS6370597A (en) | Method of solder joint of surface mount parts | |
| JPH0456461B2 (en) |